Patents by Inventor Ying Lin

Ying Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240227324
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Application
    Filed: December 7, 2022
    Publication date: July 11, 2024
    Inventors: TENG-YEN WANG, SHUN-SHENG KO, MIAO-CHANG WU, TUNG-YING LIN, CHAO-HONG HSU
  • Patent number: 12025496
    Abstract: A drug scanning and identification system including a spectrometer, a drug holder, a mobile device and a drug identification model is provided. The spectrometer includes a light source, a diffraction grating, a light-absorption element, a wavelength selector, and a single-point photodetector. The drug holder includes a transparent area and a light-absorption area. The drug is disposed on the transparent area. The light-absorption area surrounds the transparent area. The mobile device is adapted to send a control command to trigger the spectrometer scanning the drug so as to obtain spectrum data of the drug. The spectrometer is adapted to transmit the spectrum data of the drug to the drug identification model. The drug identification model is adapted to identify the spectrum data of the drug such that the drug identification model generates an identification result. The identification result is displayed by the mobile device.
    Type: Grant
    Filed: October 13, 2022
    Date of Patent: July 2, 2024
    Assignee: InnoSpectra Corporation
    Inventors: Hsi-Pin Li, Fei-Peng Chang, He-Yi Hsieh, Pei-Ying Lin, Shu-Ping Chien, Yung-Yu Huang
  • Patent number: 12027470
    Abstract: A package carrier, including a first redistribution structure layer, multiple conductive connecting members, a connection structure layer, at least one stiffener, and a molding compound, is provided. The conductive connecting members are disposed on a first surface of the first redistribution structure layer and are electrically connected to the first redistribution structure layer. The connection structure layer is disposed on a second surface of the first redistribution structure layer and includes a substrate and multiple pads. A top surface and a bottom surface of each pad are respectively exposed to an upper surface and a lower surface of the substrate. The pads are electrically connected to the first redistribution structure layer. The stiffener is disposed on the first surface and is located at least between the conductive connecting members. The molding compound is disposed on the first surface and covers the conductive connecting members and the stiffener.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: July 2, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin, Po-Chih Chang
  • Publication number: 20240213835
    Abstract: A motor includes a rotor rotatable about a central axis, and a stator located on one axial side of the rotor. The rotor includes a plurality of side magnets whose magnetization direction is a circumferential direction and that are arranged in the circumferential direction, and a plurality of core pieces disposed between the side magnets in the circumferential direction. The core piece includes a core piece main body that is in close contact with side surfaces of the side magnets on a pair of side surfaces facing both sides in the circumferential direction, and an extended tooth portion located on one axial side of the core piece main body. The extended tooth portion protrudes to one axial side with respect to a surface facing the one axial side of the side magnet, and has a larger width dimension in the circumferential direction than that of the core piece main body.
    Type: Application
    Filed: December 15, 2023
    Publication date: June 27, 2024
    Inventors: Hsiu-Ying LIN, Guo-Jhih YAN, Keng-Chang WU, Kuo-Min WANG, Sheng-Tse WU
  • Patent number: 12019378
    Abstract: A method includes: removing debris on a collector of a lithography equipment by changing physical structure of the debris with a cleaner, the cleaner being at a temperature less than about 13 degrees Celsius; forming a cleaned collector by exhausting the removable debris from the collector; and forming openings in a mask layer on a substrate by removing regions of the mask layer exposed to radiation from the cleaned collector.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: June 25, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cho-Ying Lin, Tai-Yu Chen, Chieh Hsieh, Sheng-Kang Yu, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Publication number: 20240198632
    Abstract: A display device includes a protection assembly and an outer frame. The protection assembly includes a cover plate and an elastic structure. The elastic structure includes a first adhesive layer, a second adhesive layer, and an elastic layer. The first adhesive layer is adhered to the cover plate. The elastic layer is disposed between the first adhesive layer and the second adhesive layer. The outer frame is adhered to the second adhesive layer. A modulus of elasticity of the elastic structure is between 120 N/compression % and 200 N/compression %. A peel adhesive force between the second adhesive layer and the outer frame is between 8 N/25 mm and 100 N/25 mm.
    Type: Application
    Filed: December 20, 2022
    Publication date: June 20, 2024
    Inventors: Shih Hao CHEN, Yun Chine LO, Yung Feng YEH, Tao LU, Shui Ying LIN
  • Publication number: 20240196601
    Abstract: A memory structure and a method of manufacturing the same are provided. The method includes forming a gate structure and a source/drain region in a substrate, in which the source/drain region is next to the gate structure. A dry etching process is performed to form a trench in the source/drain region. A wet etching process is performed to expand the trench to form an expanded trench, in which the expanded trench has a polygonal cross section profile. A bit line contact is formed in the expanded trench.
    Type: Application
    Filed: February 19, 2024
    Publication date: June 13, 2024
    Inventor: Yu-Ying LIN
  • Patent number: 12009824
    Abstract: A clock gating circuit includes a NOR logic gate, a transmission gate, a cross-coupled pair of transistors, and a first transistor. The NOR logic gate is coupled to a first node, and receives a first and a second enable signal, and outputs a first control signal. The transmission gate is coupled between the first and a second node, and receives the first control signal, an inverted clock input signal and a clock output signal. The cross-coupled pair of transistors is coupled between the second node and an output node, and receives at least a second control signal. The first transistor includes a first gate terminal configured to receive the inverted clock input signal, a first drain terminal coupled to the output node, and a first source terminal coupled to a reference voltage supply. The first transistor adjusts the clock output signal responsive to the inverted clock input signal.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Seid Hadi Rasouli, Jerry Chang Jui Kao, Xiangdong Chen, Tzu-Ying Lin, Yung-Chen Chien, Hui-Zhong Zhuang, Chi-Lin Liu
  • Patent number: 12009341
    Abstract: An integrated antenna package structure includes a first redistribution structure, a first chip, a heat dissipation structure, a second chip, and an antenna structure. The first chip is located on a first side of the first redistribution structure, and is electrically connected to the first redistribution structure. The heat dissipation structure is thermally connected to the first chip, and the first chip is located between the heat dissipation structure and the first redistribution structure. The second chip is located on a second side of the first redistribution structure opposite to the first side, and is electrically connected to the first redistribution structure. The antenna structure is electrically connected to the first redistribution structure.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: June 11, 2024
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Kai Chiu, Sheng-Tsai Wu, Yu-Min Lin, Wen-Hung Liu, Ang-Ying Lin, Chang-Sheng Chen
  • Patent number: 11994503
    Abstract: Computer systems, methods, and apparatuses for estimating changes in gas emissions are described. A computer system may monitor overall emission levels based on sensor outputs from a plurality of gas sensors in a facility. The computer system may estimate a total emission level over a time interval based on the accumulative, gas-response-factor weighted detections of the gas sensors. Emissions from maintenance activities may be excluded as appropriate. The total emission level may be compared with total emission level estimated from different time intervals and/or different facilities. The computer system may be further used for comparing emissions across multiple facilities, or emissions from facilities across multiple regions.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 28, 2024
    Assignee: Molex, LLC
    Inventors: Wenfeng Peng, Ling-Ying Lin, Alissa Nedossekina
  • Patent number: 11985238
    Abstract: Embodiments disclose a vehicle-mounted device upgrade method and a related device. The method may be applied to an intelligent vehicle, the intelligent vehicle includes a vehicle-mounted control device, and the method may include: receiving, by the vehicle-mounted control device, a first partial key sent by the communications device; restoring, by the vehicle-mounted control device, a first key by using the first partial key and a second partial key that is stored on the vehicle-mounted control device; and performing, by the vehicle-mounted control device, secure processing on a first upgrade file by using the first key, to obtain the securely processed first upgrade file, where the secure processing includes generating first message authentication code (MAC), and the securely processed first upgrade file includes the first upgrade file and the first MAC. According to this application, the vehicle-mounted device can be securely and efficiently upgraded.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: May 14, 2024
    Assignee: Huawei International Pte. Ltd.
    Inventors: Yanjiang Yang, Zhuo Wei, Hsiao-Ying Lin, He Wei, Junqiang Shen
  • Publication number: 20240154309
    Abstract: A multi-band antenna includes a substrate with a first surface and a second surface, a first antenna structure with a first antenna coupling segment, a second antenna structure with a second antenna coupling segment, a first grounding section, a coupling section, a via hole, and a second grounding section. Both of the first antenna structure and the second antenna structure are disposed on the first surface. The first grounding section is connected to the first antenna coupling segment. The coupling section is disposed on the second surface and projected onto the first surface to form a coupling region. Both of the first antenna coupling segment and the second antenna coupling segment at least partially overlap the coupling region. The via hole penetrates through the substrate and is connected between the coupling section and the second antenna coupling segment. The second grounding section is connected to the coupling section.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 9, 2024
    Inventors: Hung-Ying LIN, Wen Tai TSENG, Kuo Jen LAI
  • Publication number: 20240153924
    Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.
    Type: Application
    Filed: October 3, 2023
    Publication date: May 9, 2024
    Applicant: InnoLux Corporation
    Inventors: Fang-Ying Lin, Kai Cheng, Ming-Chang Lin, Tsau-Hua Hsieh
  • Publication number: 20240147689
    Abstract: Integrated circuits (ICs) and methods are provided. An IC includes a charge-storing device. The charge-storing device includes a first charge-storing stack extending into a substrate, and a second charge-storing stack extending into the substrate and adjacent to the first charge-storing stack along a first direction. The first charge-storing stack and the second charge-storing stack extend lengthwise along a second direction perpendicular to the first direction, and the first charge-storing stack and the second charge-storing stack have an offset along the second direction, the offset being greater than zero.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Ming-Hsun Lin, Jyun-Ying Lin
  • Patent number: 11973067
    Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Fang-Ying Lin, Kai Cheng, Hui-Chieh Wang, Shun-Yuan Hu
  • Publication number: 20240135846
    Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes the following. A substrate is provided. A plurality of electronic units are transferred to the substrate. The electronic units are inspected to obtain M first defect maps. The M first defect maps are integrated into N second defect maps, where N<M. M repairing groups are provided according to the N second defect maps. Each of the repairing groups includes at least one repairing electronic unit. The M repairing groups are transferred to the substrate. At least two of the repairing groups have the same location distribution of repairing electronic units, and the location distribution is consistent with a defect distribution of one of the second defect maps.
    Type: Application
    Filed: September 17, 2023
    Publication date: April 25, 2024
    Applicant: Innolux Corporation
    Inventors: Kai Cheng, Fang-Ying Lin, Ming-Chang Lin, Tsau-Hua Hsieh
  • Publication number: 20240131808
    Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.
    Type: Application
    Filed: December 7, 2022
    Publication date: April 25, 2024
    Inventors: TENG-YEN WANG, SHUN-SHENG KO, MIAO-CHANG WU, TUNG-YING LIN, CHAO-HONG HSU
  • Publication number: 20240122163
    Abstract: The present invention demonstrated a Cre-loxP based cofilin-1 transgenic animal model to address the pathophysiological role of over-expressed cofilin-1 on systemic development.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 18, 2024
    Inventors: Yi-Jang LEE, Yu-Chuan LIN, Min-Ying LIN, Bing-Ze LIN, Chia-Yun KANG
  • Patent number: D1024932
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 30, 2024
    Assignee: WALSIN LIHWA CORPORATION
    Inventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin
  • Patent number: D1025886
    Type: Grant
    Filed: December 21, 2023
    Date of Patent: May 7, 2024
    Assignee: Xiamen Jingwei Supply Chain Management Co., Ltd
    Inventor: Ying Lin