Abstract: A light-curing 3D printer includes a main-tank, a printing platform, a lighting unit, a liquid material contained in the main-tank, an isolation fluid contained in the main-tank and floating upon the liquid material, a membrane arranged upon the isolation fluid, and an auxiliary mechanism. The 3D printer controls the lighting unit to emit light toward the liquid material according to slicing data of one cured-layer of a 3D model for forming a 3D object. The 3D printer then controls the printing platform to lower and activates the auxiliary mechanism to keep varying the status of the isolation fluid. Next, the 3D printer determines whether the 3D model is completed, and controls the lighting unit to emit light according to slicing data of a next cured-layer if the 3D model is not yet completed.

Abstract: A method for intracellular delivery of single proteins or other cargo molecules by encapsulation within nanocapsules formed by interfacial polymerization of one or more types of monomers and selected protease cleavable cross-linkers is provided. The thin positively charged capsules are readily brought into the cytosol of target cells by endocytosis. The capsules are degraded by the action of endogenous proteases or co-delivered proteases on the cross-linkers releasing the functional cargo unaltered. The cross-linkers can be adapted to be cleavable by specific enzymes selected from available intracellular enzymes within the target cell or co-delivered or self-cleaving when the cargo itself is a protease. The nanocapsules produced by the methods have been shown to have long-term stability, high cell penetration capability, low toxicity and efficient protease-modulated specific degradability without affecting cargo protein function.

Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.

Abstract: In a method of manufacturing a semiconductor device including a field effect transistor (FET), a sacrificial region is formed in a substrate, and a trench is formed in the substrate. A part of the sacrificial region is exposed in the trench. A space is formed by at least partially etching the sacrificial region, an isolation insulating layer is formed in the trench and the space, and a gate structure and a source/drain region are formed. An air spacer is formed in the space under the source/drain region.

Abstract: A testing device for testing an antenna is provided. The testing device includes a housing, an antenna module, and a receiving module. The antenna module is used for holding the antenna and disposed on the housing, wherein the antenna is coupled to an antenna testing apparatus. The receiving module is disposed on the housing and includes a coupling radiation element physically separated from the antenna, wherein the receiving module is configured to receive an excited signal emitted from the antenna.

Abstract: A homogenization apparatus for pepper raw materials, including a base, and an annular storage tank and a stirring barrel fixed to the base. The stirring barrel is positioned under the storage tank, the bottom center of the stirring barrel is fixedly connected to a stationary shaft, the stirring barrel is rotationally drivable to rotate together with the stationary shaft about the axis of the stationary shaft, the stationary shaft extends upward into the storage tank, a sleeve is provided on an outer side of the stationary shaft, the sleeve is rotatably connected to the stationary shaft, so that the stirring barrel rotates relative to the storage tank; a portion of the sleeve accommodated in the stirring barrel is fixedly connected with a stirring part, an upper end of the stationary shaft is fixedly connected with a connecting plate.

Abstract: A signal testing device and a signal testing method are provided. The method includes: obtaining, through a probe, a first frequency response corresponding to a test fixture and a device under test (DUT); obtaining, through the probe, a second frequency response corresponding to the test fixture; and generating a frequency response corresponding to the DUT according to the first frequency response, the second frequency response, a de-embedding algorithm, and an empirical mode decomposition algorithm.

Abstract: The application relates to a raw material mixing apparatus, including mixing drums and a feed pipe, each of the two mixing drums is provided with a feed port and a discharge port, the feed ports of the two mixing drums are both communicated with the feed pipe, and a switching valve is arranged on the feed pipe; a first rotating disc and a second rotating disc are rotatably connected at two ends of the mixing drum respectively, and a stirring assembly is connected between the first rotating disc and the second rotating disc in the axial direction of the mixing drum; the stirring assembly includes a central stirring element and a plurality of non-central stirring elements radially arranged between inner side walls of the mixing drums and outer side walls of the central stirring element.

Abstract: The present disclosure provides compositions and methods for treating a disease or condition in a subject in need thereof, comprising administering to the subject a pharmaceutically effective amount of a composition comprising a plurality of particles comprising at least one therapeutic biologic suspended in a pharmaceutically acceptable liquid carrier.

Abstract: The invention provides enrichment platform devices for size-based capture of particles in solution. The enrichment platform device is useful for label-free capture of any particle. The invention relates to enrichment platform devices using nanowires and vertically aligned carbon nanotubes. The invention provides methods for making the enrichment platform devices. The invention provides methods for using the enrichment platform devices for filtering particles, capturing particles, concentrating particles, and releasing viable particles.

Abstract: The present disclosure provides a semiconductor light-emitting device and a semiconductor light-emitting component. The semiconductor light-emitting device includes a substrate, a first semiconductor contact layer, a semiconductor light-emitting stack including an active layer, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure and a first electrode pad. The first-conductivity-type contact structure is electrically connected to the first semiconductor contact layer. The second-conductivity-type contact structure is electrically connected to the second semiconductor contact layer. The first-conductivity-type contact structure has a first bottom surface and a first top surface, and the active layer has a second bottom surface and a second top surface.

Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.

Abstract: The multi-path copying and pasting method provided by an embodiment of the present disclosure includes: detecting a selection operation made on a to-be-copied content in a first file; outputting a first prompt box in accordance with the selection operation, a first option indicating the addition of the to-be-copied content into a pasting source list and a second option indicating the addition of the to-be-copied content into a target file in a pasting destination list being included in the first prompt box; receiving a first selection operation made on at least one of the first option and the second option; and in response to the first selection operation, adding the to-be-copied content into the pasting source list as a to-be-pasted content, and/or pasting the to-be-copied content to the selected target file.

Abstract: An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.

Abstract: Systems and methods are provided for fabricating a semiconductor device structure. An example semiconductor device structure includes a first device layer, a second device layer and an inter-level connection structure. The first device layer includes a first conductive layer and a first dielectric layer formed on the first conductive layer, the first device layer being formed on a substrate. The second device layer includes a second conductive layer, the second device layer being formed on the first device layer. The inter-level connection structure includes one or more conductive materials and configured to electrically connect to the first conductive layer and the second conductive layer, the inter-level connection structure penetrating at least part of the first dielectric layer. The first conductive layer is configured to electrically connect to a first electrode structure of a first semiconductor device within the first device layer.

Abstract: An online system provides content based on context of host content. The online system allows content providers to define specific context for providing their content for display to users, including specifying categories, format, popularity, and visual appearance of host content eligible for hosting their content. To determine which content a specific content item is eligible for hosting, the online system categories host content items according to specific criteria defined by different content providers for hosting various content. Each content is indexed by classification groups into which the host content items are classified. If a particular content item includes an opportunity for presenting content, the online system identifies content which the particular content item is eligible for hosting. The online system selects one or more identified content for presentation via the opportunity.

Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

Abstract: An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.