Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: A method of real-time prognosis of a flooding phenomenon in a packed column includes steps as follows. An online data collection step is conducted, wherein a plurality of values of the pressure drop are collected from the packed column under operation. A calculation step is conducted, wherein the values of the pressure drop are used to calculate a plurality of values of a steadiness index. A statistical step is conducted, wherein a value of a monitoring statistic is calculated based on the values of the steadiness index. A control step is conducted, wherein the value of the monitoring statistic is compared to a control limit, and an alarm is triggered when the value of the monitoring statistic is greater than the control limit.

Abstract: A portable surface finishing device based on coherent light source includes a cover, a laser source, an optical calibrating module and a laser scanning module. The cover includes a beam output opening. The laser source is disposed in the cover, and is for providing a laser beam. The optical calibrating module is disposed in the cover, and the laser beam passes through the optical calibrating module. The laser scanning module is disposed in the cover, and the laser beam from the optical calibrating module passes through the laser scanning module so as to linearly output on a target surface. The laser scanning module includes a multifaceted reflective structure, a rotation driving mechanism and an F-theta lens.

Abstract: A method of real-time prognosis of a flooding phenomenon in a packed column includes steps as follows. An online data collection step is conducted, wherein a plurality of values of a pressure drop are collected from the packed column under operation. A detrending step is conducted to obtain a plurality of values of a detrended pressure drop. A fitting step is conducted, wherein the values of the detrended pressure drop are fitted with an EGARCH(p, q) model to obtain a value of at least one of model coefficients. A repeat step is conducted to obtain another value of the at least one of model coefficients. A statistical step is conducted, wherein a value of the monitoring statistic is calculated. A control step is conducted, wherein the value of the monitoring statistic is compared to a control limit.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: An apparatus is provided including a transformer including a first printed circuit board having one or more conducting layers, the one or more conducting layers forming, at least in part, a transformer coil; at least one inductor; and at least one continuous piece of conducting material external to the printed circuit board, where the at least one continuous piece of conducting material forms a connection between the transformer and the at least one inductor. A method is also provided for assembling a switched-mode power supply.

Abstract: Method for and apparatus were fans and cable placed at the ends at the same end of a computer rack drawer. The cable ends are located between the fans and the computing elements. The bulk length of each cable passes through the region where the fans are located. Air, and optionally EMI, sealing are provided by an elastic material near the fans. In this way cables could exit the same tailstock of the drawer where fans are located. The cable ends can receive good cooling, and the distance between the cable ends and computing elements of the drawer is not lengthened by the fan position.

Abstract: A method for inline inspection during semiconductor wafer fabrication is provided. The method includes forming a plurality of test structures on a semiconductor wafer along two opposite directions. An offset distance between a sample feature and a target feature of each of the test structures increases gradually along the two opposite directions. The method further includes producing an image of the test structures. The method also includes performing image analysis of the image to recognize a position with an extreme of a gray level. In addition, the method includes calculating an overlay error according to the recognized position.

Abstract: A highly temperature-resistant glass fiber and a preparation method therefor. The glass fiber comprises 62-66 wt % of SiO2, 14-19 wt % of Al2O3, 15-20 wt % of CaO, 0-2 wt % of MgO, 0-3 wt % of Fe2O3, and 0-1.2 wt % of TiO2, the total content of Na2O and K2O is 0.1-0.8 wt %. By precisely controlling the mixture of the components, the glass fiber has good resistance to high temperature and formability, and significantly increases the high-temperature softening point. The glass fiber has a forming temperature of not exceeding 1380° C., an upper limit temperature of devitrification of lower than 1280° C., and a high temperature softening temperature of 950° C. or above.

Abstract: The present invention discloses a method of preparing polymeric photoluminescent dots in water using inexpensive non-conjugated polymers. The resulting polymeric photoluminescent dots display the following properties: excellent water dispersibility, low toxicity, high absorptivity, good photo-stability and high quantum yield. The photoluminescent properties are not influenced by aggregation-caused quenching effect. The method is amenable to scale-up and is environmentally friendly.

Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Abstract: Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.

Abstract: Aspects of the present disclosure includes a method and program product for clock synchronization of a networked computer system. The method records a time (t1) when a first codeword marker in a datastream is sent from a master computer to a slave computer and records a second time (t2) when the slave computer receives the first codeword marker. The method includes recording a third time (t3) when a third codeword marker in a datastream is sent from the slave computer to the master computer. The method includes recording a fourth time t4 when the master receives the third codeword marker from the slave. The method calculates a time offset ?, according to; ? = ( t ? ? 2 - t ? ? 1 ) + ( t ? ? 4 - t ? ? 3 ) 2 , and a roundtrip delay ?, according to ?=(t4?t1)?(t3?t2). The clock in the slave computer is synchronized with a clock in the master computer using ? and ?.

Abstract: Providing privacy protection in a captured image includes obtaining the captured image and image coordinates associated with one or more target individuals within the captured image. Facial recognition processing is executed against individual faces within the captured image, and one or more target individuals in the captured image are identified from the image coordinates. Representative data of the one or more target individuals is saved to a whitelist, and a privacy protected version of the captured image may be provided. The privacy protected version of the captured image has one or more altered image features associated with one or more other individuals within the captured image then the one or more target individuals.

Abstract: A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.

Abstract: A method, a test line and a system for detecting defects on a semiconductor wafer are presented. The method includes measuring a current-voltage (IV) curve of a plurality of metal oxide semiconductor (MOS) transistors which are connected in series in a test key; comparing the measured IV curve with a reference curve to obtain a first drain current drop in a linear region and a second drain current drop in a saturation region; and determining whether at least one of the MOS transistor among the MOS transistors of the test key is defected according to at least one of the first drain current drop and the second drain current drop.

Abstract: A vortex laser generation device in a degenerate cavity with a spiral phase element and a vortex laser generation method are provided. The vortex laser generation device has a degenerate cavity, and the degenerate cavity has a resonator mirror, a gain medium, an optical element, and an output coupler. The off-axis beams are formed in multiple pass transverse modes to resonate by disposing an optical element in the degenerate cavity, so that a vortex laser with orbital angular momentum can be generated.

Abstract: Compositions including a highly branched alpha-D-glucan or modified forms thereof and a solute compound are described herein. The compositions can provide increased water solubility and/or increased rate of dissolution for the solute compound. The compositions can also provide increased stability for the solute compound. Methods for preparing and using compositions including a solute compound and a highly branched alpha-D-glucan are also described.

Abstract: A DC-to-DC power converter device has a common magnetic core structure that serves the functions of both transformer device and output inductor by integrating each into the common core. The transformer device has primary and secondary windings integrated into a first leg structure of the magnetic core, and the output inductor device has an output inductor winding integrated into a second leg structure of the magnetic core, the inductor winding structure for delivering output current to a load when a periodically switched input voltage is applied across the primary winding structure. The winding polarities of the transformer secondary winding structure and of the output inductor winding structure provide oppositely oriented polarities of electromotive force (EMF) to substantially reduce an output current ripple to an output load when delivering power through the transformer, through the output inductor and into the output load.