Abstract: Provided are a touch substrate, a preparation method thereof and a touch device. The touch substrate includes a substrate, and a first conductive layer, a first insulating layer and a second conductive layer sequentially stacked on the substrate. The first conductive layer includes a first capacitive touch electrode, a first wiring and a second wiring. The first wiring is electrically connected to the first capacitive touch electrode, and the second wiring is insulated from the first capacitive touch electrode. The first insulating layer includes at least one first via. The second conductive layer includes a second capacitive touch electrode, which is electrically connected to the second wiring through the first via. The second conductive layer further includes an additional functional channel, which is insulated from the second capacitive touch electrode.

Abstract: Embodiments of this disclosure provide a contention window size determining method and apparatus, and relate to the communications field. One method includes: sending, by a first device, one or more data packets to one or more second devices during a reference time unit, wherein the one or more data packets occupy a first subband; receiving, by the first device from the one more second devices, one or more hybrid automatic repeat request-acknowledgements (HARQ-ACKs) corresponding to the one or more data packets; and determining, by the first device, a contention window size of the first subband based on the one or more HARQ-ACKs.

Abstract: A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

Abstract: A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based package semiconductor devices and to a method of manufacturing the same. In embodiments in accordance with the present disclosure, the lowest insulating layer(s) has/have cavities arranged near and associated with one or more package terminals, and an inner wall of the cavities is covered with a conductive body that connects to the respective associated package terminal. Furthermore, the non-singulated substrate-based package semiconductor devices are separated by a separating region of the substrate, and the cavities are at least partially formed in the separating region.

Abstract: Within a direct current hybrid circuit breaker (DC HCB), a capacitance is provided in a semiconductor switch path in series with a semiconductor switch and the semiconductor switch is in parallel with a surge arrestor to facilitate opening the DC HCB. The semiconductor switch path is connected in parallel with a mechanical switch path that includes a mechanical switch. The circuit causes the current through the mechanical switch to ramp down while the current through the semiconductor switch ramps up to a supply current. The mechanical switch can open without current and against no recovery voltage.

Abstract: The present application provides a storage-stable polyisocyanate composition and a preparation method. The polyisocyanate composition is obtained by selecting one or more diisocyanate from aliphatic diisocyanates and alicyclic diisocyanates, and reacting same with an alcohol compound; the polyisocyanate composition contains an isocyanurate group, a uretdione group, a carbamate group, and an allophanate group; within the polyisocyanate composition, the molar ratio of the carbamate group/(uretdione group+isocyanurate group) is 0.01-0.2, and preferably 0.01-0.1. Compared to existing techniques, the present application has the advantage of a noticeable increase in system viscosity of uretdione polyisocyanate during storage. With the present application, by means of controlling the ratio of the carbamate group/(uretdione group+isocyanurate group) within the system, the increase in viscosity of a product during storage is inhibited, thereby improving the storage stability of the product.

Abstract: A wafer transfer robot apparatus based on a direct drive motor, includes: a hand module including a hand loading a wafer from one surface and a hand arm coupled to the hand to transfer the wafer; an R-axis module; a connecting enclosing module having one end coupled to the R-axis module; and a T-axis module rotatably coupled to the connecting enclosure module.

Abstract: A display device includes a thin film transistor (TFT) array substrate, an isolation structure, and a front panel laminate (FPL) structure. The TFT array substrate has pixel electrodes. The isolation structure is between the pixel electrodes to form a first resistance between adjacent pixel electrodes. The front panel laminate structure is located on the isolation structure and the pixel electrodes adhesive layer, and has a display medium layer therein.

Abstract: A method and apparatus for controlling game applications are provided. In the method, when an operating system receives a game starting command, the operating system determines a manner to start a corresponding game application according to whether the game application has resided in a memory, and when a cold boot manner is used, the operating system triggers the game application to report an amount of memory required currently by the game application, and determines whether a requirement of running the game application is met according to the amount of memory required and an amount of memory currently used, or the operating system ensures to meet the requirement of running the game application through background application freezing and clearing.

Abstract: A soundproof door system includes a chute; a door body, where a bottom of the door body is inserted into the chute and able to slide along the chute; a first roller disposed on the bottom of the door body and supported on a bottom wall of the chute; a first soundproof plate provided with a first end connected to the door body and a second end abutting against an inner wall of the chute; a second soundproof plate provided with a third end connected to the door body and a fourth end abutting against the inner wall of the chute; and the first end and the third end are respectively located on two sides of the door body, and the second end and the fourth end are respectively located on both sides of the door body.

Abstract: Methods are provided for remotely starting up one or a plurality of vehicles. These methods involve starting up hardware and/or software modules of the vehicle in a particular order so as to account for dependencies among the various modules. In one form, states of various hardware and/or software modules in the vehicle, and errors observed in starting up various modules and troubleshooting is applied in an automated manner. Moreover, the methods may involve ensure proper startup of modules for performing a localization procedure for the vehicle.

Abstract: A N-heterocyclic five-membered ring-containing capsid protein assembly inhibitor, and a pharmaceutical composition and use thereof, specifically relating to a compound as represented by formula I, a stereoisomer, a tautomer, a geometrical isomer, a solvate, an active metabolite, a hydrate, a prodrug or a pharmaceutically acceptable salt thereof, a pharmaceutical composition thereof, and a medical use thereof. The medical use comprises the use in treating diseases benefiting from the capsid protein assembly inhibitor, and in particular, diseases caused by hepatitis B virus infection.

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

Abstract: The present disclosure relates to a method and system for predicting the critical floating time of a reinforcing phase. According to the method, a particle concentration processing model, a half-life processing model, an agglomeration kinetics model, and a floating time processing model are combined to obtain the critical floating time of a reinforcing phase particle according to an initial particle size of the reinforcing phase particle, a density of the reinforcing phase particle, a mass fraction of the reinforcing phase of a composite soldering material, and a density of the composite soldering material. The method and system can accurately predict the critical floating time of the reinforcing phase particle.

Abstract: This disclosure provides methods and compositions for sample processing, particularly for sequencing applications. Included within this disclosure are bead compositions, such as diverse libraries of beads attached to large numbers of oligonucleotides containing barcodes. Often, the beads provides herein are degradable. For example, they may contain disulfide bonds that are susceptible to reducing agents. The methods provided herein include methods of making libraries of barcoded beads as well as methods of combining the beads with a sample, such as by using a microfluidic device.

Abstract: This application discloses a container. The container comprises a base, two pairs of opposite side plates and a lid. The two pairs of opposite side plates are both connected to the base. The lid can be locked to the top of the side plate via a locking device. Each of the four top corners of the container is provided with one locking device. The four locking device are arranged opposite to each other tin pairs along the corresponding diagonal of the lid, and each of the locking device includes one locking tongue member provided on the lid and one locking groove provided on the corresponding side plate. The locking tongue member has a locking tongue and is arranged to be movable relative to the lid so that the locking tongue is insertable into the locking groove to lock the lid to the side plate and is detachable from the locking groove to unlock the lid. Each of the locking grooves extends outwardly from the side plate along the corresponding diagonal direction of the lid.

Abstract: Provided is a sequencing chip. The sequencing chip includes: a chip main body, nucleic acids, and a phosphonic acid polymer film. The chip main body includes a plurality of chip particles arranged in a same layer, the chip particles are obtained by cutting a chip matrix along cutting lines of a wafer layer, and the chip matrix includes: the wafer layer having the cutting lines uniformly distributed thereon; a first silicon oxide layer made of silicon oxide and formed on an upper surface of the wafer layer; and a transition metal oxide layer made of a transition metal oxide and formed on an upper surface of the first silicon oxide layer. The nucleic acids are fixed on the transition metal oxide layer; and the phosphonic acid polymer film is made of a polyphosphonic acid polymer and formed on an upper surface of the transition metal oxide layer.

Abstract: An embodiment of the present application relates to the technical field of semiconductors, and discloses a method for manufacturing a semiconductor structure. In this embodiment, the method comprises: providing an insulating substrate (101); depositing an isolation layer (103) on the insulating substrate (101) by a physical vapor deposition process, the isolation layer (103) comprising cobalt atoms and barrier atoms located at grain boundaries of the cobalt atoms; and depositing a copper-containing metal layer (104) on the isolation layer (103).

Abstract: Provided are applications of a hexokinase 2-specific inhibitor in preparing a medicament for preventing and treating acute central nervous system injury.

Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.