Abstract: A photoelectric conversion element includes a light guiding unit in which, on each of a first plane, a second plane, and a third plane, a first part of the light guiding unit and a second part of the light guiding unit, which is surrounded by the first part and a refractive index of which is lower than that of the first part, are included, a width of the second part on the first plane is a first length, the width of the second part on the second plane is a second length, and the width of the second part on the third plane is a third length, and the second length is shorter than each of the first length and the third length.

Abstract: Provided is an imaging device that includes a plurality of pixels, each of the plurality of pixels including a photoelectric conversion unit configured to accumulate charges generated by an incident light, a first holding unit and a second holding unit configured to hold the charges, an amplification unit configured to output a signal based on the charges, a first transfer switch provided between the photoelectric conversion unit and the first holding unit, a second transfer switch provided between the photoelectric conversion unit and the second holding unit, a third transfer switch provided between the first holding unit and the amplification unit, and a fourth transfer switch provided between the second holding unit and the amplification unit, and outputs a signal including a signal based on actual signal charges and a signal including a signal based on false signal charges.

Abstract: An image pickup apparatus performs a global electronic shutter operation in which exposure periods of a plurality of pixels coincide with one another. In a first period in which a photoelectric conversion unit of at least one of the pixels stores charge, signals based on charges stored in holding units of the pixels are successively output to output lines. In a second period after the output of the signals from the pixels is terminated, the holding units of the pixels hold charge.

Abstract: Provided is an imaging device including a substrate; a pixel array in which pixels are arranged in a two-dimensional manner on the substrate, each pixel including a photoelectric conversion unit that accumulates charges generated from an incident light, a charge holding unit that holds the charges transferred from the photoelectric conversion unit, and an amplification unit that receives the charges transferred from the charge holding unit; and a light-shielding portion arranged to cover at least the charge holding unit. The photoelectric conversion unit and the charge holding unit in each pixel are aligned in a first direction in a top view orthogonal to the substrate. The charge holding units of the neighboring pixels are aligned in a second direction intersecting the first direction in the top view. The light-shielding portion extends in the second direction and over the charge holding units, and covers a region between the charge holding units.

Abstract: An image capturing apparatus performs a global electronic shutter operation in which a plurality of pixels are exposed during the same exposure period. In a first period, charge is accumulated by a photoelectric conversion unit. In a second period, accumulation units of a plurality of pixels accumulate charge. A ratio of saturation charge quantity of the photoelectric conversion unit to saturation charge quantity of the accumulation unit has a certain relationship with a ratio of a length of the first period to the sum of the length of the first period and the length of the second period.

Abstract: A solid-state image pickup device is provided which can inhibit degradation of image quality which may occur when a global electronic shutter operation is performed. A gate drive line for a first transistor of gate drive lines for pixel transistors is positioned in proximity to a converting unit.

Abstract: A solid-state image pickup apparatus includes a photoelectric conversion unit, a charge storage unit, and a floating diffusion unit, all disposed on a semiconductor substrate. The solid-state image pickup apparatus further includes a first gate electrode disposed on the semiconductor substrate and extending between the photoelectric conversion unit and charge storage unit, and a second gate electrode disposed on the semiconductor substrate and extending between the charge storage unit and the floating diffusion unit. The solid-state image pickup apparatus further includes a light shielding member including a first part and a second part, wherein the first part is disposed over the charge storage unit and at least over the first gate electrode or the second gate electrode, and the second part is disposed between the first gate electrode and the second gate electrode such that the second part extends from the first part toward a surface of the semiconductor substrate.

Abstract: A photoelectric conversion apparatus includes a plurality of units each including a charge generation region disposed in a semiconductor layer. Each of a first unit and a second unit of the plurality of units includes a charge storage region configured to store charges transferred thereto from the charge generation region, a dielectric region located above the charge generation region and surrounded by an insulator layer, and a first light-shielding layer covering the charge storage region that is located between the insulator layer and the semiconductor layer, and the first light-shielding layer having an opening located above the charge generation region. The charge generation region of the first unit is able to receive light through the opening of the first light-shielding layer. The charge generation region of the second unit is covered with a second light-shielding layer.

Abstract: A manufacturing method includes a first process for forming a first gate electrode for a first MOS transistor and a second gate electrode for a second MOS transistor on a substrate including a semiconductor region defined by an insulator region for element isolation, a second process for masking a portion located above the semiconductor region of the first gate electrode to introduce an impurity to a source-drain region of the first MOS transistor, and a third process for forming a first conductor member being in contact with the portion of the first gate electrode through a first hole disposed on an insulator member covering the substrate and a second conductor member being in contact with the second gate electrode through a second hole disposed on the insulator member.

Abstract: A photoelectric conversion unit in each of a plurality of pixels starts accumulation of charges at a first time and is controlled to be turned on after the first time and to be thereafter turned off at a second time to transfer the charges to a holding unit. A second transfer switch in at least one of the pixels is controlled to be turned on at a third time and a fourth time after the second time to transfer the charges held in the holding unit to an amplification unit, and a first transfer switch in the at least one of the pixels is maintained to be in an off state during a period from the third time to a fourth time.

Abstract: An image pickup apparatus performs a global electronic shutter operation in which exposure periods of a plurality of pixels coincide with one another. In a first period in which a photoelectric conversion unit of at least one of the pixels stores charge, signals based on charges stored in holding units of the pixels are successively output to output lines. In a second period after the output of the signals from the pixels is terminated, the holding units of the pixels hold charge.

Abstract: A solid-state image pickup device is provided which can inhibit degradation of image quality which may occur when a global electronic shutter operation is performed. A gate drive line for a first transistor of gate drive lines for pixel transistors is positioned in proximity to a converting unit.

Abstract: An imaging device includes pixels including a photoelectric conversion unit, a holding unit that holds charge, and an amplifier unit. The pixels include a first group outputting a signal based on charge generated during a first exposure period, and a second group outputting a signal based on charge generated during a second exposure period longer than the first exposure period. The pixel belonging to the second group includes in the second exposure period a first period during which the charge generated in the photoelectric conversion unit is accumulated in the photoelectric conversion unit, and the charge held by the holding unit is transferred to the amplifier unit, and a second period during which the charge generated during the first period is held in the holding unit, and the charge generated after the first period is held by one of the photoelectric conversion unit and the holding unit.

Abstract: A solid-state image pickup apparatus includes a photoelectric conversion unit, a charge storage unit, and a floating diffusion unit, all disposed on a semiconductor substrate. The solid-state image pickup apparatus further includes a first gate electrode disposed on the semiconductor substrate and extending between the photoelectric conversion unit and charge storage unit, and a second gate electrode disposed on the semiconductor substrate and extending between the charge storage unit and the floating diffusion unit. The solid-state image pickup apparatus further includes a light shielding member including a first part and a second part, wherein the first part is disposed over the charge storage unit and at least over the first gate electrode or the second gate electrode, and the second part is disposed between the first gate electrode and the second gate electrode such that the second part extends from the first part toward a surface of the semiconductor substrate.

Abstract: A photoelectric conversion device includes a waveguide member disposed above a photoelectric conversion unit, and an insulating member disposed above a substrate, and surrounding at least part of the waveguide member. The waveguide member has a first side face, a second side face, and a third side face, arranged in that order from the substrate. An angle of inclination of the first side face is smaller than an angle of inclination of the second side face. An angle of inclination of the third side face is smaller than the angle of inclination of the second side face. The angle of inclination of the second side face is smaller than 90 degrees.

Abstract: A manufacturing method includes a first process for forming a first gate electrode for a first MOS transistor and a second gate electrode for a second MOS transistor on a substrate including a semiconductor region defined by an insulator region for element isolation, a second process for masking a portion located above the semiconductor region of the first gate electrode to introduce an impurity to a source-drain region of the first MOS transistor, and a third process for forming a first conductor member being in contact with the portion of the first gate electrode through a first hole disposed on an insulator member covering the substrate and a second conductor member being in contact with the second gate electrode through a second hole disposed on the insulator member.

Abstract: An image pickup apparatus according to the present invention includes a plurality of pixels arranged in rows and columns, and each of the pixels includes a photoelectric conversion unit that accumulates signal charge generated by photoelectric conversion of irradiated light, a first holding unit and a second holding unit that hold the signal charge transferred from the photoelectric conversion unit, and an output unit that outputs, to a column signal line, a signal based on an amount of the signal charge held by the first holding unit or the second holding unit. The first holding unit and the second holding unit alternately hold the signal charge generated in the photoelectric conversion unit for each frame period, and in a period in which the signal charge is not transferred from the photoelectric conversion unit, the first holding unit and the second holding unit output the signal charge to the output unit.

Abstract: Provided is an imaging device that includes a plurality of pixels, each of the plurality of pixels including a photoelectric conversion unit configured to accumulate charges generated by an incident light, a first holding unit and a second holding unit configured to hold the charges, an amplification unit configured to output a signal based on the charges, a first transfer switch provided between the photoelectric conversion unit and the first holding unit, a second transfer switch provided between the photoelectric conversion unit and the second holding unit, a third transfer switch provided between the first holding unit and the amplification unit, and a fourth transfer switch provided between the second holding unit and the amplification unit, and outputs a signal including a signal based on actual signal charges and a signal including a signal based on false signal charges.

Abstract: An imaging device includes pixels each including first and second photoelectric conversion units on which pupil-divided parts of incident light are incident and a holding unit that holds charges transferred from the first and second photoelectric conversion units, and outputting signals based on amounts of charges held by the holding unit. Each pixel outputs a first signal and a second signal based on amounts of charges generated by the first photoelectric conversion unit and by the first and second photoelectric conversion units, respectively, during a first exposure time, and a third signal and a fourth signal based on amounts of charges generated by the first photoelectric conversion unit and by the first and second photoelectric conversion units, respectively, during a second exposure time. The first and second signals are output before the third and fourth signals in one frame and after the third and fourth signals in another frame.

Abstract: An imaging apparatus includes a plurality of groups one of a part of which has a capacitance changing unit configured to change a capacitance value of an input node.