Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

Abstract: A device includes a biosensor, a sensing circuit electrically connected to the biosensor, a quantizer electrically connected to the sensing circuit, a digital filter electrically connected to the quantizer, a selective window electrically connected to the digital filter, and a decision unit electrically connected to the selective window.

Abstract: One or more semiconductor devices and array arrangements and methods of formation are provided. A semiconductor device includes an ion sensing device and a heating element proximate the ion sensing device. The ion sensing device has an active region, including a source, a drain, and a channel, the channel situated between the source and the drain. The ion sensing device also has an ion sensing film situated over the channel, and an ion sensing region over the ion sensing film. Responsive to a temperature sensed by a thermal sensor proximate the ion sensing device, the heating element is selectively activated to alter a temperature of the ion sensing region to promote desired operation of the semiconductor device, such as to function as a bio sensor. Multiple semiconductor devices can be formed into an array.

Abstract: The present disclosure provides a device, such as a FET sensing cell, which includes a first dielectric layer over a substrate, an active layer over the first dielectric layer, a source region in the active layer, a drain region in the active layer, a channel region in the active layer situated between the source region and the drain region, a sensing film over the channel region, a second dielectric layer over the active layer, wherein an opening is formed in the second dielectric layer and the sensing film is located within the opening, a first electrode located within the second dielectric layer and a fluidic gate region located over the second dielectric layer and extending into the opening. The present disclosure also provides a method for improving the sensitivity of a device by adjusting a sensing value.

Abstract: A power supplying circuit for generating an output voltage, which comprises: a noise detecting circuit, for receiving a first reference voltage and for generating a second reference voltage according to the output voltage and the first reference voltage, wherein a noise component of the second reference voltage is the same as which of the output voltage; a control voltage generating unit, for receiving a feedback voltage and the second reference voltage, and for generating a control voltage according to the feedback voltage and the second reference voltage; a voltage providing device, for generating the output voltage according to the control voltage and an input voltage; and a feedback module, for generating the feedback voltage according to the output voltage.

Abstract: The present invention relates to a receiving apparatus of a communication system, which comprises a receiving module, a selection unit, and a processing module. The receiving module receives an input signal and produces a first signal and a second signal. The phases of the first and the second signals are different. The selection unit receives the first and the second signals, and switches for outputting the first or the second signal. The processing module receives and processes the first and the second signals, and produces an output signal. Thereby, the present invention uses the selection unit for processing two phase signals via a set of channels. Thereby, circuit area and power consumption can be reduced, and hence achieving the purpose of saving cost.

Abstract: The present disclosure relates to a micro-fluidic probe card that deposits a fluidic chemical onto a substrate with a minimal amount of fluidic chemical waste, and an associated method of operation. In some embodiments, the micro-fluidic probe card has a probe card body with a first side and a second side. A sealant element, which contacts a substrate, is connected to the second side of the probe card body in a manner that forms a cavity within an interior of the sealant element. A fluid inlet, which provides a fluid from a processing tool to the cavity, is a first conduit extending between the first side and the second side of the probe card body. A fluid outlet, which removes the fluid from the cavity, is a second conduit extending between the first side and the second side of the probe card body.

Abstract: The present disclosure relates to a top-down method of forming a nanowire structure extending between source and drain regions of a nanowire transistor device, and an associated apparatus. In some embodiments, the method provides a substrate having a device layer disposed over a first dielectric layer. The device layer has a source region and a drain region separated by a device material. The first dielectric layer has an embedded gate structure abutting the device layer. One or more masking layers are selectively formed over the device layer to define a nanowire structure. The device layer is then selectively etched according to the one or more masking layers to form a nanowire structure at a position between the source region and the drain region. By forming the nanowire structure through a masking and etch process, the nanowire structure is automatically connected to the source and drain regions.

Abstract: The present disclosure provides methods of fabricating a biochip. The biochip includes a fluidic part, having through-substrate holes as inlets and outlets, and a sensing part bonded together using a bonding material. One or both of the parts has microfluidic channel patterns and one or more patterned surface modification layers formed using different methods to provide surface property for binding bioreceptors and for flowing analytes. The patterning includes lithography, etching, washing, selective depositing using printing or self-assembly of surface chemistry.

Abstract: In one aspect, described herein are field effect chemical sensor devices useful for chemical and/or biochemical sensing. Also provided herein are methods for single molecule detection. In another aspect, described herein are methods useful for amplification of target molecules by PCR.

Abstract: A method of forming a semiconductor device includes depositing a light reflecting layer over a substrate. The method also includes forming a protection layer over the light reflecting layer. The method further includes forming an anti-reflective coating (ARC) layer over the protection layer. The method additionally includes forming an opening in the ARC layer, the protection layer and the light reflecting layer exposing the substrate. The method also includes removing the ARC layer in a wet solution comprising H2O2, the ARC layer being exposed to the H2O2 at a flow rate greater than about 10 standard cubic centimeters per minute (sccm).

Abstract: The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates.

Abstract: A communication device is disclosed, having a wireless LAN transceiver, a wireless LAN demodulation circuit, a Bluetooth transceiver, a Bluetooth demodulation circuit, an oscillator, and a mixer. The wireless LAN transceiver conducts communication in a first frequency band and the wireless LAN demodulation circuit demodulates the wireless LAN signals. The Bluetooth transceiver conducts communication in a second band and a third frequency band, which are higher and lower than the first frequency band, respectively. The oscillator generates oscillating signals. The mixer mixes the signals in the second frequency band with an oscillating signal, which is higher than the second frequency band, and mixes the signals in the third frequency band with another oscillating signal, which is lower than the third frequency band to generate mixed signals. The Bluetooth demodulation circuit demodulates the mixed signals of the mixer.

Abstract: A sensing method of a current sensing amplifier is provided used for determining a storing state of a cell of a non-volatile memory device during a read cycle. After a sensing node and a reference node are adjusted to a constant voltage, the sensing node and the reference node are maintained in a floating state. Then, the sensing node is connected with a data line to receive a cell current from the cell, and the reference node is connected with a reference current source to receive a reference current from the reference current source. When a reference voltage of the reference node reaches a preset voltage, the storing state of the cell is determined according to a relationship between a sensing voltage of the sensing node and the preset voltage.

Abstract: A BioMEMS microelectromechanical apparatus and for fabricating the same is disclosed. A substrate is provided with at least one signal conduit formed on the substrate. A sacrificial layer of sacrificial material may be deposited on the signal conduit and optionally patterned to remove sacrificial material from outside the packaging covered area. A bonding layer may be deposited on at least a portion of the signal conduit and on the sacrificial layer when included. The bonding layer may be planarized and patterned to form one or more cap bonding pads and define a packaging covered area. A cap may be bonded on the cap bonding pad to define a capped area and so that the signal conduit extends from outside the capped area to inside the capped area. Additionally, a test material such as a fluid may be provided within the capped area.

Abstract: The present disclosure relates to a semiconductor package and a manufacturing method thereof The semiconductor package includes a semiconductor element including a main body, a plurality of conductive vias, and at least one filler. The conductive vias penetrate through the main body. The filler is located in the main body, and a coefficient of thermal expansion (CTE) of the filler is different from that of the main body and the conductive vias. Thus, the CTE of the overall semiconductor element can be adjusted, so as to reduce warpage.

Abstract: A clock trimming apparatus includes an oscillator, a judging unit, a latching unit, and a tracking unit. The oscillator has an input terminal receiving a bias signal and an output terminal generating a clock signal. After a frequency division is performed on the clock signal, the judging unit generates a frequency-divided signal. If the frequency-divided signal matches the reference signal, a pass signal generated by the judging unit is activated. The latching unit is used for generating a trimming completion signal. After the pass signal is activated, the trimming completion signal is activated. The tracking unit is used for counting a pulse number of the reference signal and providing the bias signal to the oscillator according to a trimming code. After the trimming completion signal is activated, the trimming code is stopped being adjusted.

Abstract: A method of forming of MEMS nanostructures includes a portion of a substrate is recessed to form a plurality of mesas in the substrate. Each of the plurality of mesas has a top surface and a sidewall surface. A light reflecting layer is deposited over the substrate thereby covering the top surface and the sidewall surface of each mesa. A protection layer is formed over the light reflecting layer. An ARC layer is formed over the protection layer. An opening in a photo resist layer is formed over the ARC layer over each mesa. A portion of the ARC layer, the protection layer and the light reflecting layer are removed through the opening to expose the top surface of each mesa. The photo resist layer and the ARC layer over the top surface of each mesa are removed.

Abstract: A speaker includes a base defining a pair of receiving cavities separated from each other in a longitudinal direction and an engaging portion disposed between the pair of receiving cavities, a pair of magnetic circuit systems received into the pair of the receiving cavities, a diaphragm attached on the base, a pair of voice coil members connecting with the diaphragm, and a suspension mounted on the base. The suspension defines a pair of separating portions separated from each other in a lateral direction. Each separating portion defines a fixing portion engaging with the engaging portion of the base, a pair of connecting portions extending from two ends of the fixing portion and towards the diaphragm, and a pair of supporting portions connecting with the connecting portion for engaging with the pair of voice coil members, respectively.

Abstract: The invention features methods of quantifying cells in a sample by lysing the cells followed by the measurement of at least one intracellular component. Methods of the invention are especially useful for quantifying small numbers of cells, e.g., over a large surface area or volume compared to the cell size. In a preferred embodiment, methods of the invention are performed using a microfluidic device.