Patents by Inventor Yi-Chun Liu

Yi-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion inhibitor of NiCu for high performance writers
    Publication number: 20010008745
    Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    Type: Application
    Filed: January 8, 2001
    Publication date: July 19, 2001
    Applicant: HEADWAY TECHNOLOGIES, INC.
    Inventors: Xuehua Wu, Yi-Chun Liu, Jei-Wei Chang, Kochan Ju
  • Corrosion inhibitor for NiCu for high performance writers
    Patent number: 6207350
    Abstract: The problem of copper corrosion that occurs in the presence of strong alkaline developing solutions during photo rework has been overcome by protecting all exposed copper bearing surfaces from attack. Two ways of achieving this are described. In the first method, benzotriazole (BTA) is added to the developing solution which is then used in the normal way, developing time being unaffected by this modification. In the second method, the surface that is to receive the photoresist is first given a dip in a solution of BTA, following which the photoresist is immediately applied and processing, including development, proceeds as normal. For both methods the result is the elimination of all copper corrosion during development.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: March 27, 2001
    Assignee: Headway Technologies, Inc.
    Inventors: Xuehua Wu, Yi-Chun Liu, Jei-Wei Chang, Kochan Ju