Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including a redistribution layer, an integrated circuit chip disposed on the first surface of the connection member, and including a plurality of units, at least one capacitor on the first surface of the connection member and in proximity to the integrated circuit chip, and an encapsulant on the first surface of the connection member and encapsulating the integrated circuit chip and the at least one capacitor, wherein the plurality of units include core power units selected from the group consisting of a central processing unit, a graphics processing unit, and an artificial intelligence unit, at least one of the core power units is disposed adjacent to one edge of the integrated circuit chip, and the at least one capacitor is disposed adjacent to the one edge of the integrated circuit chip.

Abstract: An engine control method for heating of a hybrid electric vehicle, includes collecting information for air conditioning control by a sensor during an operation of a heating, ventilation, and air conditioning (HVAC) device in the hybrid electric vehicle in which forced engine driving for heating is performed, determining whether a condition that requires pre-engine driving as driving in a separate mode from forced engine driving is satisfied based on the collected information, upon determining that the condition that requires the pre-engine driving is required is satisfied, determining whether a condition for allowing the pre-engine driving is satisfied based on engine efficiency and hybrid system efficiency information, and upon determining that the condition for allowing the pre-engine driving is satisfied, performing the pre-engine driving for driving an engine to manage engine coolant temperature.

Abstract: A method for turbocharger key-off cooling control may include performing turbocharger key-off cooling control based on engine load for circulating engine coolant to a turbocharger cooling line when high cooling performance of a vehicle is checked by a coolant temperature and an oil temperature at which a turbocharger controller does not require operation of an auxiliary electric water pump when an engine is stopped.

Abstract: Disclosed are semiconductor memory devices and methods of fabricating the same. The semiconductor memory device comprises a first semiconductor pattern that is on a substrate and that includes a first end and a second end that face each other, a first conductive line that is adjacent to a lateral surface of the first semiconductor pattern between the first and second ends and that is perpendicular to a top surface of the substrate, a second conductive line that is in contact with the first end of the first semiconductor pattern, is spaced part from the first conductive line, and is parallel to the top surface of the substrate, and a data storage pattern in contact with the second end of the first semiconductor pattern. The first conductive line has a protrusion that protrudes adjacent to the lateral surface of the first semiconductor pattern.

Abstract: Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.

Abstract: A display driver includes: a compensator configured to divide an input image into a plurality of blocks having a plurality of columns and a plurality of rows, generate a first current map in which a current magnitude corresponding to each of the plurality of blocks has been calculated, generate a second current map based on a cumulative summation of the current magnitude of the block located on each column of the first current map in a column direction, and generate output data by compensating pixel values of the input image based on a third current map in which the current magnitude of the block located on each row of the second current map has been adjusted with respect to a position in a row direction; and a data driver configured to generate an output image based on the output data and provide the output image to a display panel.

Abstract: A three-dimensional semiconductor device includes: a peripheral circuit structure disposed on a lower substrate, and including an internal peripheral pad portion; an upper substrate disposed on the peripheral circuit structure; a stack structure disposed on the upper substrate, and including gate horizontal patterns; a vertical channel structure passing through the stack structure in a first region on the upper substrate; a first vertical support structure passing through the stack structure in a second region on the upper substrate; and an internal peripheral contact structure passing through the stack structure and the upper substrate, and electrically connected to the internal peripheral pad portion, wherein an upper surface of the first vertical support structure is disposed on a different level from an upper surface of the vertical channel structure, and is coplanar with an upper surface of the internal peripheral contact structure.

Abstract: A display apparatus including a display which displays content, a communicator configured to communicate with a remote controller and an external device, and a controller. The controller being configured to, upon receiving a control command from the external device, control operation of the display apparatus based on the received control command, control the received control command to be transmitted to the remote controller, and control the communicator to transmit the received control command to the external device through the remote controller.

Abstract: An electroluminescent display device includes a thin film transistor disposed on a substrate; a passivation layer disposed on the thin film transistor; a plurality of metallic patterns disposed to be spaced apart from each other on the passivation layer; a reflective electrode disposed conforming to the shapes of the plurality of metallic patterns and a top surface of the passivation layer and including a plurality of protruding portions; an overcoat layer disposed on the passivation layer and the reflective electrode and including an opening configured to expose a top surface of each of the plurality of protruding portions; a first electrode disposed on the reflective electrode and the overcoat layer and electrically connected to the reflective electrode; an light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer.

Abstract: A semiconductor device includes a substrate having an active pattern, a conductive pattern crossing the active pattern, a spacer structure on at least one side surface of the conductive pattern, and a capping structure on the conductive pattern. The capping structure includes a first capping pattern and a second capping pattern. The second capping pattern is disposed on a top surface of the first capping pattern and a top surface of the spacer structure.

Abstract: A method of providing a synchronization signal to at least one small cell includes receiving a synchronization reference signal; extracting a synchronization signal from the synchronization reference signal; generating a network listening (NL) synchronization signal based on the synchronization signal; and transmitting the NL synchronization signal for reception by the at least one small cell.

Abstract: A display device includes a first pixel region (FPR), a second pixel region (SPR), a color conversion pattern (CCP), a first overcoat layer (FOL), a barrier layer (BL), a second overcoat layer (SOL), a liquid crystal layer (LCL), and a switching element (SE). The FPR is configured to display a first color (FC). The SPR is adjacent the FPR, and is configured to display a second color (SC) of a shorter peak wavelength than the FC. The CCP is disposed in the FPR, and is configured to: convert a color of incident light into the FC; and output converted light of the FC. The FOL is disposed on the CCP. The BL is of an inorganic material, and is disposed on the FOL. The SOL is of an organic material, and is disposed on the BL. The LCL is disposed on the SOL. The SE is disposed on the LCL.

Abstract: A quantum hybridization negative differential resistance device having negative differential resistance (NDR) under a low voltage condition using a nanowire based on an organic-inorganic hybrid halide perovskite, and a circuit thereof are provided. The quantum hybridization negative differential resistance device includes a channel formed of an organic-inorganic hybrid halide perovskite crystal and electrodes formed of its inorganic framework and is connected to opposite ends of the channel.

Abstract: A multi-stack joined body includes a first transparent member, a second transparent member disposed on the first transparent member, and an intermediate layer interposed between the first transparent member and the second transparent member, where a joining region in which a physical boundary is not provided between the first transparent member and the intermediate layer and between the second transparent member and the intermediate layer is provided across the first transparent member, the intermediate layer, and the second transparent member.

Abstract: A photopolymerizable resin composition includes a first layer and a second layer; and a barrier layer disposed between the first layer and the second layer, the barrier layer includes one or more of SiNx, SiOx, SiON, Mo, a Mo oxide, Cu, a Cu oxide, Al, an Al oxide, Ag, and a Ag oxide.

Abstract: A backlight unit includes a light guide plate; a wavelength conversion member disposed on a surface of the light guide plate; and a housing which houses the wavelength conversion member and is fused to the light guide plate.

Abstract: A battery module includes a cell stack structure formed as a plurality of battery cells stacked and accommodated in a module case. The module case includes at least one hole forming plate having a plurality of resin injection holes formed therein for receiving an adhesive resin therethrough, and the plurality of resin injection holes are distributed on both a left side and a right side of a center of the hole forming plate in a longitudinal direction thereof, such that the resin injection holes on the left side and the right side are spaced apart from each other by a predetermined distance from the center of the hole forming plate in the longitudinal dimension.

Abstract: An electroluminescent display device includes a thin film transistor disposed on a substrate; a passivation layer disposed on the thin film transistor; a plurality of metallic patterns disposed to be spaced apart from each other on the passivation layer; a reflective electrode disposed conforming to the shapes of the plurality of metallic patterns and a top surface of the passivation layer and including a plurality of protruding portions; an overcoat layer disposed on the passivation layer and the reflective electrode and including an opening configured to expose a top surface of each of the plurality of protruding portions; a first electrode disposed on the reflective electrode and the overcoat layer and electrically connected to the reflective electrode; an light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer.

Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.