Abstract: A semiconductor memory device includes insulating patterns and gate patterns alternately stacked on a substrate, a channel structure that intersects the insulating patterns and the gate patterns and connected to the substrate, a charge storage structure between the channel structure and the gate patterns, and a contact structure on the substrate at a side of the insulating patterns and the gate patterns. One of the gate patterns includes a first barrier pattern between a first insulating pattern of the insulating patterns and a second insulating pattern of the insulating patterns adjacent the first insulating pattern in a first direction perpendicular to a main surface of the substrate, the first barrier pattern defining a concave region between a first portion of the first barrier pattern extending along the first insulating pattern and a second portion extending along the second insulating pattern, and a metal pattern in the concave region.

Abstract: A semiconductor device includes a substrate having an active pattern, a conductive pattern crossing the active pattern, a spacer structure on at least one side surface of the conductive pattern, and a capping structure on the conductive pattern. The capping structure includes a first capping pattern and a second capping pattern. The second capping pattern is disposed on a top surface of the first capping pattern and a top surface of the spacer structure.

Abstract: Disclosed is a display device that can uniformly transmit light emitted from a light source to the entire display panel without using a light guide plate. The display device includes a display panel, a backlight assembly supplying light to the display panel, and a lower cover receiving the backlight assembly. The backlight assembly includes a light source, a circuit board mounted with the light source, and a reflection cover coupled to the circuit board to reflect light emitted from the light source and formed of a bendable plate type member.

Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including a redistribution layer, an integrated circuit chip disposed on the first surface of the connection member, and including a plurality of units, at least one capacitor on the first surface of the connection member and in proximity to the integrated circuit chip, and an encapsulant on the first surface of the connection member and encapsulating the integrated circuit chip and the at least one capacitor, wherein the plurality of units include core power units selected from the group consisting of a central processing unit, a graphics processing unit, and an artificial intelligence unit, at least one of the core power units is disposed adjacent to one edge of the integrated circuit chip, and the at least one capacitor is disposed adjacent to the one edge of the integrated circuit chip.

Abstract: An image sensor package includes an image sensor chip, a logic chip, and a memory chip structure that are vertically stacked. The image sensor chip includes a pixel array and an interconnection structure that receives a power voltage, ground voltage, or signals. The logic chip processes pixel signals from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip. The memory chip structure includes a memory chip, a molding portion surrounding the memory chip, and at least one through mold via contact vertically passing through the molding portion and connected to at least one of the logic or memory chip. The memory chip stores at least one of a pixel signal processed by the logic chip or a pixel signal from the image sensor chip and receives the power voltage, ground voltage, or signals via the image sensor chip and logic chip.

Abstract: The present disclosure relates to an apparatus for controlling charging of an environment-friendly vehicle. The apparatus includes a high-voltage battery SOC determining unit configured to determine a state of charge (SOC) of a high-voltage battery that is a main power source, an auxiliary battery SOC determining unit configured to determine an SOC of an auxiliary battery that assists power of the high-voltage battery, and an auxiliary battery charging control unit configured to, when receiving a request for an operation of an engine for controlling heating, perform a control such that the auxiliary battery is charged by using the high-voltage battery.

Abstract: A video processing method includes generating a first down-sampled block by down-sampling a first block included in a first frame; generating a plurality of second down-sampled blocks by down-sampling a second block included in a second frame; selecting one of the plurality of second down-sampled blocks by comparing the first down-sampled block and each of the plurality of second down-sampled blocks; and determining, based on the first down-sampled block and the one selected second down-sampled block, a motion vector whereby the second block points to the first block, wherein the plurality of second down-sampled blocks are generated using down-sampling methods that are different from each other with respect to samples of the second block.

Abstract: Provided is an apparatus for managing image data, by which the image data transferred to a mobile device from an image capturing device connected to the mobile device is managed. The apparatus may include a first controller located in a native layer for communicating with a java layer, a second controller located in a java layer for communicating with the native layer, and a plurality of ring-buffer type shared memories in which the image data transferred from the image capturing device is stored. The first controller may store the image data in the shared memory at a first state according to the order of the shared memories and may change the state information of the shared memory to a second state when the image data is completely stored. The second controller may read the image data stored in the shared memories at the second state according to the order of the shared memories and may change the state information of the shared memory to the first state when the image data is completely read.

Abstract: There are disclosed a temperature sensor and a method for manufacturing the same. The temperature sensor comprises; a sensor unit including an organic light emitting layer including a delayed fluorescent material; a temperature transfer unit located below the sensor unit to transfer an external temperature to the sensor unit; a first electrode located on the sensor unit; a second electrode located below the sensor unit to be spaced apart from the temperature transfer unit; and a light intensity measuring unit located below the second electrode and measuring the intensity of light emitted from the organic light emitting layer. The temperature sensor can measure a temperature by using a change in the intensity of light using delayed fluorescence, thereby providing improved sensitivity.

Abstract: A substrate treating apparatus includes a plurality of conveying rollers arranged in a first direction which is a horizontal direction, and configured to transfer a substrate in the first direction, the substrate being disposed on a plane formed by the first direction and a second direction perpendicular to the first direction, a developer providing nozzle configured to provide a developer onto the substrate to form a developer layer on the substrate, a sensor part for recognizing a position of the substrate, and a vertical moving part configured to move each of the conveying rollers along a third direction which is downward and perpendicular to the first and second directions.

Abstract: Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

Abstract: A three-dimensional semiconductor device includes a substrate including a cell array region and a contact region, a stack structure including gate electrodes sequentially stacked on the substrate, vertical structures penetrating the stack structure, and cell contact plugs connected to end portions of the gate electrodes in the contact region. Upper surfaces of the end portions of the gate electrodes have an acute angle with respect to an upper surface of the substrate in the cell array region.

Abstract: An image display apparatus includes a display displaying contents, a communicator communicating with a server, and a processor controlling the communicator to receive additional information for the displayed contents and an information providing rule from the server and providing target information corresponding to a context among the received additional information when the context corresponding to the information providing rule is generated while the contents are displayed on the display.

Abstract: There is provided a method of processing uplink Ethernet packets of an aggregation node included in a distributed antenna system, the method includes: receiving a plurality of uplink Ethernet packets; summing the plurality of received uplink Ethernet packets; and transmitting the summed uplink Ethernet packets in an uplink direction.

Abstract: A thin film transistor array substrate includes: a base substrate; a first transistor including a first electrode on a surface of the base substrate, a spacer, on the first electrode, a second electrode on the spacer, a first active layer contacting the first electrode, the spacer and the second electrode, and a first gate electrode opposite to the first active layer with a first insulating layer interposed therebetween; a storage capacitor including a first storage electrode integrally connected to the first electrode or the second electrode, and a second storage electrode opposite to the first storage electrode with the first insulating layer interposed therebetween, where the second storage electrode is integrally connected to the first gate electrode; and a second transistor electrically connected to the storage capacitor, where the second transistor includes a second active layer extending in a direction intersecting the base substrate.

Abstract: A display apparatus is provided. The display apparatus includes: a display panel unit which comprises a first panel region corresponding to an opaque display region, and a second panel region corresponding to a transparent display region, a panel driving unit which drives the first panel region and the second panel region independently, and a controller which controls to display a main image on the opaque display region and display an additional image on the transparent display region.

Abstract: A display driver includes: a compensator configured to divide an input image into a plurality of blocks having a plurality of columns and a plurality of rows, generate a first current map in which a current magnitude corresponding to each of the plurality of blocks has been calculated, generate a second current map based on a cumulative summation of the current magnitude of the block located on each column of the first current map in a column direction, and generate output data by compensating pixel values of the input image based on a third current map in which the current magnitude of the block located on each row of the second current map has been adjusted with respect to a position in a row direction; and a data driver configured to generate an output image based on the output data and provide the output image to a display panel.

Abstract: Provided is a back cover for a portable terminal having remote control function, comprising: an infrared module provided on an upper end of the back cover, receiving power from the portable terminal, and emitting infrared rays; a button module including function keys, provided on a front surface of the back cover, and transmitting a control signal to the infrared module, wherein the control signal remotely controls an electronic product; a power supply and data connection module provided on a lower end of a back surface of the back cover; an application execution function key provided on the back cover and executing a remote control application which is installed on the portable terminal; and a camera activation function key provided on the back cover and activating a camera, wherein the camera is mounted on the portable terminal.

Abstract: The present disclosure relates to an Akkermansia muciniphila strain having a prophylactic or therapeutic effect on a degenerative brain disease and uses thereof. Since the Akkermansia muciniphila strain, the intestinal microorganism of the present disclosure, shows an effect of improving movement control and cognitive abilities as well as memory in an animal model having a degenerative brain disease such as Parkinson's disease and Alzheimer's disease, it can be useful in the prevention or treatment of brain diseases including Alzheimer's disease, Parkinson's disease, mild cognitive impairment, etc. In addition, it was confirmed in the present disclosure that compared to the Akkermansia muciniphila strain cultured in a mucin-containing medium, that cultured in a mucin-free medium showed a remarkable effect of improving hyperlipidemia, fatty liver, obesity, and hyperglycemia induced in a mouse model by high-fat diet when administered orally (in vivo).