Abstract: An energy storage apparatus is provided. The energy storage apparatus includes: a support structure, which is provided with at least one support layer in a height direction of the support structure; an energy storage device, an air outlet is defined at the top of the energy storage device, and an air inlet is defined on a sidewall of the energy storage device, where the number of the energy storage device is at least two, the energy storage devices are arranged in at least two layers through the support layer, and the support layer between adjacent layers of energy storage devices is hollowed out or configured in a partitioning manner; and an air guide structure mounted on the energy storage device and in communication with an air inlet of the energy storage device.

Abstract: A microelectronic device is disclosed that incudes array regions individually comprising memory cells comprising access devices and storage node devices; digit lines coupled to the access devices that extend in a first direction; and word lines coupled to the access devices that extend in a second direction orthogonal to the first direction. Digit line exit regions horizontally alternate with the array regions in the first direction; sense amplifier sections comprising sense amplifier circuitry vertically overlie and horizontally overlapping the digit line exit regions; and routing structures within horizontal areas of the digit line exit regions, couple the sense amplifier circuitry of the sense amplifier sections to the digit lines.

Abstract: A microelectronic device comprises a first microelectronic device structure comprising a stack structure comprising conductive structures vertically alternating with insulative structures, a staircase structure within the stack structure, and vertical stacks of memory cells. Each vertical stack of memory cells individually comprises a vertical stack of capacitor structures, transistor structures each individually neighboring a capacitor structure of the capacitor structures, and a conductive pillar structure vertically extending through the transistor structures.

Abstract: Methods, systems, and devices for sensing a memory with shared sense components are described. A device may activate a word line and a plate line each coupled with a set of memory cells, where each memory cell of the set of memory cells is coupled with a respective digit line of a set of digit lines. The device may activate a set of switching components to couple each digit line of the set of digit lines with a respective sense component of a set of sense components, where each switching component of the set of switching components is coupled with a respective memory cell of the set of memory cells. The device may sense the set of memory cells based on activating the word line and the plate line and based on coupling the set of digit lines with the set of sense components.

Abstract: In some examples, a system may include a plurality of memory blocks, a first data bus coupled to the plurality of memory blocks in a memory device, a second data bus coupled to the plurality of memory blocks, a controller configured to perform memory read and write operations on the plurality of memory blocks via the first data bus, and a non-volatile storage (NVS) data transfer circuit configured to transfer data in a first memory block of the plurality of memory blocks to a NVS device via the second data bus. The first memory block may be a cold data block least accessed among the plurality of memory blocks. The cold data transfer may be performed via the second data bus when a different memory block is being accessed via the first data bus concurrently. The second data bus may be a fuse bus in the memory device.

Abstract: A microelectronic device comprises a first control logic region comprising first control logic devices and a memory array region vertically overlying the first control logic region. The memory array region comprises capacitors, access devices laterally neighboring and in electrical communication with the capacitors, conductive lines operatively associated with the access devices and extending in a lateral direction, and first conductive pillars operatively associated with the access devices and vertically extending through the memory array region. The microelectronic device further comprises a second control logic region comprising second control logic devices vertically overlying the memory array region. Related microelectronic devices, memory devices, electronic systems, and methods are also described.

Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.

Abstract: Apparatuses, systems, and methods for accurate bias temperature instability (BTI) mitigation. During a first period a signal is provided to a path of a device, and during a second period a BTI toggle signal is provided to the path. During the first period a ratio of the time that the signal is active or inactive is measured. During the second period the BTI toggle signal is provided with a duty cycle based on the measured ratio. The duty cycle may be higher if the measured ratio is lower and lower if the measured ratio was higher.

Abstract: Methods, systems, and devices for circuit for tracking access occurrences are described. For instance, a memory device may include a memory array with column lines extending in a first direction and row lines extending in a second direction. The memory device may include a set of sense amplifiers adjacent to the memory array in the first direction, where a first subset of the set of sense amplifiers is coupled with the first set of column lines and a second subset of the set of sense amplifiers is coupled with the second set of column lines. The memory device may include a circuit adjacent to the set of sense amplifiers along the second direction, where the circuit is configured to increment, based on the access operation for the row line, a value including the logic states read by the second subset of the set of sense amplifiers.

Abstract: An exemplary memory is configurable to operate in a low latency mode through use of a low latency register circuit to execute a read or write command, rather performing a memory array access to execute the read or write command. A control circuit determines whether an access command should be performed using the low latency mode of operation (e.g., first mode of operation) or a normal mode of operation (e.g., second mode of operation). In some examples, a processor unit directs the memory to execute an access command using the low latency mode of operation via one or more bits (e.g., a low latency enable bit) included in the command and address information.

Abstract: Methods, systems, and devices for techniques for memory cell reset using dummy word lines are described. A memory device may activate, as part of a reset operation, one or more dummy word lines to couple a voltage node with a bit line to supply the bit line with a reset voltage supplied to the voltage node. The memory device may then activate one or more word lines to couple the bit line with one or more memory cells to supply the one or more memory cells with the reset voltage such that the one or more memory cells are reset. In some cases, the memory device may disable one or more components of a sense amplifier coupled with the bit line during the reset operation to support the voltage node supplying the bit line with the reset voltage.

Abstract: Multi-level cells, and related methods, arrays, devices, and systems, are described. A device may include a memory array including a first reference section including a first number of memory cells and a first reference digit line. The memory array may also include a second reference section including a second number of memory cells and a second reference digit line. The memory array may also include a target section including a memory cell. The target section may further include a first digit line coupled to the memory cell via a first switch, wherein the first digit line is further coupled to the first reference digit line via a first sense amplifier. The target section may also include a second digit line coupled to the first digit line via a second switch, wherein the second digit line is further coupled to the second reference digit line via a second sense amplifier.

Abstract: Methods, systems, and devices for memory cell capacitor structures for three-dimensional memory arrays are described. A memory device may include a memory array including multiple levels of memory cells that are each separated from another level by a respective dielectric layer. A memory cell at a first level of the memory array may include a channel portion and a capacitor operable to store a logic state of the memory cell. A first portion of the capacitor may be located between the channel portion and a voltage source coupled with the memory cell. A second portion of the capacitor may be in a cavity in a dielectric layer between the first level and a second level of the memory array. The second portion of the capacitor may be located between the channel portion and a word line coupled with a channel portion of a second memory cell at the second level.

Abstract: Apparatuses including a level shifter circuit are disclosed. An example apparatus according to the disclosure includes a plurality of array access control circuits and a level shifter circuit. The plurality of array access control circuits receive an access control signal and a respective plurality of section enable signals. An array access control circuit of the plurality of array access control circuits provides a section access control signal responsive to the access control signal when a respective section enable signal is in an active state. The level shifter circuit receives a control signal and provides an access control signal responsive to the first signal. A first logic level of the control signal is represented by a first power supply voltage and a first logic level of the access control signal is represented by a second power supply voltage greater than the first power supply voltage.

Abstract: A microelectronic device comprises a first control logic region comprising first control logic devices and a memory array region vertically overlying the first control logic region. The memory array region comprises capacitors, access devices laterally neighboring and in electrical communication with the capacitors, conductive lines operatively associated with the access devices and extending in a lateral direction, and first conductive pillars operatively associated with the access devices and vertically extending through the memory array region. The microelectronic device further comprises a second control logic region comprising second control logic devices vertically overlying the memory array region. Related microelectronic devices, memory devices, electronic systems, and methods are also described.

Abstract: Apparatuses, systems, and methods for access based targeted refresh operations. A memory bank has a first sub-bank and a second sub-bank. A refresh control circuit detects an aggressor in one of the sub-banks. Responsive to an access in the other sub-bank, the refresh control circuit performs a targeted refresh operation based on the sub-bank based on the aggressor address.

Abstract: A sense amplifier can be formed outside of/horizontally adjacent to an array of vertically stacked tiers of memory cells. Memory cells can be sensed via multiplexors formed under the array that can operate to couple vertical sense lines (to which the memory cells are coupled) to horizontal sense lines (to which the sense amplifier is coupled).

Abstract: Methods, systems, and devices for driver sharing between banks or portions of banks of memory devices are described. An apparatus may include a first bank and a second bank of memory cells and a word line driver configured to activate word lines. The word line driver may include a master word line driver and an address driver. In some examples, the master word line driver may be configured to generate a first signal to a first portion of the first bank or a second portion of the first bank as part of performing an access operation. In some examples, the master word line driver may be configured to generate a first signal for the first bank or the second bank as part of performing an access operation. The address driver configured to generate a second signal to a portion of the first bank or the second bank.

Abstract: Disclosed is a method for recognizing a bitting code of a key. The method comprises: using a back light source and/or a lateral light source to collect an image of a key to be recognized; and recognizing, on the basis of the image, a bitting code of the key to be recognized. Further disclosed are an apparatus for recognizing a bitting code of a key, and a storage medium and an image collection device. The present disclosure can improve the efficiency of recognizing a bitting code of a key and reduce the wear of the key during a recognition process.

Abstract: Methods, systems, and devices for non-destructive pattern identification at a memory device are described. A memory device may perform pattern identification within the memory device and output a flag indicating whether a first data pattern matches with a second data pattern. The memory device may access one or more memory cells, via a word line, and latch the second data pattern of the memory cells to a sense amplifier. The memory device may deactivate the word line, which may result in isolating the memory cells from potential destruction of data. The memory device may write a first data pattern to the sense amplifier and compare the first data pattern and second data pattern at the sense amplifier. The memory device may output a signal indicating whether the data patterns match.