Abstract: Provided is a plated steel sheet having excellent surface quality, as well as having excellent formability while also having high strength characteristics; and a method for manufacturing same. The plated steel sheet includes: base iron; and a plating layer provided on at least one surface of the base iron. The base iron includes by weight: 0.002 to 0.01% of carbon (C), 0.1% or less of silicon (Si), 0.4 to 1.0% of manganese (Mn), 0.04 to 0.1% of phosphorus (P), 0.01% or less of sulfur (S), 0.005% or less of nitrogen (N), 0.1% or less of aluminum (S·Al), 0.005 to 0.03% of titanium (Ti), 0.01 to 0.05% of niobium (Nb), 0.06 to 0.1% of copper (Cu), 0.0015% or less of boron (B), a content of molybdenum (Mo). The base iron includes ferrite as a matrix structure.

Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.

Abstract: A semiconductor memory device includes a stack structure comprising a plurality of layers vertically stacked on a substrate, each layer including a semiconductor pattern, a gate electrode extending in a first direction on the semiconductor pattern, and a data storage element electrically connected to the semiconductor pattern, a plurality of vertical insulators penetrating the stack structure, the vertical insulators arranged in the first direction, and a bit line provided at a side of the stack structure and extending vertically. The bit line electrically connects the semiconductor patterns which are stacked. Each of the vertical insulators includes first and second vertical insulators adjacent to each other. The gate electrode includes a connection portion disposed between the first and second vertical insulators.

Abstract: A method and an apparatus for calibrating an array path of a beam forming test equipment for a base station, includes enabling a beam forming-related interlocking test of a base station and a test equipment by compensating for distortion of the beam forming characteristics of the base station incidentally caused by the connection between the base station and the test equipment by using a specific signal transmitted from the base station, when test equipment such as a channel simulator is used to test beam forming of a base station.

Abstract: A method of controlling vehicle braking includes decelerating a vehicle to a first speed by using regenerative braking when a vehicle stop request is generated by a manipulation of a paddle shifter, stopping the vehicle by using hydraulic braking when the vehicle is decelerated to the first speed, and maintaining a stopped state of the vehicle by automatic vehicle hold control when the vehicle is stopped.

Abstract: A display device includes a base layer including an upper base layer and a lower base layer on a rear surface of the upper base layer; at least one light emitting element on a surface of the upper base layer; and at least one pad on the rear surface of the upper base layer and including a first pad layer adjacent to the upper base layer and a second pad layer adjacent to the lower base layer. The second pad layer includes indium zinc oxide (IZO).

Abstract: There is provided a method of processing uplink Ethernet packets of an aggregation node included in a distributed antenna system, the method includes: receiving a plurality of uplink Ethernet packets; summing the plurality of received uplink Ethernet packets; and transmitting the summed uplink Ethernet packets in an uplink direction.

Abstract: Disclosed is a display driver integrated circuit (IC) which includes a data line driver that drives a first data line connected with a first pixel of a display in response to output image data, and a dithering circuit that receives a brightness value of the display, calculates a first reference grayscale value corresponding to the brightness value using a first group of threshold grayscale values, receives input image data with a first grayscale value, which corresponds to the first pixel, compares the first grayscale value and the first reference grayscale value, and generates the output image data having not the first grayscale value but an output grayscale value when the first grayscale value is smaller than the first reference grayscale value.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

Abstract: There is provided an anhydrous dyeing system for yarn, including: a transfer printer which repeatedly sprays dye ink on a surface of a transfer sheet a plurality of times to laminate and apply ink layers; a dyeing jig which is in a drum form having a plurality of microholes formed in an outer circumferential surface thereof to penetrate inside and outside; a process chamber into which the dyeing jig is put; a heating member for heating the yarn wound on the dyeing jig, by supplying heat to the inside of the process chamber; and a vacuum-generating member which is in communication with an internal space of the dyeing jig and vacuum-evacuates the air in the internal space of the dyeing jig to thereby form a vacuum pressure inside the dyeing jig.

Abstract: The present disclosure provides a light emitting module replacement type light emitting device including: one or more light emitting modules (100) configured to include a substrate (110), one or more light emitting diodes (120) mounted on one side surface of the substrate (110) in a third direction, and a light emitting module terminal (130) electrically connected to the one or more light emitting diodes (120); a heat sink (200) having a contact surface (S) which is configured to come in contact with the light emitting modules (100); and one or more binding clips (300) coupled to the heat sink (200), positioned on the contact surface (S) and electrically connected to an external power supply.

Abstract: In a method for coating on a surface of a medical PEEK material with titanium to have a microporous structure, titanium is coated on a surface of polyether ether ketone (PEEK) via magnetron sputtering. The surface of the titanium coated on the surface of PEEK is polished via an electromagnetic polishing apparatus. A thin-film with titanium dioxide (TiO2) having a microporous structure is formed on the polished surface of the titanium via an anodic oxidation treatment.

Abstract: A display device and a method of fabricating the same are provided. The display device includes a substrate, a first electrode on the substrate, a second electrode on the substrate and spaced apart from the first electrode, a plurality of light emitting elements, at least a portion of each of which is between the first electrode and the second electrode, and contact electrodes on the first electrode, the second electrode and the light emitting elements, the contact electrodes including a conductive polymer, wherein the contact electrodes include a first contact electrode which contacts an end portion of a first portion of the light emitting elements and the first electrode and a second contact electrode which contacts an end portion of a second portion of the light emitting elements, and the second electrode and is spaced apart from the first contact electrode.

Abstract: A display includes a substrate including a first contact hole and a residual film of the substrate overlapping each other in a thickness direction, an electric conductor provided in the residual film and having conductivity, a first barrier insulating film disposed on the substrate and including a second contact hole, a fan-out line disposed in a first metal layer on the first barrier insulating film and including a pad disposed in the second contact hole, the pad electrically contacting the electric conductor, a display layer disposed on the fan-out line, and a flexible film disposed below the substrate, extending to the first contact hole, and electrically connected to the pad through the electric conductor.

Abstract: A display device includes a substrate, a first metal layer on the substrate, a first barrier insulating layer on the first metal layer, an etching control layer on the first barrier insulating layer, a first contact hole passing through the substrate, the first barrier insulating layer, and the etching control layer, a second barrier insulating layer on the etching control layer and including a second contact hole, a fan-out line on the second barrier insulating layer and included in a second metal layer, a pad part inserted into the second contact hole and included in the second metal layer, the pad part integral with the fan-out line, a display layer on the fan-out line, and a flexible film under the substrate and inserted into the first contact hole to be electrically connected to the pad part. The first metal layer includes an etching mark adjacent to the first contact hole.

Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.

Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

Abstract: A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.

Abstract: A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.

Abstract: A semiconductor memory device may include a bit line extending in a first direction, a first conductive pattern extending in a second direction intersecting the first direction, a semiconductor pattern connecting the bit line and the first conductive pattern, a second conductive pattern including an insertion portion in the first conductive pattern, and a dielectric layer between the first conductive pattern and the second conductive pattern. The insertion portion of the second conductive pattern may have a width which increases as a distance from the semiconductor pattern increases.