Abstract: A power supply with a cooling fan includes a first housing, a fan body, a plurality of connecting members, and a second housing. The first housing includes a first bottom wall and two first side walls, and the two first side walls have two first extension parts. Each connecting member includes a strip of connecting part and two fixing parts connected to the connecting part. The fan body is disposed in the first housing, and fixed to the first extension part by each fixing part. The connecting part is supported between the two fixing parts along the side of the fan body. The second housing uses a second bottom wall and two second side walls to cover the first extension parts and the connecting members, and is fixed with the first housing, so that the fixing elements of the fan body are not exposed on the power supply.

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Abstract: A device is provided to excite and locate methylene blue two-photon fluorescence (MB-2 PF) signals under skin surface. The device comprises a laser source, a nonlinear optical microscope unit, a beam-splitter unit, an optical-signal capturing and observing unit, and an image processing unit. Second harmonic generation (SHG) signals and the MB-2 PF signals are combined and observed simultaneously to form images of nerve fiber structures at different depths under the surface of human skin. The MB-2 PF signals directly observe the nerve fiber structure under the skin surface. The SHG signals reflects the signals of collagen fibers in dermal layer of the skin. The junction between the dermal layer and the epidermal layer are located to divide the dermis and epidermis layers for determining whether the nerve fiber structure passes through the epidermis and dermis layers. Thus, the density of intraepidermal nerve fiber is calculated in a non-invasive way.

Abstract: This disclosure relates to a biological tissue forming method includes the following steps: providing a biological tissue forming package with a base, a membrane, a sliding assembly and a sealing film that seals a chamber of the base used for receiving the membrane and the sliding assembly with one of the base and the sealing film being light-transmitting; passing a biological tissue fluid through the sealing film and the sliding assembly so as to be dispensed on the membrane; moving the sliding assembly away from a covering position used for covering the membrane via at least one passive magnetic element so as to expose the biological tissue fluid on the membrane; and emitting the biological tissue fluid exposed on the membrane by a curing light transmitting through the one of the base and the sealing film so as to cure the biological tissue fluid into a biological tissue.

Abstract: The present application discloses a sensing device, in which obtaining a first filtered signal by a first filter element according to a sensing reference signal corresponding to a sensing signal and obtaining a second filtered signal by a second filter element according to an analog reference signal, and then a noise compensation signal is generated according to the first filtered signal and the second filtered signal. Hereby, an analog-front-end circuit will decrease a noise of the sensing signal by compensating the sensing signal after the sensing signal and the noise compensation signal are received.

Abstract: An alditol oxidase and application thereof. The method uses D-glucose as a substrate to dock the alditol oxidase derived from Streptomyces coelicolor A3, and selects amino acid residues around an active center for saturation mutagenesis, and screens for alditol oxidase with D-glucose oxidizing activity by plate color development. An amino acid sequence of the alditol oxidase is shown in SEQ ID NO: 2 or SEQ ID NO: 4. The alditol oxidase has the activity of converting D-glucose to D-gluconic acid and D-glyceraldehyde to D-glyceric acid. By using the alditol oxidase, the conversion of D-glucose to pyruvic acid is realized by only three enzymes for the first time and does not depend on any coenzyme.

Abstract: A capacitor structure and method of forming the capacitor structure is provided, including a providing a doped region of a substrate having a two-dimensional trench array with a plurality of segments defined therein. Each of the plurality of segments has an array of a plurality of recesses extending along the substrate, where the plurality of segments are rotationally symmetric about a center of the two-dimensional trench array. A first conducting layer is presented over the surface and a bottom and sidewalls of the recesses and is insulated from the substrate by a first dielectric layer. A second conducting layer is presented over the first conducting layer and is insulated by a second dielectric layer. First and second contacts respectively connect to an exposed top surface of the first conducting layer and second conducting layer. A third contact connects to the substrate within a local region to the capacitor structure.

Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.

Abstract: An ingot splitting method and an ingot splitting apparatus are provided. The ingot splitting method includes the following steps. A laser provided from a laser source is focused with a focusing lens group on a plane to be split of an ingot, and a focus point of the laser is used to scan the plane to be split. An opposing first side and second side of the ingot are fixed with a chuck table and an ultrasonic source. The plane to be split is located between the first side and the second side. A pulling force is applied to the second side in a direction away from the ingot with a tensioner, and ultrasonic waves are applied to vibrate the ingot with the ultrasonic source simultaneously, so that the ingot is divided into two parts from the plane to be split.

Abstract: A display apparatus including a foldable touch display panel and a display driving device is provided. The foldable touch display panel includes a plurality of touch sensors. The display driving device is coupled to the foldable touch display panel. The display driving device is configured to determine a folding angle of the foldable touch display panel according to a capacitance variation of the touch sensors in a folded state, and drive the foldable touch display panel to operate in a full panel display mode or in a partial panel display mode according to the folding angle.

Abstract: Managing a battery including measuring, in response to a first charging current and over a first time period, a first amperage and a first voltage of the cell at predetermined intervals; measuring, in response to a second charging current and over a second time period, a second amperage and a second voltage of the cell at the predetermined intervals; determining that the first amperage of the cell was maintained greater than a first threshold amount of time within the first time period, and in response, qualifying the first amperage and the first voltage as stable; determining that the second amperage of the cell was maintained greater than a second threshold amount of time within the second time period, and in response, qualifying the second amperage and the second voltage as stable; and in response to the qualifying, calculating a DCIR of the cell based on the voltages and the amperage.

Abstract: A smart digital computer platform is disclosed that collects, analyzes, and/or renders appropriate information about fugitive emissions identified by a sensor network-based emissions monitoring system in a facility. More specifically to the methods used by the smart digital computer platform to analyze, filter, and transform the collected monitoring data into a visual output that is capable of being rendered on a graphical user interface (GUI) on a screen display with, in some embodiments, a restricted form factor. For example, smart analytics may be used to cull, filter, and transform the data displayed in a pop-up dialog box on a GUI. In another example, the transformed data may be translated into a visual, graphical element that conveys an abundance of appropriate, tailored information to a particular type of user viewing the GUI.

Abstract: Calibrating a battery including identifying a historical discharge rate of the battery; segmenting the historical discharge rate of the battery into regions; determining, based on the historical discharge rate of the battery, a first historical charge capacity of the battery for a first region and a second historical charge capacity of the battery for a second region; discharging, at an updated discharge rate, the battery from a first threshold voltage to a second threshold voltage; calculating, based on the updated discharge rate, a first updated charge capacity of the battery for the first region; determining a full charge capacity of the battery based on i) the first updated charge capacity of the battery for the first region and ii) the second historical charge capacity of the battery for the second region; adjusting a charging current of the battery based on the determined full charge capacity of the battery.

Abstract: A scan flip-flop circuit includes first and second I/O nodes, a flip-flop circuit, a selection circuit configured to receive a scan direction signal and including input terminals coupled to the first and second I/O nodes and an output terminal coupled to an input terminal of the flip-flop circuit, and first and second drivers configured to receive the scan direction signal and a scan enable signal, each including an input terminal coupled to an output terminal of the flip-flop circuit and an output terminal coupled to a respective first or second input terminal of the selection circuit. Responsive to the scan direction and scan enable signals, one of the first driver is configured to output a first signal responsive to a second signal received at the second input terminal or the second driver is configured to output a third signal responsive to a fourth signal received at the first input terminal.

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.

Abstract: An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a substrate comprising first opposing sidewalls defining a first trench and second opposing sidewalls defining a second trench laterally offset from the first trench. A stack of layers comprises a plurality of conductive layers and a plurality of dielectric layers alternatingly stacked with the conductive layers. The stack of layers comprises a first segment in the first trench and a second segment in the second trench. A first lateral distance between the first segment and the second segment aligned with a first surface of the substrate is greater than a second lateral distance between the first segment and the second segment below the first surface of the substrate.

Abstract: Some implementations described herein provide techniques and apparatuses for an integrated circuit device including a trench capacitor structure that has a merged region. A material filling the merged region is different than a material that is included in electrode layers of the trench capacitor structure. Furthermore, the material filling the merged region includes a coefficient of thermal expansion and a modulus of elasticity that, in combination with the architecture of the trench capacitor structure, reduce thermally induced stresses and/or strains within the integrated circuit device relative to another integrated circuit device having a trench capacitor structure including a merged region and electrode layers of a same material.

Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.