Abstract: The apparatus includes a drive base, a drive cover overlying the drive base, wherein the drive cover comprises an opening therein, and wherein the drive cover is coupled to the drive base to enclose a media within an interior of the apparatus. A snubber is overmolded onto the drive cover. A clamp assembly contacts the snubber during shock events.

Abstract: An apparatus includes a drive base. A drive cover overlies the drive base. A fastener secures the drive cover to the drive base. The fastener extends through the drive cover and into the drive base. A gasket is between the drive base and the drive cover. The gasket is compressed by the drive base and the drive cover. A spring feature is formed in the drive cover. The spring feature exerts a first force on the fastener and a second force on the base. The first force is opposite the second force.

Abstract: The present disclosure provides a cooking appliance control method, a control device, and a cooking appliance. The cooking appliance acquires cooking effect evaluation information of a cooking appliance provided by a user. The cooking effect evaluation information comprises a plurality of evaluation dimensions for evaluating cooking effects of the cooking appliance and scores of the plurality of evaluation dimensions. The cooking appliance adjusts control parameters of the cooking appliance according to the cooking effect evaluation information, so as to control the cooking of the cooking appliance according to the adjusted control parameters. By adjusting the control parameters of the cooking appliance according to the cooking effect evaluation information, the cooking appliance ensures that the final cooking effect satisfy the requirements of the user and improves the use experience of the user.

Abstract: An apparatus includes a drive base. A drive cover overlies the drive base. A fastener secures the drive cover to the drive base. The fastener extends through the drive cover and into the drive base. A gasket is between the drive base and the drive cover. The gasket is compressed by the drive base and the drive cover. A spring feature is formed in the drive cover. The spring feature exerts a first force on the fastener and a second force on the base. The first force is opposite the second force.

Abstract: The apparatus includes a drive base, a drive cover overlying the drive base, and a snubber overmolded onto the drive cover. The drive base and the drive cover encloses a media. The media contacts the snubber during shock events.

Abstract: The apparatus includes a drive base, a drive cover overlying the drive base, and a snubber overmolded onto the drive cover. The drive base and the drive cover encloses a media. The clamp assembly contacts the snubber during shock events.

Abstract: A data storage device fastener seal system can have at least a base, a cover, and a fastener seal. The base may have at least one fastener aperture and a first contact surface while the cover can have a second contact and a fastener hole. The second contact surface may physically contact the first contact surface to enclose a data storage region. The fastener seal can be positioned between the base and cover proximal the fastener aperture with the fastener seal extending less than an inch from the fastener aperture in every direction along a plane parallel to the first and second contact surfaces.

Abstract: Fabricating a first semiconductor device cell using a first process based on a first process parameter or material comprises extracting semiconductor device parameters from the first process parameters to obtain extracted semiconductor device parameters of a first semiconductor device cell. The fabrication process includes training an artificial intelligence to obtain a predictive artificial intelligence using training data as input, the training data comprising the extracted semiconductor device cell parameters and the first process parameter or material. A proposed process modification is provided to the predictive artificial intelligence to generate a predicted cell delay by the predictive artificial intelligence. The predicted cell delay is evaluated against a cell delay threshold. When the predicted cell delay satisfies the cell delay threshold, a new semiconductor device cell is fabricated using a modified process incorporating the proposed process modification.

Abstract: A method performed at least partially by a processor includes performing an air gap insertion process. The air gap insertion process includes sorting a plurality of nets of a layout of an integrated circuit in an order, and inserting, in accordance with the sorted order of the plurality of nets, air gap patterns adjacent to the plurality of nets. The method further includes generating a modified layout of the integrated circuit. The modified layout includes the plurality of nets and the inserted air gap patterns.

Abstract: Provided herein are methods and compositions related to a retinoid receptor-selective pathway. As described herein, this pathway can be targeted to manipulate a tumor microenviroment. For example, the methods and compositions described herein can be used to induce apoptosis in a cancer cell. Further, the compositions described herein, including Sulindac and analogs thereof, can be used to target this pathway for the treatment or prevention of cancer in human patients.

Abstract: Disclosed is a method for evaluating cooking quality that includes: in response to receiving evaluation information of a food sent by a terminal, retrieving an assessment result corresponding to the food, the assessment result being an assessment result of the cooking quality of a cooking appliance; and determining an evaluation result of the cooking quality of the cooking appliance based on the assessment result, the evaluation information, and a preset evaluation rule. Also disclosed is a device for evaluating cooking quality. With this disclosure, both the assessment result and the evaluation information are weighted in computing the evaluation result of the cooking quality of the cooking appliance. Such an evaluation result not only reflects users' subjective evaluation of the cooking quality, but it also reflects an objective and tenable evaluation of the cooking quality, making the evaluation of the cooking quality more reasonable.

Abstract: A method, of generating a modified layout based on an original layout, includes: determining a first set of width bias values of an i-th set of layout patterns which compensate for subtractive process effects, the original layout having N sets of layout patterns corresponding to N masks; determining a second set of width bias values of the i-th set of layout patterns of the original layout which compensate for additive process effects; generating the modified layout based on the first and second sets of width bias values of the i-th set of layout patterns, the order index i of the i-th mask corresponding to an order of the i-th mask being applied during a fabrication process; and fabricating, based on the modified layout, at least one of a semiconductor mask or at least one component in a layer of an inchoate semiconductor integrated circuit.

Abstract: Method, device, and storage medium for generating and self-adaptively rotating a voice recognition interface are provided. The method for generating and self-adaptively rotating a voice recognition interface includes: identifying a direction of an interface layout of a current interface when a voice recognition is triggered; generating the voice recognition interface in a same layout direction as the direction of the current interface layout, the voice recognition interface covering a portion of a screen; monitoring in real time whether the interface layout of the current interface rotates; and rotating the generated voice recognition interface self-adaptively along with the current interface layout, in response to a rotation of the interface layout of the current interface.

Abstract: A method and a corresponding system for analyzing process variation and parasitic resistance-capacitance (RC) elements in an interconnect structure of an integrated circuit (IC) are provided. First descriptions of parasitic RC elements in an interconnect structure of an IC are generated. The first descriptions describe the parasitic RC elements respectively at a typical process corner and a peripheral process corner. Sensitivity values are generated at the peripheral process corner from the first descriptions. The sensitivity values respectively quantify how sensitive the parasitic RC elements are to process variation. The sensitivity values are combined into a second description of the parasitic RC elements that describes the parasitic RC elements as a function of a process variation parameter. Simulation is performed on the second description by repeatedly simulating the second description with different values for the process variation parameter.