Patents by Inventor Ying Lin

Ying Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250052637
    Abstract: Methods and systems are disclosed for inspection of a potential source location (PSL) at an industrial facility that has physical components, such as pipes and valves, that transport one or more gaseous materials. A computing device assist in refocusing a technician equipped with a network of mobile sensors and a handheld device/wand to detect a gaseous emission at the industrial facility. The mobile sensors capture measurements on a recurring basis to assist the technician responsible for operating the handheld device/wand to identify exactly which physical component located within a PSL at the industrial facility are causing fugitive emissions. The disclosed system and method update an initial PSL by considering the recurring measurements and/or other inputs (e.g., weather data) to reduce the area of the initial PSL, thus better instructing the mechanic to identify the fugitive emission.
    Type: Application
    Filed: January 20, 2023
    Publication date: February 13, 2025
    Inventors: Wenfeng Peng, Brian Michael Zappa, Ling-Ying Lin
  • Patent number: 12225660
    Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 11, 2025
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Ying-Lin Chen, Chia-Weng Hsu, Ping-Liang Eng, Feng-Chang Chien
  • Publication number: 20250041093
    Abstract: A patella brace having a chip is disclosed. The patella brace includes a strap, a pad and a chip. The strap has two ends each provided with a buckle. A hook-and-loop strap is insertedly connected to the buckles at the two ends of the strap. The pad is disposed in the strap. The pad has an upper surface, a lower surface, and at least one side surface. A support part is integrally formed with a middle portion of the upper surface. The side surface of the pad and a top surface and a side surface of the support part are concave surfaces. When in use, they are attached to and brace the patella for protecting the patella. A raised portion is provided on either end of the upper surface. A recess is formed on either end of the lower surface. The chip is disposed in the recess of the pad.
    Type: Application
    Filed: November 13, 2023
    Publication date: February 6, 2025
    Inventors: Li-Chi Lin, Yi-Ying Lin
  • Patent number: 12218440
    Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a first coupling branch, and a dielectric substrate. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The first coupling branch is coupled to a first grounding point on the ground element. The first coupling branch extends across the first radiation element. The first coupling branch includes a first coil portion and a first connection portion.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: February 4, 2025
    Assignee: WISTRON NEWEB CORP.
    Inventors: Tzu-Min Wu, Kuo-Jen Lai, Kuang-Yuan Ku, Hung-Ying Lin, Wen-Tai Tseng
  • Patent number: 12218670
    Abstract: An integrated circuit includes a first clocked forwarding-switch and a second clocked forwarding-switch each implemented with strong transistors in at least one strong active-region structure. The integrated circuit also includes a first clocked inverter and a second clocked inverter each implemented with weak transistors in at least one weak active-region structure. The integrated circuit further includes a first inverter cross coupled with the first clocked inverter and a second inverter cross coupled with the second clocked inverter. An output of the first clocked forwarding-switch is conductively connected with an output of the first clocked inverter, and an output of the second clocked forwarding-switch is conductively connected with an output of the second clocked inverter.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: I-Wen Wang, Po-Chih Cheng, Jia-Hong Gao, Kuang-Ching Chang, Tzu-Ying Lin, Jerry Chang Jui Kao
  • Tie
    Patent number: 12210924
    Abstract: A tie includes an RFID device and a body encapsulating the RFID device by overmolding. The body includes a strap member, a head member, and a protection member connected between the strap member and the head member. The strap member has a plurality of engaging teeth. The RFID device is embedded in the protection member. The head member has a through hole. A hole wall of the through hole is provided with a one-way pawl. When winding the body around an object, the protection member can get a better protection since the protection member is located on an inner side between the head member and the strap member without protruding outward. Because the protection member and the head member are closer to a surface of the object, the extent to which the protection member protrudes outwards is reduced, thereby facilitating the RFID device to be sensed more easily.
    Type: Grant
    Filed: October 10, 2023
    Date of Patent: January 28, 2025
    Assignees: YOKE INDUSTRIAL CORP., ASIA SMART TAG CO., LTD.
    Inventors: Rong-Der Hong, Lien-Feng Lin, Yu-Ying Lin
  • Patent number: 12213308
    Abstract: A memory structure and a method of manufacturing the same are provided. The method includes forming a gate structure and a source/drain region in a substrate, in which the source/drain region is next to the gate structure. A dry etching process is performed to form a trench in the source/drain region. A wet etching process is performed to expand the trench to form an expanded trench, in which the expanded trench has a polygonal cross section profile. A bit line contact is formed in the expanded trench.
    Type: Grant
    Filed: February 19, 2024
    Date of Patent: January 28, 2025
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Yu-Ying Lin
  • Patent number: 12206809
    Abstract: An easily disassembled lens module in a terminal device includes a lens assembly, a circuit board, and a structural member. The circuit board includes a first portion, a second portion, and a third portion which are connected in sequence. The first portion is connected to the lens assembly, the second portion and the third portion protrude from the lens assembly. The structural member includes a connecting portion fixed on the third portion and at least one pulling portion protruding from the third portion. After installation in the terminal device, the lens assembly can be disassembled by using the at least one pulling portion to pull on the structural member so that the lens assembly can be disassembled without using tools and without causing damage.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: January 21, 2025
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Ying-Lin Chen, Hui-Hui Shangguan, Hu Zhu, Xiao-Fei Wang, Zheng-Zhi Lun
  • Publication number: 20250021814
    Abstract: Techniques are disclosed for generating multi-dimensional variable matrices for predicting abnormality of electronic communications. After receiving the request for a new communication from a given entity, a system retrieves attributes of the entity. The system generates, a variable matrix for the entity with a variable dimension corresponding to a number of variables determined for the entity based on the entity's attributes and an entity dimension corresponding to a number of other entities with which the entity performed communications. The system inputs the variable matrix into a trained machine learning model and determines, based on an abnormality score output by the model, whether the communication requested by the entity corresponds to anomalous behavior. The disclosed techniques may advantageously provide a greater distribution of data for an entity using a multi-dimensional variable matrix for anomaly prediction e.g.
    Type: Application
    Filed: August 24, 2023
    Publication date: January 16, 2025
    Inventors: Ying Lin, Shiwen Song, Yingying Yu
  • Patent number: 12199139
    Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: January 14, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Chen Hsu, Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shu-Hui Su, Shi-Min Wu
  • TIE
    Publication number: 20250013850
    Abstract: A tie includes an RFID device and a body encapsulating the RFID device by overmolding. The body includes a strap member, a head member, and a protection member connected between the strap member and the head member. The strap member has a plurality of engaging teeth. The RFID device is embedded in the protection member. The head member has a through hole. A hole wall of the through hole is provided with a one-way pawl. When winding the body around an object, the protection member can get a better protection since the protection member is located on an inner side between the head member and the strap member without protruding outward. Because the protection member and the head member are closer to a surface of the object, the extent to which the protection member protrudes outwards is reduced, thereby facilitating the RFID device to be sensed more easily.
    Type: Application
    Filed: October 10, 2023
    Publication date: January 9, 2025
    Applicants: YOKE INDUSTRIAL CORP., Asia Smart Tag Co., Ltd.
    Inventors: RONG-DER HONG, LIEN-FENG LIN, YU-YING LIN
  • Patent number: 12189251
    Abstract: A signal control method suitable for a touch screen is provided. The signal control method comprises: switching a plurality of scan lines to an enabling voltage level sequentially in a display stage; turning on a plurality of switches sequentially to transmit a plurality of display data to a plurality of data lines when a first scan line of the plurality of scan lines is in an enabled voltage level, wherein a first switch of the plurality of switches is coupled to a first data line of the plurality of data lines, and the first data line corresponds to one of a plurality of dummy lines in a vertical direction, when the first scan line is in the enabled voltage level, the first switch is turned on after other switches are turned on; and setting the plurality of dummy lines to a touch voltage in a touch stage.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: January 7, 2025
    Assignee: AUO CORPORATION
    Inventors: Shih-Hsi Chang, Yu-Hsin Ting, Chung-Lin Fu, I-Fang Chen, Wei-Chun Hsu, Nan-Ying Lin
  • Patent number: 12193167
    Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.
    Type: Grant
    Filed: October 27, 2023
    Date of Patent: January 7, 2025
    Assignee: Innolux Corporation
    Inventors: Kai Cheng, Fang-Ying Lin, Tsau-Hua Hsieh
  • Patent number: 12179044
    Abstract: A positive-pressure protective wear has a protective body and an air supply. The protective body has a clothing and a headgear connected with the clothing. The air supply is connected with the protective body and inputs gas into the protective body to keep the protective body under positive pressure, and this can provide an effect of ventilation.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: December 31, 2024
    Inventors: Yung Chi Lin, Chao-Ting Lin, Tzu-Ying Lin
  • Patent number: 12183721
    Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.
    Type: Grant
    Filed: December 4, 2023
    Date of Patent: December 31, 2024
    Assignee: Innolux Corporation
    Inventors: Jian-Jung Shih, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng
  • Publication number: 20240423983
    Abstract: Materials and methods useful for therapy, including cancer therapy, that combine an agent that blocks the CD47/SIRP? interaction with a DHFR inhibitor are provided.
    Type: Application
    Filed: April 25, 2022
    Publication date: December 26, 2024
    Applicant: PF Argentum IP Holdings LLC
    Inventors: Robert Adam UGER, Gloria Hoi Ying LIN
  • Patent number: 12176387
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: December 24, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu, Tuo-Hsin Chien, Felix Ying-Kit Tsui, Shi-Min Wu, Yu-Chi Chang
  • Publication number: 20240413812
    Abstract: An integrated circuit includes a first clocked forwarding-switch and a second clocked forwarding-switch each implemented with strong transistors in at least one strong active-region structure. The integrated circuit also includes a first clocked inverter and a second clocked inverter each implemented with weak transistors in at least one weak active-region structure. The integrated circuit further includes a first inverter cross coupled with the first clocked inverter and a second inverter cross coupled with the second clocked inverter. An output of the first clocked forwarding-switch is conductively connected with an output of the first clocked inverter, and an output of the second clocked forwarding-switch is conductively connected with an output of the second clocked inverter.
    Type: Application
    Filed: June 12, 2023
    Publication date: December 12, 2024
    Inventors: I-Wen WANG, Po-Chih CHENG, Jia-Hong GAO, Kuang-Ching CHANG, Tzu-Ying LIN, Jerry Chang Jui KAO
  • Publication number: 20240411858
    Abstract: A whitelisting method for blocking script-based malware includes steps of: checking a command line of a process to confirm the process to launch a first interception point of a startup script file; checking whether the startup script file in a whitelist at the first interception point; determining that a test is passed when the startup script file exists in the whitelist, and launching the startup script file, wherein the startup script file at least includes a module script file; confirming the process to invoke a module loader to import and launch a second interception point of the module script file; checking whether the module loader is allowed to import the module script file, or is allowed to launch the module script file that has been imported by using the whitelist at the second interception point.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 12, 2024
    Inventors: Yi-Hui LIN, Kun-Ying LIN, Chia-Lin LIANG, Lap-Chung LAM, Tzi-Cker CHIUEH
  • Patent number: 12166487
    Abstract: A scan flip-flop circuit includes a selection circuit including first and second input terminals coupled to first and second I/O nodes, a flip-flop circuit coupled to the selection circuit, a first driver coupled between the flip-flop circuit and the first I/O node, and a second driver coupled between the flip-flop circuit and the second I/O node. The selection circuit and drivers receive a scan direction signal. In response to a first logic level of the scan direction signal, the selection circuit responds to a first signal received at the first input terminal, and the second driver outputs a second signal responsive to a flip-flop circuit output signal. In response to a second logic level of the scan direction signal, the selection circuit responds to a third signal received at the second input terminal, and the first driver outputs a fourth signal responsive to the flip-flop circuit output signal.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: December 10, 2024
    Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TSMC NANJING COMPANY, LIMITED
    Inventors: Huaixin Xian, Tzu-Ying Lin, Liu Han, Jerry Chang Jui Kao, Qingchao Meng, Xiangdong Chen