Focus ring
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The features shown in broken lines depict environmental subject matter only and form no part of the claimed design.
The alternate long and short dash lines are merely the boundary lines between the claimed parts and the non-claimed parts.
Claims
The ornamental design for a FOCUS RING as shown and described.
| D692475 | October 29, 2013 | Hasuda |
| D731577 | June 9, 2015 | Hasuda |
| D750152 | February 23, 2016 | Awazu et al. |
| D780822 | March 7, 2017 | Awazu et al. |
| D820341 | June 12, 2018 | Tokiwa et al. |
| D870185 | December 17, 2019 | Nagaoka et al. |
| D888804 | June 30, 2020 | Clark |
| D900194 | October 27, 2020 | Tamura et al. |
| D900196 | October 27, 2020 | Tamura et al. |
| D937926 | December 7, 2021 | Nagaoka et al. |
| D973609 | December 27, 2022 | Babu et al. |
| 20140140688 | May 22, 2014 | Xu |
| 20190278058 | September 12, 2019 | Chou et al. |
| 20220157573 | May 19, 2022 | Sasaki et al. |
| 20220415621 | December 29, 2022 | Cho et al. |
| 305528664 | January 2020 | CN |
- Chinese Patent Office, Office Action in counterpart Chinese Design Patent Application No. 201930258942.3, dated Feb. 25, 2020.
- Focus Ring SIC, retrieved Feb. 22, 2022, https://www.soc.co.jp/service/new_material/semiconductor/semiconductor04/, see PDF Download English (Year: 2022).
Type: Grant
Filed: May 22, 2019
Date of Patent: Jul 18, 2023
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Yasuharu Sasaki (Miyagi), Yohei Uchida (Miyagi), Masato Takayama (Miyagi)
Primary Examiner: Richard Kearney
Assistant Examiner: Benjamin M Weeks
Application Number: 29/692,039