Abstract: A stabilization degree adjustment method includes obtaining a stabilization degree adjustment instruction and adjusting a stabilization degree of a stabilization mechanism according to the stabilization degree adjustment instruction. The stabilization mechanism is configured to support a load.

Abstract: A housing structure of an optical module with self-sinking unlocking comprises: a base, an upper cover, a rotating lug, a support rod and a pull ring; wherein the rotating lug comprises a first connecting piece a lug, a second connecting piece and a stem, wherein the first connecting piece and the second connecting piece are respectively horizontally disposed at two ends of the stem, and the lug is disposed on the stem; and the pull ring comprises a fixing shaft, a rotating shaft and a side rod; wherein the second connecting piece of the rotating lug is disposed on the bas; the first connecting piece of the rotating lug is coupled to a right connecting piece of the support rod; a left hole of the support rod is coupled to the rotating shaft of the pull ring.

Abstract: Composite nanostructures having a crumpled graphene oxide shell and a nanoparticle selected from titanium dioxide, silver and magnetite within the shell are disclosed. The nanostructures may be incorporated into a filtration membrane suitable for purifying water for targeted separations and for human consumption.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include millimeter wave antenna arrays. Non-millimeter-wave antennas such as cellular telephone antennas may have conductive structures separated by a dielectric gap. In a device with a metal housing, a plastic-filled slot may form the dielectric gap. The conductive structures may be slot antenna structures, inverted-F antenna structures such as an inverted-F antenna resonating element and a ground, or other antenna structures. The plastic-filled slot may serve as a millimeter wave antenna window. A millimeter wave antenna array may be mounted in alignment with the millimeter wave antenna window to transmit and receive signals through the window. Millimeter wave antenna windows may also be formed from air-filled openings in a metal housing such as audio port openings.

Abstract: A wireless power transmission system may include a wireless power transmitting device such as a tablet computer and a wireless power receiving device such as a computer stylus. A wireless power transmitting capacitor electrode may be formed in the tablet computer. A wireless power receiving capacitor electrode may be formed in the computer stylus. The transmitting capacitor electrode may be driven by a drive signal having a frequency of 900 MHz or greater to produce wireless power. The wireless power may be transmitted from the transmitting capacitor electrode to the receiving capacitor electrode on the stylus via near field capacitive coupling. The transmitting and receiving capacitor electrodes may each include conductive traces on dielectric substrates. The conductive traces may follow meandering paths to maximize the possible capacitive coupling efficiency between the capacitor electrodes and thus the end-to-end charging efficiency of the wireless power transmission system.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antenna structures and transceiver circuitry such as millimeter wave transceiver circuitry. Antenna structures in the wireless circuitry may include patch antennas that are organized in a phased antenna array. Each patch antenna may include an antenna resonating element and a parasitic element. The parasitic element for the patch antenna may have dielectric-filled openings formed between coplanar parasitic conductors. The parasitic conductors may include a central parasitic conductor, four rectangular parasitic conductors formed around the central parasitic conductor, and corner parasitic conductors formed at the corners of the parasitic element. The corner parasitic conductors may be non-rectangular. For example, the corner parasitic conductors may have first and second perpendicular edges and a straight or curved third edge that joins the first and second edges.

Abstract: A wireless communication system comprises a base station and one or more relay docks and transmits directional wave signals between components using high frequency waves, such as millimeter waves. A beam forming decision engine utilizes position information collected from one or more position or motion sensors of a user device to determine a direction in which to form a directional wave signal being transmitted between components of the wireless communication system.

Abstract: A wireless power transmission system may include a wireless power transmitting device such as a tablet computer and a wireless power receiving device such as a computer stylus. A wireless power transmitting capacitor electrode may be formed in the tablet computer. A wireless power receiving capacitor electrode may be formed in the computer stylus. The transmitting capacitor electrode may be driven by a drive signal having a frequency of 900 MHz or greater to produce wireless power. The wireless power may be transmitted from the transmitting capacitor electrode to the receiving capacitor electrode on the stylus via near field capacitive coupling. The transmitting and receiving capacitor electrodes may each include conductive traces on dielectric substrates. The conductive traces may follow meandering paths to maximize the possible capacitive coupling efficiency between the capacitor electrodes and thus the end-to-end charging efficiency of the wireless power transmission system.

Abstract: An electronic device may include a phased antenna array mounted in a conductive cavity for conveying radio-frequency signals above 10 GHz. The cavity may include sidewalls extending from a rear wall. The array may include rectangular patches each having first and second perpendicular edges. Each of the first edges in the array may be aligned with a first axis. Each of the second edges in the array may be aligned with a second axis perpendicular to the first axis. The first and second axes may be oriented at 45 degrees with respect to each of the sidewalls of the cavity. Each patch may be fed using first and second positive antenna feed terminals that cover orthogonal linear polarizations. The cavity may prevent interference while symmetrically loading the impedance of both the first and second positive antenna feed terminals in each patch.

Abstract: An electronic device such as a wristwatch may be provided with wireless circuitry and a display having a display module and a cover layer. The display module may include a dielectric layer. Touch sensor electrodes may be formed from conductive traces on the dielectric layer. An antenna may be embedded within the display module. The antenna may include an antenna resonating element formed from a grid of intersecting conductive traces on the dielectric layer. The grid may have edges that define a lateral outline of the antenna resonating element. The outline may have a length that configures the antenna to radiate at a desired frequency. The antenna resonating element may be formed from indium tin oxide and may be substantially transparent.

Abstract: A device including a capping layer over a portion of a top electrode, and method of production thereof. Embodiments include an MRAM cell in a first region and a logic area in a second region of a substrate, wherein the MRAM cell includes a MTJ pillar between a top electrode and a bottom electrode; and a capping layer over a portion of the top electrode.

Abstract: Integrated circuits with integrated memory devices and high capacitors, and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming, from a lower conductive layer, a lower memory interconnect and a lower capacitor interconnects over a substrate. The method further includes forming a conductive memory via coupled to the lower memory interconnect and a conductive capacitor vias coupled to the lower capacitor interconnect. Also, the method includes forming a memory structure over the memory via and forming a capacitor dielectric layer over the memory structure and over the capacitor via. Further, the method includes forming, from an upper conductive layer, an upper memory interconnect coupled to the memory structure and an upper capacitor interconnects over the capacitor dielectric layer over the capacitor via. The capacitor via, capacitor dielectric layer, and upper capacitor interconnects form the high capacitor.

Abstract: Integrated circuits with integrated memory devices and high capacitors, and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming, from a lower conductive layer, a lower memory interconnect and a lower capacitor interconnects over a substrate. The method further includes forming a conductive memory via coupled to the lower memory interconnect and a conductive capacitor vias coupled to the lower capacitor interconnect. Also, the method includes forming a memory structure over the memory via and forming a capacitor dielectric layer over the memory structure and over the capacitor via. Further, the method includes forming, from an upper conductive layer, an upper memory interconnect coupled to the memory structure and an upper capacitor interconnects over the capacitor dielectric layer over the capacitor via. The capacitor via, capacitor dielectric layer, and upper capacitor interconnects form the high capacitor.

Abstract: A device including a reduced top RRAM electrode structure, and method of production thereof. Embodiments include a bottom resistive random-access memory (RRAM) electrode structure over a plurality of lower metal level contacts formed laterally separated in a substrate; a resistive switching structure over the bottom RRAM electrode structure; a top RRAM electrode structure over the resistive switching structure; a protective structure over the top RRAM electrode structure; an encapsulation structure over the bottom RRAM electrode structure and on sidewalls of the resistive switching structure, the top RRAM electrode structure and the protective structure; and an Nblock layer over the substrate.

Abstract: An electronic device may be provided with a dielectric cover and a phased antenna array for conveying millimeter wave signals. A conductive pocket may be mounted to the cover. The pocket may include a conductive rear wall and conductive sidewalls that extend from a periphery of the rear wall to the cover. The array may be mounted to the rear wall and may convey signals through the cover. The sidewalls may extend from the cover at non-zero angles with respect to the normal axis of the cover. The shape of the pocket and the cover may be selected so that the pocket is non-resonant at frequencies handled by the array, to mitigate destructive interference within the pocket, to block surface waves from propagating along the cover, and to tweak the radiation pattern of the array to exhibit a desired shape and directionality.

Abstract: A wireless power system may use a wireless power transmitting device to transmit wireless power to a wireless power receiving device. The wireless power transmitting device may have microwave antennas that extend along an axis in a staggered arrangement. In the staggered arrangement, the microwave antennas are positioned on alternating sides of the axis. Each microwave antenna is elongated along a dimension that is perpendicular to the axis. Multiple antennas may overlap a wireless power receiving antenna in the wireless power receiving device. Control circuitry may use oscillator and amplifier circuitry to provide antennas that have been overlapped by the wireless power receiving antenna with drive signals. The drive signals may be adjusted based on feedback from the wireless power receiving device to enhance power transmission efficiency. The system may have a wireless power transmitting device with inductive wireless power transmitting coils.

Abstract: A low temperature poly-silicon (LTPS) display panel manufacturing method, including: providing a vacuum environment; providing a glass substrate; forming a lower silicon monoxide layer on the glass substrate; forming a silicon nitride layer on the lower silicon monoxide layer; forming an upper silicon monoxide layer on the silicon nitride layer; forming an amorphous silicon layer on the upper silicon monoxide layer under the vacuum environment; forming a protective layer on the amorphous silicon layer; implementing an excimer-laser annealing (ELA) process to the amorphous silicon layer to form poly-silicon on the amorphous silicon layer. The present invention can prevent the issue that the amorphous silicon layer is attached with residual particles from the air or metal ions and results in that a crystal lattice of the poly-silicon formed from the amorphous silicon layer by the ELA process has defects.

Abstract: A method of forming a memory cell with a high aspect ratio metal via formed underneath a metal tunnel junction (MTJ) and the resulting device are provided. Embodiments include a device having a metal via formed underneath a metal tunnel junction (MTJ) in a memory cell, and the metal via has an aspect ratio smaller than 2.

Abstract: Integrated circuits with embedded memory structures, and methods for fabricating integrated circuits are provided. An exemplary method for fabricating an integrated circuit includes forming from a first metallization layer a first lower conductive interconnect in a first region of a dielectric layer and a second lower conductive interconnect in a second region of the dielectric layer. The method includes forming a memory structure in the first region. Further, the method includes depositing an interlayer dielectric over the first region and over the second region. Also, the method includes forming from a second metallization layer a first upper conductive interconnect over the interlayer dielectric, wherein the first upper conductive interconnect is coupled to the memory structure.