Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact is formed above the first device layer. A first capping layer is formed at an upper end of the first bonding contact. The first capping layer has a conductive material different from a remainder of the first bonding contact. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact is formed above the second device layer. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact by the first capping layer.

Abstract: Systems and processes for user configurable task triggers are provided. In one example, at least one user input, including a selection of at least one condition of a plurality of conditions and a selection of at least one task of a plurality of tasks, is received. Stored context data corresponding to an electronic device is received. A determination is whether the stored context data indicates an occurrence of the at least one selected condition. In response to determining that the stored context data indicates an occurrence of the at least one selected condition, the at least one selected task associated with the at least one selected condition is performed.

Abstract: According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion (“CTE”). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

Abstract: The disclosure provides a semiconductor package substrate made from non-metallic material having a first top surface, a second bottom surface opposite from the first surface, and at least one side surface, the substrate includes at least two pads positioned on the first surface and suitable for receiving an electronic element, an encapsulant material layer covering the first surface, at least two terminals positioned on the second surface and electrically connected to the pads, and a portion of at least one of the two terminals is exposed at the at least one side surface and structured as a wettable flank.

Abstract: Disclosed by the present application is a crystalline form of a capsid protein assembly inhibitor containing an N hetero five-membered ring; specifically disclosed is the crystalline form of the compound of formula I; also comprised is an the application of said crystalline form in the preparation of a drug for preventing or treating diseases benefiting from the inhibition of capsid protein assembly.

Abstract: One embodiment provides a computer-implemented method that includes acquiring, via at least one microphone, sound pressure data from a loudspeaker in a room. The sound pressure data is input into an artificial intelligence (AI) model. The AI model automatically estimates, without user interaction, at least one of energy average (EA) in a listening area or total sound power (TSP) produced by the loudspeaker. The AI model is trained prior to automatically estimating the at least one of the EA in the listening area or the TSP produced by the loudspeaker.

Abstract: An in-situ vapor injection thermal desorption device includes a sectional combined input head, several intermediate connectors and a bottom protector connected in series from top to bottom. The in-situ vapor injection thermal desorption device further includes several water-vapor coupling injection activation chips, selectively disposed below any of the intermediate connectors; the sectional combined input head is provided with a high-pressure-gas inlet, several pairs of heat-transfer-oil inlets and heat-transfer-oil outlets, and several pairs of hot-water inlets and hot-water outlets; the water-vapor coupling injection activation chip is provided with several gas-liquid spraying holes.

Abstract: Embodiments of this disclosure provide a contention window size determining method and apparatus, and relate to the communications field. One method includes: sending, by a first device, one or more data packets to one or more second devices during a reference time unit, wherein the one or more data packets occupy a first subband; receiving, by the first device from the one more second devices, one or more hybrid automatic repeat request-acknowledgements (HARQ -ACKs) corresponding to the one or more data packets; and determining, by the first device, a contention window size of the first subband based on the one or more HARQ-ACKs.

Abstract: A mass transfer device includes at least one transfer cavity. Each transfer cavity is configured to accommodate a plurality of micro light-emitting diodes. Each transfer cavity includes a bottom plate and a cavity wall connecting the bottom plate. The bottom plate defines a plurality of through holes spaced apart from each other. The transfer cavity is used to transfer the plurality of micro light-emitting diodes to the array substrate of a display panel through the plurality of through holes.

Abstract: A N-heterocyclic five-membered ring-containing capsid protein assembly inhibitor, and a pharmaceutical composition and use thereof, specifically relating to a compound as represented by formula I, a stereoisomer, a tautomer, a geometrical isomer, a solvate, an active metabolite, a hydrate, a prodrug or a pharmaceutically acceptable salt thereof, a pharmaceutical composition thereof, and a medical use thereof. The medical use comprises the use in treating diseases benefiting from the capsid protein assembly inhibitor, and in particular, diseases caused by hepatitis B virus infection.

Abstract: A multiphase flow cylindrical model test system includes a loading structure, a multiphase flow displacement model bucket, a data acquisition and analysis system, a flexible seepage model bucket and a dynamic control system. A multi-parameter test method in the displacement process of pollutants in three-dimensional multi-field and multiphase media is reasonably configured based on the sequential and superimposed application requirements of heat and steam in the thermal enhanced soil vapor extraction process.

Abstract: A playback device includes a speaker, a controller, a first switch circuit, and a second switch circuit. The speaker has a first terminal and a second terminal. The controller is configured to output a first audio signal and a second audio signal. The controller is coupled to the first terminal of the speaker, and is configured to transmit the first audio signal to the speaker. The second switch circuit is coupled between the second terminal of the speaker and the controller, and is coupled to the first switch circuit. The second switch circuit is configured to transmit the second audio signal from the controller to the speaker when the first switch circuit is turned on.

Abstract: Systems and processes for user configurable task triggers are provided. In one example, at least one user input, including a selection of at least one condition of a plurality of conditions and a selection of at least one task of a plurality of tasks, is received. Stored context data corresponding to an electronic device is received. A determination is whether the stored context data indicates an occurrence of the at least one selected condition. In response to determining that the stored context data indicates an occurrence of the at least one selected condition, the at least one selected task associated with the at least one selected condition is performed.

Abstract: A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.

Abstract: The invention discloses an embedded system for dexterous hand, comprising: a central communication unit, several fingers, a palm; wherein the central communication unit communicates with the fingers, the palm and a host computer, and is configured to receive an operation instruction from the host computer, and convert the operation instruction into a control instruction and send it to the fingers and the palm; the fingers and the palm are designed to be compatible in hardware structure, and are connected by serial communication; the fingers and the palm move according to the control instructions. The fingers and palm are designed as embedded compatibility standards, which makes the dexterous hand more flexible and easy to maintain and use with lower cost. Thus, the dexterous hand has the advantages of high flexibility, high reliability, strong anti-interference, low cost, high transmission speed, convenient maintenance, and good user experience.

Abstract: Provided are applications of a hexokinase 2-specific inhibitor in preparing a medicament for preventing and treating acute central nervous system injury.

Abstract: Provided are a touch substrate, a preparation method thereof and a touch device. The touch substrate includes a substrate, and a first conductive layer, a first insulating layer and a second conductive layer sequentially stacked on the substrate. The first conductive layer includes a first capacitive touch electrode, a first wiring and a second wiring. The first wiring is electrically connected to the first capacitive touch electrode, and the second wiring is insulated from the first capacitive touch electrode. The first insulating layer includes at least one first via. The second conductive layer includes a second capacitive touch electrode, which is electrically connected to the second wiring through the first via. The second conductive layer further includes an additional functional channel, which is insulated from the second capacitive touch electrode.

Abstract: Embodiments of this disclosure provide a contention window size determining method and apparatus, and relate to the communications field. One method includes: sending, by a first device, one or more data packets to one or more second devices during a reference time unit, wherein the one or more data packets occupy a first subband; receiving, by the first device from the one more second devices, one or more hybrid automatic repeat request-acknowledgements (HARQ-ACKs) corresponding to the one or more data packets; and determining, by the first device, a contention window size of the first subband based on the one or more HARQ-ACKs.

Abstract: A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

Abstract: A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based package semiconductor devices and to a method of manufacturing the same. In embodiments in accordance with the present disclosure, the lowest insulating layer(s) has/have cavities arranged near and associated with one or more package terminals, and an inner wall of the cavities is covered with a conductive body that connects to the respective associated package terminal. Furthermore, the non-singulated substrate-based package semiconductor devices are separated by a separating region of the substrate, and the cavities are at least partially formed in the separating region.