Abstract: Semiconductor structures and methods for manufacturing the same are provided. The method includes forming first channel structures, second channel structures, and third channel structures. The method also includes forming gate dielectric layers surrounding the first channel structures, the second channel structures, and the third channel structures and forming dipole layers over the gate dielectric layers. The method also includes forming a dummy material in a first space between the first and the second channel structures and in a second space between the second and the third channel structures and removing first portions of the dummy material. The method also includes implanting first dopants in the dummy material in the first space and removing second portions of the dummy material in the first space and the second space. The method also includes removing the dipole layers in the top device region and completely removing the dummy material.

Abstract: A photochromic polypropylene fiber is provided. The photochromic polypropylene fiber includes about 98 to 99 parts by weight of polypropylene, about 0.2 to 0.8 parts by weight of a photochromic agent, about 0.1 to 1 parts by weight of an ultraviolet absorber, and about 0.1 to 1 parts by weight of a light stabilizer. The ultraviolet absorber includes and the light stabilizer includes wherein n is 10-14. A preparation method of the photochromic polypropylene fiber is further provided.

Abstract: A cerium-zirconium-aluminum-based composite material, a cGPF catalyst and a preparation method thereof are provided. The cerium-zirconium-aluminum-based composite material adopts a stepwise precipitation method, firstly preparing an aluminum-based pre-treated material, then coprecipitating the aluminum-based pre-treated material with zirconium and cerium sol, and finally roasting at high temperature to obtain the cerium-zirconium-aluminum-based composite material. The cerium-zirconium-aluminum-based composite material has better compactness and higher density, and when it is used in cGPF catalyst, it occupies a smaller volume of pores on the catalyst carrier, such that cGPF catalyst has lower back pressure and better ash accumulation resistance, which is beneficial to large-scale application of cGPF catalyst.

Abstract: A blockchain-based method for saving research data is implemented by a processing system. The processing system is connected to a blockchain system, and stores a user account associated with the blockchain system. The method includes sending a deployment request that includes the user account and an application to the blockchain system, in order for the blockchain system to deploy the application associated with the user account on the blockchain system. The method further includes generating and sending a processing request that includes a to-be-processed dataset to the blockchain system, in order for the blockchain system to analyze the to-be-processed dataset using the application so as to obtain a target dataset that corresponds to the to-be-processed dataset and that indicates an analysis result of the to-be-processed dataset, to store the to-be-processed dataset and the target dataset in the blockchain system, and to send the target dataset to the processing system.

Abstract: Disclosed are emulsion gel with both a freshness indication and a low migration rate, and a preparation method therefor. Lipase and organic acid are used and subjected to hydrophobic modification of anthocyanins to obtain acylated anthocyanins, the acylated anthocyanins and oil-phase gel are then dissolved in vegetable oil to form an oil phase, while a sodium alginate aqueous solution is used as a water phase, the oil phase and the water phase are mixed and subjected to high-speed shearing, and calcium carbonate and glucono-?-lactone are finally added for high-speed shearing to form emulsion gel. The emulsion gel prepared in the present disclosure has both a freshness indication and a low migration rate, and the preparation method of the present disclosure is simple, green, pollution-free and low energy consumption.

Abstract: An optical element driving mechanism includes a fixed assembly, a first movable part and a driving assembly. The first movable part is configured to be connected to a first optical element, and the first movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the first movable part to move relative to the fixed assembly.

Abstract: A computing circuit with a de-identified architecture, a data computing method, a data processing system, and a data de-identification method are provided. The computing circuit includes an arithmetic array and a de-identification circuit. The computing circuit may perform an accumulation operation on input data to generate accumulated data by the arithmetic array. The de-identification circuit has an analog offset error determined based on an analog physical unclonable function. The computing circuit may operate the accumulated data according to the analog offset error to generate de-identification data by the de-identification circuit. It can not only provide the analog offset error through the transistors in the de-identification circuit, but also be combined with obfuscated code settings to dynamically adjusting the degree of de-identification of data.

Abstract: The present invention provides a federated large model adaptive learning system. Based on the combination of multiobjective optimization and incremental learning, multiple optimization indexes are constructed, and adaptive mini model incremental learning is designed. A gradient scaling method of mini models is proposed for data privacy protection under federated learning, to make full use of gradient information. A correlation between the generalization ability and sampling data is revealed to propose a generalization ability evaluation function. With respect to the real problems of performance degradation and fault faced by industrial equipment during operation, multiple optimization objectives are designed in combination with the generalization ability evaluation function, and the models are updated and repaired adaptively through multiobjective evolutionary learning, to improve the usability of large models in real industrial scenarios.

Abstract: An optical element driving mechanism includes a fixed assembly, a first movable part and a driving assembly. The first movable part is configured to be connected to a first optical element, and the first movable part is movable relative to the fixed assembly. The driving assembly is configured to drive the first movable part to move relative to the fixed assembly.

Abstract: Disclosed herein is a system for implementing medical data exchange and medical claim settlement via Fast Healthcare Interoperability Resources (FHIR) standard data. The system includes a data exchange module, a blockchain database, a service-provider server, and an authority management module, all of which are communicatively connected to each other. The system receives and converts raw medical data into FHIR standard data for transmission to insurance institutions, and encrypts the FHIR standard data, and facilitates medical claims settlement. Also disclosed herein is a method for implementing medical data exchange and claims settlement based on FHIR standards.

Abstract: A memory cell structure includes a transistor structure and a capacitor structure, where the capacitor structure includes a hydrogen absorption layer. The hydrogen absorption layer absorbs hydrogen, which prevents or reduces the likelihood of the hydrogen diffusing into an underlying metal-oxide channel of the transistor structure. In this way, the hydrogen absorption layer minimizes and/or reduces the likelihood of hydrogen contamination in the metal-oxide channel, which may enable a low current leakage to be achieved for the memory cell structure and reduces the likelihood of data corruption and/or failure of the memory cell structure, among other examples.

Abstract: An optical sensing apparatus including: a substrate including a first material; an absorption region including a second material different from the first material; an amplification region formed in the substrate and configured to collect at least a portion of the photo-carriers from the absorption region and to amplify the portion of the photo-carriers; an interface-dopant region formed in the substrate between the absorption region and the amplification region; a buffer layer formed between the absorption region and the interface-dopant region; one or more field-control regions formed between the absorption region and the interface-dopant region and at least partially surrounding the buffer layer; and a buried-dopant region formed in the substrate and separated from the absorption region, where the buried-dopant region is configured to collect at least a portion of the amplified portion of the photo-carriers from the amplification region.

Abstract: A method includes forming a multi-layer stack over a semiconductor substrate, the multi-layer stack comprising a plurality of sacrificial layers that alternate with a plurality of channel layers, forming a dummy gate stack over a top surface and sidewalls of the multi-layer stack, forming first spacers on sidewalls of the dummy gate stack, growing an epitaxial source/drain region that extends through the plurality of sacrificial layers and the plurality of channel layers, forming a metal-semiconductor alloy region on first portions of the epitaxial source/drain region, forming a coating layer on the metal-semiconductor alloy region, wherein during the forming of the metal-semiconductor alloy region and the coating layer, a residual layer is formed on sidewalls of the first spacers, and performing a wet clean process to selectively etch the residual layer from the sidewalls of the first spacers.

Abstract: A method for filling a gap includes: filling a dielectric layer in the gap so that a seam is formed in the dielectric layer, the dielectric layer including two surface portions at two opposite sides of the seam, respectively; introducing a surface modification agent into the seam such that each of the two surface portions has first functional groups and second functional groups; forming a stress layer on the dielectric layer to cover the seam, the stress layer including a material different from that of the dielectric layer; and applying an energy field to permit the two surface portions to bond with each other through reaction between the first functional groups and the second functional groups.

Abstract: The present disclosure describes an image sensor device and a method for forming the same. The image sensor device can include a semiconductor layer. The semiconductor layer can include a first surface and a second surface. The image sensor device can further include an interconnect structure formed over the first surface of the semiconductor layer, first and second radiation sensing regions formed in the second surface of the semiconductor layer, a metal stack formed over the second radiation sensing region, and a passivation layer formed through the metal stack and over a top surface of the first radiation sensing region. The metal stack can be between the passivation layer and an other top surface of the second radiation sensing region.

Abstract: Thermoplastic compositions include: from about 40 wt % to about 89.9 wt % of at least one crystalline or semi-crystalline polymer; from about 10 wt % to about 20 wt % of at least one amorphous polymer; from about 0.1 wt % to about 20 wt % of a conductive carbon filler; and from 0) wt % to about 30 wt % of a reinforcing filler comprising glass fiber, glass flake, or a combination thereof. The thermoplastic composition has an absorption of at least 65%, a reflection of 35% or lower, and a transmission of 1% or lower, wherein absorption, reflection and transmission are tested in transmission mode in accordance with a Free Space Method at a frequency of from 75 gigahertz (GHz) to 110 GHz. The compositions are particularly suitable for use in radar absorbers for a radar or automobile sensor application.

Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: In an embodiment, a method includes: forming a fin extending from a substrate; forming a first gate mask over the fin, the first gate mask having a first width; forming a second gate mask over the fin, the second gate mask having a second width, the second width being greater than the first width; depositing a first filling layer over the first gate mask and the second gate mask; depositing a second filling layer over the first filling layer; planarizing the second filling layer with a chemical mechanical polish (CMP) process, the CMP process being performed until the first filling layer is exposed; and planarizing the first filling layer and remaining portions of the second filling layer with an etch-back process, the etch-back process etching materials of the first filling layer, the second filling layer, the first gate mask, and the second gate mask at the same rate.

Abstract: Thermoplastic compositions include: from about 30 wt % to about 70 wt % of a polybutylene terephthalate (PBT) polymer component; from about 10 wt % to about 20 wt % of a polyetherimide (PEI) polymer component; an impact modifier component; and from about 20 wt % to about 50 wt % of a glass fiber component. An injection molded sample of the composition has no observed mold whitening. The combined weight percent value of all components does not exceed 100 wt %, and all weight percent values are based on the total weight of the composition.