Patents by Inventor Yong-Hoon An

Yong-Hoon An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220180977
    Abstract: The present concept relates to a first principle-derived effective mass approximation simulation technology for accurate and efficient computational simulation of an optical property of a quantum nanostructure including creating an effective mass approximation (EMA) parameter through first principle density functional theory (DFT) calculation for a model nanostructure corresponding to a simulation target quantum nanostructure, performing EMA calculation using the EMA parameter created through the DFT calculation, and acquiring the optical property of the quantum nanostructure based on an electronic structure generated through the EMA calculation.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 9, 2022
    Applicant: Korea Advanced Institute of Science and Technology
    Inventor: Yong-Hoon Kim
  • Patent number: 11350529
    Abstract: A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Eun Lee, Yong Hoon Kim
  • Patent number: 11348924
    Abstract: A semiconductor memory device may include a bit line extending in a first direction, a first conductive pattern extending in a second direction intersecting the first direction, a semiconductor pattern connecting the bit line and the first conductive pattern, a second conductive pattern including an insertion portion in the first conductive pattern, and a dielectric layer between the first conductive pattern and the second conductive pattern. The insertion portion of the second conductive pattern may have a width which increases as a distance from the semiconductor pattern increases.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: May 31, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hoon Kim, Kwang-Ho Park, Yong-Hoon Son, Hyunji Song, Gyeonghee Lee, Seungjae Jung
  • Patent number: 11349173
    Abstract: A battery module includes a cell stack structure formed as a plurality of battery cells stacked and accommodated in a module case. The module case includes at least one hole forming plate having a plurality of resin injection holes formed therein for receiving an adhesive resin therethrough, and the plurality of resin injection holes are distributed on both a left side and a right side of a center of the hole forming plate in a longitudinal direction thereof, such that the resin injection holes on the left side and the right side are spaced apart from each other by a predetermined distance from the center of the hole forming plate in the longitudinal dimension.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: May 31, 2022
    Inventors: Jung-Min Kwak, Jong-Ha Jeong, Do-Hyun Park, Young-Ho Lee, Yong-Hoon Lee
  • Publication number: 20220164760
    Abstract: Disclosed is an unmanned goods supply system using a drone. The unmanned goods supply system includes a landing unit to which delivery goods are mailed by a drone; a transfer unit for transferring the delivery goods mailed to the landing unit; a loading unit that is located under the landing unit and stores the delivery goods transported by the transfer unit; and an interface unit for delivering the delivery goods stored in the loading unit to a customer. The transfer unit includes a first transfer unit that is installed on the landing unit and horizontally transports the delivery goods to a predetermined region on the landing unit, and a second transfer unit for transferring the delivery goods collected in the predetermined region to the loading unit.
    Type: Application
    Filed: September 17, 2021
    Publication date: May 26, 2022
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Hoon CHOI, Sung Hee KIM, Hoon JUNG
  • Patent number: 11343917
    Abstract: Provided is an air conditioner capable of preventing a soldering defect when a circuit element is installed on a circuit board. The air conditioner includes a circuit board configured to form a circuit, a choke coil installed on the circuit board and having a wire wound around on a core, and a support device installed at a lower side of the choke coil to support the choke coil, and provided with a through-hole allowing the wire to pass therethrough, wherein the support device includes a support portion that protrudes from a lower surface of the support device to support the choke coil installed on the circuit board at an interval from the circuit board, the support portion disposed to be spaced apart from the through-hole in a direction away from an outer edge of the support device.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: May 24, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong Hoon Kim
  • Publication number: 20220154071
    Abstract: A technology disclosed in the present disclosure provides a Group III-V-based quantum dot including a seed which includes a Group III element, a Group V element, and an active metal having various oxidation numbers and in which a molar ratio of the Group III element and the active metal is 1:3 to 1:30, and a method of manufacturing the same.
    Type: Application
    Filed: April 7, 2020
    Publication date: May 19, 2022
    Inventors: Eun Byul BANG, Do Eon KIM, Yun Hee PARK, Jong Nam PARK, Kang Yong KIM, Yong Hoon Choi
  • Patent number: 11335685
    Abstract: Disclosed are semiconductor memory devices and methods of fabricating the same. The semiconductor memory device comprises a first semiconductor pattern that is on a substrate and that includes a first end and a second end that face each other, a first conductive line that is adjacent to a lateral surface of the first semiconductor pattern between the first and second ends and that is perpendicular to a top surface of the substrate, a second conductive line that is in contact with the first end of the first semiconductor pattern, is spaced part from the first conductive line, and is parallel to the top surface of the substrate, and a data storage pattern in contact with the second end of the first semiconductor pattern. The first conductive line has a protrusion that protrudes adjacent to the lateral surface of the first semiconductor pattern.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: May 17, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Hoon Son, Hyung Joon Kim, Hyun Jung Lee
  • Patent number: 11315929
    Abstract: A semiconductor device includes a bit line extending in a first direction, a gate electrode extending in a second direction, and a semiconductor pattern extending in a third direction and connected to the bit line, and a capacitor. The capacitor includes a first electrode connected to the semiconductor pattern and a dielectric film between the first and second electrodes. The first or the second direction is perpendicular to an upper surface of the substrate. The first electrode includes an upper and a lower plate region parallel to the upper surface of the substrate, and a connecting region which connects the upper and the lower plate regions. The upper and the lower plate regions of the first electrode include an upper and a lower surface facing each other. The dielectric film extends along the upper and the lower surfaces of the upper and lower plate regions of the first electrode.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: April 26, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Jae Jung, Jae Hoon Kim, Kwang-Ho Park, Yong-hoon Son
  • Publication number: 20220123255
    Abstract: A method for manufacturing a display device according to an embodiment of the present invention includes providing a display substrate and an encapsulation substrate, each of which has a display area and a non-display area surrounding the display area thereon, forming a nanowire on the encapsulation substrate overlapping a sealing area defined as a partial area of the non-display area, and combining the encapsulation substrate and the display substrate with each other, wherein the forming of the nanowire includes irradiating a first laser, which is a ultrashort pulse laser, onto the encapsulation substrate overlapping the sealing area, and the combining of the encapsulation substrate and the display substrate with each other includes irradiating a second laser, which is a ultrashort pulse laser, onto the display substrate overlapping the sealing area.
    Type: Application
    Filed: June 27, 2019
    Publication date: April 21, 2022
    Inventors: JUNG HYUN KIM, YONG-HOON KWON, TAEOH KIM, WOOSUK SEO
  • Patent number: 11309280
    Abstract: An electronic device includes a circuit board, a semiconductor device package mounted on the circuit board, the semiconductor device package including a package substrate connected to the circuit board, a first semiconductor device and a second semiconductor device mounted side by side on the package substrate, and a molding surrounding a sidewall of the first semiconductor device and a sidewall of the second semiconductor device, the molding not covering a top surface of the first semiconductor device, and a heat dissipation structure on the semiconductor device package, the top surface of the first semiconductor device being in contact with the heat dissipation structure.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: April 19, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-hoon Kim, Kil-soo Kim, Kyung-suk Oh, Tae-joo Hwang
  • Publication number: 20220111833
    Abstract: A method of controlling a hybrid electric vehicle including an engine and a first motor connected to main drive wheels and a second motor connected to auxiliary drive wheels includes determining a required torque, in response to a predetermined condition being satisfied, determining a first torque that the second motor is to continuously output based on the required torque and a vehicle speed and determining a second torque that the second motor is to discontinuously output in order to compensate for acceleration loss in a situation in which the acceleration loss occurs based on a state of an engine clutch disposed between the engine and the first motor, a state of a transmission, or the required torque, and determining a final torque of the second motor based on the first and second torques.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 14, 2022
    Inventors: Seong Ik Park, Sung Chan Na, Ku Young Kang, Yong Hoon Lee
  • Patent number: 11282901
    Abstract: A display device includes a display panel, a control part below the display panel and including a first control layer below the display panel, a second control layer below the first control layer, and a third control layer below the second control layer. The first control layer includes a first transmission portion and a first absorption portion. The second control layer includes a second transmission portion and a second absorption portion. The third control layer includes a third transmission portion and a third absorption portion. The display panel also includes a sensing layer below the control part to recognize biometric information.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 22, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sikwang Kim, Minsuk Ko, Kabjong Seo, Yong-Hoon Yang
  • Patent number: 11284515
    Abstract: An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component, a second wiring layer disposed on the first insulating material, a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection, a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component, and a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: March 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Eun Lee, Jin Won Lee, Yong Hoon Kim
  • Publication number: 20220086781
    Abstract: There is provided a method of processing uplink Ethernet packets of an aggregation node included in a distributed antenna system, the method includes: receiving a plurality of uplink Ethernet packets; summing the plurality of received uplink Ethernet packets; and transmitting the summed uplink Ethernet packets in an uplink direction.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 17, 2022
    Applicant: SOLiD, INC.
    Inventors: Dong Hee KWON, Hoo Pyo HONG, Yong Hoon KANG, Dae Young KIM, Young Man CHO
  • Publication number: 20220087025
    Abstract: An electronic component-embedded substrate includes a wiring structure including a plurality of insulating layers and a plurality of wiring layers and having a cavity penetrating through at least one of the plurality of insulating layers, a first electronic component disposed in the cavity, a dam structure disposed on the wiring structure and having a through-portion, a first insulating material disposed in at least a portion of each of the cavity and the through-portion, and covering at least a portion of each of the wiring structure and the first electronic component, and a first circuit layer disposed on the first insulating material.
    Type: Application
    Filed: March 26, 2021
    Publication date: March 17, 2022
    Inventors: Yun Je JI, Yong Hoon KIM
  • Patent number: 11276300
    Abstract: The present invention provides a method for learning latest data considering external influences in an early warning system, and the early warning system for same. The method for learning latest data considering external influences comprises the steps of: an early warning processing device categorizing device monitored variables according to external influences; and the early warning processing device differently applying a pattern learning method for each of the categorized monitored variables.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 15, 2022
    Assignee: Korea Hydro & Nuclear Power Co., LTD.
    Inventors: Dae Woong Kim, Nam Woo Choi, Bum Nyun Kim, Hyoung Kyun Kim, Ji In Kim, Ju Hyung Kang, Yong Hoon Park, Gun Woong Shin, Yang Seok Kim, Young Sheop Park, Chi Yong Park, Byoung Oh Lee, Jong Seog Kim
  • Publication number: 20220063417
    Abstract: A braking control method of an electrified vehicle provided with an electric motor as a driving source may include the steps of starting regenerative braking when a required braking amount is obtained; determining a minimum transition time which is a minimum time required for braking transition from the regenerative braking to hydraulic braking according to a maximum response slope of a hydraulic braking device of the vehicle; determining braking deceleration according to the required braking amount and a road surface condition; determining a start vehicle speed of the braking transition according to the minimum transition time, the braking deceleration, and an end vehicle speed of the braking transition; and starting the braking transition upon determining that the start vehicle speed of the braking transition is reached during the regenerative braking.
    Type: Application
    Filed: August 13, 2021
    Publication date: March 3, 2022
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Yong Hoon Lee, Hyun Woo Lim, Joon Shik Park
  • Publication number: 20220053631
    Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.
    Type: Application
    Filed: March 18, 2021
    Publication date: February 17, 2022
    Inventors: Seon Ha Kang, Yong Hoon Kim
  • Patent number: 11248566
    Abstract: An exhaust gas recirculation (EGR) cooler is provided and includes a plurality of tubes that are spaced apart from each other and a cavity that is disposed on an engine to receive the plurality of tubes. A coolant guide guides a coolant to the plurality of tubes and a cover then closes the cavity. The cavity has an inlet port that communicates with a water jacket of the engine and the cavity receives the coolant from the water jacket of the engine through the inlet port.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: February 15, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae Seok Choi, Ki Seok Lee, Yong Hoon Kim, Yang Geol Lee