Abstract: A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group consisting of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group blocked by a blocking agent. The polymer has a functional group reacting with the polyfunctional crosslinker.

Abstract: If at least one terpene-phenol resin is used as tackifying resin for pressure-sensitive adhesives based on polar framework polymers, wherein the at least one terpene-phenol resin in gel permeation chromatography analysis shows a multimodal molar mass distribution wherein the low molecular weight peak has its maximum within a range above 260 g/mol, it is possible, even at elevated temperatures, to achieve elevated storage stability of the terpene-phenol resins, apparent from a distinct reduction in increases in softening points over time.

Abstract: The battery cell structure includes a body and an electrode tab. The electrode tab is disposed on a side of the body and outward extended from the body. Two sides of the electrode tab are separately disposed with a slit. Each slit has two inner edges adjacent to each other. The two slits are staggered along a longitudinal direction of the electrode tab and overlapped with each other along a transverse direction of the electrode tab. When an overcurrent occurs at the electrode tab, the electrode tab may melt between the slits to prevent the battery cell structure from overheating and firing.

Abstract: A contact sensor includes two film layers, two electrode layers, and a failure detection electrode. The two film layers respectively have a first inner surface and a second inner surface corresponding to each other. The two electrode layers are respectively disposed on the first inner surface and the second inner surface, and the two electrode layers are separated by a gap. The failure detection electrode is disposed on at least one of the first inner surface and the second inner surface and is electrically isolated from the two electrode layers.

Abstract: A unidirectional perspective film includes a first niobium oxide layer, a first silicon oxide layer, an absorption layer, a second niobium oxide layer, and a second silicon oxide layer that are sequentially disposed. The absorption layer has a thickness ranging from 8 nm to 20 nm.

Abstract: Disclosed systems and methods may register a first plugin server as a primary server of a cluster management plugin (CMP) for a user interface (UI) of a virtualization platform client and a second plugin server as an auxiliary server of the CMP. The first plugin server may be associated with a first cluster of the virtualization platform and the second plugin server is associated with a second cluster of the visualization platform. The clusters may include one or more multi-node hyperconverged infrastructure (HCI) clusters. The first cluster may be managed by a first instance of a cluster manager while the second cluster may be managed by a second instance of the cluster manager. A CMP manifest, indicative of user interface extension points defined by the CMP, is loaded into a browser from the primary server.

Abstract: A sound barrier system for reducing electric field distortion includes a wall unit and a sound barrier unit. The sound barrier unit includes a sound barrier plate that, from top to bottom, includes an arc-shaped part, an inclined part, and a vertical part that are integrally formed, wherein a center of a circle of the arc-shaped part points towards an interior of a power facility, the inclined part is tilted away from the power facility from top to bottom and is tangent to the arc-shaped part, and a lower end of the vertical part is arranged on a top of the wall unit. The sound barrier system further includes an energy supply pipeline, a security device, and an online monitoring device. The sound barrier system can be easily manufactured, and not only can improve an acoustic environment around a substation, but also can reduce an amplitude of an electric field.

Abstract: Preparation method for a polyurethane optical resin and applications thereof. The preparation method for the polyurethane optical resin comprises: a raw material composition comprising isocyanate and a polythiol compound undergoes a polymerization to produce the polyurethane optical resin. The turbidity value of the isocyanate used in the raw material composition is controlled at ?2 NTU. The polyurethane optical resin produced is applicable in manufacturing optical products.

Abstract: System and techniques are described herein for processing images to detect objects in the provided images. In one illustrative example, a method of processing image data includes obtaining an image including at least a first object. The method can include generating a feature map based on providing the image to a neural network. The method can further include identifying a plurality of objects based on the feature map, the plurality of objects including a first part of the first object. The method can include identifying a first set of object parts within the plurality of objects corresponding to the first object.

Abstract: A pressure sensor includes a substrate, a pressure sensing element, a first signal line, a second signal line, an elastomer, and an opposite substrate. The pressure sensing element includes a first resistor and a second resistor connected in series, a third resistor and a fourth resistor connected in series, a first switch component, and a second switch component. The first and the second resistor are connected in parallel to the third and the fourth resistor. The first switch component is electrically connected between the first and the second resistor. The second switch component is electrically connected between the third and the fourth resistor. The first signal line is electrically connected between the first and the fourth resistor. The second signal line is electrically connected between the second and the third resistor. The elastomer includes a cavity. The first resistor to the fourth resistor overlap with the cavity.

Abstract: Redistribution layers of integrated circuits include one or more arrays of conductive contacts that are configured and arranged to allow a bonding wave to displace air between the redistribution layers during bonding. This configuration and arrangement of the one or more arrays minimize discontinuities, such as pockets of air to provide an example, between the redistribution layers during the bonding.

Abstract: This application describes a positioning method, apparatus, and system. The positioning apparatus includes an antenna selection circuit, a receiving processing circuit, and a processor, and the antenna selection circuit is coupled to the processor through the receiving processing circuit. The antenna selection circuit is coupled to an antenna array that includes M*N antenna elements, and the antenna selection circuit selects different combinations of antenna elements from the antenna array, where each combination of antenna elements includes L antenna elements. The processor controls the antenna selection circuit to select a combination of antenna elements from the antenna array. The receiving processing circuit receives an answer signal from a tag through L antenna elements selected by the antenna selection circuit, and processes the answer signal. The processor then positions the tag based on processed data.

Abstract: A soundproof door system includes a chute; a door body, where a bottom of the door body is inserted into the chute and able to slide along the chute; a first roller disposed on the bottom of the door body and supported on a bottom wall of the chute; a first soundproof plate provided with a first end connected to the door body and a second end abutting against an inner wall of the chute; a second soundproof plate provided with a third end connected to the door body and a fourth end abutting against the inner wall of the chute; and the first end and the third end are respectively located on two sides of the door body, and the second end and the fourth end are respectively located on both sides of the door body.

Abstract: This application provides a data transmission method and a communications apparatus. The method includes: first determining, based on a first time domain resource, M mini-slot-level second time domain resources that do not cross a slot boundary; and then performing repeated mini-slot-level data transmission on the M second time domain resources.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a first semiconductor device. The semiconductor structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first oxide layer formed below the a first substrate, a first bonding layer formed below the first oxide layer, and a first bonding via formed through the first bonding layer and the first oxide layer. The second semiconductor device includes a second oxide layer formed over a second substrate, a second bonding layer formed over the second oxide layer, and a second bonding via formed through the second bonding layer and the second oxide layer. The semiconductor structure also includes a bonding structure between the first substrate and the second substrate, and the bonding structure includes the first bonding via bonded to the second bonding via.

Abstract: A communication method, and a communications apparatus. The method includes: a terminal device determines uplink information; when the uplink information is first feedback information, the terminal device determines a first uplink control channel resource corresponding to the first feedback information, and sends the first feedback information on the first uplink control channel resource; or when the uplink information includes A-CSI, the terminal device determines a second uplink control channel resource corresponding to the uplink information, and sends the uplink information on the second uplink control channel resource, where the first uplink control channel resource is different from the second uplink control channel resource.

Abstract: The disclosure provides a heat-compensation serial cooling module including a heat exchanger, a cooling element, a pump, and a working fluid. The heat exchanger includes multiple heat exchanging portions. The heat exchange loop includes a main heat exchange pipeline and a compensational heat exchange pipeline serially connected to the heat exchanging portions. The main heat exchange pipeline and the compensational heat exchange pipeline are arranged parallelly and adjacently. The pump drives the working fluid to circulate in the heat exchange loop. A flowing direction of the working fluid in the main heat exchange pipeline is opposite to a flowing direction of the working fluid in the compensational heat exchange pipeline. The temperature of the compensational heat exchange pipeline is higher than that of the heat exchanging portions to compensate heat to make the temperature of each heat exchanging portion be approximately the same.

Abstract: A random access method, a communications apparatus, a chip, and a storage medium are described. A terminal device receives a first synchronization signal/PBCH block (SSB) on a first candidate SSB occasion. The first candidate SSB occasion is associated with a first random access channel time-frequency-code resource, and the terminal device sends random access information on the first random access channel time-frequency-code resource. The first candidate SSB occasion is included in L candidate SSB occasions. The L candidate SSB occasions are periodically and sequentially associated with random access channel time-frequency-code resources. By using M adjacent candidate SSB occasions as a mapping periodicity, M is less than L.

Abstract: Processors, systems and methods are provided for thread level parallel processing. A processor may include a plurality of columns of vector processing units arranged in a two-dimensional column array with a plurality of column stacks placed side-by-side in a first direction and each column stack having two columns stacked in a second direction and a temporary storage buffer. Each column may include a processing element (PE) that has a vector Arithmetic Logic Unit (ALU) to perform arithmetic operations in parallel threads. At a first end of the column array in the first direction, two columns in the column stack are coupled to the temporary storage buffer for one-way data flow. At a second end of the column array in the first direction, two columns are coupled to each other for one-way data flow. The column array and the temporary storage buffer may form a one-way circular data path.

Abstract: A xylylene diisocynate composition, a preparation method therefor and the use thereof. The xylylene diisocynate composition includes xylylene diisocynate and 0.2-500 ppm of a compound represented by formula (1). A resin prepared from the provided xylylene diisocynate composition has an excellent discoloration resistance and can effectively inhibit yellowing and/or white turbidity thereof.