Patents by Inventor Yuan He

Yuan He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11646073
    Abstract: Some embodiments include an integrated assembly having a deck over a base, and having memory cells supported by the deck. Each of the memory cells includes a capacitive unit and a transistor. The individual capacitive units of the memory cells each have a storage node electrode, a plate electrode, and a capacitor dielectric material between the storage node electrode and the plate electrode. A reference-voltage-generator includes resistive units supported by the deck. The resistive units are similar to the memory cells but include interconnecting units in place of the capacitive units. The interconnecting units of some adjacent resistive units are shorted to one another.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: May 9, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Hyunui Lee, Takamasa Suzuki, Yasuo Satoh, Yuan He
  • Publication number: 20230111633
    Abstract: A system and method for lead conversion using conversational virtual avatar is disclosed. System comprising processor causes Conversation Virtual Avatar Platform (CVAP) to receive, for first entity, from lead prioritization engine, leads applicable to first entity via lead repository based on scores associated with respective leads. Processor causes CVAP to receive, through conversation management engine (CME) configured in CVAP, from leads, responses to questions pertaining to product attributes and information pertaining to lead.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 13, 2023
    Applicant: ACCENTURE GLOBAL SOLUTIONS LIMITED
    Inventors: Anwitha PARUCHURI, Guanglei XIONG, Lan GUAN, Jayashree SUBRAHMONIA, Yuan HE, Louise Noreen BARRERE
  • Publication number: 20230089713
    Abstract: A quantum dot composite, an optical film, and a backlight module are provided. The quantum dot composite includes a polymerizable polymer and a plurality of quantum dot particles dispersed in the polymerizable polymer. A particle size of the plurality of the quantum dot particles ranges from 8 nm to 30 nm. Based on a total weight of the polymerizable polymer being 100 wt %, the polymerizable polymer includes: 10 wt % to 30 wt % of a multifunctional acrylic monomer, 8 wt % to 60 wt % of a thiol compound self-assembled on surfaces of the plurality of the quantum dot particles, and 1 wt % to 5 wt % of a photoinitiator.
    Type: Application
    Filed: July 22, 2022
    Publication date: March 23, 2023
    Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, Ren-Yu Liao, Guo-Yuan He
  • Publication number: 20230067220
    Abstract: A microelectronic device comprises array regions individually comprising memory cells comprising access devices and storage node device, digit lines coupled to the access devices and extending in a first direction, word lines coupled to the access devices and extending in a second direction orthogonal to the first direction, and control logic devices over and in electrical communication with the memory cells. The microelectronic device further comprises capacitor regions horizontally offset from the array regions in the first direction and having a dimension in the second direction greater than each individual array region in the second direction. The capacitor regions individually comprise additional control logic devices vertically overlying the memory cells, and capacitor structures within horizontal boundaries of the additional control logic devices. Related microelectronic devices, electronic systems, and methods are also described.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Fatma Arzum Simsek-Ege, Yuan He
  • Publication number: 20230059803
    Abstract: Methods, systems, and devices for driver sharing between banks or portions of banks of memory devices are described. An apparatus may include a first bank and a second bank of memory cells and a word line driver configured to activate word lines. The word line driver may include a master word line driver and an address driver. In some examples, the master word line driver may be configured to generate a first signal to a first portion of the first bank or a second portion of the first bank as part of performing an access operation. In some examples, the master word line driver may be configured to generate a first signal for the first bank or the second bank as part of performing an access operation. The address driver configured to generate a second signal to a portion of the first bank or the second bank.
    Type: Application
    Filed: August 20, 2021
    Publication date: February 23, 2023
    Inventors: Yuan He, George B. Raad
  • Patent number: 11587931
    Abstract: A memory device can comprise an array of memory cells comprising a plurality of vertically stacked tiers of memory cells, a respective plurality of horizontal access lines coupled to each of the plurality of tiers, and a plurality of vertical sense lines coupled to each of the plurality of tiers. The array of memory cells can further comprise a plurality of multiplexors each coupled to a respective vertical sense line and configured to electrically couple the respective vertical sense line to a horizontal sense line. The memory device can also comprise a semiconductor under the array (SuA) circuitry, comprising a plurality of sense amplifiers, each sense amplifier coupled to a respective subset of the plurality of multiplexors.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: February 21, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Fatma Arzum Simsek-Ege
  • Publication number: 20230043108
    Abstract: Methods, systems, and devices for vertical transistor fuse latches are described. An apparatus may include a substrate and a memory array that is coupled with the substrate. The apparatus may also include a latch that is configured to store information from a fuse for the memory array. The latch may be at least partially within an additional substrate separate from and above the substrate. The latch may include a quantity of p-type vertical transistors and a quantity of n-type vertical transistors each at least partially disposed within the additional substrate above the substrate.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Inventors: Fatma Arzum Simsek-Ege, Yuan He
  • Publication number: 20230029528
    Abstract: Methods for improving timing in memory devices are disclosed. A method may include sampling a data signal according to a clock signal to obtain a data sample; sampling the data signal according to an advanced clock signal to obtain an advanced data sample; and sampling the data signal according to a delayed clock signal to obtain a delayed data sample. The method may also include comparing the data sample with the advanced data sample and the delayed data sample and performing an action based on the comparison. The action may include selecting a data sample, selecting a clock signal and/or adjusting a clock signal. Associated devices and systems are also disclosed.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 2, 2023
    Inventors: Takehiro Hasegawa, Chikara Kondo, Yuan He, Hyunui Lee
  • Publication number: 20230037106
    Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.
    Type: Application
    Filed: July 27, 2021
    Publication date: February 2, 2023
    Inventors: CHI-LUEN WANG, HUNG-SHENG LEE, TAI-MING CHANG, CHUN-HUI YU, YU-CHING YEH, SHENG PING LAI, SHIH-WEI LIN, YUAN-HE TENG, LI-CHANG TSOU, SZUTSUN SIMON OU
  • Patent number: 11568922
    Abstract: An edge memory array mat with access lines that are split, and a bank of sense amplifiers formed under the edge memory array may in a region that separates the access line segment halves. The sense amplifiers of the bank of sense amplifiers are coupled to opposing ends of a first subset of the half access lines pairs. The edge memory array mat further includes access line connectors configured to connect a second subset of the half access line pairs across the region occupied by the bank of sense amplifiers to form combined or extended access lines that extend to a bank of sense amplifiers coupled between the edge memory array mat and an inner memory array mat.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 31, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Yuan He
  • Publication number: 20230028772
    Abstract: A microparticle for drug loading, a drug loading microparticle, a particle containing tube, and an implantation system for the microparticle. The microparticle for drug loading includes a housing (31) and a drug loading part (34) located inside the housing and is used for being implanted into body tissues by means of a puncture needle (5); the housing (31) is provided with at least one micro-hole (33) running through the wall thickness of the housing (31); and the drug loading part (34) is located inside the housing (31) and is used for loading drugs. The microparticle for drug loading/drug loading microparticle can achieve different types of drug loading and different release speeds, can be directly implanted into tissues, and have the technical advantages of both microspheres and radioactive particles.
    Type: Application
    Filed: September 20, 2022
    Publication date: January 26, 2023
    Applicant: SUZHOU YIBEN LIFE TECHNOLOGY CO., LTD
    Inventors: Yonghua DONG, Yuan HE
  • Publication number: 20230017740
    Abstract: The present disclosure discloses an electric border gateway device which adopts the blockchain technology to implement communication authentication and data transmission encryption at the gateway. As a device for sinking and processing local information, the border gateway device may build not only a local blockchain network with a variety of local electric sensing terminal devices, but also a regional blockchain network with other border gateways and electric management platforms. As a critical node of these two types of blockchain, the border gateway may enable the authentication of identity legality between electric sensing terminal devices, the critical data storage in the blockchain ledger, the deployment and implementation of blockchain transaction by control and coordinated functions, and the safe and reliable data interaction. The present disclosure also discloses a method for chaining and storage of sensing data based on the electric border gateway device.
    Type: Application
    Filed: December 18, 2020
    Publication date: January 19, 2023
    Inventors: Yuan HE, Hui LIU, Wansheng ZHANG, Gang YAO
  • Patent number: 11551746
    Abstract: Apparatuses, systems, and methods for faster memory access regions. A memory array may have a first bank which has a greater access speed than a second bank. For example the first bank may have a reduced read latency compared to the second bank. The first bank may have structural differences, such as reduced word line and/or reduced global input output (GIO) line length. In some embodiments, the first and second bank may have separate bank pad data buses, and data terminals. In some embodiments, they may share the bank pads data bus, and data terminals. In some embodiments, when an access command is received for the first (faster) bank while an access command to the second (slower) bank is still processing, the access to the faster bank may interrupt the access to the slower bank.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: January 10, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Daigo Toyama, Chikara Kondo, Takehiro Hasegawa
  • Patent number: 11550654
    Abstract: Methods, apparatuses, and systems related to an apparatus are described. The apparatus may include (1) a fuse array configured to provide non-volatile storage of fuse data and (2) local latches configured to store the fuse data during runtime of the apparatus. The apparatus may further include an error processing circuit configured to determine error detection-correction data for the fuse data. The apparatus may subsequently broadcast data stored in the local latches to the error processing circuit to determine, using the error detection-correction data, whether the locally latched data has been corrupted. The error processing circuit may generate corrected data to replace the locally latched data based on determining corruption in the locally latched data.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: January 10, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Jiyun Li
  • Patent number: 11544010
    Abstract: An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: January 3, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Ming-Bo Liu
  • Patent number: 11537306
    Abstract: A cold data detector circuit includes a bubble break register that is configured to detect cold data in a memory system including main memory and secondary memory. The bubble break register selectively shifts received segment addresses to fill empty slots without having to wait until the empty slots are shifted out an end slot, and may provide an indication of cold data in response to every slot of the register being filled with a different respective segment address.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: December 27, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Daigo Toyama
  • Patent number: 11538516
    Abstract: A memory mat architecture is presented where a column decoder is disposed within the memory array. The location of the column decoder reduces a distance between the column decoder and a target memory cell and thus reduces a distance that a column select signal travels from the column decoder to the target memory cell. A single predecoder is disposed in a bank controller for the memory array. The column decoder may be disposed in the middle of the memory array or offset from the middle near the far edge of the memory array opposite the bank controller. The location of the column decoder enables a reduced array access time to obtain data from the target memory cell.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: December 27, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Hiroshi Akamatsu
  • Publication number: 20220399308
    Abstract: A microelectronic device comprises a first control logic region comprising first control logic devices and a memory array region vertically overlying the first control logic region. The memory array region comprises capacitors, access devices laterally neighboring and in electrical communication with the capacitors, conductive lines operatively associated with the access devices and extending in a lateral direction, and first conductive pillars operatively associated with the access devices and vertically extending through the memory array region. The microelectronic device further comprises a second control logic region comprising second control logic devices vertically overlying the memory array region. Related microelectronic devices, memory devices, electronic systems, and methods are also described.
    Type: Application
    Filed: June 10, 2021
    Publication date: December 15, 2022
    Inventors: Fatma Arzum Simsek-Ege, Yuan He
  • Publication number: 20220392515
    Abstract: Some embodiments include an integrated assembly having a memory array over a base. First sense-amplifier-circuitry is associated with the base and includes sense amplifiers directly under the memory array. Vertically-extending digit lines are associated with the memory array and are coupled with the first sense-amplifier-circuitry. Second sense-amplifier-circuitry is associated with the base and is offset from the first sense-amplifier-circuitry. Control circuitry is configured to selectively couple the digit lines to either a voltage supply terminal or to the second sense-amplifier-circuitry.
    Type: Application
    Filed: August 12, 2022
    Publication date: December 8, 2022
    Inventors: Yuan He, Beau D. Barry
  • Patent number: 11514977
    Abstract: Memory device data-access schemes are disclosed. Various embodiments may include a memory device including a first column plane, a second column plane, and a data-steering circuit. The first column plane may include a first edge, a second edge, and a first number of digit lines arranged between the first edge and the second edge. The second column plane may include a third edge positioned adjacent to the second edge, a fourth edge, and a second number of digit lines arranged between the third edge and the fourth edge. The data-steering circuit may be configured to logically relate a first digit line of the first number of digit lines to a second digit line of the second number of digit lines, the first digit line proximate to the first edge and the second digit line proximate to the fourth edge. Associated systems and methods are also disclosed.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: November 29, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Jongtae Kwak