Abstract: The invention relates to an electronic calendar system method, and computer program product thereof. The system includes a cloud platform, at least one user terminal, at least one creative terminal, and a display terminal. The cloud platform is connected to the user terminal and the creative terminal, and the user terminal is connected to the display terminal. The creative terminal provides the digital creative content to transmit to the cloud platform. The user terminal obtains at least one digital calendar template and digital creative content front the cloud platform. The user terminal combines the digital calendar template, the digital creative content, and the digital calendar schedule to generate a graphical digital calendar, and transmits the graphical digital calendar to the display terminal by the user the terminal. The display terminal outputs the graphical digital calendar.

Abstract: A signal control method suitable for a touch screen is provided. The signal control method comprises: switching a plurality of scan lines to an enabling voltage level sequentially in a display stage; turning on a plurality of switches sequentially to transmit a plurality of display data to a plurality of data lines when a first scan line of the plurality of scan lines is in an enabled voltage level, wherein a first switch of the plurality of switches is coupled to a first data line of the plurality of data lines, and the first data line corresponds to one of a plurality of dummy lines in a vertical direction, when the first scan line is in the enabled voltage level, the first switch is turned on after other switches are turned on; and setting the plurality of dummy lines to a touch voltage in a touch stage.

Abstract: An integrated circuit includes a first cell and a second cell. The first cell has a first height along a first direction. The second cell has a second height shorter than the first height along the first direction. A transistor of the first cell and a transistor of the second cell share a first active area, and a first boundary of the first cell, a first boundary of the second cell, a second boundary of the first cell and a second boundary of the second cell are arranged in order along the first direction.

Abstract: A control method, suitable for a controller in an interface device having capacitive sensors, includes following steps. The capacitive sensors are arranged on a plane. During a first period, the controller is configured to set the capacitive sensors as self-capacitance sensors individually. During a second period, the controller is configured to divide the capacitive sensors into at least a first group and a second group, set the first group of capacitive sensors as a mutual-capacitance transmitter and generate a pulse signal to the mutual-capacitance transmitter, set the second group of capacitive sensors as a mutual-capacitance receiver and collect a sensing signal from the mutual-capacitance receiver in response to the pulse signal.

Abstract: CD47+ disease cells such as cancer cells are treated using a combination of CD47 blocking agent and a CD38 antibody such as daratumumab. The anti-cancer effect of SIRP?Fc is enhanced in the presence of daratumumab. Specific combinations include SIRP?Fc forms that comprise an Fc that is either IgG1 or IgG4 isotype. These combinations are useful particularly to treat blood cancers including lymphomas, leukemias and myelomas.

Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. A spacer is disposed on the substrate and has a first opening, a second opening and a third opening arranged in a first direction. The second opening is located between the first opening and the third opening. A distance between the first opening and the second opening is less than a distance between the second opening and the third opening in the first direction. A first element is located in at least one of the first opening and the second opening. A second element is located in the third opening.

Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.

Abstract: A method of manufacturing a semiconductor device including the following steps is provided herein. A semiconductor substrate is provided. The semiconductor substrate is transferred to a carrier. The semiconductor substrate on the carrier is diced into a plurality of semiconductor 5 components. A target substrate is provided. At least one of the semiconductor components is transferred onto the target substrate.

Abstract: Systems and methods for processing machine learning attributes are disclosed. An example method includes: identifying a user transaction associated with a set of transaction attributes and a first transaction status; selecting, based on a risk evaluation model, a first plurality of transaction attributes from the set of transaction attributes; modifying a first value of a first transaction attribute in the first plurality of transaction attributes to produce a first modified plurality of transaction attributes; determining, based on the risk evaluation model, that the first modified plurality of transaction attributes identify a second transaction status different from the first transaction status; and in response to the determining, identifying the first transaction attribute as a risk attribute associated with the user transaction.

Abstract: A clock gating circuit includes a NOR logic gate, a transmission gate, a cross-coupled pair of transistors, and a first transistor. The NOR logic gate is coupled to a first node, and receives a first and a second enable signal, and outputs a first control signal. The transmission gate is coupled between the first and a second node, and receives the first control signal, an inverted clock input signal and a clock output signal. The cross-coupled pair of transistors is coupled between the second node and an output node, and receives at least a second control signal. The first transistor includes a first gate terminal configured to receive the inverted clock input signal, a first drain terminal coupled to the output node, and a first source terminal coupled to a reference voltage supply. The first transistor adjusts the clock output signal responsive to the inverted clock input signal.

Abstract: Disclosed herein are non-aqueous compositions including: a flowable Part A including at least one resin and Reactant A; and a flowable Part B including at least one resin and Reactant B; wherein at least one of flowable Part A and flowable Part B further includes a free radically polymerizable resin; wherein at least one of flowable Part A and flowable Part B further includes a free radical initiator system; wherein flowable Part A and flowable Part B are capable of being mixed to provide a flowable mixed composition; wherein when flowable Part A and flowable Part B are mixed, Reactant A and Reactant B are capable of interacting to cause a non-free radical reaction within a first staging time to provide a first staged stable consistency for the mixed composition; wherein Reactant A comprises an acid and Reactant B comprises a base, and upon mixing flowable Part A and flowable Part B, the Reactant A acid is capable of reacting with the Reactant B base in an ionic acid-base reaction; and wherein the mixed compo

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

Abstract: A connector assembly for a mobile device is provided that includes a back plate adapted to be operably coupled with a mobile device, a connector region operably couple with the back plate, and at least one alignment member operably coupled with the back plate and positioned adjacent to the connector region. The connector region is configurable in at least a first arrangement and a second arrangement. The at least one alignment member aligns with the connector region and frictionally receive an accessory device. In the first arrangement, the connector region includes at least one electrical connector, and in the second arrangement, the connector region includes no electrical connectors.

Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a first coupling branch, and a dielectric substrate. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The first coupling branch is coupled to a first grounding point on the ground element. The first coupling branch extends across the first radiation element. The first coupling branch includes a first coil portion and a first connection portion.

Abstract: The disclosure provides projection device and light source system thereof. The light source system includes a first light source, a second light source, a curved surface reflection element and a wavelength conversion element. The first light source is configured to emit a first light beam. The second light source is configured to emit a second light beam. The curved surface reflection element has a first focal point and a groove, wherein the groove is adjacent to the first focal point. The wavelength conversion element is arranged through the groove and has a first surface and a second surface, wherein the first light beam is incident on a first area of the first surface where the first focal point located, and the second light beam is incident on a second area of the second surface where the first focal point located.

Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.

Abstract: A tamper resistant assembly applied to a tamper resistant system includes a tamper resistant screw, a housing, a lock member, a nut and a cover. The tamper resistant screw includes a head, a thread, a groove and a tip. The lock member is disposed in the housing. The lock member includes a plurality of locking blocks, wherein a deformable opening is formed between the locking blocks. The nut is disposed in the housing and covers the deformable opening. The cover is disposed in the housing. The nut is located between the lock member and the cover. When the tip of the tamper resistant screw passes through the cover and the nut sequentially and enters the deformable opening, the nut is separated from the deformable opening and the locking blocks engage with the groove. Furthermore, a detaching tool is provided to detach the tamper resistant assembly.

Abstract: A method includes forming a circuit region over a substrate. The circuit region includes at least one active region extending along a first direction, and at least one gate region extending across the at least one active region and along a second direction transverse to the first direction. At least one first input/output (TO) pattern and at least one second TO pattern are correspondingly formed in different first and second metal layers to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first TO pattern extends along a third direction oblique to both the first direction and the second direction. The at least one second TO pattern extends along a fourth direction oblique to both the first direction and the second direction, the fourth direction transverse to the third direction.

Abstract: A method is provided for evaluating a maintenance requirement of a linear transmission device that is driven by a driving device. A control unit receives, from a sensing unit, a plurality of electric sensor signals that respectively correspond to multiple physical quantities of the linear transmission device or the driving device. The control unit calculates at least four correction factors based on the electric sensor signals, and calculates a service life of the linear transmission device based on the electric sensor signals and the at least four correction factors for scheduling maintenance of the linear transmission device.

Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.