Patents by Inventor Ying Hao
Ying Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071535Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.Type: ApplicationFiled: October 16, 2022Publication date: February 29, 2024Applicant: United Microelectronics Corp.Inventors: Chung-Hao Chen, Chi-Hsiu Hsu, Chi-Fa Lien, Ying-Ting Lin, Cheng-Hsiao Lai, Ya-Nan Mou
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Publication number: 20240069067Abstract: A test device includes a power compensation module and a test module. The power compensation module receives AC power generated by a device under test to generate DC power to the device under test. The test module provides a plurality of test signals and a test mode to the device under test for testing the device under test.Type: ApplicationFiled: December 5, 2022Publication date: February 29, 2024Inventors: Wei-Chih HUNG, Ying-Ping CHIANG, Yu-Ren RUAN, Chia-Hao WU
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Patent number: 11913876Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.Type: GrantFiled: August 10, 2022Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chia-Jung Chang, Jui-Hung Tsai, Ying-Hao Wang, Chih-Hao Hsu
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Patent number: 11913925Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.Type: GrantFiled: December 17, 2020Date of Patent: February 27, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Che Lo, Yu-Sheng Lin, Po-Jen Su, Ting-Hao Hsiao
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Patent number: 11900160Abstract: Methods, non-transitory machine readable media, and computing devices that more efficiently and effectively manage storage quota enforcement are disclosed. With this technology, a quota ticket comprising a tally generation number (TGN) and a local allowed usage amount (AUA) are obtained. The local AUA comprises a portion of a global AUA associated with a quota rule. The local AUA is increased following receipt of another portion of the global AUA in a response from a cluster peer, when another TGN in the response matches the TGN and the local AUA is insufficient to execute a received storage operation associated with the quota rule. The local AUA is decreased by an amount corresponding to, and following execution of, the storage operation, when the increased local AUA is sufficient to execute the storage operation.Type: GrantFiled: May 13, 2022Date of Patent: February 13, 2024Assignee: NETAPP, INC.Inventors: Xin Wang, Keith Allen Bare, II, Ying-Hao Wang, Jonathan Westley Moody, Bradley Raymond Lisson, Richard Wight, David Loren Rose, Richard P. Jernigan, IV, Daniel Tennant
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Publication number: 20240035224Abstract: The embodiments are and include an apparatus, system and method for a liquid level monitoring dispenser for association with a liquid filled consumable. The apparatus, system and method may include: a receiver for receiving the consumable upon inversion thereof; at least one electrical contact within the receiver for communicative association with conductive strips on the consumable; a sensing module communicative with the at least one electrical contact and having associated therewith firmware for converting signals associated with the conductive strips and received at the electrical contact to an indication of the liquid level; a communications module for communicating the liquid level to at least a user display and over at least one network; a power module for powering at least the sensing module and the communications module; and at least one dispensing output in fluid communication with the consumable and capable of dispensing the liquid from the consumable to modify the liquid level.Type: ApplicationFiled: October 12, 2023Publication date: February 1, 2024Inventors: Amanda Williams, Julio Danel Oropeza, Yu-Chang Lee, Ying Hao Lee, Martin Johnson, Marc Theeuwes, Stefan Vaes, Toon Diels
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Publication number: 20230405643Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.Type: ApplicationFiled: July 31, 2023Publication date: December 21, 2023Inventors: Ying-Hao Wang, Chien-Lung Chen, Chia-Han Chuang, Jhe-Hong Wang, Chien-Chi Tzeng
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Publication number: 20230402478Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.Type: ApplicationFiled: August 9, 2023Publication date: December 14, 2023Inventors: Yun-Wei CHENG, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
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Publication number: 20230386875Abstract: An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.Type: ApplicationFiled: January 31, 2023Publication date: November 30, 2023Inventors: Ying-Hao WANG, Chien-Lung CHEN, Wei-Hao CHEN, Chien-Chi TZENG, Hu-Wei LIN
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Publication number: 20230387304Abstract: A device including a gate stack over a semiconductor substrate having a pair of spacers abutting sidewalls of the gate stack. A recess is formed in the semiconductor substrate adjacent the gate stack. The recess has a first profile having substantially vertical sidewalls and a second profile contiguous with and below the first profile. The first and second profiles provide a bottle-neck shaped profile of the recess in the semiconductor substrate, the second profile having a greater width within the semiconductor substrate than the first profile. The recess is filled with a semiconductor material. A pair of spacers are disposed overly the semiconductor substrate adjacent the recess.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Inventors: Eric PENG, Chao-Cheng CHEN, Chii-Horng LI, Ming-Hua YU, Shih-Hao LO, Syun-Ming JANG, Tze-Liang LEE, Ying-Hao HSIEH
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Publication number: 20230377910Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.Type: ApplicationFiled: May 23, 2022Publication date: November 23, 2023Inventors: Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Meng-Fu Shih, Hu-Wei Lin
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Patent number: 11824120Abstract: A device including a gate stack over a semiconductor substrate having a pair of spacers abutting sidewalls of the gate stack. A recess is formed in the semiconductor substrate adjacent the gate stack. The recess has a first profile having substantially vertical sidewalls and a second profile contiguous with and below the first profile. The first and second profiles provide a bottle-neck shaped profile of the recess in the semiconductor substrate, the second profile having a greater width within the semiconductor substrate than the first profile. The recess is filled with a semiconductor material. A pair of spacers are disposed overly the semiconductor substrate adjacent the recess.Type: GrantFiled: August 27, 2021Date of Patent: November 21, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Eric Peng, Chao-Cheng Chen, Chii-Horng Li, Ming-Hua Yu, Shih-Hao Lo, Syun-Ming Jang, Tze-Liang Lee, Ying-Hao Hsieh
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Patent number: 11807978Abstract: The embodiments are and include an apparatus, system and method for a liquid level monitoring dispenser for association with a liquid filled consumable. The apparatus, system and method may include: a receiver for receiving the consumable upon inversion thereof; at least one electrical contact within the receiver for communicative association with conductive strips on the consumable; a sensing module communicative with the at least one electrical contact and having associated therewith firmware for converting signals associated with the conductive strips and received at the electrical contact to an indication of the liquid level; a communications module for communicating the liquid level to at least a user display and over at least one network; a power module for powering at least the sensing module and the communications module; and at least one dispensing output in fluid communication with the consumable and capable of dispensing the liquid from the consumable to modify the liquid level.Type: GrantFiled: March 21, 2022Date of Patent: November 7, 2023Assignee: Nypro Inc.Inventors: Amanda Williams, Julio Danel Oropeza, Yu-Chang Lee, Ying Hao Lee, Martin Johnson, Marc Theeuwes, Stefan Vaes, Toon Diels
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Patent number: 11810933Abstract: A method for fabricating an image sensor device is provided. The method includes forming a plurality of photosensitive pixels in a substrate; depositing a dielectric layer over the substrate; etching the dielectric layer, resulting in a first trench in the dielectric layer and laterally surrounding the photosensitive pixels; and forming a light blocking structure in the first trench, such that the light blocking structure laterally surrounds the photosensitive pixels.Type: GrantFiled: September 2, 2020Date of Patent: November 7, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Feng-Chien Hsieh, Yun-Wei Cheng, Wei-Li Hu, Kuo-Cheng Lee, Ying-Hao Chen
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Publication number: 20230351577Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.Type: ApplicationFiled: April 27, 2022Publication date: November 2, 2023Inventors: I-Hsuan Chen, Ying-Hao Wang, Chien-Lung Chen, Chien-Chi Tzeng, Hu-Wei Lin
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Patent number: 11798969Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.Type: GrantFiled: June 15, 2022Date of Patent: October 24, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
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Publication number: 20230330710Abstract: An embodiment system, configured to clean a semiconductor package assembly, may include a sprayer device including a plurality of nozzles configured to direct a pressurized cleaning fluid toward the semiconductor package assembly; a conveyor configured to move the semiconductor package assembly relative to the sprayer device along a first direction; and a dryer spatially displaced from the sprayer device and configured to direct a pressurized gas flow toward the semiconductor package assembly to remove cleaning fluid introduced by the sprayer device. Each of the plurality of nozzles may be displaced from one another along a second direction to thereby generate respective separate spray distribution patterns. Adjacent nozzles may be further displaced from one another along a third direction to thereby a reduce an overlap of adjacent spray distribution patterns relative to a configuration in which the adjacent nozzles are not displaced from one another along the third direction.Type: ApplicationFiled: April 19, 2022Publication date: October 19, 2023Inventors: Ying-Hao Wang, Chien-Lung Chen, Chia-Han Chuang, Jhe-Hong Wang, Chien-Chi Tzeng
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Patent number: 11769780Abstract: An image sensor with stress adjusting layers and a method of fabrication the image sensor are disclosed. The image sensor includes a substrate with a front side surface and a back side surface opposite to the front side surface, an anti-reflective coating (ARC) layer disposed on the back side surface of the substrate, a dielectric layer disposed on the ARC layer, a metal layer disposed on the dielectric layer, and a stress adjusting layer disposed on the metal layer. The stress adjusting layer includes a silicon-rich oxide layer. The concentration profiles of silicon and oxygen atoms in the stress adjusting layer are non-overlapping and different from each other. The image sensor further includes oxide grid structure disposed on the stress adjusting layer.Type: GrantFiled: July 23, 2020Date of Patent: September 26, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Feng-Chien Hsieh, Kuo-Cheng Lee, Ying-Hao Chen, Yun-Wei Cheng
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Publication number: 20230253284Abstract: The present disclosure describes heat dissipation structures formed in functional or non- functional areas of a three-dimensional chip structure. These heat dissipation structures are configured to route the heat generated within the three-dimensional chip structure to designated areas on or outside the three-dimensional chip structure. For example, the three-dimensional chip structure can include a plurality of chips vertically stacked on a substrate, a first passivation layer interposed between a first chip and a second chip of the plurality of chips, and a heat dissipation layer embedded in the first passivation layer and configured to allow conductive structures to pass through.Type: ApplicationFiled: April 19, 2023Publication date: August 10, 2023Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yun-Wei CHENG, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
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Publication number: 20230220314Abstract: Disclosed herein is a decontaminant aqueous solution for decontaminating diisocyanate drum, including 20-97 wt % of at least one alcohol or derivative thereof, based on the total weight of decontaminant aqueous solution, and an alkaline source in an amount effective to provide the solution a pH of at least 8. Further disclosed herein is a method for decontaminating diisocyanate residues in an emptied drum with the decontaminant aqueous solution.Type: ApplicationFiled: April 21, 2021Publication date: July 13, 2023Inventors: Kang HAN, Xiao Qing LV, Zhi Zhong TANG, Xiu Zhi ZHANG, Ying-Hao LIU, Chuan Gang ZHU, Jian Hong LIANG, Hu ZENG