Patents by Inventor Yuan Chen

Yuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12243907
    Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.
    Type: Grant
    Filed: January 5, 2024
    Date of Patent: March 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsuan-Han Tseng, Chun-Yuan Chen, Lu-Sheng Chou, Hsiao-Hui Tseng, Ching-Chun Wang
  • Publication number: 20250072049
    Abstract: The present disclosure describes a semiconductor device having a dielectric structure between a source/drain (S/D) structure and a contact structure. The semiconductor device includes a S/D structure on a substrate, a dielectric structure on a top surface of the S/D structure, and a S/D contact structure on the S/D structure and the dielectric structure. A portion of the S/D contact structure is in contact with a top surface of the dielectric structure.
    Type: Application
    Filed: November 12, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Chien WU, Chun-Yuan CHEN, Huan-Chieh SU, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Publication number: 20250070041
    Abstract: A method for manufacturing a display device is provided. The method includes providing an array module having at least one first alignment mark. The method also includes providing a light-emitting module having at least one second alignment mark. The method further includes aligning the light-emitting module and the array module by the at least one first alignment mark and the at least one second alignment mark. In addition, the method includes bonding the light-emitting module onto the array module.
    Type: Application
    Filed: November 14, 2024
    Publication date: February 27, 2025
    Inventors: Jia-Yuan CHEN, Tsung-Han TSAI, Kuan-Feng LEE, Yuan-Lin WU
  • Patent number: 12237414
    Abstract: A method includes receiving a semiconductor substrate. The semiconductor substrate has a top surface and includes a semiconductor element. Moreover, the semiconductor substrate has a fin structure formed thereon. The method also includes recessing the fin structure to form source/drain trenches, forming a first dielectric layer over the recessed fin structure in the source/drain trenches, implanting a dopant element into a portion of the fin structure beneath a bottom surface of the source/drain trenches to form an amorphous semiconductor layer, forming a second dielectric layer over the recessed fin structure in the source/drain trenches, annealing the semiconductor substrate, and removing the first and second dielectric layers. After the annealing and the removing steps, the method further includes further recessing the recessed fin structure to provide a top surface. Additionally, the method includes forming an epitaxial layer from and on the top surface.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDCUTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Ching Wang, Wen-Yuan Chen, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
  • Patent number: 12233692
    Abstract: The invention refers to a light-transmissive plastic plate structure suitable for vehicle sunroof with curved surface and a method for fabricating the same. By using polymer material formulation, UV resistant coating formulation and precision coating technology, the wear resistance of polymer surface of plastic substrate can be improved to the same level as glass, and the original optical and physical properties after various environmental tests can also be maintained. The plastic substrate is first formed into a curved plastic plate through a hot pressing process, and then a connecting structure is formed and fixed on the plastic plate by an insert-molding injection process, in order to replace the traditional car sunroof mechanism which is assembled by glass plate bonded with metal connecting parts.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: February 25, 2025
    Assignee: Enflex Corporation
    Inventors: Hsin Yuan Chen, Jui Lin Hsu, Lung Hsiang Peng, Teng Hsiang Wei, Yong-Xin Chen, Zong Yang Li
  • Publication number: 20250058452
    Abstract: A handle structure for a garden tool, and the handle structure has a handle and a padding member. An accepting slot is formed inside the handle, and there are several binding apertures on the handle, and one end of the binding aperture is a circular edge connected to a rim in the accepting slot. The circular edge has a guiding slope that gradually expands toward the other end of the rim, and a circular groove is provided on the periphery of the handle. There are several positioning columns protruding from the padding member. The positioning column is hollow and an engaging groove is adjacent to the positioning column.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Inventor: Chin-Yuan Chen
  • Publication number: 20250057174
    Abstract: Provided herein are dairy-like analogue compositions and the methods of making the same using recombinant single variants of casein proteins. including. for example, recombinant single variants of alpha casein proteins.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 20, 2025
    Applicant: New Culture Inc.
    Inventors: Inja RADMAN, Dilrajkaur PANFAIR, Meng Yuan CHEN
  • Publication number: 20250057447
    Abstract: An evaluation method for gait-impaired individuals, including freezing gait in Parkinson's disease, and a corresponding hydrostatic water therapy pool, is provided. A multispectral thermal imager is utilized to observe and record the multispectral images of COP (Center of Pressure) trajectories in both on-land and underwater scenarios on black walkways. These images, including far/near-infrared and visible light with gait temporal/spatial parameters, serve as references for analysis and interpretation by physical therapists and attending physicians. Additionally, a personalized hydrostatic water therapy pool rehabilitation program is provided in conjunction with the patient or elderly individual, establishing a correlation between the evaluation and training.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Inventors: Chi-Hseng Hsieh, Szu-Yuan Chen
  • Patent number: 12230572
    Abstract: A semiconductor structure includes a first transistor having a first source/drain (S/D) feature and a first gate; a second transistor having a second S/D feature and a second gate; a multi-layer interconnection disposed over the first and the second transistors; a signal interconnection under the first and the second transistors; and a power rail under the signal interconnection and electrically isolated from the signal interconnection, wherein the signal interconnection electrically connects one of the first S/D feature and the first gate to one of the second S/D feature and the second gate.
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng, Wei-Cheng Lin, Wei-An Lai, Ming Chian Tsai, Jiann-Tyng Tzeng, Hou-Yu Chen, Chun-Yuan Chen, Huan-Chieh Su
  • Patent number: 12230228
    Abstract: A light-emitting assembly includes a substrate and a plurality of light-emitting elements disposed on the substrate. The substrate includes a base material layer, a first electrical conductive layer and a protection layer in a sectional view. A thickness of the first electrical conductive layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 ?m and less than 30 ?m. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: February 18, 2025
    Assignee: INNOLUX CORPORATION
    Inventors: Chung-Chun Kuo, Chun-Fang Chen, Hui-Wen Su, Wei-Yuan Chen, Chung-Yu Cheng
  • Patent number: 12230632
    Abstract: An integrated circuit (IC) structure includes a first transistor and a second transistor. The first transistor includes a first active region and a first gate disposed on the first active region, in which the first gate has a first effective gate length along a first direction parallel to a lengthwise direction of the first active region. The second transistor includes a second active region and a second gate disposed on the second active region, and includes a plurality of gate structures arranged along the first direction and separated from each other, in which the second gate has a second effective gate length along the first direction, the second effective gate length is n times the first effective gate length, and n is a positive integer greater than 1.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Yuan Chen, Hau-Tai Shieh
  • Publication number: 20250054332
    Abstract: An electronic device includes a light source and an optical sensor. The light source emits a light having a maximum light intensity at a first wavelength A. The optical sensor has a maximum response value at a second wavelength B, and receives a reflected portion of the light that is reflected by an object. The integral value of the light intensity of the light from the wavelength 380 nm to the first wavelength A is I1. The integral value of the light intensity of the light from the first wavelength A to the wavelength 780 nm is I2. The first wavelength A, the second wavelength B, the integral value I1, and the integral value I2 satisfy the following equation: (B-A)*(I2-I1)>0.
    Type: Application
    Filed: October 30, 2024
    Publication date: February 13, 2025
    Inventors: Jia-Yuan CHEN, Tsung-Han TSAI
  • Patent number: 12224212
    Abstract: A semiconductor structure has a frontside and a backside. The semiconductor structure includes an isolation structure at the backside; one or more transistors at the frontside, wherein the one or more transistors have source/drain epitaxial features; two metal plugs through the isolation structure and contacting two of the source/drain electrodes from the backside; and a dielectric liner filling a space between the two metal plugs, wherein the dielectric liner partially or fully surrounds an air gap between the two metal plugs.
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: February 11, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Yuan Chen, Huan-Chieh Su, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang
  • Publication number: 20250042068
    Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.
    Type: Application
    Filed: October 20, 2024
    Publication date: February 6, 2025
    Applicant: ENFLEX CORPORATION
    Inventors: Hsin Yuan CHEN, Chih Teng KU, Jui Lin HSU, Chun Kai WANG, Yu Ling CHIEN
  • Publication number: 20250046718
    Abstract: Embodiments of the present disclosure provide a method for forming backside gate contacts and semiconductor fabricated thereof. A semiconductor device includes both signal outputs, such as source/drain contacts, and signal inputs, such as gate contacts, formed on a backside of the substrate. The backside gate contacts and backside source/drain contacts are formed in a self-aligned manner.
    Type: Application
    Filed: November 30, 2023
    Publication date: February 6, 2025
    Inventors: Chun-Yuan CHEN, Huan-Chieh SU, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Publication number: 20250048710
    Abstract: An integrated circuit includes a substrate having a semiconductor layer. The integrated circuit includes a transistor. The transistor includes stacked channels above the semiconductor layer, a first source/drain region in contact with the channels, and a second source/drain region in contact with the channels. A backside source/drain contact is positioned in the substrate directly below and electrically coupled to the first source/drain region. A frontside source/drain contact is directly above and electrically coupled to the first source/drain region. A bottom semiconductor structure is positioned below the second source/drain region and in contact with the semiconductor layer.
    Type: Application
    Filed: January 12, 2024
    Publication date: February 6, 2025
    Inventors: Lo-Heng CHANG, Huan-Chieh SU, Chun-Yuan CHEN, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Patent number: 12218285
    Abstract: A display device is provided. The display device includes a substrate, a driving layer, a light-emitting element, and a light-shielding element. The substrate has a surface. The driving layer includes a thin-film transistor. The thin-film transistor is disposed on the surface. The light-emitting element has a P-end and an N-end. The light-emitting element is disposed on the driving layer and arranged in such a way that a virtual line connecting the P-end and the N-end is parallel to the surface of the substrate. The light-shielding element is disposed between the light-emitting element and the thin-film transistor for blocking a light emitted from the light-emitting element from irradiating the thin-film transistor.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 4, 2025
    Assignee: INNOLUX CORPORATION
    Inventors: Jia-Yuan Chen, Tsung-Han Tsai, Kuan-Feng Lee
  • Patent number: 12216709
    Abstract: Techniques for performing a machine learning model based spatial-temporal adaptive shift for end-to-end text-video retrieval are described.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: February 4, 2025
    Assignee: Amazon Technologies, Inc.
    Inventors: Ning Xie, Han Li, Qipin Chen, Yuan Chen, Lingyun Wang
  • Publication number: 20250034323
    Abstract: A polymer is a biodegradable polymer, and a constituent monomer of the polymer includes a 2-hydroxyethyl methacrylate, a lactide and a caprolactone. When an average molecular weight of the polymer is Mw, a degradation rate of the polymer on a 7th day is Dr7, and a time for the polymer to reach a 1% degradation rate is TDr1p, the specific conditions related to Mw and Dr7 or TDr1p, respectively, can be satisfied.
    Type: Application
    Filed: June 27, 2024
    Publication date: January 30, 2025
    Inventors: Wei-Yuan CHEN, Po-Tsun CHEN, Rih-Sian CHEN, Yi-Rou LU, Yu Jie HONG, Chun-Hung TENG
  • Patent number: D1065440
    Type: Grant
    Filed: June 23, 2023
    Date of Patent: March 4, 2025
    Inventor: Chin-Yuan Chen