Abstract: A wavelength conversion component includes a substrate, a reflection layer, and a phosphor layer. The reflection layer is disposed on the substrate and extends along a first direction. The reflection layer has a top surface that is away from the substrate. The top surface has a height variation on a second direction that is perpendicular to the first direction along the first direction. The phosphor layer is disposed on the reflection layer. The phosphor layer has a thickness variation on the second direction along the first direction. A ratio of the height of the top surface and the thickness of the phosphor layer increases and decreases reciprocally along the first direction.

Abstract: A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner; forming a cleaned collector by exhausting the removable debris from the collector; and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.

Abstract: A compound closed-type metal lid for a semiconductor chip package is provided. The compound closed-type metal lid includes a cover plate, and a frame bottom board. The cover plate has a frame body, and a plurality of riveting holes. The riveting holes penetrate through the frame body and are distributed symmetrically on the frame body. The frame bottom board has a frame body, a plurality of riveting protrusions, and an opening. The riveting protrusions are distributed on an upper surface of the frame body. The cover plate is disposed on an upper surface of the frame bottom board. The riveting protrusions are correspondingly riveted in the riveting holes.

Abstract: Computer system security can be improved through the use of whitelists and blacklists based on Bloom filters in the context of real-time data and electronic actions. A transaction may use a specific asset. A first search of the specific asset can be conducted in a Bloom filter whitelist comprising first assets classified as having a first status. The first search may return a plurality of first binary results corresponding to different hash functions performed the first assets. A second search of the specific asset can be conducted in a Bloom filter blacklist comprising second assets classified as having a second status different from the first status. The second search can return a plurality of second binary results corresponding to different hash function performed on the second assets, and the specific asset can be determined to be good or bad based on values of the first and second binary results.

Abstract: A method for managing software versions of an electronic device in a vehicle and a relevant device are disclosed. The method includes: transmitting an update bundle to a target vehicle; receiving an update response from the target vehicle, wherein the update response is used to indicate one or more patches which have been successfully installed among the N patches; updating a vehicle version tree corresponding to the target vehicle according to the update response to obtain an updated VVT. The technical solution provides a lightweight and efficient version control mechanism for maintaining the software versions for each of the electronic devices in a vehicle.

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.

Abstract: A semiconductor device includes several first cell row an several second cell rows. The first cell rows extend in a first direction. Each of the first cell rows has a first row height. A first row of the first cell rows is configured for a first cell to be arranged. The second cell rows extend in the first direction. Each of the second cell rows has a second row height that is different from the first row height. At least one row of the second cell rows includes a portion for at least one second cell to be arranged. The portion has a third row height that is different from the first row height and the second row height.

Abstract: Systems, methods, and devices are described herein for pre-setting scan flip-flops using combinational logic circuits. A system includes a plurality of flip-flop devices and a first pre-setting combinational logic circuit. The plurality of flip-flop devices are coupled together in series and configured to receive a scan input signal, capture data output from each flip-flop device of the plurality of flip-flop devices based on the scan input signal, and generate a scan output signal comprising the captured data. The first pre-setting combinational logic circuit is coupled to a first flip-flop device of the plurality of flip-flop devices. The first pre-setting combinational logic circuit includes a plurality of transistors and is configured to override and set either the scan input signal to the first flip-flop device or the scan output signal of the first flip-flop device based on selective operation of the plurality of transistors.

Abstract: Methods for manufacturing an electronic device and a transfer device are provided. The method for manufacturing the electronic device includes the following steps. A plurality of elements are provided, wherein each of the elements includes a first bonding pad. A substrate including a plurality of second bonding pads is provided. The plurality of elements are transferred to a transfer head. A portion of the elements is selectively transferred to the substrate, wherein the step of selectively transferring includes projecting a laser-light onto the portion of the elements so that the first bonding pad of the portion of the elements is bonded to at least one of the second bonding pads on the substrate.

Abstract: A lithography system is provided capable of deterring contaminants, such as tin debris from entering into the scanner. The lithography system in accordance with various embodiments of the present disclosure includes a processor, an extreme ultraviolet light source, a scanner, and a hollow connection member. The light source includes a droplet generator for generating a droplet, a collector for reflecting extreme ultraviolet light into an intermediate focus point, and a light generator for generating pre-pulse light and main pulse light. The droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light. The scanner includes a wafer stage. The hollow connection member includes an inlet that is in fluid communication with an exhaust pump. The hollow connection member provides a hollow space in which the intermediate focus point is disposed.

Abstract: A control method, suitable for a controller in an interface device having capacitive sensors, includes following steps. The capacitive sensors are arranged on a plane. During a first period, the controller is configured to set the capacitive sensors as self-capacitance sensors individually. During a second period, the controller is configured to divide the capacitive sensors into at least a first group and a second group, set the first group of capacitive sensors as a mutual-capacitance transmitter and generate a pulse signal to the mutual-capacitance transmitter, set the second group of capacitive sensors as a mutual-capacitance receiver and collect a sensing signal from the mutual-capacitance receiver in response to the pulse signal.

Abstract: A manufacturing method of an electronic device includes: providing a first substrate, which has a base layer and a plurality of electronic components disposed on the base layer; adhering adhesive material to each of the plurality of electronic components; providing a target substrate, wherein the target substrate and the first substrate are separated from each other by a distance; and transferring at least part of the plurality of electronic components adhered with the adhesive material to the target substrate through a laser process, wherein at least part of the plurality of electronic components are attached to the target substrate via the adhesive material.

Abstract: A smart digital computer platform is disclosed that collects, analyzes, and/or renders appropriate information about fugitive emissions identified by a sensor network-based emissions monitoring system in a facility. More specifically to the methods used by the smart digital computer platform to analyze, filter, and transform the collected monitoring data into a visual output that is capable of being rendered on a graphical user interface (GUI) on a screen display with, in some embodiments, a restricted form factor. For example, smart analytics may be used to cull, filter, and transform the data displayed in a pop-up dialog box on a GUI. In another example, the transformed data may be translated into a visual, graphical element that conveys an abundance of appropriate, tailored information to a particular type of user viewing the GUI.

Abstract: An electronic apparatus including a touch display panel and a driver circuit is provided. The touch display panel includes a plurality of first electrodes and at least one second electrode. The plurality of first electrodes are arranged in an active area of the touch display panel, and the at least one second electrode is arranged in a border area of the touch display panel. The driver circuit is coupled to the touch display panel. The driver circuit is configured to drive the plurality of first electrodes to perform a touch sensing operation in a first period. The driver circuit is configured to drive the plurality of first electrodes and the at least one second electrode to perform a gesture sensing operation in a second period.

Abstract: A flip-flop circuit includes a first inverter configured to receive a first clock signal and output a second clock signal, a second inverter configured to receive the second clock signal and output a third clock signal, a master stage, and a slave stage including a first feedback inverter and a first transmission gate. The first feedback inverter includes a first transistor configured to receive the first clock signal and a second transistor configured to receive the second clock signal, and the first transmission gate includes first and second input terminals configured to receive the second and third clock signals.

Abstract: Circuits, systems, and methods are described herein for increasing a hold time of a master-slave flip-flop. A flip-flop includes circuitry configured to receive a scan input signal and generate a delayed scan input signal; a master latch configured to receive a data signal and the delayed scan input signal; and a slave latch coupled to the master latch, the master latch selectively providing one of the data signal or the delayed scan input signal to the slave latch based on a scan enable signal received by the master latch.

Abstract: A layout method includes generating a design data comprising an electronic circuit, and generating a design layout by placing a first cell corresponding to the electronic circuit. The first cell includes a first source/drain region and a second source/drain region extending in a first direction in a first layer, a gate electrode extending in a second direction perpendicular to the first direction in a second layer, and a first conductive line arranged in a third layer over the second layer and electrically connected to one of the first source/drain region, the second source/drain region and the gate electrode. The first cell is defined by a left cell side and a right cell side. At least one of the left cell side, the right cell side, the gate electrode and the first conductive line extends in a third direction not parallel to the first and second directions.

Abstract: A touch apparatus includes a touch screen and a touch controller. The touch controller is configured to process touch sensing signals received from the touch screen to generate a touch coordinate with respect to a touch event occurring on the touch screen. The touch screen includes a plurality of first touch sensing electrodes and a plurality of second touch sensing electrodes. The first touch sensing electrodes are disposed in a center area of the touch screen, wherein at least one part of the first touch sensing electrodes are rectangular. The second touch sensing electrodes are disposed in an edge area of the touch screen surrounding the center area, wherein each of the second touch sensing electrodes is corresponding to a central angle and a plurality of central angles corresponding to the plurality of second touch sensing electrodes substantially equal.

Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N<M. M repairing groups are provided according to the N second defect maps. Each of the repairing groups includes at least one repairing electronic unit. The M repairing groups are transferred to the substrate. At least two of the repairing groups have the same location distribution of repairing electronic units, and the location distribution is consistent with a defect distribution of one of the second defect maps.