Patents by Inventor Yu-Hua Chen

Yu-Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190275925
    Abstract: A vehicle dual-functional lighting module is provided, including a light guide layer having a top surface, a bottom surface and at least one side surface, one lateral solid-state light source located on the side surface of the light guide layer and emitting a first light in a first direction, and one direct light solid-state light source located below the light guide layer and emitting a second light selectively in a second direction. The first light is guided by the side surface and led out of the top surface to present a surface-illuminated surface light source. The first direction is substantially perpendicular to the second direction. The second light is emitted toward the top surface to present an intensified light source which is located in the surface light source to selectively enhance the illumination intensity locally of the surface light source. A vehicle dual-functional lighting set is also provided.
    Type: Application
    Filed: April 25, 2018
    Publication date: September 12, 2019
    Inventors: YU-CHU CHEN, SHENG-HUA YANG
  • Patent number: 10411085
    Abstract: A semiconductor device includes a substrate having a first conductivity type, a first well formed in the substrate and having a second conductivity type, a first diffusion region formed in the first well and having the first conductivity type, a first interlayer dielectric layer disposed over the first well and the first diffusion region, and a resistor wire formed of a conductive material and embedded in the first interlayer dielectric layer. The resistor wire overlaps the first diffusion region and at least partially overlaps the first well in plan view.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: September 10, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Chiun Lin, Po-Nien Chen, Chen Hua Tsai, Chih-Yung Lin
  • Publication number: 20190259613
    Abstract: Embodiments of the present disclosure may be used for patterning a layer in a 5 nm node or beyond fabrication to achieve an end-to-end distance below 35 nm. Compared to the state of the art technology, embodiments of the present disclosure reduce cycle time and cost of production from three lithographic processes and four etching processes to one lithographic process and three etch processes.
    Type: Application
    Filed: May 3, 2019
    Publication date: August 22, 2019
    Inventors: Yu-Lien Huang, Tsai-Chun Li, Huan-Just Lin, Huang-Ming Chen, Yang-Cheng Wu, Cheng-Hua Yang
  • Patent number: 10388838
    Abstract: A light-emitting device includes a substrate, a light-emitting component, a translucent layer, an adhesive layer, a reflective layer and translucent encapsulant. The light-emitting component is disposed on the substrate. The adhesive layer is formed between the light-emitting component and the translucent layer. The reflective layer is formed above the substrate and covering a lateral surface of the light-emitting component, a lateral surface of the adhesive layer and a lateral surface of the translucent layer. The translucent encapsulant is formed on the substrate and encapsulating the light-emitting component, the translucent layer and the reflective layer.
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: August 20, 2019
    Assignee: GENESIS PHOTONICS INC.
    Inventors: Chin-Hua Hung, Cheng-Wei Hung, Yu-Feng Lin, Cheng-Chuan Chen
  • Publication number: 20190252209
    Abstract: A semiconductor package has a first redistribution layer, a first die, a second redistribution layer, and a surface coating layer. The first die is encapsulated within a molding material and disposed on and electrically connected to the first redistribution layer. The second redistribution layer is disposed on the molding material, on the first die, and electrically connected to the first die. The second redistribution layer has a topmost metallization layer having at least one contact pad, and the at least one contact pad includes a concave portion. The surface coating layer covers a portion of the topmost metallization layer and exposes the concave portion of the at least one contact pad. A manufacturing process is also provided.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Feng Chen, Chih-Hua Chen, Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Hui-Jung Tsai, Hao-Yi Tsai
  • Publication number: 20190251321
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 15, 2019
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
  • Publication number: 20190250502
    Abstract: A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.
    Type: Application
    Filed: April 26, 2019
    Publication date: August 15, 2019
    Applicant: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • Publication number: 20190244004
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Application
    Filed: April 22, 2019
    Publication date: August 8, 2019
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20190246144
    Abstract: A video compression system includes a video encoder and a bitstream processing circuit. The video encoder is hardware that performs hardware video encoding upon frames to generate a first bitstream. The first bitstream is output from an entropy encoding circuit of the video encoder. The bitstream processing circuit performs a bitstream post-processing operation upon the first bitstream to produce a second bitstream that is different from the first bitstream, and outputs the second bitstream as a compression output of the frames.
    Type: Application
    Filed: November 19, 2018
    Publication date: August 8, 2019
    Inventors: Li-Heng Chen, Chung-Hua Tsai, Tung-Hsing Wu, Lien-Fei Chen, Yu-Kun Lin, Yi-Hsin Huang, Han-Liang Chou
  • Publication number: 20190236326
    Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.
    Type: Application
    Filed: January 30, 2018
    Publication date: August 1, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo, Ying-Cheng Tseng
  • Publication number: 20190221260
    Abstract: A power on reset method for a resistive memory storage device is provided and includes performing a forming procedure on a memory cell of the resistive memory storage device. The forming procedure includes applying at least one forming voltage and at least one reset voltage to the memory cell. The forming procedure further includes a thermal step. The step of applying at least one reset voltage to the memory cell may be preformed before or after the thermal step. After one forming voltage is applied, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. After the thermal step, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. In addition, after one reset voltage is applied, if the memory cell passes verification, the next reset voltage is not applied to the memory cell.
    Type: Application
    Filed: November 6, 2018
    Publication date: July 18, 2019
    Applicant: Winbond Electronics Corp.
    Inventors: Ping-Kun Wang, Shao-Ching Liao, Yu-Ting Chen, Ming-Che Lin, Chien-Min Wu, Chia-Hua Ho
  • Patent number: 10354114
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 16, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • Patent number: 10355071
    Abstract: A semiconductor device includes a substrate having a first conductivity type, a first well formed in the substrate and having a second conductivity type, a first diffusion region formed in the first well and having the first conductivity type, a first interlayer dielectric layer disposed over the first well and the first diffusion region, and a resistor wire formed of a conductive material and embedded in the first interlayer dielectric layer. The resistor wire overlaps the first diffusion region and at least partially overlaps the first well in plan view.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: July 16, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Chiun Lin, Po-Nien Chen, Chen Hua Tsai, Chih-Yung Lin
  • Publication number: 20190215393
    Abstract: A communication device includes a first body, a second body, a first audio module, and a second audio module. The second body is rotatably connected to the first body. The first audio module is disposed on the first body. The second audio module is at least partially disposed on the first body. When the second body rotates relatively to the first body to be in a first state to switch the communication device to be in a first operation mode, at least a portion of the first audio module is turned on, and the second audio module is turned off. When the second body rotates relatively to the first body to be in a second state to switch the communication device to be in a second operation mode, the first audio module is turned off, and the second audio module is turned on.
    Type: Application
    Filed: January 7, 2019
    Publication date: July 11, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ching-Hua Li, Li-Fang Chen, Chen-Hsien Cheng, Yi-Chang Wu, Po-Yueh Lan, Yu-Wei Lai, Kun-Chang Chen, Yi-Chun Lin
  • Patent number: 10324370
    Abstract: A manufacturing method of a circuit substrate is provided. A substrate is provided. A positive photoresist layer is coated on the substrate. Once exposure process is performed on the positive photoresist layer disposed on the substrate so as to simultaneously form concaves with at least two different depths.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: June 18, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho
  • Patent number: 10312089
    Abstract: Embodiments of the present disclosure may be used for patterning a layer in a 5 nm node or beyond fabrication to achieve an end-to-end distance below 35 nm. Compared to the state of the art technology, embodiments of the present disclosure reduce cycle time and cost of production from three lithographic processes and four etching processes to one lithographic process and three etch processes.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 4, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Lien Huang, Tsai-Chun Li, Huan-Just Lin, Huang-Ming Chen, Yang-Cheng Wu, Cheng-Hua Yang
  • Publication number: 20190160298
    Abstract: A wireless electromagnetic thermotherapy apparatus applies a magnetic field on a needle for actuating heat generation thereby, and includes an excitation device and a detector device. The detector device includes a sensor unit that measures a temperature of the needle, a wireless charging unit that generates electrical energy in response to receipt of the magnetic field, a wireless transmitter that is powered by the electrical energy, and that transmits the measured temperature to the excitation device to enable the same to make a comparison between the measured temperature and a target temperature and to adjust an intensity of the magnetic field based on a result of the comparison.
    Type: Application
    Filed: December 28, 2017
    Publication date: May 30, 2019
    Inventors: Tung-Chieh YANG, Yu-Jie LAN, Chien-Chang CHEN, Szu-Hua YANG, Yii-Der WU, Tsung-Chih YU
  • Publication number: 20190164759
    Abstract: Embodiments of the present disclosure may be used for patterning a layer in a 5 nm node or beyond fabrication to achieve an end-to-end distance below 35 nm. Compared to the state of the art technology, embodiments of the present disclosure reduce cycle time and cost of production from three lithographic processes and four etching processes to one lithographic process and three etch processes.
    Type: Application
    Filed: March 16, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Lien HUANG, Tsai-Chun LI, Huan-Just LIN, Huang-Ming CHEN, Yang-Cheng WU, Cheng-Hua YANG
  • Publication number: 20190139907
    Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
    Type: Application
    Filed: January 7, 2019
    Publication date: May 9, 2019
    Inventors: Pu-Ju LIN, Cheng-Ta KO, Yu-Hua CHEN, Tzyy-Jang TSENG, Ra-Min TAIN
  • Publication number: 20190139886
    Abstract: A package structure includes an insulating encapsulation, at least one die, and conductive structures. The at least one die is encapsulated in the insulating encapsulation. The conductive structures are located aside of the at least one die and surrounded by the insulating encapsulation, and at least one of the conductive structures is electrically connected to the at least one die. Each of the conductive structures has a first surface, a second surface opposite to the first surface and a slant sidewall connecting the first surface and the second surface, and each of the conductive structures has a top diameter greater than a bottom diameter thereof, and wherein each of the conductive structures has a plurality of pores distributed therein.
    Type: Application
    Filed: January 23, 2018
    Publication date: May 9, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu