Abstract: A semiconductor device includes: a substrate having a cell region with a semiconductor element and an outer peripheral region; and a drift layer on the substrate. The semiconductor element includes a base region, a source region, a trench gate structure, a deep layer deeper than a gate trench, a source electrode, and a drain electrode. The outer peripheral region has a recess portion in which the drift layer are exposed, and a guard ring layer. The guard ring layer includes multiple guard ring trenches having a frame shape, surrounding the cell region and arranged on an exposed surface of the drift layer, and a first guard ring in the guard ring trenches. Each of the linear deep trenches has a width equal to a width of each of the linear guard ring trenches.

Abstract: An endoscope apparatus includes a spectroscopic section disposed on an optical axis of return light from an object irradiated with visible light, first excitation light and second excitation light including a longer wavelength than a wavelength of the first excitation light and configured to separate and emit the light of a second wavelength band other than light of a first wavelength band, a first excitation light cut filter configured to block a wavelength band of one of the first excitation light and the second excitation light included in the return light, and a second excitation light cut filter configured to block a wavelength band of another excitation light of the first excitation light and the second excitation light and a wavelength band of the visible light.

Abstract: A semiconductor device includes: a substrate having a cell region with a semiconductor element and an outer peripheral region; and a drift layer on the substrate. The semiconductor element includes a base region, a source region, a trench gate structure, a deep layer deeper than a gate trench, a source electrode, and a drain electrode. The outer peripheral region has a recess portion in which the drift layer are exposed, and a guard ring layer. The guard ring layer includes multiple guard ring trenches having a frame shape, surrounding the cell region and arranged on an exposed surface of the drift layer, and a first guard ring in the guard ring trenches. Each of the linear deep trenches has a width equal to a width of each of the linear guard ring trenches.

Abstract: A method of manufacturing a semiconductor device includes: setting a plurality of main semiconductor wafers and a plurality of sub semiconductor wafers in a load lock chamber of an electrode forming equipment; repeating a wafer-transfer and electrode-formation process of transferring at least one of the main semiconductor wafers from the load lock chamber to the film formation chamber in a state where the load lock chamber and the film formation chamber are decompressed and then forming a surface electrode on a surface of the at least one main semiconductor wafer transferred in the film formation chamber; removing the main semiconductor wafers on which the surface electrodes have been formed and the sub semiconductor wafers from the electrode forming equipment without forming an electrode on the sub semiconductor wafers by the electrode forming equipment; and making the surface electrodes Schottky-contact the main semiconductor wafers.

Abstract: There is provided a printing system. A reward information memory stores reward identification information and an upper limit amount in association with each other. A set charge memory stores a usage charge for each print setting. A specification unit obtains an upper limit amount in association with the input reward identification information from the reward information memory, and specifies selectable print settings within a range of the upper limit amount from the information stored in the set charge memory. A controller controls the execution of printing so as to be executed with the print settings specified by the specification unit.

Abstract: A method for manufacturing a SiC semiconductor device includes: forming recesses to be separated from each other on a cross section in parallel to a surface of the substrate by partially removing a top portion of the drift layer with etching using a mask after arranging the mask on a front surface of a drift layer; forming electric field relaxation layers having the second conductivity type to be separated from each other on the cross section by ion-implanting a second conductivity type impurity on a bottom of each recess using the mask; and forming a channel layer by forming a second conductivity type layer on the front surface of the drift layer including a front surface of each electric field relaxation layer in a respective recess.

Abstract: A switching device includes a semiconductor substrate; a trench; a conductor layer extending in a longitudinal direction of the trench so as to be in contact with a bottom surface of the trench; a bottom insulating layer covering an upper surface of the conductor layer; a gate insulating layer covering a side surface of the trench; and a gate electrode disposed in the trench. The semiconductor substrate includes a first semiconductor region of a first conductivity type, a body region of a second conductivity type, a second semiconductor region of the first conductivity type, a bottom semiconductor region of the second conductivity type extending in the longitudinal direction so as to be in contact with the conductor layer, and a connection semiconductor region of the second conductivity type connected to the body region and to the bottom semiconductor region.

Abstract: A switching device includes a semiconductor substrate; a trench; a conductor layer extending in a longitudinal direction of the trench so as to be in contact with a bottom surface of the trench; a bottom insulating layer covering an upper surface of the conductor layer; a gate insulating layer covering a side surface of the trench; and a gate electrode disposed in the trench. The semiconductor substrate includes a first semiconductor region of a first conductivity type, a body region of a second conductivity type, a second semiconductor region of the first conductivity type, a bottom semiconductor region of the second conductivity type extending in the longitudinal direction so as to be in contact with the conductor layer, and a connection semiconductor region of the second conductivity type connected to the body region and to the bottom semiconductor region.

Abstract: A semiconductor device includes a p-type semiconductor region in contact with a bottom face of a trench gate, wherein the p-type semiconductor region includes a first p-type semiconductor region containing a first type of p-type impurities and a second p-type semiconductor region containing a second type of p-type impurities. The first p-type semiconductor region is located between the trench gate and the second p-type semiconductor region. In a view along the depth direction, the second p-type semiconductor region is located within a part of the first p-type semiconductor region. A diffusion coefficient of the second type of p-type impurities is smaller than a diffusion coefficient of the first type of p-type impurities.

Abstract: An endoscope system includes an image pickup section that picks up, light included in return light generated according to radiation of excitation light, and reference light, the return light including the fluorescence, light in a first wavelength band, and light in a second wavelength band; an observation image generation section that generates an observation image using first through third image signals obtained by picking up the return light; and a control section that controls the observation image generation section such that the observation image is generated, by causing the first image signal to be assigned to a green component, and by causing one image signal having a relatively large signal value, between the second image signal and the third image signal, to be assigned to a red component and another image signal having a relatively small signal value to be assigned to a blue component and the green component.

Abstract: In a silicon carbide semiconductor device, a trench penetrates a source region and a first gate region and reaches a drift layer. On an inner wall of the trench, a channel layer of a first conductivity-type is formed by epitaxial growth. On the channel layer, a second gate region of a second conductivity-type is formed. A first depressed portion is formed at an end portion of the trench to a position deeper than a thickness of the source region so as to remove the source region at the end portion of the trench. A corner portion of the first depressed portion is covered by a second conductivity-type layer.

Abstract: An SiC semiconductor device has a p type region including a low concentration region and a high concentration region filled in a trench formed in a cell region. A p type column is provided by the low concentration region, and a p+ type deep layer is provided by the high concentration region. Thus, since a SJ structure can be made by the p type column and the n type column provided by the n type drift layer, an on-state resistance can be reduced. As a drain potential can be blocked by the p+ type deep layer, at turnoff, an electric field applied to the gate insulation film can be alleviated and thus breakage of the gate insulation film can be restricted. Therefore, the SiC semiconductor device can realize the reduction of the on-state resistance and the restriction of breakage of the gate insulation film.

Abstract: A semiconductor device includes a p-type semiconductor region in contact with a bottom face of a trench gate, wherein the p-type semiconductor region includes a first p-type semiconductor region containing a first type of p-type impurities and a second p-type semiconductor region containing a second type of p-type impurities. The first p-type semiconductor region is located between the trench gate and the second p-type semiconductor region. In a view along the depth direction, the second p-type semiconductor region is located within a part of the first p-type semiconductor region. A diffusion coefficient of the second type of p-type impurities is smaller than a diffusion coefficient of the first type of p-type impurities.

Abstract: An endoscope apparatus enables observation using reflected light of white light and observation using fluorescence, and includes: an insertion portion configured to be insertable into a subject; an objective optical system; a transmitting optical system; a camera unit; an optical splitter configured to split light exiting through the transmitting optical system; an optical filter disposed in the transmitting optical system or the camera unit, the optical filter being configured to transmit the reflected light of the white light and the fluorescence and block the reflected light of the excitation light; a first image pickup device for picking up an image of the reflected light of the white light exiting through the optical filter and the optical splitter; and a second image pickup device for picking up an image of the fluorescence exiting through the optical filter and the optical splitter.

Abstract: A method is provided for manufacturing an insulated gate type switching device. The method includes: implanting second conductivity type impurities into a surface of a semiconductor substrate so as to form a second region of a second conductivity type in the surface; forming a third region of the second conductivity type having a second conductivity type impurity density lower than the second region on the surface by epitaxial growth: and forming a trench gate electrode.

Abstract: There is provided a printing system. A reward information memory stores reward identification information and an upper limit amount in association with each other. A set charge memory stores a usage charge for each print setting. A specification unit obtains an upper limit amount in association with the input reward identification information from the reward information memory, and specifies selectable print settings within a range of the upper limit amount from the information stored in the set charge memory. A controller controls the execution of printing so as to be executed with the print settings specified by the specification unit.

Abstract: A silicon carbide semiconductor device includes: a substrate; a drift layer over the substrate; a base region over the drift layer; multiple source regions over an upper layer portion of the base region; a contact region over the upper layer portion of the base region between opposing source regions; multiple trenches from a surface of each source region to a depth deeper than the base region; a gate electrode on a gate insulating film in each trench; a source electrode electrically connected to the source regions and the contact region; a drain electrode over a rear surface of the substrate; and multiple electric field relaxation layers in the drift layer between adjacent trenches. Each electric field relaxation layer includes: a first region at a position deeper than the trenches; and a second region from a surface of the drift layer to the first region.

Abstract: A method of manufacturing an insulated gate type switching device includes forming a gate trench that has a first portion with a first width in a first direction and a second portion with a second width in the first direction, the second width being wider than the first width. In an oblique implantation, second conductivity type impurities are irradiated at an irradiation angle inclined around an axis orthogonal to the first direction. The first width, the second width, and the irradiation angle are set such that the second conductivity type impurities are suppressed, at a first side surface of the first portion, from being implanted into a part below a lower end of a second semiconductor region, and at a second side surface of the second portion, the impurities are implanted into the part below the lower end of the second semiconductor region.

Abstract: In a silicon carbide semiconductor device, a p-type SiC layer is disposed in a corner of a bottom of a trench. Thus, even if an electric field is applied between a drain and a gate when a MOSFET is turned off, a depletion layer in a pn junction between the p-type SiC layer and an n? type drift layer greatly extends toward the n? type drift layer, and a high voltage caused by an influence of a drain voltage hardly enters a gate insulating film. Hence, an electric field concentration within the gate insulating film can be reduced, and the gate insulating film can be restricted from being broken. In this case, although the p-type SiC layer may be in a floating state, the p-type SiC layer is formed in only the corner of the bottom of the trench. Thus, the deterioration of the switching characteristic is relatively low.

Abstract: An endoscope system includes a convex-portion specifying section that detects a convex portion in a picked-up image of a subject picked up by an image pickup section, and a convex-portion-size calculating section that detects a convex portion in a predetermined size range on the basis of information concerning the convex portion. An illumination section includes a plurality of illumination-light emitting sections that illuminate the subject with lights in bands different from one another from directions different from one another. The plurality of illumination-light emitting sections are provided on a distal end side inner circumferential surface of a cylindrical cap attached to the distal end of an insertion section of an endoscope to specify an image pickup range of the image pickup section.