Patents by Inventor Yi Yang

Yi Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230395504
    Abstract: Provided are devices with conductive contacts and methods for forming such devices. A method includes forming a lower conductive contact in a dielectric material and over a structure, wherein the lower conductive contact has opposite sidewalls that extend to and terminate at a top surface. The method also includes separating an upper portion of each sidewall from the dielectric material and locating a barrier material between the upper portion of each sidewall and the dielectric material. Further, the method includes forming an upper conductive contact over the lower conductive contact.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu Pei Chen, Chia-Hao Chang, Shin-Yi Yang, Chia-Hung Chu, Po-Chin Chang, Shuen-Shin Liang, Chun-Hung Liao, Yuting Cheng, Hung-Yi Huang, Harry Chien, Pinyen Lin, Sung-Li Wang
  • Publication number: 20230396286
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first user equipment (UE) may receive, from abase station, a set of sidelink frequency hopping parameters. The first UE may transmit, to a second UE via a sidelink interface, a frequency hopping configuration for sidelink reference signaling by the second UE, wherein the frequency hopping configuration is based at least in part on the set of sidelink frequency hopping parameters. Numerous other aspects are provided.
    Type: Application
    Filed: December 9, 2021
    Publication date: December 7, 2023
    Inventors: Alexandros MANOLAKOS, Wei YANG, Yi HUANG, Seyedkianoush HOSSEINI
  • Publication number: 20230389969
    Abstract: A bone screw kit includes a support member, a screw, an extension sleeve, a connecting rod, a locking screw, a screw driver and an extension sleeve remover. The support member has two wings. An external wall of one axial end of the screw driver has ribs and one first snap. The first snap has oppositely a first outer diameter and a second outer diameter less than the first outer diameter. A through hole having a second snap is disposed on the locking screw furnished thereinside with grooves. The second snap has a first inner diameter less than the first outer diameter but larger than the second outer diameter. The locking screw and the screw driver are disposed in the support member and the extension sleeve. The extension sleeve having two extension wings sleeves the support member. Engagement structures are provide to engage the wing and the inner extension wing.
    Type: Application
    Filed: September 8, 2022
    Publication date: December 7, 2023
    Inventors: JUNG-TSOU TUNG, HAO-YUN TUNG, CHANG-YI KUO, WEI-HAN CENG, CHI-YEN YANG
  • Publication number: 20230395445
    Abstract: In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer. The conductive metal electrically couples the first side of the glass core layer and the second side of the glass core layer. The substrate also includes a dielectric material between the conductive metal and the inside surfaces of the holes of the glass core layer.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 7, 2023
    Applicant: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Suddhasattwa Nad, Yi Yang, Benjamin T. Duong, Junxin Wang, Sameer R. Paital
  • Publication number: 20230395468
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Application
    Filed: August 2, 2023
    Publication date: December 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Publication number: 20230395467
    Abstract: In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer. The conductive metal electrically couples the first side of the glass core layer and the second side of the glass core layer. The substrate also includes a dielectric material between the conductive metal and the inside surfaces of the holes of the glass core layer.
    Type: Application
    Filed: June 6, 2022
    Publication date: December 7, 2023
    Applicant: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Jeremy D. Ecton, Brandon Christian Marin, Gang Duan, Suddhasattwa Nad, Yi Yang, Benjamin T. Duong, Junxin Wang, Sameer R. Paital
  • Publication number: 20230395025
    Abstract: Provided is a pixel circuit configured to drive, in an Xth frame period, a light emitting device to emit light. The Xth frame period includes Y data writing stages and Z light emitting stages, in which a yth data writing stage includes a first sub-stage to a third sub-stage. The pixel circuit includes: a driving transistor; a first reset module configured to transmit, in the first sub-stage, a first initialization signal to the driving transistor in response to a first scanning signal; a gating module configured to perform, in the second sub-stage, a threshold compensation on the driving transistor in response to a second scanning signal; and an input module configured to transmit, in the third sub-stage, a data signal to the driving transistor in response to a third scanning signal. X, Y, Z and y are positive integers, y?Y, and Y>Z.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 7, 2023
    Inventors: Tingliang Liu, Lingtong Li, Huijuan Yang, Xiaoqing Shu, Liheng Wei, Maoying Liao, Yi Zhang, Yixuan Long, Nanhao Chen, Peng Xu
  • Publication number: 20230390353
    Abstract: The present invention provides a pharmaceutical composition for treating myocardial ischemia, comprising Salvia Miltiorrhiza medicinal material 250-700 parts by weight, Radix Notoginseng medicinal material 50-150 parts by weight, Borneolum Syntheticum 3-9 parts by weight, and ranolazine 25-100 parts by weight. According to a further aspect of the present invention, there is provided a use of a pharmaceutical composition for preparation of a medicine for prevention and/or treatment of myocardial ischemia.
    Type: Application
    Filed: September 5, 2022
    Publication date: December 7, 2023
    Inventors: He SUN, Kaijing YAN, Xiaohui MA, Shunnan ZHANG, Yi HE, Haoshu XIONG, Yongfeng ZHENG, Xinxin LI, Hongbo ZHANG, Yanmei LI, Jing WANG, Tiantian WEN, Zhipeng HUO, Lijun FAN, Wei SUN, Jianchun WANG, Nan CAI, Rui YANG, Jingjing ZHANG
  • Publication number: 20230390747
    Abstract: Disclosed is a catalyst useful for producing organic amines by catalytic amination, its preparation and application thereof, wherein the catalyst comprises an inorganic porous carrier containing aluminum and/or silicon and an active metal component supported on the carrier, the active metal component comprises at least one metal selected from the group consisting of Group VIII and Group IB metals, and the carrier has an ammonia adsorption capacity of 0.25 to 0.65 mmol/g, as measured by NH3-TPD test. The catalyst has an improved performance, when used for producing organic amines by catalytic amination.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 7, 2023
    Inventors: Baoliang TIAN, Guoqi TANG, Liangyu XIANG, Xiaorong ZHANG, Guoqing WANG, Hui PENG, Yi YANG, Lijun ZHANG, Chao SONG, Jianzhun JIANG, Yi MAN
  • Patent number: 11838893
    Abstract: Methods, systems, and devices for wireless communications are described for relayed sidelink communications in which a set of relays receives a groupcast sidelink communication from a source and relay the communication to a destination using cooperative multiple-input multiple-output (MIMO) techniques. A source, such as a source user equipment (UE), may reserve resources for the groupcast sidelink communication and the cooperative MIMO transmissions, and may transmit a resource reservation message with an indication of the reserved resources. The resource reservation message may be transmitted in a sidelink control information transmission, in a medium access control message, or any combinations thereof. In the event of a collision in reserved resources of multiple different sources, the sources or relays may determine a priority of each communication and transmit a selected communication based on the priority determination.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Wei Yang, Seyedkianoush Hosseini, Peter Gaal, Wanshi Chen, Tingfang Ji, Krishna Kiran Mukkavilli, Hwan Joon Kwon
  • Patent number: 11835669
    Abstract: A method of normalizing detector elements in an imaging system is described herein. The method includes a line source that is easier to handle for a user, and decouples the normalization of the detector elements into a transaxial domain and an axial domain in order to isolate errors due to positioning of the line source. Additional simulations are performed to augment the real scanner normalization. A simulation of a simulated line source closely matching the real line source can be performed to isolate errors due to physical properties of the crystals and position of the crystals in the system, wherein the simulated detector crystals are otherwise modeled uniformly. A simulation of a simulated cylinder source can be performed to determine errors due to other effects stemming from gaps between the detector crystals.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: December 5, 2023
    Assignee: CANON MEDICAL SYSTEMS CORPORATION
    Inventors: Wenyuan Qi, Yi Qiang, Evren Asma, Xiaoli Li, Li Yang, Peng Peng, Jeffrey Kolthammer
  • Patent number: 11838750
    Abstract: Methods, systems, and devices for wireless communications are described. Wireless communications systems may employ one or more scheduling constraints to support efficient utilization of techniques for intra-device handling of overlapping scheduled uplink transmissions (e.g., intra-device dynamic resource cancelation and multiplexing) as well as inter-device handling of overlapping scheduled uplink transmissions (e.g., inter-device dynamic resource cancelation and multiplexing). Scheduling constraints may define how a device may apply intra-device and inter-device multiplexing and cancelation rules for various scenarios. For example, a device may apply intra-UE cancelation rules before inter-device cancelation rules. In some examples, later-received grants or uplink preemption indications (ULPIs) may not change a device's previously established decision to drop an uplink transmission.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Wei Yang, Seyedkianoush Hosseini, Peter Gaal, Wanshi Chen, Yi Huang
  • Patent number: 11838083
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive a configuration signal indicating a codebook construction configuration for constructing a codebook of sequences for conveying a first type of uplink payload in a resource block that is orthogonal to a second type of uplink payload transmitted from a second UE in the resource block. The UE may construct the codebook of sequences for the first type of uplink payload according to the codebook construction configuration. The UE may generate the first type of uplink payload for transmission using a first sequence from the codebook of sequences. The UE may transmit the first type of uplink payload in the resource block, wherein the first type of uplink payload is multiplexed in the resource block with the second type of uplink payload from the second UE.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: December 5, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Peter Gaal, Wei Yang, Tingfang Ji, Hwan Joon Kwon, Krishna Kiran Mukkavilli, Wanshi Chen
  • Patent number: 11838376
    Abstract: Systems and methods provide for scaling service discovery in a micro-service environment. A controller can inject a service discovery agent onto a host. At least one of the controller or the agent can identify a first set of micro-service containers that are dependencies of the first micro-service container and a second set of micro-service containers that are dependencies of the second micro-service container. At least one of the controller or the agent can update routing data for the first set of micro-service containers and the second set of micro-service containers. At least one of the controller or the agent can determine the second micro-service container has terminated on the host computing device. At least one of the controller or the agent can update the agent to remove the routing data for the second set of micro-service containers.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: December 5, 2023
    Assignee: Cisco Technology, Inc.
    Inventors: Yi Yang, Wojciech Dec, Syed Basheeruddin Ahmed, Sanjay Agrawal, Ruchir Gupta
  • Publication number: 20230389436
    Abstract: An ultra-large height top electrode for MRAM is achieved by employing a novel thin metal/thick dielectric/thick metal hybrid hard mask stack. Etching parameters are chosen to etch the dielectric quickly but to have an extremely low etch rate on the metals above and underneath. Because of the protection of the large thickness of the dielectric layer, the ultra-large height metal hard mask is etched with high integrity, eventually making a large height top electrode possible.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 30, 2023
    Inventors: Yi Yang, Yu-Jen Wang
  • Publication number: 20230381757
    Abstract: Disclosed are a catalyst useful for producing organic amines by catalytic amination its preparation and application thereof, which catalyst comprising an inorganic porous carrier containing aluminum and/or silicon, and an active metal component supported on the carrier, the active metal component comprising at least one metal selected from Group VIII and Group IB metals, wherein the carrier has an L acid content of 85% or more relative to the total of the L acid and B acid contents. The catalyst shows an improved catalytic performance when used for producing organic amines by catalytic amination.
    Type: Application
    Filed: October 26, 2021
    Publication date: November 30, 2023
    Inventors: Baoliang TIAN, Guoqing WANG, Hui PENG, Guoqi TANG, Liangyu XIANG, Yi YANG, Lijun ZHANG, Chao SONG, Xiaorong ZHANG, Song CHEN, Jing LIU
  • Publication number: 20230387100
    Abstract: A method includes forming a redistribution structure including metallization patterns; attaching a semiconductor device to a first side of the redistribution structure; encapsulating the semiconductor device with a first encapsulant; forming openings in the first encapsulant, the openings exposing a metallization pattern of the redistribution structure; forming a conductive material in the openings, comprising at least partially filling the openings with a conductive paste; after forming the conductive material, attaching integrated devices to a second side of the redistribution structure; encapsulating the integrated devices with a second encapsulant; and after encapsulating the integrated devices, forming a pre-solder material on the conductive material.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Chang-Yi Yang, Po-Yao Chuang, Shin-Puu Jeng
  • Publication number: 20230384438
    Abstract: An electronic device and/or an operation method of an electronic device may be provided.
    Type: Application
    Filed: August 15, 2023
    Publication date: November 30, 2023
    Inventors: Hyunchul KIM, Moonseok KANG, Yi YANG, Jonghoon JANG, Sukgi HONG
  • Publication number: 20230385252
    Abstract: An approach is provided that retrieves fingerprint configuration sets corresponding to a received data source and uses the configuration sets to generate fingerprints that correspond to the data source. These fingerprints are compared to a number of fingerprints that are stored in a repository. If a match is found, then the data quality configuration set is retrieved from the repository and used to perform a data quality analysis. On the other hand, if a match is not found, then one of the configuration sets is selected to perform the data quality analysis on the received data source and the repository is updated so that the selected fingerprint configuration set corresponds to the received data source.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Inventors: Xu Bin Cai, Wei Wang, Chun Hua Sun, Chun Leng, Pin Lv, Yi Yang Ren, Jian Ling Shi, YI WANG, Tao Zhuang
  • Publication number: 20230387018
    Abstract: A method includes forming a trench within a dielectric layer, the trench comprising an interconnect portion and a via portion, the via portion exposing an underlying conductive feature. The method further includes depositing a seed layer within the trench, depositing a carbon layer on the seed layer, performing a carbon dissolution process to cause a graphene layer to form between the seed layer and the underlying conductive feature, and filling a remainder of the trench with a conductive material.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 30, 2023
    Inventors: Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue