Abstract: According to an embodiment, a semiconductor device includes a silicon substrate, an insulation film, and a plurality of chip-side connection terminals. The silicon substrate is internally provided with a first wire layer. The insulation film is stacked on a first surface of surfaces of the silicon substrate, the first surface being approximately parallel to the first wire layer. The chip-side connection terminals are electrically connected to the wire layer. Moreover, the chip-side connection terminals are exposed on a second surface side, the second surface being continuous from the first surface in an approximately perpendicular manner.

Abstract: A non-volatile semiconductor storage device includes: a memory string including a plurality of memory cells connected in series; a first selection transistor having one end connected to one end of the memory string; a first wiring having one end connected to the other end of the first selection transistor; a second wiring connected to a gate of the first selection transistor. A control circuit is configured to boost voltages of the second wiring and the first wiring in the erase operation, while keeping the voltage of the first wiring greater than the voltage of the second wiring by a certain potential difference. The certain potential difference is a potential difference that causes a GIDL current.

Abstract: A semiconductor device comprising a stacked layer memory block and associated peripheral circuits in stacked layer arrangements. Booster circuits in a variety of stacked layer arrangements are described. The booster circuit possesses plural rectifier cells that are series-connected and plural first capacitors. The plural first capacitors receive the first clock signal on one end, and the other ends are each connected to one end of different rectifier cells. The first capacitor is composed of capacities between plural first conductive layers that are arrayed with a set pitch perpendicularly to the substrate. One of the either even numbered or odd numbered first conductive layers is supplied with a first clock signal. The other of the either even numbered or odd numbered first conductive layers that line perpendicularly to the substrate is, individually, connected to one end of different rectifier cells.

Abstract: A semiconductor storage device has a nonvolatile storage region, a voltage generating circuit that generates an operational voltage for the storage region, and a control circuit that sends the voltage generated by the voltage generating circuit to the storage region. The voltage generating circuit has a transistor, a first resistance element, a second resistance element, and a comparator. The first resistance element and the second resistance element have wiring structure for resistance. The resistance wiring in the wiring structure has the same line width as the finest line width in the wiring formed in the storage region.

Abstract: A semiconductor memory device includes a first comparative device, to which first and second voltages are input; a first capacitor, which accumulates the electrical potential of a first node; a power source, which outputs the first electric current to a second node; a resistor, which generates a third voltage in the second node; a second capacitor, which accumulates the electric potential of the second node; first switches, which make a common connection at a third node possible for the first node and the second node, to which the first capacitor and the second capacitor are connected respectively; and a second comparison device, which uses as an input voltage a fourth voltage, which is obtained as a result of the charge share between the first and the second capacitors and the electrical potential of a fourth node, and equalizes the electrical potential of the fourth node with the fourth voltage.

Abstract: A non-volatile semiconductor memory device includes a peripheral circuit having multilayer wirings. Above this peripheral circuit, a plurality of memory strings is formed. The memory strings include a plurality of memory cells and a back gate transistor connected in series. Multiple back gate layers are formed to function as a control electrode of the back gate transistor. A first connection part composed of semiconductor films connects a lower surface of one of the back gate layers and an upper surface of the uppermost wiring layer of the multilayer wirings, and a barrier metal film is disposed above the uppermost wiring layer.

Abstract: According to one embodiment, a programmable logic switch includes first and second word lines above a first path transistor, a first pillar passing through the first and second word lines and connected to the first path transistor, a second pillar passing through the first and second word lines and connected to the first path transistor, a first memory device between the first pillar and the first word line, a second memory device between the first pillar and the second word line, a third memory device between the second pillar and the first word line, and a fourth memory device between the second pillar and the second word line.

Abstract: An dielectric film is formed above the semiconductor substrate. A first conductive layer is formed in the dielectric film and extending in a first direction. The first conductive layer is connected to a first select transistor. A second conductive layer formed in the dielectric film and extending in the first direction. The second conductive layer is connected to a second select transistor. A semiconductor layer is connected to both the first and second conductive layers and functioning as a channel layer of a memory transistor. A gate-insulating film is formed on the semiconductor layer. The gate-insulating film includes a charge accumulation film as a portion thereof. A third conductive layer is surrounded by the gate-insulating film.

Abstract: A magnetoresistive effect memory of an aspect of the present invention including a magnetoresistive effect element including a first magnetic layer having an invariable magnetization direction, a second magnetic layer having a variable magnetization direction, and an interlayer provided between the first magnetic layer and the second magnetic layer, and a reading circuit which passes a pulse-shaped read current through the magnetoresistive effect element to read data stored in the magnetoresistive effect element, wherein the pulse width of the read current is shorter than a period from an initial state to a cooperative coherent precession movement of magnetizations included in the second magnetic layer.

Abstract: A nonvolatile semiconductor memory device comprises a cell array having plural memory cells arranged in matrix, each memory cell including a variable resistor having a resistance reversibly variable to store data corresponding to the resistance of the variable resistor; a selection circuit operative to select a memory cell from the cell array; and a write circuit operative to execute certain voltage or current supply to the memory cell selected by the selection circuit to vary the resistance of a variable resistor in the selected memory cell to erase or write data. The write circuit terminates the voltage or current supply to the selected memory cell in accordance with resistance variation situation of the variable resistor in the selected memory cell when current flowing in the selected memory cell reaches a certain level appeared after the data erase or write.

Abstract: A storage device includes a recording medium, a probe, a substrate, and a processing unit. The recording medium stores a signal. The probe reads or writes the signal to/from the recording medium. The substrate is provided with the probe via a conductive anchor interposed therebetween and a first connection terminal connected to the probe. The processing unit is provided on the substrate and has a second connection terminal. The second connection terminal is connected to the first connection terminal.

Abstract: A semiconductor memory device comprises: a semiconductor substrate; a plurality of memory units provided on the semiconductor substrate and each including a plurality of memory cells that are stacked; and a plurality of bit lines formed above each of a plurality of the memory units aligned in a column direction, an alignment pitch in a row direction of the plurality of bit lines being less than an alignment pitch in the row direction of the memory units, and an end of each of the memory units aligned in the column direction being connected to one of the plurality of bit lines formed above the plurality of the memory units aligned in the column direction.

Abstract: A control circuit is configured to erase a selected block in the erase operation by applying a predetermined potential to the source-line and the third conductive layer to generate a current to increase a potential of the first columnar semiconductor layer and by providing a first voltage to the first conductive layer. The control circuit is configured to keep first conductive layers at a floating state during the first period, while during the second period after the first period, to switch the first conductive layers from the floating state to a state in which the conductive layer is charged to a second voltage higher than the first voltage, in an unselected block in the erase operation.

Abstract: A control circuit is configured to set a drain-side select transistor and a source-side select transistor connected to a selected memory string to non-conductive states. The control circuit is configured to apply a first voltage to a non-selected word line connected to a gate of a non-selected memory cell in the selected memory string. The control circuit is configured to apply a second voltage to a selected word line connected to a gate of a selected memory cell in the selected memory string. The second voltage is smaller than the first voltage in an erasing operation.

Abstract: Each of the memory blocks includes: a first conductive layer expanding in parallel to the substrate over the first area, n layers of the first conductive layers being formed in a lamination direction and shared by the plurality of memory strings; a first semiconductor layer; and an electric charge accumulation layer. The memory strings are arranged with m columns in a second direction for each of the memory blocks. The wiring layers are arranged in the second direction, formed to extend to the vicinity of one end of the first conductive layer in the first direction from one side of the memory block, and connected via contact plugs to the first conductive layers.

Abstract: A memory string is configured by a plurality of memory transistors and a spare memory transistor connected in series. Word lines are connected to gates of the memory transistors. A spare word line is connected to a gate of the spare memory transistor. The memory string comprises a first semiconductor layer, a charge storage layer, a plurality of first conductive layers, and a second conductive layer. The first semiconductor layer extends in a perpendicular direction with respect to a substrate. The charge storage layer surrounds a side surface of the first semiconductor layer. The plurality of first conductive layers surround a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and function as the word lines. The second conductive layer surrounds a side surface of the first semiconductor layer with the charge storage layer interposed therebetween, and functions as the spare word line.

Abstract: According to one embodiment, in the case of performing an operation for increasing a threshold voltage of a first transistor or a third transistor, a control circuit is configured to apply a first voltage to a bit line, and apply a second voltage greater than the first voltage to a gate of a second transistor, thereby rendering the second transistor in a conductive state to transfer the first voltage to a second semiconductor layer, and then apply a program voltage to a gate of the first transistor or the third transistor to store a charge in a second charge storage layer.

Abstract: A non-volatile semiconductor storage device includes: a memory string including a plurality of memory cells connected in series; a first selection transistor having one end connected to one end of the memory string; a first wiring having one end connected to the other end of the first selection transistor; a second wiring connected to a gate of the first selection transistor. A control circuit is configured to boost voltages of the second wiring and the first wiring in the erase operation, while keeping the voltage of the first wiring greater than the voltage of the second wiring by a certain potential difference. The certain potential difference is a potential difference that causes a GIDL current.

Abstract: A non-volatile semiconductor storage device includes a control circuit performing an erase operation to erase data from a selected one of memory transistors. The control circuit applies a first voltage to the other end of selected one of selection transistors, causes the selected one of the selection transistors to turn on, and causes any one of the memory transistors to turn on that is closer to the selection transistor than the selected one of the memory transistors. The control circuit also applies a second voltage lower than the first voltage to a gate of the selected one of the memory transistors. Such a potential difference between the first voltage and the second voltage causing a change in electric charges in the electric charge storage layer.

Abstract: When a data erase operation is performed in one memory cell block, a first voltage is applied to one source line selected from m source lines in the one memory cell block. A second voltage equal to a voltage of the source lines before the data erase operation begins is applied to the other source lines. Then, after a certain time delay from application of the first voltage, a third voltage smaller than the first voltage is applied to a third conductive layer of a source-side selection transistor connected to a selected source line. Then, a hole current is produced near a third gate insulation layer due to a potential difference between the first and third voltage. A fourth voltage is applied to one of first conductive layers connected to one of the memory transistor to be erased. The other first conductive layers are brought into a floating state.