Patents by Inventor Yi Yang

Yi Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240146721
    Abstract: A mechanism for building decentralized computer applications that execute on a distributed computing system. The present technology works within a web browser, client application, or other software and provides access to decentralized computer applications through the browser. The present technology is non-custodial, wherein a public-private key pair, which represents user identity, is created on a client machine and then directly encrypted by a third-party platform without relying on one centralized computing system.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Fei-Yang Jen, Yi Wei Chen, Jaemin Jin, Hanyu Xue, Wentao Liu, Shang Li
  • Publication number: 20240145381
    Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
  • Publication number: 20240145389
    Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.
    Type: Application
    Filed: July 28, 2023
    Publication date: May 2, 2024
    Inventors: Li-Chiu WENG, Yew Teck TIEO, Ming-Hsuan WANG, Chia-Cheng CHEN, Wei-Yi CHANG, Jen-Hang YANG, Chien-Hsiung HSU
  • Publication number: 20240145868
    Abstract: Provided a separator, a preparation method thereof, and a secondary battery, a battery module, a battery pack, and an electric apparatus containing such separator. The separator includes: a substrate and a coating applied on at least one surface of the substrate, where the coating includes 40 wt % to 90 wt % first organic particles, 2 wt % to 15 wt % pressure-sensitive binder, and optionally 0 wt % to 50 wt % second organic particles. The first organic particles include an organic polymer and an inorganic substance. The pressure-sensitive binder includes an organic polymer and a plasticizer. The separator has good ionic conductivity and adhesion performance at room temperature, is not adhered under a pressure of 1 MPa or below and is significantly adhered under a pressure of 2 MPa or above, which can significantly improve structural stability and ionic conductivity of an electrochemical device while satisfying requirements for yield rate of production and kinetic performance of a battery cell.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 2, 2024
    Inventors: Haiyi Hong, Jianrui Yang, Haiyang Kang, Chengdong Sun, Yi Zheng, Lei Chao
  • Patent number: 11972368
    Abstract: Methods, systems, computer program products for determining the source of activity during interaction with a user interface are provided. The method comprises selecting one or more input devices from a plurality of available input devices coupled to the user interface and receiving respective measurements for the selected one or more input devices. Based on the received respective measurements, respective feature vectors for the one or more input devices are generated and then inputted to a pre-defined regression model. Then, the source of activity is determined based on a result received from the regression model.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: April 30, 2024
    Assignee: International Business Machines Corporation
    Inventors: Liang LL Lu, Sun Chun Hua, Jian Ling Shi, Yi Yang Ren
  • Patent number: 11971862
    Abstract: In one embodiment, a method includes receiving a first network event corresponding to a first transaction, the first network event being assigned a unique transaction group identifier, authorizing the first transaction based on a balance value of a ledger account recorded in an account ledger, recording a first update in the account ledger, comprising recording the unique transaction group identifier in association with the first update and the ledger account and modifying the balance value of the ledger account, receiving a second network event corresponding to a second transaction, determining that a unique transaction group identifier assigned to the second network event matches the unique transaction group identifier associated with the first update and the ledger account, and recording a second update in the account ledger, comprising recording the unique transaction group identifier in association with the second update without modifying the balance value of the ledger account.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: April 30, 2024
    Assignee: Lithic, Inc.
    Inventors: Yi Lun Han, Ian Boynton, Xiaojing Yang
  • Patent number: 11969727
    Abstract: Present invention is related to a tumor microenvironment on chip or a biochip for cell therapy having a carrier, a first cell or tissue culture area and a second cell or tissue area imbedded within the carrier. The present invention provides a biochip successfully cooperating micro fluidic technology and cell culture achieving the goal for detecting or testing the function of cell therapy for cancer or tumor.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: April 30, 2024
    Assignees: China Medical University, China Medical University Hospital
    Inventors: Yi-Wen Chen, Ming-You Shie, Der-Yang Cho, Shao-Chih Chiu, Kai-Wen Kan, Chien-Chang Chen
  • Patent number: 11974478
    Abstract: An array substrate includes a first pixel driving circuit, a second pixel driving circuit, and a third pixel driving circuit; and a first voltage supply line, a second voltage supply line, and a third voltage supply line configured to provide a constant voltage signal respectively to the first pixel driving circuit, the second pixel driving circuit, and the third pixel driving circuit. The first voltage signal line crosses over a second capacitor electrode in the first pixel driving circuit by a first overlapping area. The second voltage supply line crosses over a second capacitor electrode in the second pixel driving circuit by a second overlapping area. The third voltage supply line crosses over a second capacitor electrode in the third pixel driving circuit by a third overlapping area. The third overlapping area is greater than the first overlapping area, and is greater than the second overlapping area.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: April 30, 2024
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Tinghua Shang, Huijuan Yang, Tingliang Liu, Yi Zhang, Hao Zhang, Lulu Yang, Yang Zhou, Xiaofeng Jiang
  • Patent number: 11974286
    Abstract: Aspects of the present disclosure relate to wireless communications, and more particularly, to techniques for allowing for the coexistence of legacy and non-legacy PUCCH formats. An example method generally includes generating a first orthogonal sequence for a first payload for a physical uplink control channel (PUCCH) to be transmitted; generating a second orthogonal sequence for a second payload for the PUCCH to be transmitted; mapping the first orthogonal sequence to a first set of virtual resources and the second orthogonal sequence to a second set of virtual resources; mapping the first set of virtual resources to a first set of physical resources and the second set of virtual resources to a second set of physical resources; and transmitting the first and second payloads for the PUCCH on the first and second sets of physical resources.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: April 30, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Peter Gaal, Wei Yang, Tingfang Ji, Hwan Joon Kwon, Krishna Kiran Mukkavilli
  • Patent number: 11974276
    Abstract: Methods, systems, and devices for wireless communications are described. A first user equipment (UE) may receive, from a base station, control signaling indicating a set of resources of a sidelink channel available for sidelink communication with a second UE. The first UE may receive a sidelink preemption indication indicating that at least a first resource from the set of resources is preempted. The first UE may communicate a sidelink transmission over the sidelink channel with the second UE based on the sidelink preemption indication. In some cases, the first UE may determine whether the SPI satisfies one or more thresholds and the first UE may communicate the sidelink transmission, or refrain from communicating the sidelink transmission, based on determining whether the SPI satisfies the one or more thresholds.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: April 30, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Seyedkianoush Hosseini, Peter Gaal, Wanshi Chen, Wei Yang, Juan Montojo, Hwan Joon Kwon, Yi Huang, Krishna Kiran Mukkavilli, Tugcan Aktas
  • Publication number: 20240134837
    Abstract: Implementations of this specification provide methods and apparatuses for generating index entries. One method includes: acquiring a first sequence number of front large object data that is adjacent to a target data to be inserted in a large object data, wherein the first sequence number is generated based on a first code arrangement sequence and is comprised in a first index entry corresponding to the front large object data, in response to determining that the second sequence number immediately following the first sequence number is occupied, determining, based on a second code arrangement sequence, a branch index sequence number for the target data, and adding an index entry comprising the branch index sequence number to an index of the large object data, wherein the index entry is added between the first index entry comprising the first sequence number and a second index entry comprising the second sequence number.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Applicant: Beijing OceanBase Technology Co., Ltd.
    Inventors: Zhenkun Yang, Yi Zhang, Hongdi Luo
  • Patent number: 11968908
    Abstract: In an embodiment, a method includes: forming a first inter-metal dielectric (IMD) layer over a semiconductor substrate; forming a bottom electrode layer over the first IMD layer; forming a magnetic tunnel junction (MTJ) film stack over the bottom electrode layer; forming a first top electrode layer over the MTJ film stack; forming a protective mask covering a first region of the first top electrode layer, a second region of the first top electrode layer being uncovered by the protective mask; forming a second top electrode layer over the protective mask and the first top electrode layer; and patterning the second top electrode layer, the first top electrode layer, the MTJ film stack, the bottom electrode layer, and the first IMD layer with an ion beam etching (IBE) process to form a MRAM cell, where the protective mask is etched during the IBE process.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tai-Yen Peng, Hui-Hsien Wei, Han-Ting Lin, Sin-Yi Yang, Yu-Shu Chen, An-Shen Chang, Qiang Fu, Chen-Jung Wang
  • Patent number: 11967611
    Abstract: A multilayer structure, a capacitor structure and an electronic device are provided. The multilayer structure includes a first dielectric layer, a second dielectric layer and an intermediate dielectric layer. The intermediate dielectric layer is disposed between the first dielectric layer and the second dielectric layer. A material of the intermediate dielectric layer is represented by a formula of AxB1-xO, wherein A includes hafnium (Hf), zirconium (Zr), lanthanum (La) or tantalum (Ta), B includes lanthanum (La), aluminum (Al) or tantalum (Ta), A is different from B, O is oxygen, and x is a number less than 1 and greater than 0.
    Type: Grant
    Filed: May 30, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hai-Dang Trinh, Yi Yang Wei, Fa-Shen Jiang, Bi-Shen Lee, Hsun-Chung Kuang
  • Patent number: 11967272
    Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: April 23, 2024
    Assignees: AUO Corporation, National Cheng-Kung University
    Inventors: Chih-Lung Lin, Yi-Chen Huang, Chih-I Liu, Po-Cheng Lai, Ming-Yang Deng, Chia-En Wu, Ming-Hung Chuang, Chia-Tien Peng
  • Patent number: 11968206
    Abstract: A mechanism for building decentralized computer applications that execute on a distributed computing system. The present technology works within a web browser, client application, or other software and provides access to decentralized computer applications through the browser. The present technology is non-custodial, wherein a public-private key pair, which represents user identity, is created on a client machine and then directly encrypted by a third-party platform without relying on one centralized computing system.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: April 23, 2024
    Assignee: Magic Labs, Inc.
    Inventors: Fei-Yang Jen, Yi Wei Chen, Jaemin Jin, Hanyu Xue, Wentao Liu, Shang Li
  • Patent number: 11968066
    Abstract: The embodiments of the present disclosure disclose a method for uplink multiuser data transmission and a system for uplink multiuser multiple input multiple output. The method includes: sending, by an access point AP, indication information to at least two stations STAs, wherein the indication information is used for indicating that the at least two STAs perform an uplink multiuser data transmission; receiving, by the AP, uplink data sent by the at least two STAs through channels from the at least two STAs to the AP, respectively; and demodulating, by the AP, the uplink data sent by the at least two STAs using receiving beams corresponding to pre-estimated channels from the at least two STAs to the AP, respectively.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 23, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Xun Yang, Yi Luo
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Publication number: 20240128876
    Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.
    Type: Application
    Filed: June 15, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Fu-Ciao Syu, Chia-Hsien Yang, Hsin-Yi Wu
  • Publication number: 20240124298
    Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
  • Publication number: 20240130050
    Abstract: An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Inventors: Cheng-Yi Yang, Hao-Wen Zhong, Biao Li, Ming-Jaan Ho, Ning Hou