Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.

Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

Abstract: The disclosed subject matter relates generally to memory devices and a method of forming the same. More particularly, the present disclosure relates to resistive random-access (ReRAM) memory devices. The present disclosure provides a memory device including a first electrode having tapered sides and a top surface, in which the sides taper towards each other as they meet the top surface, a dielectric layer disposed on and conforming to the tapered sides of the first electrode, a resistive layer in contact with the top surface of the first electrode and the dielectric layer, and a second electrode disposed on the resistive layer.

Abstract: A wireless communication system comprises a base station and one or more relay docks and transmits directional wave signals between components using high frequency waves, such as millimeter waves. A beam forming decision engine utilizes position information collected from one or more position or motion sensors of a user device to determine a direction in which to form a directional wave signal being transmitted between components of the wireless communication system.

Abstract: An electrochemical device is disclosed. The electrochemical device includes a first transparent conductive layer, an electrochromic layer overlying the first transparent conductive layer, a counter electrode layer overlying the electrochromic layer, a second transparent conductive layer, and a switching speed parameter of not greater than 0.68 s/mm at 23° C.

Abstract: Embodiments of the present disclosure provide a method, device, and computer program product for managing a backup system. The method comprises obtaining a state of a backup system, the backup system comprising a backup server and at least one backup client, the backup server being communicatively coupled to the at least one backup client via a network and configured to back up data of the at least one backup client; determining a reward score corresponding to the state of the backup system; and determining, based on the state of the backup system and the reward score, configuration information for the backup system, the configuration information indicating a schedule for the backup server to perform data backups on the at least one backup client. Embodiments of the present disclosure can improve the performance of the backup system and reduce the management overhead of the backup system.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: A calibrating method is provided including the following steps. A type of a first sensor and a type of a first sensor carrier are determined according to an external shape of a first object. The first sensor is carried by the first sensor carrier, and a relative coordinate of the first object is measured by the first sensor. The relative coordinate of the first object is compared with a predetermined coordinate of the first object to obtain a first object coordinate error, and the first object coordinate error is corrected. After the first object coordinate error is corrected, the first object is driven to perform an operation on a second object or the second object is driven to perform the operation on the first object. A calibrating system is also provided.

Abstract: An electronic device may include first and second phased antenna arrays that convey radio-frequency signals at frequencies greater than 10 GHz. The second array may have fewer antennas than the first array. Control circuitry may control the first and second arrays in a diversity mode and in a simultaneous array mode. In the diversity mode, the first array may form a first signal beam while the second array is inactive. When the first array is blocked by an object or otherwise exhibits unsatisfactory performance, the second array may form a second signal beam while the first array is inactive. In the simultaneous mode, the first and second arrays may form a combined array that produces a third signal beam. The combined array may maximize gain. Hierarchical beam searching operations may be performed. The arrays may be distributed across one or more modules.

Abstract: An electronic device may include a phased antenna array. The array may include co-located first and second antennas formed on a dielectric substrate. The first antenna may include a first patch element and multi-layer parasitic structures. The multi-layer parasitic structures may include a first set of co-planar parasitic elements. The first set of parasitic elements may overlap the first patch element and may be separated by a gap. The multi-layer parasitic structures may include an additional parasitic element that overlaps the gap. The second antenna may include a second patch element that is co-planar with the additional parasitic patch. The second patch element may at least partially overlap one of the parasitic elements in the first set. The first and second patch antennas may collectively cover first and second frequency bands while occupying a minimal amount of space on the dielectric substrate.

Abstract: An electronic device may have an antenna that conveys radio-frequency signals at frequencies greater than 10 GHz. The antenna may be embedded in a substrate. The substrate may have routing layers, first antenna layers on the routing layers, second antenna layers on the first antenna layers, and a third antenna layers on the second antenna layers. The antenna may include first traces on the first antenna layers, second traces on the second antenna layers, and third traces on the third antenna layers. The first antenna layers may have a first bulk dielectric permittivity. The second layers may have a second bulk dielectric permittivity. The third layers may have a third bulk dielectric permittivity. At least one of the first, second, and third bulk dielectric permittivities may be different from the others. This may differentially load the antenna across the antenna layers, thereby broadening the bandwidth of the antenna.

Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

Abstract: An electronic device may include first and second phased antenna arrays and a triplet of first, second, and third ultra-wideband antennas. An antenna module in the device may include a dielectric substrate. The first and second arrays and the triplet may be formed on the dielectric substrate. The third and second ultra-wideband antennas may be separated by a gap. The first array may be laterally interposed between the third and second ultra-wideband antennas within the gap. The third ultra-wideband antenna may be laterally interposed between the first phased antenna array and at least some of the second array. An integrated circuit may be mounted to the dielectric substrate using an interposer. The antenna module may occupy a minimal amount of space within the device and may be less expensive to manufacture relative to scenarios where the arrays and the ultra-wideband antennas are formed on separate substrates.

Abstract: A semiconductor device may be provided, including a first insulating layer; a second insulating layer arranged over the first insulating layer; a memory structure arranged within a memory region and including a resistance changing memory element within the first insulating layer; and a logic structure arranged within a logic region. In the memory region, the first insulating layer may contact the second insulating layer and in the logic region, the semiconductor device may further include a stop layer arranged between the first insulating layer and the second insulating layer.

Abstract: A wireless communication system comprises a base station and one or more relay docks and transmits directional wave signals between components using high frequency waves, such as millimeter waves. A beam forming decision engine utilizes position information collected from one or more position or motion sensors of a user device to determine a direction in which to form a directional wave signal being transmitted between components of the wireless communication system.

Abstract: A semiconductor device may be provided, including a base layer, an insulating layer arranged over the base layer, a memory structure arranged at least partially within the insulating layer, where the memory structure may include a first electrode, a second electrode, and an intermediate element between the first electrode and the second electrode, and a resistor arranged at least partially within the insulating layer, where the resistor may be arranged in substantially a same horizontal plane with one of the first electrode and the second electrode.

Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

Abstract: The disclosure discloses an intelligent terminal energy saving method based on artificial intelligence (AI) prediction. The method includes: collecting application (APP)-related operation data on the intelligent terminal; carrying out AI analysis on the APP-related operation data collected, to predict timing and a restriction measurement to restrict an APP in a background; and adopting the restriction measurement to restrict the APP in the background at the timing predicted. Corresponding to the method, the disclosure further discloses an intelligent terminal energy saving device based on AI prediction. Using the technical schemes disclosed in the disclosure, the power consumption of applications on a portable intelligent terminal can be reduced, and the battery life can be extended, without affecting the user experience.

Abstract: Embodiments of the present systems and methods may provide improved capability to predict the risk of recurrence of ductal carcinoma in situ (DCIS) conditions using whole slide image analysis based on machine learning techniques. For example, in an embodiment, a computer-implemented method for determining treatment of a patient may comprise receiving an image of living tissue of a patient, annotating the entire image into tissue structures, extracting texture features from the annotated image, determining a distribution of the extracted texture features relative to tissue conditions, classifying the patient into a risk group based on the distribution, and treating the patient accordingly based on the risk group.

Abstract: An electrochemical device is disclosed. The electrochemical device includes a first transparent conductive layer, an electrochromic layer overlying the first transparent conductive layer, a counter electrode layer overlying the electrochromic layer, a second transparent conductive layer, and a switching speed parameter of not greater than 0.68 s/mm at 23° C.