Patents by Inventor Ying Yang

Ying Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220315073
    Abstract: Disclosed are a method and system for correcting the precision of a magnetic levitation train traction system position control ring. The precision correction method comprises: step A, a speed measuring system collecting position-related information of a train; step B, sending the position-related information to a traction system through a signal system; and step C, the traction system carrying out closed-loop control on the position of the train according to the position-related information. The method further comprises step A1 before step A: checking the time for the speed measuring system, the signal system and the traction system, and adding timestamp information. According to the correcting method and system, the time is checked for a speed measuring system, a signal system and a traction system, and timestamp information is added, such that the influences of a delay and periodic random shaking are overcome, and the requirement of traction control of a medium-high speed magnetic levitation train is met.
    Type: Application
    Filed: October 22, 2019
    Publication date: October 6, 2022
    Inventors: Xiaochun LI, Lin LI, Xiaoli HUANG, Liwei SONG, Ying YANG, Laisheng TONG, Huajun LUO
  • Publication number: 20220310555
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: June 13, 2022
    Publication date: September 29, 2022
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20220296677
    Abstract: A peptide Scyreprocin of Scylla paramamosain, an amino acid sequence of the peptide Scyreprocin is SEQ ID NO 01.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 22, 2022
    Inventors: Kejian Wang, Ying Yang, Fangyi Chen, Huiyun Chen, Hui Peng
  • Patent number: 11442299
    Abstract: Disclosed are a display module, a display device and a viewing-angle switching method. The display module includes a backlight module, a display panel, a lower polarizer sheet, a viewing-angle switching element and a transparent cover plate; the viewing-angle switching element and the transparent cover plate are arranged between the display panel and the lower polarizer sheet, and the transparent cover plate is arranged on a side of the viewing-angle switching element that is close to the lower polarizer sheet; the backlight module is configured to supply light that meets a preset condition, the viewing-angle switching element is configured to switch viewing-angle modes of the display module; the viewing-angle modes include; a first viewing-angle mode and a second viewing-angle mode; and a viewing-angle range of the first viewing-angle mode is smaller than a viewing angle range of the second viewing-angle mode.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: September 13, 2022
    Assignees: Chongqing BOE Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Pan Yuan, Sijun Lei, Liang Gao, Xianyong Gao, Yansheng Sun, Yunsong Li, Zhicai Xu, Yong Long, Ying Zhang, Dengqian Li, Guojian Zhang, Fanjian Zeng, Shanbin Chen, Sen Tan, Hebing Ma, Chaojie Zhang, Song Liu, Xinzhi Shao, Yong Deng, Xiangchao Chen, Genchuan Yan, Ying Yang, Xinyu Wang
  • Patent number: 11441636
    Abstract: A bearing assembly configured to be disposed on casing of electronic device and including plate body, first damping component, second damping component, first fastener and second fastener. The plate body includes first mounting hole and second mounting hole. The first damping component is disposed in the first mounting hole. The first damping component includes first hole. The second damping component is disposed in the second mounting hole. The second damping component includes second hole. The first fastener is disposed in the first hole of the first damping component and configured to be fixed to the casing of the electronic device. The second fastener is disposed in the second hole of the second damping component and configured to be fixed to the casing of the electronic device. A hardness of the first damping component is greater than a hardness of the second damping component.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: September 13, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Chi-Cheng Hsiao, Ying-Chao Peng, Chun-Ying Yang
  • Patent number: 11437466
    Abstract: An avalanche-protected field effect transistor includes, within a semiconductor substrate, a body semiconductor layer and a doped body contact region having a doping of a first conductivity type, and a source region a drain region having a doping of a second conductivity type. A buried first-conductivity-type well may be located within the semiconductor substrate. The buried first-conductivity-type well underlies, and has an areal overlap in a plan view with, the drain region, and is vertically spaced apart from the drain region, and has a higher atomic concentration of dopants of the first conductivity type than the body semiconductor layer. The configuration of the field effect transistor induces more than 90% of impact ionization electrical charges during avalanche breakdown to flow from the source region, to pass through the buried first-conductivity-type well, and to impinge on a bottom surface of the drain region.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: September 6, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Liang-Yu Su, Hung-Chih Tsai, Ruey-Hsin Liu, Ming-Ta Lei, Chang-Tai Yang, Te-Yin Hsia, Yu-Chang Jong, Nan-Ying Yang
  • Patent number: 11428008
    Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a roofing membrane, which may include a cap, a scrim, and a core. In some embodiments, the roofing system may also include an adhesive film, which may include a first adhesive layer adhered to the roofing membrane, a second adhesive layer configured to adhere the roofing membrane to a roofing substrate, and a barrier layer positioned between the first and second adhesive layers. Methods of manufacturing roofing systems are also disclosed.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: August 30, 2022
    Assignee: BMIC LLC
    Inventor: Li-Ying Yang
  • Patent number: 11426456
    Abstract: The invention relates to activated Streptococcus pneumoniae serotype 10A, 22F or 33F polysaccharides and processes for their preparation. The invention also relates to immunogenic conjugates comprising Streptococcus pneumoniae serotype 10A, 22F or 33F polysaccharides covalently linked to a carrier protein, processes for their preparation and immunogenic compositions and vaccines comprising them.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: August 30, 2022
    Assignee: Pfizer Inc.
    Inventors: Jianxin Gu, Rajesh Kumar Kainthan, Jin-Hwan Kim, Avvari Krishna Prasad, Yu-Ying Yang
  • Patent number: 11419866
    Abstract: The present invention is directed to a depot composition for sustained release delivery of buprenorphine with enhanced stability and bioavailability. The composition is an injectable, low viscosity liquid and can form a depot in situ capable of delivering therapeutic level of buprenorphine over a period of time from one week to 3 months.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: August 23, 2022
    Assignee: Foresee Pharmaceuticals Co., Ltd.
    Inventors: Yuhua Li, MingHsin Li, Chen-Chang Lee, Chia-Ying Yang, Chih-Ying Lin
  • Publication number: 20220260690
    Abstract: Distance measuring is disclosed. In one example, a distance measuring device includes a ToF (time of flight) sensor, a distance calculation unit, a mode switching unit, and an estimation unit. The ToF sensor has a sensor clock that controls a photographing timing. The sensor clock is a device-specific clock different from a light source clock that controls a modulation frequency of a light emission pulse of a light source. The ToF sensor performs photographing by reflecting, on a surface of an object, emission light of the light source that emits pulse light. The distance calculation unit calculates a distance to the object based on image data captured by the ToF sensor. The estimation unit estimates the modulation frequency of the light source generated from the light source clock based on pieces of image data captured in an operation mode switched by the mode switching unit.
    Type: Application
    Filed: June 12, 2020
    Publication date: August 18, 2022
    Inventors: Ying Yang, Kensei Jo, Takafumi Fujita, Nana Matsumoto
  • Publication number: 20220251843
    Abstract: Some embodiments of the present disclosure relate to a roofing system. In some embodiments, the roofing system includes a first roofing material, wherein the first roofing material comprises a top surface and a bottom surface. In some embodiments, the top surface of the first roofing material comprises a nail zone with a plurality of fines. In some embodiments, the roofing system includes a second roofing material, wherein the second roofing material comprises a top surface and a bottom surface. In some embodiments, the bottom surface of the second roofing material comprises a plurality of fines. In some embodiments, the roofing system comprises and a patterned adhesive, which directly contacts at least a portion of the plurality of fines in the nail zone and at least a portion of the plurality of fines on the bottom surface of the second roofing material.
    Type: Application
    Filed: February 4, 2022
    Publication date: August 11, 2022
    Inventors: James A. Svec, Li-Ying Yang, Daniel E. Boss
  • Patent number: 11395791
    Abstract: Methods of increasing sIgA and mucin 5B levels in an individual's oral cavity are disclosed. The methods comprise applying to the individual's oral cavity in an amount effective to increase sIgA and mucin 5B levels in the individual's oral cavity, an oral care composition comprising: zinc phosphate, stannous fluoride and optionally, an organic acid buffer system.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: July 26, 2022
    Assignee: Colgate-Palmolive Company
    Inventors: Dandan Chen, Harsh Mahendra Trivedi, Ying Yang, James Masters
  • Patent number: 11393921
    Abstract: A high-voltage semiconductor device includes a substrate, a first insulating structure, a gate, a drain region, a source region and a doped region. The substrate has a first conductive type, and the first insulating structure is disposed on the substrate. The drain region and the source region are disposed in the substrate. The source region has a first portion and a second portion. The first portion has the second conductive type and the second portion has the first conductive type. The gate is disposed on the substrate, between the source region and the drain region to partially cover a side of the first insulating structure. The doped region is disposed in the substrate and has a first doped region and a second doped region, and the first doped region and the second doped region both include the first conductive type and separately disposed under the first insulating structure.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: July 19, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Hung-Chih Tan, Hsing-Chao Liu, Hsiao-Ying Yang, Chih-Cherng Liao
  • Patent number: 11388907
    Abstract: A method of preparing a lysolecithin composition. The method includes the steps of (a) providing a lecithin mixture including a lecithin, water, and ethanol, (b) adding phospholipase A1 or A2 to the lecithin mixture; and (c) allowing an enzymatic reaction to occur so that at least 70% of the phospholipids in the lecithin are converted to lysophospholipids to obtain the lysolecithin composition. Also disclosed are a lysolecithin composition thus prepared, a flavor emulsion prepared from the lysolecithin composition, and a liquid beverage or liquid beverage concentrate containing the lysolecithin composition.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 19, 2022
    Assignee: INTERNATIONAL FLAVORS & FRAGRANCES INC.
    Inventors: Ying Yang, Daniel Kaiping Lee, Chii-Fen Wang
  • Patent number: 11392174
    Abstract: Examples of communication of clocking apparatuses with computing devices are described. In an example implementation, a docking device and a computing device communicate through a Universal Serial Bus (USB) port of a USB hub of the docking device in USB Alternate Mode based on USB protocol-based messages.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: July 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yi-Fan Hsia, Hui-Ying Yang, Hung Lung Chen
  • Patent number: 11383090
    Abstract: A pacemaker fixation system, a leadless pacemaker system and a method of use thereof are disclosed. The leadless pacemaker system includes: a pacemaker fixation system including a leadless pacemaker and an elastic unfoldable element attached thereto, wherein in an unfolded configuration of the elastic unfoldable element, it fixes the leadless pacemaker at a target location in a blood vessel in communication with the heart; a delivery system for delivering the pacemaker fixation system to the target location; and a guide for guiding the delivery system into the blood vessel. According to the present invention, atrial pacing can be achieved by the leadless pacemaker through fixing the leadless pacemaker in the blood vessel in communication with the heart with the elastic unfoldable element.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: July 12, 2022
    Assignee: MICROPORT SOARING CRM (SHANGHAI) CO., LTD.
    Inventors: Zhijun Cheng, Grace Ying Yang Jang, Li Wang, Jiangkai Sun
  • Publication number: 20220216308
    Abstract: The present disclosure provides a high voltage semiconductor device includes a substrate, a first well region, a second well region, a source, a drain, a first electrode structure and a second electrode structure. The first well region and the second well region are disposed in the substrate, and which includes a first conductive type and a second conductive type which are complementary with each other. The source and the drain are respectively disposed within the first well region and the second well region. The first electrode structure and the second electrode structure are both disposed on the substrate, and the distance between the top surface of an electrode of the first electrode structure and the top surface of the substrate includes a first height and a second height which are different from each other.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 7, 2022
    Inventors: Chung-Ren Lao, Kuan-I Ho, Kuo-Chien Hsu, Che-Hua Chang, Hsiao-Ying Yang, Chih-Cherng Liao
  • Patent number: 11374096
    Abstract: The present disclosure provides a high voltage semiconductor device includes a substrate, a first well region, a second well region, a source, a drain, a first electrode structure and a second electrode structure. The first well region and the second well region are disposed in the substrate, and which includes a first conductive type and a second conductive type which are complementary with each other. The source and the drain are respectively disposed within the first well region and the second well region. The first electrode structure and the second electrode structure are both disposed on the substrate, and the distance between the top surface of an electrode of the first electrode structure and the top surface of the substrate includes a first height and a second height which are different from each other.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: June 28, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chung-Ren Lao, Kuan-I Ho, Kuo-Chien Hsu, Che-Hua Chang, Hsiao-Ying Yang, Chih-Cherng Liao
  • Publication number: 20220195194
    Abstract: Nail sealable materials comprising a matrix material and bentonite embedded within the matrix material are described herein in accordance with non-limiting embodiments of the present disclosure. In some embodiments, the nail sealable material comprises a sufficient amount of bentonite, such that the nail sealable material passes ASTM D1970 at a specified nail sealable material test thickness. Some embodiments relate to systems and methods utilizing the nail sealable materials described herein.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 23, 2022
    Inventors: Eric R. Anderson, Walter Zarate, Li-Ying Yang
  • Patent number: 11368064
    Abstract: An outer rotor direct drive motor with a position encoder includes an outer rotor and a stator disposed in the outer rotor, wherein the stator includes: a stator chassis; a stator printed circuit board disposed on an side of the stator chassis, at least an excitation coil and a receiving coil being printed at the stator printed circuit board; and a stator winding disposed on the stator printed circuit board; wherein the outer rotor changes a coupling strength between the excitation coil and the receiving coil. The present invention has the following advantages: the installation method is flexible, and supports through-shaft installation without occupying too much space of the motor body; the sensor structure is stable, the rotor scale area and the induction coil are all printed on the printed circuit board, even in the case where the rotational speed is too fast, deformation or cracking will not be occurred.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: June 21, 2022
    Assignee: SEMIMENT TECHNOLOGIES (SHANGHAI) CO., LTD.
    Inventors: Cheng Tao, Ying Yang, Honggang Song