Abstract: A portable electronic device, including a first body and a second body, is provided. The second body includes a support structure and a display panel. The support structure is pivotally connected to the first body and is connected to the display panel. The support structure has a first bendable portion. An included angle between the first bendable portion and an edge of the support structure is 45 degrees. The support structure is adapted to be bent along the first bendable portion, so that the second body switches between a first mode and a second mode relative to the first body.

Abstract: Methods and apparatus for Adaptive Loop Filter (ALF) processing of reconstructed video are disclosed. According to one implementation, a method receives reconstructed pixels of a current block and determines one or more clipping values for the ALF processing, wherein a target clipping value is always signaled at an encoder side or parsed at a decoder side even if the target clipping value is zero. The method then derives a current ALF output for the current block, wherein the current ALF output has a weighted sum of clipped differences and each of the original differences is calculated between a first reconstructed pixel at a non-center filter location and a center reconstructed pixel at a center filter location, and each of the original differences is clipped according to a corresponding clipping value to form one clipped difference. The method then provides filtered-reconstructed pixels.

Abstract: Device structures and methods for forming the same are provided. A device structure according to the present disclosure includes a first electrode and a second electrode disposed over an etch stop layer (ESL), a first dielectric layer disposed between the first electrode and the second electrode, a phase-change material layer disposed over the first electrode, the first dielectric layer and the second electrode, an insulator layer disposed over the phase-change material layer, a metal feature disposed over the insulator layer, and a second dielectric layer disposed over the insulator layer, the first electrode, the second electrode, and the metal feature.

Abstract: A lens module includes: a lens barrel including a annular structure, an inner annular surface surrounding the central axis and an outer annular surface opposite to and surrounding the inner annular surface, wherein the inner annular surface forms an accommodating space; an optical lens assembly and an optical filter sequentially disposed in the accommodating space from the object side to the image side; wherein the annular structure is disposed on the inner annular surface and surrounds the central axis, the annular structure includes at least two step portions and at least two bevel portions, all the step portions and the bevel portions are close to the image side, and the optical filter is disposed on the step portions; and the step portions and the bevel portions are alternately disposed along a annular path of the inner annular surface.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer disposed on an inner surface of the light-permeable layer, a light filter layer arranged between the light-curing layer and the shielding layer, and a package body that is formed on the substrate. A projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. The shielding layer has at least one light-permeable slot being covered by the light filter layer. The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.

Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate. A first capacitor includes a first top plate and a first bottom plate above the substrate. The first top plate is coupled to a first metal electrode within an inter-level dielectric (ILD) layer to access the first capacitor. A second capacitor includes a second top plate and a second bottom plate, where the second top plate is coupled to a second metal electrode within the ILD layer to access the second capacitor. The second metal electrode is disjoint from the first metal electrode. The first capacitor is accessed through the first metal electrode without accessing the second capacitor through the second metal electrode. Other embodiments may be described and/or claimed.

Abstract: A method for fabricating an integrated circuit device is provided. The method includes forming an interconnect layer over a substrate, wherein the interconnect layer has a first interlayer dielectric layer, a first conductive feature in a first portion of the first interlayer dielectric layer, and a second conductive feature in a second portion of the first interlayer dielectric layer; depositing a dielectric layer over the interconnect layer; removing a first portion of the dielectric layer over the first conductive feature and the first portion of the first interlayer dielectric layer, and remaining a second portion of the dielectric layer over the second conductive feature and the second portion of the first interlayer dielectric layer; and forming a memory structure over the first conductive feature.

Abstract: Provided is a nanoparticle or a pharmaceutical composition including the same for treating or remitting a neovascularization or an angiogenesis in eye segments, and the nanoparticle includes a hyaluronic acid and a therapeutic peptide.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first interconnect within a first inter-level dielectric (ILD) layer over a substrate. A memory device is disposed over the first interconnect and is surrounded by a second ILD layer. A sidewall spacer is arranged along opposing sides of the memory device and an etch stop layer is arranged on the sidewall spacer. The sidewall spacer and the etch stop layer have upper surfaces that are vertically offset from one another by a non-zero distance. A second interconnect extends from a top of the second ILD layer to an upper surface of the memory device.

Abstract: Conventional intra-prediction uses pixels from left and upper neighbour blocks to predict a macroblock (MB). Thus, the MBs must be sequentially processed, since reconstructed left and upper MBs must be available for prediction. In an improved method for encoding Intra predicted MBs, a MB is encoded in two steps: first, a first portion of the MB is encoded independently, without references outside the MB. Pixels of the first portion can be Intra predicted using DC mode. Then, the first portion is reconstructed. The remaining pixels of the MB, being a second portion, are intra predicted from the reconstructed pixels of the first portion and then reconstructed. The first portion comprises at least one column or one row of pixels of the MB. The encoding is applied to at least two Intra predicted MBs per slice, or per picture if no slices are used.

Abstract: According to a method for Adaptive Loop Filter (ALF) processing of reconstructed video, multiple indicators are signaled in slice at an encoder side or parsed at a decoder side, where the multiple indicators are Adaptive Parameter Set (APS) indices associated with temporal ALF filter sets for the ALF processing. A current indicator is determined from the multiple indicators, where the current indicator is used to select a current ALF filter set. Filtered-reconstructed pixels are derived for the current block by applying the current ALF filter to the current block. In another method, if the ALF processing applied at a target sample requires an outside sample on other side of a target virtual boundary from the target sample, the outside sample is replaced by a padded sample.

Abstract: A differentiable physics model of a building is used that defines thermodynamic relationships between zones of the building and a heating, ventilation, and air-conditioning (HVAC) system. A physics-constrained, data driven model learns behaviors of controlled components of the HVAC system. For each of a series of times during online operation of the HVAC system, past state values are recorded representing a performance of the HVAC system in the building and past inputs to the HVAC system to maintain the states. The past state values and the past inputs are input into the differentiable physics model and the data driven model to: jointly update first parameters of the differentiable physics model and second parameters of the data driven model, e.g., using moving horizon estimation; and determine a current input to the controlled components, e.g., using model predictive control.

Abstract: Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.

Abstract: A cooling system for a heat-generating electronic device includes a cold plate module, a flow channel, and a fin arrangement. The cold plate module includes a base plate and a top cover. The flow channel is for a liquid coolant and extends between an inlet connector and an outlet connector. The liquid coolant flows along a flow direction. The fin arrangement is located between the base plate and the top cover. The fin arrangement is thermally coupled to the flow channel and is eccentrically located relative to the cold plate module.

Abstract: The present disclosure provides a method and electronic apparatus for modifying pages of an electronic document, and the method is performed by the electronic apparatus and comprises the following steps: opening a first user operation interface; detecting whether a first input region is selected; when it is detected that the first input region is selected, displaying a plurality of first pages of a first electronic document on a page preview region and determining a first page change position located in the plurality of first pages according to a first operation event; detecting whether a second input region is selected; when it is detected that the second input region is selected, displaying a plurality of second pages of a second electronic document on the page preview region and determining at least one second page of the plurality of second pages according to a second operation event; and adding the at least one second page to the first page change position according to a third operation event.

Abstract: A connector is disclosed and includes a main body, a sleeving component, a conductive terminal and a signal terminal. The main body has an opening end and a sleeved end opposite to each other. An electronic device end is matched with the connector through the opening end. The sleeving component is slidably disposed on the sleeved end, and includes a conductive contact portion and a signal contact portion arranged in parallel. The conductive terminal is fixed to the main body for connecting with the conductive contact portion. The signal terminal is fixed to the main body for connecting with the signal contact portion. When the connector is detached from the electronic device end, the sleeving component is displaced relative to the main body, the signal contact portion is separated from the signal terminal, and the conductive terminal end and the conductive contact portion are maintained in an electrical connection.

Abstract: A connector is disclosed and includes a housing base, a conductive terminal, a signal terminal and a protrusion. A sleeve of an electronic device end sleeves on the housing base through an opening end along a first direction and slides a first displacement distance, plural contact pins of the electronic device end slide into the accommodation space through the opening end, and a conductive contact pin of the electronic device end is interfered with the conductive terminal to form an electrical connection. The protrusion is elastically connected to the housing base and penetrates through the housing base. When the sleeve passes through the opening end and slides a second displacement distance greater than the first displacement distance, the protrusion is interfered with the sleeve and drives the signal terminal, so that the signal terminal pushes against a signal contact pin of the electronic device end to form an electrical connection.

Abstract: This disclosure provides a method and a user apparatus for generating and applying a translation marker, and the method is performed by the user apparatus and comprises: opening an electronic document on a user operation interface; selecting at least one text string in the electronic document according to a first triggering event; and when a translation option is detected to be selected, performing the following steps: generating a code corresponding to the selected text string by using an operation function; and displaying a first translated text string of the first translation record on the user operation interface and generating a first translation marker associated with the first translated text string on the electronic document when it is determined that a first translation record associated with the code exists in the user apparatus.

Abstract: A device is provided. The device is configured to measure the air speed near an air outlet of an air curtain. The air curtain is mounted near an open of a wafer box. Receiving grooves are defined in the wafer box. Each receiving groove is configured to receive a wafer. The device includes one or more fixing members and one or more air speed measuring members. Each fixing members is received and held in one receiving groove. Each air speed measuring member is arranged on one fixing member. Each air speed measuring member includes one or more sensors. Each sensor extends outside the wafer box and is positioned below the air curtain. Each sensor is configured to measure the air speed near the air outlet of the air curtain. A related wafer box is also provided.