Abstract: The present disclosure provides a chemical supply system, including a chamber, a tubing extending into the chamber, an interlock apparatus, including a fixture for fastening the tubing, and means for determining whether the tubing is fastened by the fixture.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: Microwave photonic devices use light to carry and process microwave signals over a photonic link. Light can be used as a stimulus to microwave devices that directly control microwave signals. Previous optically controlled devices suffer from large footprint, high optical power level required for switching, lack of scalability and complex integration requirements, restricting their implementation in practical microwave systems. Disclosed are monolithic optically reconfigurable integrated microwave switches (MORIMSs) built on a CMOS compatible silicon photonic chip. The disclosed scalable micrometer-scale switches provide higher switching efficiency and operate using optical power that is orders of magnitude lower than previous devices. The disclosed devices and techniques provide examples of silicon photonic platforms integrating microwave circuitry.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: The present invention provide novel immunofiber compositions for protein or peptide purification and simple and cost-efficient methods and systems using these compositions. In some embodiments, the immunofibers comprise a customized Z-33 peptide derived from Staphylococcus aureus Protein A which is used to construct immuno-amphiphile molecules that assemble into immunofibers in aqueous solution with bioactive epitopes on the surface and have peptide or protein binding ability.

Abstract: Provided are a probe joint including a micro-electromechanical probe head and a conductive member, and a spring probe including the same. The probe head includes a docking portion extending in a radial direction to form a deformable portion; and a contact portion for contacting an object to be tested, which is located at one end of the docking portion and has a size decreasing as away from the docking portion. The conductive member has a connecting section having an extended portion surrounding to define a carrier space; and a notch which communicates with the carrier space. When assembling, the docking portion can be disposed in the carrier space, the deformable portion extends out of the connecting section through the notch. The deformable portion can be deformed and forms a deformed portion, which partially wraps the extended portion, thereby preventing the probe head from being separated from the conductive member.

Abstract: Provided are a probe head, a probe assembly and a spring probe including the same. The probe head comprises a contact portion and first, second and third body portions stacked in sequence; the contact portion has a size decreasing as away from the first body portion, the contact portion is for contacting an object to be tested; the first body portion has a radial size greater than the second and third body portions; the second body portion is surround by a second concave wall and a second boundary wall; the third body portion has a radial size not greater than the second boundary wall and larger than a smallest radial size of the second concave wall; the probe assembly includes the probe head and a pipe having a portion protruding into the second concave wall, thereby achieving easy assembly and good firmness of the pipe and the probe head.

Abstract: A method for generating and outputting a message is implemented using an electronic device the stores a computer program product and a text database. The text database includes a main message template, a template text that includes a placeholder, and a word group that includes a plurality of preset words for replacing the placeholder. The method includes: in response to receipt of a command for execution of the computer program product, displaying an editing interface including the main message template; in response to receipt of user operation of a selection of the main message template, displaying the template text; in response to receipt of user operation of a selection of one of the preset words via the user interface, generating an edited text by replacing the placeholder with the one of the preset words in the template text; and outputting the edited text as a message.

Abstract: A photomask structure having a first region and a second region is provided. The layout pattern density of the first region is smaller than the layout pattern density of the second region. The photomask structure includes a first layout pattern, a second layout pattern, and first assist patterns. The first layout pattern is located in the first region and the second region. The second layout pattern is located in the second region. The second layout pattern is located on one side of the first layout pattern. The first assist patterns are located on the first sidewall of the first layout pattern and separated from each other. The first sidewall is adjacent to the second layout pattern. The first assist patterns are adjacent to a boundary between the first region and the second region. The lengths of two adjacent first assist patterns decrease in the direction away from the boundary.

Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: The present application discloses an information processing method and apparatus, a terminal device, and a storage medium. The method includes: based on a first bit length and/or a second bit length, determining a first rate matching output sequence length corresponding to first information.

Abstract: Provided are methods for data-driven suggested remote vehicle assistance actions, which can include in response to receiving a request from a vehicle requesting assistance to address a scenario involving the vehicle, determining, using data stored in at least one data structure regarding a plurality of previously resolved scenarios involving a plurality of vehicles, a plurality of actions to address the scenario, causing an indication of the plurality of actions to be provided on at least one display remotely located from the vehicle, receiving a user selection of one of the plurality of actions; and causing an instruction to be transmitted to the vehicle based on the selected one of the plurality of actions. Systems and computer program products are also provided.

Abstract: System and method to use position information about a power supply unit (PSU) within a system for status reporting or control. The system may have multiple slots into which the PSU may be installed, and each of multiple PSUs installed may sense position information, such as an indication of the slot into which it is installed. A controller may receive the position information in connection with status information such that faults or other events associated with a PSU may be reported to a system operator in connection with a position of the affected PSU. The controller may determine adjustments to operating parameters of the PSUs that are impacted by position and may direct commends to the appropriate PSU based on the position information.

Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.

Abstract: A multifunction connector is provided. A housing of the connector has a base portion, a pair of walls extending from the base portion in a longitudinal direction and separated by a gap, and a pair of wings extending from the base portion on opposite sides of the pair of walls and in a transverse direction. A pair of power conductors each is held by one of the walls and has contact portions curving into the gap. A pair of sense conductors each is held by one of the walls and has a contact portion curving into the gap and being offset from the contact portions of a respective power conductor along the longitudinal direction. A position identification subassembly is held by a first wall of the pair and separate from the gap by the first wall. A ground conductor is held by a second wall of the pair and separate from the gap by the second wall. Such a configuration enables the connector to carry high current, identify insertion position on a busbar, sense the degree of insertion, and/or provide grounding.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

Abstract: A method and apparatus for block partition are disclosed. If a cross-colour component prediction mode is allowed, the luma block and the chroma block are partitioned into one or more luma leaf blocks and chroma leaf blocks. If a cross-colour component prediction mode is allowed, whether to enable an LM (Linear Model) mode for a target chroma leaf block is determined based on a first split type applied to an ancestor chroma node of the target chroma leaf block and a second split type applied to a corresponding ancestor luma node. According to another method, after the luma block and the chroma block are partitioned using different partition tress, determine whether one or more exception conditions to allow an LM for a target chroma leaf block are satisfied when the chroma partition tree uses a different split type, a different partition direction, or both from the luma partition tree.