Patents by Inventor Yohei Uchida

Yohei Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240347322
    Abstract: An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.
    Type: Application
    Filed: June 24, 2024
    Publication date: October 17, 2024
    Applicant: Tokyo Electron Limited
    Inventors: Yasuharu SASAKI, Shoichiro MATSUYAMA, Yohei UCHIDA
  • Patent number: 12084745
    Abstract: A copper alloy powder is a copper alloy powder for additive manufacturing. The copper alloy powder contains more than 1.00 mass % and not more than 2.80 mass % of chromium, and a balance of copper. A method for producing an additively-manufactured article includes a first step of preparing a copper alloy powder containing more than 1.00 mass % and not more than 2.80 mass % of chromium and a balance of copper and a second step of producing the additively-manufactured article from the copper alloy powder, and the additively-manufactured article is produced such that forming a powder layer including the copper alloy powder, and solidifying the copper alloy powder at a predetermined position in the powder layer to form a shaped layer are sequentially repeated to stack such shaped layers to thus produce the additively-manufactured article.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: September 10, 2024
    Assignees: DAIHEN CORPORATION, Osaka Research Institute of Industrial Science and Technology
    Inventors: Ryusuke Tsubota, Yohei Oka, Akira Okamoto, Takayuki Nakamoto, Takahiro Sugahara, Naruaki Shinomiya, Mamoru Takemura, Sohei Uchida
  • Patent number: 12046457
    Abstract: An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: July 23, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Shoichiro Matsuyama, Yohei Uchida
  • Patent number: 11984300
    Abstract: A plasma processing apparatus includes a chamber; a wall member; an insulating member; and a ground member. The wall member is partially placed in an internal space of the chamber and exposed to a space at an outside of the chamber. The insulating member is provided on the wall member. The ground member is made of silicon, provided in the internal space and mounted on the insulating member. The wall member is configured to support the ground member in a non-contact state with the insulating member therebetween. The ground member is in contact with a spherical surface of the insulating member and mounted on the spherical surface.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: May 14, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takehiro Tanikawa, Shuhei Yamabe, Yohei Uchida, Yasuharu Sasaki
  • Patent number: 11942357
    Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: March 26, 2024
    Assignee: Tokyo Electron Limited
    Inventors: Yohei Uchida, Naoki Sugawa, Katsushi Abe, Tsuyoshi Hida
  • Patent number: 11825589
    Abstract: A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: November 21, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yohei Uchida, Tetsuji Sato, Shojiro Yahata, Taira Takase
  • Patent number: 11795346
    Abstract: A polishing liquid composition for a silicon oxide film according to the present invention includes cerium oxide particles, a water-soluble macromolecular compound, and an aqueous medium, and the water-soluble macromolecular compound is a water-soluble macromolecular compound including a betaine structure, excluding carbobetaine homopolymers and sulfobetaine homopolymers. The water-soluble macromolecular compound is preferably a water-soluble macromolecular compound containing a constitutional unit A including a betaine structure, and a constitutional unit B that is a constitutional unit other than the constitutional unit A and contains at least one group of a primary amino group, a secondary amino group, a tertiary amino group, a quaternary ammonium group, and salts thereof.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 24, 2023
    Assignee: KAO CORPORATION
    Inventor: Yohei Uchida
  • Patent number: 11717912
    Abstract: A capillary guide device (40) includes: a guide body portion (41) capable of being in contact with a capillary (8) held in a hole (7h); and a drive portion (42) which arranges the guide body portion (41) at a position capable of being in contact with the capillary (8) by moving the guide body portion (41) along an X-axis direction. The drive portion (42) includes: a table (46) connected to the guide body portion (41); a drive shaft (47b) extending in the X-axis direction and exhibiting a frictional resistance force with the table (46); and an ultrasonic element (47a) fixed to an end of the drive shaft (47b) and supplying an ultrasonic wave to the drive shaft (47b).
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: August 8, 2023
    Assignee: SHINKAWA LTD.
    Inventor: Yohei Uchida
  • Patent number: 11600471
    Abstract: A substrate support for a plasma processing apparatus includes a first support area configured to support a substrate placed thereon; a second support area configured to support a focus ring placed thereon, and extending in a circumferential direction outward in a radial direction with respect to the first support area; a conductive structure configured to be connected to the focus ring; and a holder configured to hold the connection member to press the connection member downward, and also to cause the connection member to press the surface of the focus ring. The conductive structure includes a first conductive path which provides a terminal area outward in the radial direction with respect to the second support area, and a connection member configured to electrically connect the focus ring and the terminal area, and disposed on the terminal area to face a surface of the focus ring.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: March 7, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yasuharu Sasaki, Yohei Uchida
  • Publication number: 20230020793
    Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yohei UCHIDA, Jun HIROSE
  • Patent number: 11501995
    Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 15, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yohei Uchida, Jun Hirose
  • Patent number: 11495445
    Abstract: A plasma processing apparatus includes a processing chamber where a plasma processing is performed on a workpiece, a stage, an edge ring, a shield, and a driver. The stage has a placement surface on which the workpiece is placed inside the processing chamber. The edge ring is provided around the stage so as to surround the workpiece on the placement surface. The shield is capable of shielding a portion of the surface of the edge ring from plasma generated in the processing chamber. The driver changes the area of the edge ring exposed to the plasma by moving the shield relative to the edge ring.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: November 8, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yohei Uchida, Yusuke Mizuno
  • Publication number: 20220336257
    Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 20, 2022
    Inventors: Yohei UCHIDA, Naoki SUGAWA, Katsushi ABE, Tsuyoshi HIDA
  • Patent number: 11410871
    Abstract: A placement apparatus for placing a workpiece is provided. The placement apparatus includes a stage on which a workpiece can be placed in a processing vessel; an edge ring including a locking part which is disposed on the stage so as to surround a periphery of the workpiece; a conductive connecting member connected with the edge ring at the locking part; and a first contacting member configured to cause the edge ring to contact the stage, while the edge ring is connected with the connecting member.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 9, 2022
    Assignee: Tokyo Electron Limited
    Inventors: Yohei Uchida, Naoki Sugawa, Katsushi Abe, Tsuyoshi Hida
  • Publication number: 20220134468
    Abstract: A capillary guide device 40 includes: a guide body portion 41 capable of being in contact with a capillary 8 held in a hole 7h; and a drive portion 42 which arranges the guide body portion 41 at a position capable of being in contact with the capillary 8 by moving the guide body portion 41 along an X-axis direction. The drive portion 42 includes: a table 46 connected to the guide body portion 41; a drive shaft 47b extending in the X-axis direction and exhibiting a frictional resistance force with the table 46; and an ultrasonic element 47a fixed to an end of the drive shaft 47b and supplying an ultrasonic wave to the drive shaft 47b.
    Type: Application
    Filed: March 16, 2020
    Publication date: May 5, 2022
    Applicant: SHINKAWA LTD.
    Inventor: Yohei UCHIDA
  • Publication number: 20210366694
    Abstract: An electrostatic chuck according to an exemplary embodiment includes a first region and a second region. The first region has a first upper surface. The first region is configured to hold a substrate disposed on the first upper surface. The second region has a second upper surface. The second region extends in a circumferential direction to surround the first region. The second region is configured to support a focus ring mounted on the second upper surface. The first upper surface and the second upper surface extend along a single flat surface. The first region and the second region provide a space therebetween to separate the first upper surface and the second upper surface from each other.
    Type: Application
    Filed: June 3, 2019
    Publication date: November 25, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Yasuharu SASAKI, Shoichiro MATSUYAMA, Yohei UCHIDA
  • Publication number: 20210327688
    Abstract: A mounting base for placing a substrate to be subjected to a predetermined processing is provided. The mounting base includes an electrostatic chuck for electrostatically attracting and holding the substrate, a first edge ring that is disposed around the substrate and is transferrable, a second edge ring fixed around the first edge ring, a lifter pin for raising and lowering the first edge ring, a first electrode disposed in a position facing the first edge ring in the electrostatic chuck to electrostatically attract and hold the first edge ring; and a second electrode disposed in a position facing the second edge ring in the electrostatic chuck to electrostatically attract and hold the second edge ring.
    Type: Application
    Filed: August 26, 2019
    Publication date: October 21, 2021
    Applicant: Tokyo Electron Limited
    Inventors: Yasuharu SASAKI, Yohei UCHIDA
  • Publication number: 20210267042
    Abstract: A plasma processing apparatus includes a cooling plate having a fixing surface to which an upper electrode is fixed, the cooling plate having, on the fixing surface, an electrostatic chuck configured to attract the upper electrode by an attraction force generated by an applied voltage; a power supply configured to apply the voltage to the electrostatic chuck; and a power supply controller configured to control the power supply such that an absolute value of the voltage applied to the electrostatic chuck is increased based on a degree of consumption of the upper electrode.
    Type: Application
    Filed: May 7, 2021
    Publication date: August 26, 2021
    Inventors: Yohei Uchida, Tetsuji Sato, Shojiro Yahata, Taira Takase
  • Patent number: D992614
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 18, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Yohei Uchida, Masato Takayama
  • Patent number: D992615
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 18, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Yasuharu Sasaki, Yohei Uchida, Hikaru Abe, Tomoya Ujiie