Abstract: A method for preparing a ZnO nanocrystal directly on a silicon substrate includes the steps of: (S1) forming a Zn—Si—O composite thin film on the silicon substrate; and (S2) thermally treating the obtained thin film. Particularly, ZnO nanocrystals are formed in an amorphous Zn—Si—O composite thin film by controlling the composition of the Zn—Si—O composite thin film and heating temperature thereof. With the present invention method for preparing a ZnO nanocrystal directly on a silicon substrate, more possibilities are opened up for the applications of ZnO nanocrystals to an optoelectronic device in use of a silicon substrate.

Abstract: Provided are a semiconductor package and a module printed circuit board (PCB) for mounting the same. Each of the semiconductor package and the module PCB includes a substrate, a first-type pad structure disposed in a first region of the substrate, and a second-type pad structure disposed in a second region of the package substrate. The first-type pad includes a first conductive pad disposed on the package substrate and a first insulating layer coated on the package substrate. The first insulating layer has a first opening by which a portion of a sidewall of the first conductive pad is exposed, and partially covers the first conductive pad. The second-type pad includes a second insulating layer coated on the package substrate to have a second opening and a second conductive pad disposed on the package substrate in the second opening to have an exposed sidewall.

Abstract: A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second structural parameter associated therewith, wherein a value of one of the first and a second structural parameter of each device is selected to provide a value of a performance parameter of the device substantially equal to a predetermined reference value, the predetermined reference value being the same for each device.

Abstract: There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isolation layer on the rear of the die pad or heat sink.

Abstract: A plasma display panel including: a first substrate; a plurality of first electrodes and a plurality of second electrodes, the first and second electrodes being disposed in parallel on the first substrate; a first dielectric surrounding the first electrodes and the second electrodes and connecting the first electrodes and the second electrodes; a passivation layer on the first dielectric and on the first electrodes and the second electrodes; a second substrate facing the first substrate; a plurality of third electrodes on the second substrate and crossing the first electrodes and the second electrodes; and a second dielectric on the third electrodes.

Abstract: Disclosed is a bill recycle machine, in which a separation part for separating bills from each other and a push plate are installed at the same level as a bill receiving space, and an elevation plate is removed, so that a simple structure and small volume thereof can be achieve.

Abstract: A laser beam despeckling device including a laser diode for producing a laser beam having a central characteristic wavelength. The device includes diode current drive circuitry for producing a diode drive current to drive said laser diode and produce said laser beam. High frequency modulation (HFM) circuitry modulates the diode drive current at a sufficiently high frequency to cause said laser diode to produce spectral side-band components about the central characteristic wavelength, and reducing the coherence as well as coherence length of the laser beam. An optical beam multiplexing (OMUX) module is provided for receiving the laser beam as input beam, a generating as output, a plurality of laser beam components that are recombined to produce a composite laser beam having substantially reduced coherence for use in illumination applications where a substantial reduction in speckle pattern noise is achieved.

Abstract: A multi-hop wireless network system and an authentication method thereof, wherein during initial mutual authentication between multi-hop nodes and a multi-hop wireless network, a shared key is acquired for hop-by-hop mutual authentication between the multi-hop nodes using a centralized authentication scheme. Using the acquired shared key, distributed authentication between the multi-hop nodes is performed.

Abstract: Disclosed herein is a memory device having an increased level of integration with a simplified method of manufacture The memory device includes: a plurality of word lines and a plurality of bit lines each regularly arranged, and a plurality of unit memory cells each formed at an intersection between an associated one of the word lines and an associated one of the bit lines, wherein each unit memory cell includes a capacitor connected to one of the bit lines and a threshold voltage switching device comprising two terminals, one terminal being connected to the capacitor and the other terminal being connected to one of the bit lines, the threshold voltage switching device being capable of switching current flow at a specific threshold voltage via a rapid variation in resistance depending upon a voltage applied through the word line and the bit line, wherein the capacitor is capable of accumulating electric charges supplied from the bit line based on a switching operation of the threshold voltage switching device

Abstract: A method for fabricating a semiconductor device having a bulb-type recessed channel including forming a mask layer on the semiconductor substrate to expose a region where a trench for a bulb-type recessed channel can be formed, forming the trench in the semiconductor substrate, implanting dopant ions in three-dimensional radial directions with a predetermined tilt angle in the exposed region of the semiconductor substrate, removing the mask layer, forming a gate stack in the region including the trench, and forming a source/drain in the semiconductor substrate.

Abstract: Provided are a system and method for identifying a peer-to-peer (P2P) application service. The method includes the steps of: (a) collecting an Internet protocol (IP) packet and generating a flow; (b) identifying the P2P application service on the basis of a port number using the generated flow; (c) when the P2P application service is identified in step (b), verifying the identified application service; (d) when it is verified that the identification is not correct, or the P2P application service is not identified in step (b), identifying the P2P application service on the basis of a payload; (e) when the P2P application service is identified in step (d) or it is verified in step (c) that the identification is correct, generating a SET table using a flow of the identified P2P application service; and (f) identifying the P2P application service for a flow not identified in either step (b) or step (d) using the SET table.

Abstract: A method of manufacturing a semiconductor device for decreasing a chip area by changing a connecting structure of pull up transistors and pull down transistors are disclosed. The semiconductor device can include pull up and pull down transistors including a first pull down transistor, a first pull up transistor, a second pull up transistor and a second pull down transistor, the first pull down transistor, the first pull up transistor, the second pull up transistor and the second pull down transistor being sequentially arranged in a series form on a SRAM, and line type contacts and metal lines formed on the respective pull up and pull down transistors.

Abstract: A method for fabricating a semiconductor device includes forming a first conductive layer over a substrate, forming an intermediate structure over the first conductive layer, the intermediate structure formed in a stack structure comprising at least a first metal layer and a nitrogen containing metal silicide layer, and forming a second conductive layer over the intermediate structure.

Abstract: Provided is an ice dispenser. The ice dispenser dispenses ice pieces have various sizes such as chunks, fragments, and shavings to users, and the size of ice pieces discharged from the ice dispenser can be conveniently adjusted. The ice dispenser includes a rotatable first roller, a rotatable second roller disposed close to the first roller, and a distance adjustor. The distance adjustor is configured to adjust a distance between the first and second rollers for adjusting sizes of ice crushed between the first and second rollers.

Abstract: The present invention relates to apparatus and method for a silicon ingot to a mounter, the apparatus including a frame; a mounter placed on the frame for mounting a silicon ingot; a press member installed movably to the frame for pressing the silicon ingot toward the mounter; and a heat or light emitting member arranged to emit heat or light to an adhesive member interposed between the silicon ingot and the mounter.

Abstract: An ice supply device is capable of supplying cubed ice, sliced ice, and grinded ice. The ice supply device is configured to supply cubed ice, sliced ice, or grinded ice based on a speed and direction of rotation of a rotary blade included in the ice supply device.

Abstract: A blood pump actuator to generate a driving force for driving a blood pump is disclosed. The blood pump actuator includes: a motor unit having a stator and a rotor, and rotating to generate a rotating force; a cam unit to convert the rotating motion of the motor unit into a rectilinear reciprocating motion; and a bellows unit having a bellows, which is expandable and contractible and contains a fluid therein, and an upper bellows plate and a lower bellows plate respectively attached to the upper and lower ends of the bellows, wherein the lower bellows plate moves upwards and downwards in a vertical direction according to the rectilinear reciprocating motion of the cam unit engaging with the lower bellows plate, and the bellows repeatedly expands and contracts according to the vertical movement of the lower bellows plate.

Abstract: A BIOS chip expansion card for starting a computer when the computer needs to be tested, includes a BIOS chip for starting the computer a first connector configured for connecting with a motherboard of the computer, and a switch member connected to the BIOS chip and the first connector for controlling communication therebetween, thereby controlling communication between the BIOS chip and the motherboard of the computer. Wherein when the BIOS chip communicates with the motherboard, the computer is started via the BIOS chip so that the computer can be tested.

Abstract: A sliding-type mobile communication terminal having a first housing and a second housing adapted to allow the first housing to be opened or closed by means of a sliding movement on the first housing in a longitudinal direction of the first housing. The terminal includes a spring module adapted to provide a sliding force, along the longitudinal direction of the first housing, for allowing closing of the second housing within a predetermined range of distance, and for providing the sliding force in an opposite direction for allowing opening of the second housing beyond the predetermined range of distance. The spring module includes link bars rotatably coupled in one end onto the first housing, coil springs supported by one end of the link bar and coupled to enclose the link bar, and a slider slidably coupled to the link bar to be acted upon by an elastic force from the coil spring. The terminal uses the elasticity in coil springs to implement a semi-automatic sliding opening/closure of the second housing.

Abstract: A semiconductor package may include a semiconductor pattern, a bonding pad, and a polymer insulation member. The semiconductor pattern may include a semiconductor device and first hole. The bonding pad may include a wiring pattern and plug. The wiring pattern may be formed on an upper face of the semiconductor pattern. The plug may extend from the wiring pattern to fill the first hole. The polymer insulation member may be formed on a lower face of the semiconductor pattern and may include a second hole exposing a lower end of the plug. A method of manufacturing a semiconductor package may include forming a first hole through a semiconductor substrate; forming a bonding pad and plug; attaching a supporting member to the upper face of the substrate; reducing a thickness of the substrate; forming a polymer insulation member on the lower face of the substrate; and cutting the substrate.