Patents by Inventor Ying Hao

Ying Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310677
    Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 29, 2022
    Inventors: Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
  • Publication number: 20220282421
    Abstract: The embodiments are and include an apparatus, system and method for a liquid level monitoring dispenser for association with a liquid filled consumable. The apparatus, system and method may include: a receiver for receiving the consumable upon inversion thereof; at least one electrical contact within the receiver for communicative association with conductive strips on the consumable; a sensing module communicative with the at least one electrical contact and having associated therewith firmware for converting signals associated with the conductive strips and received at the electrical contact to an indication of the liquid level; a communications module for communicating the liquid level to at least a user display and over at least one network; a power module for powering at least the sensing module and the communications module; and at least one dispensing output in fluid communication with the consumable and capable of dispensing the liquid from the consumable to modify the liquid level.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 8, 2022
    Applicant: Nypro Inc.
    Inventors: Amanda Williams, Julio Danel Oropeza, Yu-Chang Lee, Ying Hao Lee, Martin Johnson, Marc Theeuwes, Stefan Vaes, Toon Diels
  • Publication number: 20220269541
    Abstract: Methods, non-transitory machine readable media, and computing devices that more efficiently and effectively manage storage quota enforcement are disclosed. With this technology, a quota ticket comprising a tally generation number (TGN) and a local allowed usage amount (AUA) are obtained. The local AUA comprises a portion of a global AUA associated with a quota rule. The local AUA is increased following receipt of another portion of the global AUA in a response from a cluster peer, when another TGN in the response matches the TGN and the local AUA is insufficient to execute a received storage operation associated with the quota rule. The local AUA is decreased by an amount corresponding to, and following execution of, the storage operation, when the increased local AUA is sufficient to execute the storage operation.
    Type: Application
    Filed: May 13, 2022
    Publication date: August 25, 2022
    Inventors: Xin WANG, Keith Allen Bare, II, Ying-Hao Wang, Jonathan Westley Moody, Bradley Raymond Lisson, Richard Wight, David Loren Rose, Richard P. Jernigan, IV, Daniel Tennant
  • Patent number: 11415762
    Abstract: A method of forming an optical bench includes forming a reflector layer over a sloping side of a substrate. The method includes depositing a redistribution layer over the substrate. The method includes disposing an under bump metallization (UBM) layer over the redistribution layer. The method includes forming a passivation layer over the redistribution layer and surrounding sidewalls of the UBM layer. The method includes mounting a first optical component over an uppermost portion of the substrate, wherein the reflector layer is configured to reflect an electromagnetic wave from the first optical component, and the first optical component is mounted outside the trench.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ying-Hao Kuo, Shang-Yun Hou, Wan-Yu Lee
  • Patent number: 11367745
    Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: June 21, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
  • Patent number: 11354160
    Abstract: Methods, non-transitory machine readable media, and computing devices that more efficiently and effectively manage storage quota enforcement are disclosed. With this technology, a quota ticket comprising a tally generation number (TGN) and a local allowed usage amount (AUA) are obtained. The local AUA comprises a portion of a global AUA associated with a quota rule. The local AUA is increased following receipt of another portion of the global AUA in a response from a cluster peer, when another TGN in the response matches the TGN and the local AUA is insufficient to execute a received storage operation associated with the quota rule. The local AUA is decreased by an amount corresponding to, and following execution of, the storage operation, when the increased local AUA is sufficient to execute the storage operation.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: June 7, 2022
    Assignee: NETAPP, INC.
    Inventors: Xin Wang, Keith Allen Bare, II, Ying-Hao Wang, Jonathan Westley Moody, Bradley Raymond Lisson, Richard Wight, David Loren Rose, Richard P. Jernigan, IV, Daniel Tennant
  • Publication number: 20220172986
    Abstract: A method for manufacturing a semiconductor device includes forming a metal layer in a substrate and sequentially forming a barrier layer and an insulating layer on the substrate. The method includes performing a first etching step to form an opening in the insulating layer, and the opening does not expose the barrier layer. After the first etching step, a gap-filling layer is formed on the insulating layer and fills the opening. The method includes performing a second etching step to form a first via communicating with the opening in the gap-filling layer, and an upper portion of the opening is widened to form a trench. The method includes performing a third etching step to remove the gap-filling layer in a bottom of the opening and to deepen both the trench and the opening. The method includes forming a second via communicating with the opening to expose the metal layer.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 2, 2022
    Inventors: Chang-Ju HO, Kao-Tsair TSAI, Ying-Hao CHEN
  • Publication number: 20220156731
    Abstract: A computer-implemented system for streamlining encryption payload of a card transaction from a transaction code transaction via a merchant inside a restricted computer network firewall. A wallet application stores data of a payment device, and the wallet application retrieves information of a merchant and a transaction via a transaction code. In response to the retrieved information, the wallet application generates an encrypted payload. The wallet application transmits the encrypted payload to a payment facilitator within the restricted computer network firewall. After decryption of the encrypted payload, the payment facilitator transmits a decrypted payload in one payment packet to the payment processing server outside the restricted computer network firewall.
    Type: Application
    Filed: June 18, 2019
    Publication date: May 19, 2022
    Inventors: PRANAV SHETH, YING HAO, VINAY GAONKAR
  • Patent number: 11328972
    Abstract: A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: May 10, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wan-Yu Lee, Ying-Hao Kuo, Kuo-Chung Yee
  • Patent number: 11315440
    Abstract: A respiratory gating phantom device includes a first airbag, a second airbag, a first catheter, a second catheter, a fixture, and an air pressure gating device. The first catheter and the second catheter are respectively installed in the first airbag and the second airbag. The fixture is provided with a phantom tumor and adjustably installed in the first catheter or the second catheter, thereby installing the phantom tumor in the first catheter or the second catheter. The air pressure gating device, connected to the first airbag and the second airbag, inflates and deflates the first airbag and the second airbag to simulate breathing. The first catheter and the second catheter respectively move along three-dimensional direction and two-dimensional direction in response to motions of the first airbag and the second airbag.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: April 26, 2022
    Assignee: NATIONAL CHUNG CHENG UNIVERSITY
    Inventor: Ying-Hao Yu
  • Patent number: 11280042
    Abstract: The embodiments are and include an apparatus, system and method for a liquid level monitoring dispenser for association with a liquid filled consumable. The apparatus, system and method may include: a receiver for receiving the consumable upon inversion thereof; at least one electrical contact within the receiver for communicative association with conductive strips on the consumable; a sensing module communicative with the at least one electrical contact and having associated therewith firmware for converting signals associated with the conductive strips and received at the electrical contact to an indication of the liquid level; a communications module for communicating the liquid level to at least a user display and over at least one network; a power module for powering at least the sensing module and the communications module; and at least one dispensing output in fluid communication with the consumable and capable of dispensing the liquid from the consumable to modify the liquid level.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: March 22, 2022
    Assignee: NYPRO INC.
    Inventors: Amanda Williams, Julio Danel Oropeza, Yu-Chang Lee, Ying Hao Lee, Martin Johnson, Marc Theeuwes, Stefan Vaes, Toon Diels
  • Publication number: 20220079639
    Abstract: One embodiment of the disclosure relates to a flexible bone fixation device including two first fixation parts and a first flexible spanning part, connected between the two first fixation parts. The first flexible spanning part has a plurality of first cuts spaced apart by one another.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 17, 2022
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Fang-Jie JANG, Pei-I TSAI, An-Li CHEN, Wei-Lun FAN, Shih-Ping LIN, Yi-Hung WEN, De-Yau LIN, Shun-Mao YANG, Ying-Hao SU, Huan-Jang KO
  • Publication number: 20220059581
    Abstract: Apparatus and methods for sensing long wavelength light are described herein. A semiconductor device includes: a carrier; a device layer on the carrier; a semiconductor layer on the device layer, and an insulation layer on the semiconductor layer. The semiconductor layer includes isolation regions and pixel regions. The isolation regions are or include a first semiconductor material. The pixel regions are or include a second semiconductor material that is different from the first semiconductor material.
    Type: Application
    Filed: August 20, 2020
    Publication date: February 24, 2022
    Inventors: Yun-Wei CHENG, Chun-Hao CHOU, Kuo-Cheng LEE, Ying-Hao CHEN
  • Publication number: 20220047239
    Abstract: A respiratory gating phantom device includes a first airbag, a second airbag, a first catheter, a second catheter, a fixture, and an air pressure gating device. The first catheter and the second catheter are respectively installed in the first airbag and the second airbag. The fixture is provided with a phantom tumor and adjustably installed in the first catheter or the second catheter, thereby installing the phantom tumor in the first catheter or the second catheter. The air pressure gating device, connected to the first airbag and the second airbag, inflates and deflates the first airbag and the second airbag to simulate breathing. The first catheter and the second catheter respectively move along three-dimensional direction and two-dimensional direction in response to motions of the first airbag and the second airbag.
    Type: Application
    Filed: August 13, 2020
    Publication date: February 17, 2022
    Inventor: YING-HAO YU
  • Patent number: 11243353
    Abstract: A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: February 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ying-Hao Kuo, Tien-Yu Huang
  • Publication number: 20220032049
    Abstract: A microneedle electroporation device is provided, including a housing, a positioning member, an intermediate plate, a first microneedle assembly, a second microneedle assembly, a socket, a first wire, and a second wire. The positioning member is connected to the housing and the intermediate plate. The intermediate plate includes a plurality of first holes and a plurality of second holes. The first microneedle assembly includes a plurality of first microneedles and a first metal connecting portion connected to the first microneedles. The first microneedles pass through the first holes. The second microneedle assembly includes a plurality of second microneedles and a second metal connecting portion connected to the second microneedles. The second microneedles pass through the second holes. The first microneedle assembly and the second microneedle assembly are electrically independent of each other. The first wire connects the socket to the first metal connecting portion.
    Type: Application
    Filed: June 29, 2021
    Publication date: February 3, 2022
    Inventors: Bo-Kai CHAO, Ying-Hao WANG, Jui-Hung TSAI, Chih-Hao HSU
  • Publication number: 20210391465
    Abstract: A device including a gate stack over a semiconductor substrate having a pair of spacers abutting sidewalls of the gate stack. A recess is formed in the semiconductor substrate adjacent the gate stack. The recess has a first profile having substantially vertical sidewalls and a second profile contiguous with and below the first profile. The first and second profiles provide a bottle-neck shaped profile of the recess in the semiconductor substrate, the second profile having a greater width within the semiconductor substrate than the first profile. The recess is filled with a semiconductor material. A pair of spacers are disposed overly the semiconductor substrate adjacent the recess.
    Type: Application
    Filed: August 27, 2021
    Publication date: December 16, 2021
    Inventors: Eric PENG, Chao-Cheng CHEN, Chii-Horng LI, Ming-Hua YU, Shih-Hao LO, Syun-Ming JANG, Tze-Liang LEE, Ying-Hao HSIEH
  • Publication number: 20210384247
    Abstract: A semiconductor structure includes a substrate having a pixel array region and a first seal ring region, wherein the first seal ring region surrounds the pixel array region, and the first seal ring region includes a first seal ring. The semiconductor structure further includes a first isolation feature in the first seal ring region, wherein the first isolation feature is filled with a dielectric material, and the first isolation feature is a continuous structure surrounding the pixel array region. The semiconductor structure further includes a second isolation feature between the first isolation feature and the pixel array region, wherein the second isolation feature is filled with the dielectric material.
    Type: Application
    Filed: August 24, 2021
    Publication date: December 9, 2021
    Inventors: Yun-Wei CHENG, Chun-Wei CHIA, Chun-Hao CHOU, Kuo-Cheng LEE, Ying-Hao CHEN
  • Publication number: 20210366953
    Abstract: A semiconductor arrangement is provided. The semiconductor arrangement includes a first component in a substrate. The semiconductor arrangement includes a gap fill layer. A first portion of the gap fill layer overlies the first component. The first portion of the gap fill layer has a tapered sidewall. A first portion of the substrate separates the first portion of the gap fill layer from the first component.
    Type: Application
    Filed: May 21, 2020
    Publication date: November 25, 2021
    Inventors: Chia Jung HSU, Chia-Yu Wei, Kuo-Cheng Lee, Chen Ying-Hao
  • Patent number: 11183392
    Abstract: According to an embodiment of the present disclosure, a method of manufacturing semiconductor device includes: forming a first mandrel and a second mandrel over a mask layer; depositing a spacer layer over the first mandrel and the second mandrel; forming a line-end cut pattern over the spacer layer between the first mandrel and the second mandrel; depositing a protection layer over the line-end cut pattern; etching the protection layer and exposing upper portion of the line-end cut pattern; reducing a width of the line-end cut pattern; etching the spacer layer to expose the first mandrel and the second mandrel; and patterning the mask layer using the etched spacer layer and the reduced line-end cut pattern as an etch mask.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: November 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jiann-Horng Lin, Chao-Kuei Yeh, Ying-Hao Wu, Tai-Yen Peng, Chih-Hao Chen, Chih-Sheng Tian