Patents by Inventor Ying Lin

Ying Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11751758
    Abstract: An intraoral scanner includes a device body and a connection portion. The device body has a heat-dissipating structure and a first electrical connection port. The connection portion is detachably connected to the device body and includes a second electrical connection port and a fan. The second electrical connection port is electrically connected to the first electrical connection port. The fan generates an airflow that flows through the heat-dissipating structure.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: September 12, 2023
    Assignee: Qisda Corporation
    Inventor: Chih-Ying Lin
  • Publication number: 20230284366
    Abstract: A light source is provided capable of maintaining the temperature of a collector surface at or below a predetermined temperature. The light source in accordance with various embodiments of the present disclosure includes a processor, a droplet generator for generating a droplet to create extreme ultraviolet light, a collector for reflecting the extreme ultraviolet light into an intermediate focus point, a light generator for generating pre-pulse light and main pulse light, and a thermal image capture device for capturing a thermal image from a reflective surface of the collector.
    Type: Application
    Filed: April 11, 2023
    Publication date: September 7, 2023
    Inventors: Tai-Yu CHEN, Cho-Ying LIN, Sagar Deepak KHIVSARA, Hsiang CHEN, Chieh HSIEH, Sheng-Kang YU, Shang-Chieh CHIEN, Kai Tak LAM, Li-Jui CHEN, Heng-Hsin LIU, Zhiqiang WU
  • Publication number: 20230273534
    Abstract: A lithography system is provided capable of deterring contaminants, such as tin debris from entering into the scanner. The lithography system in accordance with various embodiments of the present disclosure includes a processor, an extreme ultraviolet light source, a scanner, and a hollow connection member. The light source includes a droplet generator for generating a droplet, a collector for reflecting extreme ultraviolet light into an intermediate focus point, and a light generator for generating pre-pulse light and main pulse light. The droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light. The scanner includes a wafer stage. The hollow connection member includes an inlet that is in fluid communication with an exhaust pump. The hollow connection member provides a hollow space in which the intermediate focus point is disposed.
    Type: Application
    Filed: May 3, 2023
    Publication date: August 31, 2023
    Inventors: Chieh HSIEH, Tai-Yu CHEN, Cho-Ying LIN, Heng-Hsin LIU, Li-Jui CHEN, Shang-Chieh CHIEN
  • Publication number: 20230275081
    Abstract: A semiconductor device includes first and second cell rows, first to fourth fin shaped structures. The first cell row has a first row height. The second cell row is adjacent with the first cell row, and having a second row height. The first fin shaped structure extends across the first cell row. The second fin shaped structure extends across the first cell row, and separated from the first fin shaped structure. The third fin shaped structure extends across the second cell row. The fourth fin shaped structure extends across the second cell row, and separated from the third fin shaped structure. The first to fourth fin shaped structures are arranged in order along the first direction, each of the first, second and fourth fin shaped structure has a first conductive type, the third fin shaped structure has a second conductive type.
    Type: Application
    Filed: May 5, 2023
    Publication date: August 31, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hui-Zhong ZHUANG, Xiang-Dong CHEN, Lee-Chung LU, Tzu-Ying LIN, Yung-Chin HOU
  • Publication number: 20230276616
    Abstract: A semiconductor structure includes a semiconductor substrate; a spacer located in a trench of the semiconductor substrate, wherein the spacer includes two trench nitride layers and an empty gap sandwiched between the two trench nitride layers; a first nitride layer disposed to seal an exposed opening of the empty gap between the two trench nitride layers; a second nitride layer over the first nitride layer, wherein the second nitride layer has a higher density than the first nitride layer; and a third nitride layer having a first portion over the second nitride layer and a second portion disposed on sidewalls of the two trench nitride layers.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Inventors: Yu-Ying LIN, Chung-Lin HUANG
  • Publication number: 20230273705
    Abstract: A smart digital computer platform is disclosed that collects, analyzes, and/or renders appropriate information about fugitive emissions identified by a sensor network-based emissions monitoring system in a facility. More specifically to the methods used by the smart digital computer platform to analyze, filter, and transform the collected monitoring data into a visual output that is capable of being rendered on a graphical user interface (GUI) on a screen display with, in some embodiments, a restricted form factor. For example, smart analytics may be used to cull, filter, and transform the data displayed in a pop-up dialog box on a GUI. In another example, the transformed data may be translated into a visual, graphical element that conveys an abundance of appropriate, tailored information to a particular type of user viewing the GUI.
    Type: Application
    Filed: July 29, 2021
    Publication date: August 31, 2023
    Inventors: Ling-Ying LIN, Alissa NEDOSSEKINA, Wenfeng PENG, Alexander CHERNYSHOV
  • Patent number: 11733792
    Abstract: A touch display device includes a plurality of photo sensors, a plurality of display pixels, and a touch sensing layer. The touch sensing layer disposed over the plurality of photo sensors and including a plurality of collimating openings corresponding to the plurality of photo sensors respectively to collimate light from different locations to the plurality of optical sensors.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 22, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventors: Yi-Ying Lin, Chih-Chang Lai
  • Patent number: 11728170
    Abstract: A semiconductor device includes: a fin structure disposed on a substrate; a gate feature that traverses the fin structure to overlay a central portion of the fin structure; a pair of source/drain features, along the fin structure, that are disposed at respective sides of the gate feature; and a plurality of contact structures that are formed of tungsten, wherein a gate electrode of the gate feature and the pair of source/drain features are each directly coupled to a respective one of the plurality of contact structures.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: August 15, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hong-Ying Lin, Cheng-Yi Wu, Alan Tu, Chung-Liang Cheng, Li-Hsuan Chu, Ethan Hsiao, Hui-Lin Sung, Sz-Yuan Hung, Sheng-Yung Lo, C. W. Chiu, Chih-Wei Hsieh, Chin-Szu Lee
  • Patent number: 11726610
    Abstract: A control method, suitable for a controller in an interface device having capacitive sensors, includes following steps. The capacitive sensors are arranged on a plane. During a first period, the controller is configured to set the capacitive sensors as self-capacitance sensors individually. During a second period, the controller is configured to divide the capacitive sensors into at least a first group and a second group, set the first group of capacitive sensors as a mutual-capacitance transmitter and generate a pulse signal to the mutual-capacitance transmitter, set the second group of capacitive sensors as a mutual-capacitance receiver and collect a sensing signal from the mutual-capacitance receiver in response to the pulse signal.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: August 15, 2023
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Yi-Ying Lin, Chih-Chang Lai
  • Publication number: 20230253204
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of isolation structures on the semiconductor substrate, and a plurality of blocking structures disposed directly over the isolation structures. The blocking structures have a lower reflectivity than the isolation structures.
    Type: Application
    Filed: April 3, 2023
    Publication date: August 10, 2023
    Inventors: Yu-Hsuan YANG, Tzy-Kuang LEE, Chia Ying LIN, Wen Han HUNG
  • Publication number: 20230253961
    Abstract: A flip-flop circuit includes a first inverter configured to receive a first clock signal and output a second clock signal, a second inverter configured to receive the second clock signal and output a third clock signal, a master stage, and a slave stage including a first feedback inverter and a first transmission gate. The first feedback inverter includes a first transistor configured to receive the first clock signal and a second transistor configured to receive the second clock signal, and the first transmission gate includes first and second input terminals configured to receive the second and third clock signals.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 10, 2023
    Inventors: Yung-Chen CHIEN, Xiangdong CHEN, Hui-Zhong ZHUANG, Tzu-Ying LIN, Jerry Chang Jui KAO, Lee-Chung LU
  • Publication number: 20230246121
    Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.
    Type: Application
    Filed: April 10, 2023
    Publication date: August 3, 2023
    Applicant: Innolux Corporation
    Inventors: Kai Cheng, Tsau-Hua Hsieh, Jian-Jung Shih, Fang-Ying Lin, Hui-Chieh Wang, Wan-Ling Huang
  • Patent number: 11710055
    Abstract: Systems and methods for processing machine learning attributes are disclosed. An example method includes: identifying a user transaction associated with a set of transaction attributes and a first transaction status; selecting, based on a risk evaluation model, a first plurality of transaction attributes from the set of transaction attributes; modifying a first value of a first transaction attribute in the first plurality of transaction attributes to produce a first modified plurality of transaction attributes; determining, based on the risk evaluation model, that the first modified plurality of transaction attributes identify a second transaction status different from the first transaction status; and in response to the determining, identifying the first transaction attribute as a risk attribute associated with the user transaction.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: July 25, 2023
    Assignee: PayPal, Inc.
    Inventors: Ying Lin, Huagang Yin, Jiaqi Zhang
  • Publication number: 20230232617
    Abstract: A method of manufacturing a memory structure is provided. The method includes forming a first gate structure, a second gate structure, and a plurality of source/drain regions in a substrate, in which the plurality of source/drain regions are disposed on opposite sides of the first gate structure and the second gate structures; performing a dry etching process to form a trench between the first gate structure and the second gate structure; performing a wet etching process to expand the trench, in which the expanded trench has a hexagonal shaped cross section profile; and forming a bit line contact in the expanded trench.
    Type: Application
    Filed: March 20, 2023
    Publication date: July 20, 2023
    Inventor: Yu-Ying LIN
  • Publication number: 20230226371
    Abstract: A chip pad decompression structure includes a pad, a protective ring, a chip, and an upper lid. A middle of one side of the pad has a raised portion. Another side of the pad has a recess. The protective ring is disposed in the recess of the pad. The protective ring has a through hole. The chip is disposed in the through hole of the protective ring and located in the recess of the pad. The upper lid is configured to cover the protective ring and the chip. The protective ring is disposed between the pad and the chip, which can disperse the force, improve a force-cushioning effect and protect the chip, so as to reduce a foreign body sensation and prolong the service life of the chip.
    Type: Application
    Filed: January 9, 2023
    Publication date: July 20, 2023
    Inventors: Li-Chi Lin, Yi-Ying Lin
  • Patent number: 11699690
    Abstract: A display device is provided in an embodiment in the disclosure, including a subpixel region, a spacer, a light-emitting element, and a driving circuit. The spacer separates the subpixel region into a first region and a second region. The light-emitting element is located in at least one of the first region or the second region. The driving circuit is electrically connected to the first region and the second region, so as to drive the light-emitting element. A manufacturing method of the display device is also disclosed.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: July 11, 2023
    Assignee: Innolux Corporation
    Inventors: Jian-Jung Shih, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng
  • Publication number: 20230215970
    Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.
    Type: Application
    Filed: March 1, 2023
    Publication date: July 6, 2023
    Applicant: InnoLux Corporation
    Inventors: Hui-Chieh Wang, Tsau-Hua Hsieh, Fang-Ying Lin
  • Publication number: 20230201266
    Abstract: The present disclosure provides a method for treating arthritis by using a stem cell preparation. The stem cell preparation of the present disclosure can effectively delay cartilage degeneration caused by arthritis, and it is confirmed by whole blood analysis and blood biochemical analysis that the stem cell preparation in the form of three-dimensional stem cell spheres provides a safe treatment for arthritis. The present disclosure also provides a method for preparing the stem cell preparation.
    Type: Application
    Filed: September 9, 2021
    Publication date: June 29, 2023
    Inventors: Feng-Huei Lin, Che-Yung Kuan, Yu-Ying Lin, Ching-Yun Chen, Zhi-Yu Chen, I-Hsuan Yang, Ming-Hsi Chuang, Po-Cheng Lin, Chia-Hsin Lee, Kai-Ling Zhang, Pei-Syuan Chao, Wan-Sin Syu, Chun-Hung Chen, Ting-Ju Wang
  • Publication number: 20230208953
    Abstract: An easily disassembled lens module in a terminal device includes a lens assembly, a circuit board, and a structural member. The circuit board includes a first portion, a second portion, and a third portion which are connected in sequence. The first portion is connected to the lens assembly, the second portion and the third portion protrude from the lens assembly. The structural member includes a connecting portion fixed on the third portion and at least one pulling portion protruding from the third portion. After installation in the terminal device, the lens assembly can be disassembled by using the at least one pulling portion to pull on the structural member so that the lens assembly can be disassembled without using tools and without causing damage.
    Type: Application
    Filed: March 30, 2022
    Publication date: June 29, 2023
    Inventors: YING-LIN CHEN, HUI-HUI SHANGGUAN, HU ZHU, XIAO-FEI WANG, ZHENG-ZHI LUN
  • Patent number: 11688762
    Abstract: A capacitor structure and method of forming the capacitor structure is provided, including a providing a doped region of a substrate having a two-dimensional trench array with a plurality of segments defined therein. Each of the plurality of segments has an array of a plurality of recesses extending along the substrate, where the plurality of segments are rotationally symmetric about a center of the two-dimensional trench array. A first conducting layer is presented over the surface and a bottom and sidewalls of the recesses and is insulated from the substrate by a first dielectric layer. A second conducting layer is presented over the first conducting layer and is insulated by a second dielectric layer. First and second contacts respectively connect to an exposed top surface of the first conducting layer and second conducting layer. A third contact connects to the substrate within a local region to the capacitor structure.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: June 27, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui, Chien-Li Kuo