Patents by Inventor Yu-Hua Chen

Yu-Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8587091
    Abstract: A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: November 19, 2013
    Assignee: Invensas Corporation
    Inventors: Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin, Shan-Pu Yu
  • Patent number: 8513532
    Abstract: A flexible circuit structure with stretchability comprises a flexible substrate, a metal layer, and a plurality of flexible bumps. The metal layer is formed on the flexible substrate. These flexible bumps are formed on the metal layer and the flexible substrate.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: August 20, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Hua Chen, Ying-Ching Shih
  • Publication number: 20130149542
    Abstract: The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer.
    Type: Application
    Filed: August 27, 2012
    Publication date: June 13, 2013
    Inventors: Jui-Hsiang CHEN, Jean-Dean Yang, Yu-Hua Chen, Ting-Yu Shih, Chia-Wei Hong, Chao-Chen Tien
  • Publication number: 20130128610
    Abstract: A plane light source including a circuit substrate, a plurality of sets of side-view light-emitting devices (LEDs), and a diffusive light-guiding layer is provided. The side-view LEDs are arranged in array over the circuit substrate and are electrically connected with the circuit substrate. The diffusive light-guiding layer covers the side-view LEDs, wherein the diffusive light-guiding layer includes a plurality of diffusive light-guiding units arranged in array and connected to each other. Each of the diffusive light-guiding units is respectively corresponded to illumination coverage of one set of side-view LEDs. Each set of side-view LEDs at least includes two side-view LEDs for emitting light respectively along two different directions and towards into one single diffusive light-guiding units.
    Type: Application
    Filed: August 21, 2012
    Publication date: May 23, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Kai Hsu, Yu-Hua Chen, Wei-Chung Lo
  • Patent number: 8425931
    Abstract: The description provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: April 23, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Yu-Hua Chen, Shu-Hua Jan, Mei-Jung Liu
  • Patent number: 8314482
    Abstract: This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: November 20, 2012
    Assignee: Invensas Corporation
    Inventors: Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin, Shan-Pu Yu
  • Patent number: 8313765
    Abstract: The invention provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: November 20, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Yu-Hua Chen, Shu-Hua Jan, Mei-Jung Liu
  • Publication number: 20120283429
    Abstract: The description provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.
    Type: Application
    Filed: July 13, 2012
    Publication date: November 8, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Yu-Hua Chen, Shu-Hua Jan, Mei-Jung Liu
  • Patent number: 8304666
    Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: November 6, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Ta Ko, Min-Lin Lee, Wei-Chung Lo, Shur-Fen Liu, Jinn-Shing King, Shinn-Juh Lai, Yu-Hua Chen
  • Publication number: 20120267765
    Abstract: A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias.
    Type: Application
    Filed: June 26, 2012
    Publication date: October 25, 2012
    Applicant: Industrial Technology Research Institute
    Inventors: Shou-Lung CHEN, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin, Shan-Pu Yu
  • Patent number: 8269112
    Abstract: A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.
    Type: Grant
    Filed: August 11, 2008
    Date of Patent: September 18, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Lee, Yu-Hua Chen, Ying-Ching Shih, Cheng-Ta Ko
  • Publication number: 20120150078
    Abstract: A medical dressing is provided. The medical dressing includes a first and a second woven layers respectively having a fiber of polyurethane or a yarn of polyurethane; and a plurality of linear support portions woven between the first and second woven layers.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 14, 2012
    Inventors: Jui-Hsiang CHEN, Yu-Hua Chen, Ting-Yu Shih, Wei Hu, Jean-Dean Yang, Chun-Min Lee
  • Publication number: 20120043115
    Abstract: In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.
    Type: Application
    Filed: February 23, 2011
    Publication date: February 23, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Hua CHEN, Ying-Ching SHIH
  • Publication number: 20100316682
    Abstract: The invention provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group, and p is an integer of 1 to 4.
    Type: Application
    Filed: August 20, 2010
    Publication date: December 16, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Yu-Hua Chen, Shu-Hua Jan, Mei-Jung Liu
  • Patent number: 7838333
    Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: November 23, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Shou-Lung Chen, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin
  • Patent number: 7780982
    Abstract: A biodegradable hyaluronic acid derivative comprising a modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C?O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C2-16 hydrocarbyl group or a prepolymer, and p is an integer of 1 to 4. The biodegradable hyaluronic acid derivative when dissolved in a hydrophilic medium can form micelles and can be used to entrap a pharmaceutically active or bioactive molecule.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: August 24, 2010
    Assignee: Industrial Technology Research Instittute
    Inventors: Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Yu-Hua Chen, Shu-Hua Jan, Mei-Jung Liu
  • Patent number: 7763895
    Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: July 27, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
  • Publication number: 20100163897
    Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.
    Type: Application
    Filed: April 13, 2009
    Publication date: July 1, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
  • Publication number: 20100163296
    Abstract: A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.
    Type: Application
    Filed: May 19, 2009
    Publication date: July 1, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Ta Ko, Min-Lin Lee, Wei-Chung Lo, Shur-Fen Liu, Jinn-Shing King, Shinn-Juh Lai, Yu-Hua Chen
  • Publication number: 20100112757
    Abstract: The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.
    Type: Application
    Filed: November 3, 2009
    Publication date: May 6, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Shou-Lung CHEN, Ching-Wen Hsiao, Yu-Hua Chen, Jeng-Dar Ko, Jyh-Rong Lin