Skew reduction of a wave pipeline in a memory device

- Micron Technology, Inc.

A wave pipeline includes a plurality of data paths, a clock signal path, and a return clock signal path. Each data path includes an input node, an output node, and a data stage between the input node and the output node. Each data path has a different delay between the input node and the output node. A first data path of the plurality of data paths has a first delay and each of the other data paths of the plurality of data paths have a delay less than the first delay. The clock signal path provides a clock signal to the data stage of each data path. The return clock signal path provides a return clock signal from the data stage of the first data path. The return clock signal triggers data out of the data stage of each data path of the plurality of data paths.

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Description
TECHNICAL FIELD

The present disclosure relates generally to signal timing in integrated circuit devices. In particular, in one or more embodiments, the present disclosure relates to skew reduction for a wave pipeline in a memory device.

BACKGROUND

Memory devices are typically provided as internal, semiconductor, integrated circuit devices in computers or other electronic devices. There are many different types of memory including random-access memory (RAM), read only memory (ROM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and flash memory.

Flash memory devices have developed into a popular source of non-volatile memory for a wide range of electronic applications. Flash memory devices typically use a one-transistor memory cell that allows for high memory densities, high reliability, and low power consumption. Changes in threshold voltage of the memory cells, through programming (which is often referred to as writing) of charge storage structures (e.g., floating gates or charge traps) or other physical phenomena (e.g., phase change or polarization), determine the data value of each cell. Common uses for flash memory include personal computers, tablet computers, digital cameras, digital media players, cellular telephones, solid state drives and removable memory modules, and the uses are growing.

A wave pipeline may be used in a data path to send or receive data between different parts of an integrated circuit, such as a memory device. In a wave pipeline, the data signal and the clock signal move together. Different paths for the data signal and the clock signal, however, may result in skew between the data signal and the clock signal. Skew between the data signal and the clock signal should be minimized since a large skew limits the maximum clock frequency and the maximum distance that the data signal and the clock signal may travel.

For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for alternative methods for reducing skew between a data signal and a clock signal in a wave pipeline, and system and apparatus to perform such methods.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified block diagram of one embodiment of a memory device in communication with a processor as part of an electronic system.

FIGS. 2A-2B are schematic diagrams of portions of an array of memory cells as could be used in a memory device of the type described with reference to FIG. 1.

FIG. 3 is a schematic diagram illustrating one embodiment of an output data path.

FIG. 4 is a timing diagram illustrating one embodiment of the data signals and the return clock signal of the output data path described with reference to FIG. 3.

FIG. 5 is a schematic diagram illustrating another embodiment of an output data path.

FIG. 6 is a timing diagram illustrating one embodiment of the data signals and the return clock signal of the output data path described with reference to FIG. 5.

FIG. 7 is a timing diagram illustrating one embodiment of the triggering of data out of a sense amplifier of the output data path described with reference to FIG. 5.

FIG. 8 is a timing diagram illustrating one embodiment of the latching of data into the FIFO of the output data path described with reference to FIG. 5.

FIG. 9 is a flow diagram illustrating one embodiment of a method for processing data through a wave pipeline.

FIG. 10 is a flow diagram illustrating one embodiment of a method for reading data from an array of memory cells.

 DETAILED DESCRIPTION

In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which is shown, by way of illustration, specific embodiments. In the drawings, like reference numerals describe substantially similar components throughout the several views. Other embodiments may be utilized and structural, logical and electrical changes may be made without departing from the scope of the present disclosure. The following detailed description is, therefore, not to be taken in a limiting sense.

Skew is generated between different parts of data when the different parts of the data have different delays due to different paths within an integrated circuit, such as a memory device. The different paths may create different delays resulting in skew within the data and between the data and the clock signal. Accordingly, this disclosure describes embodiments for reducing skew within data and between the data and the clock signal.

FIG. 1 is a simplified block diagram of a first apparatus, in the form of a memory device 100, in communication with a second apparatus, in the form of a processor 130, as part of a third apparatus, in the form of an electronic system, according to an embodiment. Some examples of electronic systems include personal computers, tablet computers, digital cameras, digital media players, digital recorders, games, appliances, vehicles, wireless devices, cellular telephones and the like. The processor 130, e.g., a controller external to the memory device 100, may be a memory controller or other external host device.

Memory device 100 includes clock-data tracking that may facilitate an improved setup and hold time margin when reading data out of memory device 100. A clock signal path 126 may be routed along with a data bus 128. A return clock signal path 127 also may be routed along with the data bus 128. A clock signal on the clock signal path 126 may be used to trigger data out of the sensing devices 106 (e.g., sense amplifiers). A return clock signal on the return clock signal path 127 may be used to latch the data from the sensing devices 106 into a data latch (e.g., FIFO) of input/output (I/O) control circuitry 112 just prior to outputting the data to processor 130. By routing the clock signal and return clock signal along with the data, they may be subjected to the same logic circuitry and process, voltage, and temperature (PVT) variations as the data, and the setup and hold time margin at the data latch may be improved. It will be recognized that process variations typically experienced in fabrication will generally lead to variations in performance of circuits, even where those circuits are intended to be of the same design or otherwise provide the same functionality. Similarly, even small separations of circuits may expose those circuits to differing voltage and temperature values if measured to sufficient precision. Thus, while this disclosure seeks to mitigate the effects of such variations between clock signal paths and data paths, there is no expectation that such variations are necessarily eliminated.

Memory device 100 includes an array of memory cells 104 logically arranged in rows and columns. Memory cells of a logical row are typically coupled to the same access line (commonly referred to as a word line) while memory cells of a logical column are typically selectively coupled to the same data line (commonly referred to as a bit line). A single access line may be associated with more than one logical row of memory cells and a single data line may be associated with more than one logical column. Memory cells (not shown in FIG. 1) of at least a portion of array of memory cells 104 are capable of being programmed to one of at least two data states.

A row decode circuitry 108 and a column decode circuitry 110 are provided to decode address signals. Address signals are received and decoded to access the array of memory cells 104. Memory device 100 also includes I/O control circuitry 112 to manage input of commands, addresses and data to the memory device 100 as well as output of data and status information from the memory device 100. An address register 114 is in communication with I/O control circuitry 112 and row decode circuitry 108 and column decode circuitry 110 to latch the address signals prior to decoding. A command register 124 is in communication with I/O control circuitry 112 and control logic 116 to latch incoming commands.

An internal controller (e.g., control logic 116) controls access to the array of memory cells 104 in response to the commands and generates status information for the external processor 130, i.e., control logic 116 is configured to perform access operations in accordance with embodiments described herein. The control logic 116 is in communication with row decode circuitry 108 and column decode circuitry 110 to control the row decode circuitry 108 and column decode circuitry 110 in response to the addresses.

Control logic 116 is also in communication with a cache register 118. Cache register 118 latches data, either incoming or outgoing, as directed by control logic 116 to temporarily store data while the array of memory cells 104 is busy writing or reading, respectively, other data. During a program operation (e.g., write operation), data is passed from sensing devices 106 to the cache register 118. The data is then passed from the cache register 118 to data register 120 for transfer to the array of memory cells 104; then new data is latched in the cache register 118 from sensing devices 106, which receive the new data from the I/O control circuitry 112. During a read operation, data is passed from the cache register 118 to sensing devices 106, which pass the data to the I/O control circuitry 112 for output to the external processor 130; then new data is passed from the data register 120 to the cache register 118. A status register 122 is in communication with I/O control circuitry 112 and control logic 116 to latch the status information for output to the processor 130.

Memory device 100 receives control signals at control logic 116 from processor 130 over a control link 132. The control signals may include at least a chip enable CE#, a command latch enable CLE, an address latch enable ALE, a write enable WE#, and a read enable RE#. Additional control signals (not shown) may be further received over control link 132 depending upon the nature of the memory device 100. Memory device 100 receives command signals (which represent commands), address signals (which represent addresses), and data signals (which represent data) from processor 130 over a multiplexed input/output (I/O) bus 134 and outputs data to processor 130 over I/O bus 134.

For example, the commands are received over input/output (I/O) pins [7:0] of I/O bus 134 at I/O control circuitry 112 and are written into command register 124. The addresses are received over input/output (I/O) pins [7:0] of bus 134 at I/O control circuitry 112 and are written into address register 114. The data are received over input/output (I/O) pins [7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bit device at I/O control circuitry 112 and are written into cache register 118 through sensing devices 106. The data are subsequently written into data register 120 for programming the array of memory cells 104. For another embodiment, cache register 118 may be omitted, and the data are written directly into data register 120 through sensing devices 106. Data are also output over input/output (I/O) pins [7:0] for an 8-bit device or input/output (I/O) pins [15:0] for a 16-bit device.

It will be appreciated by those skilled in the art that additional circuitry and signals can be provided, and that the memory device of FIG. 1 has been simplified. It should be recognized that the functionality of the various block components described with reference to FIG. 1 may not necessarily be segregated to distinct components or component portions of an integrated circuit device. For example, a single component or component portion of an integrated circuit device could be adapted to perform the functionality of more than one block component of FIG. 1. Alternatively, one or more components or component portions of an integrated circuit device could be combined to perform the functionality of a single block component of FIG. 1.

Additionally, while specific I/O pins are described in accordance with popular conventions for receipt and output of the various signals, it is noted that other combinations or numbers of I/O pins may be used in the various embodiments.

FIG. 2A is a schematic of a NAND memory array 200A, e.g., as a portion of array of memory cells 104. Memory array 200A includes access lines, such as word lines 2020 to 202N, and data lines, such as bit lines 2040 to 204M. The word lines 202 may be coupled to global access lines (e.g., global word lines), not shown in FIG. 2A, in a many-to-one relationship. For some embodiments, memory array 200A may be formed over a semiconductor that, for example, may be conductively doped to have a conductivity type, such as a p-type conductivity, e.g., to form a p-well, or an n-type conductivity, e.g., to form an n-well.

Memory array 200A might be arranged in rows (each corresponding to a word line 202) and columns (each corresponding to a bit line 204). Each column may include a string of series-coupled memory cells, such as one of NAND strings 2060 to 206M. Each NAND string 206 might be coupled to a common source 216 and might include memory cells 2080 to 208N. The memory cells 208 represent non-volatile memory cells for storage of data. The memory cells 208 of each NAND string 206 might be connected in series between a select transistor 210 (e.g., a field-effect transistor), such as one of the select transistors 2100 to 210M (e.g., that may be source select transistors, commonly referred to as select gate source), and a select transistor 212 (e.g., a field-effect transistor), such as one of the select transistors 2120 to 212M (e.g., that may be drain select transistors, commonly referred to as select gate drain). Select transistors 2100 to 210M might be commonly coupled to a select line 214, such as a source select line, and select transistors 2120 to 212M might be commonly coupled to a select line 215, such as a drain select line.

A source of each select transistor 210 might be connected to common source 216. The drain of each select transistor 210 might be connected to the source of a memory cell 2080 of the corresponding NAND string 206. For example, the drain of select transistor 2100 might be connected to the source of memory cell 2080 of the corresponding NAND string 2060. Therefore, each select transistor 210 might be configured to selectively couple a corresponding NAND string 206 to common source 216. A control gate of each select transistor 210 might be connected to select line 214.

The drain of each select transistor 212 might be connected to the bit line 204 for the corresponding NAND string 206. For example, the drain of select transistor 2120 might be connected to the bit line 2040 for the corresponding NAND string 2060. The source of each select transistor 212 might be connected to the drain of a memory cell 208N of the corresponding NAND string 206. For example, the source of select transistor 2120 might be connected to the drain of memory cell 208N of the corresponding NAND string 2060. Therefore, each select transistor 212 might be configured to selectively couple a corresponding NAND string 206 to a corresponding bit line 204. A control gate of each select transistor 212 might be connected to select line 215.

The memory array in FIG. 2A might be a quasi-two-dimensional memory array and might have a generally planar structure, e.g., where the common source 216, strings 206 and bit lines 204 extend in substantially parallel planes. Alternatively, the memory array in FIG. 2A might be a three-dimensional memory array, e.g., where strings 206 may extend substantially perpendicular to a plane containing the common source 216 and to a plane containing the bit lines 204 that may be substantially parallel to the plane containing the common source 216.

Typical construction of memory cells 208 includes a data-storage structure 234 (e.g., a floating gate, charge trap, etc.) that can determine a data value of the cell (e.g., through changes in threshold voltage), and a control gate 236, as shown in FIG. 2A. Memory cells 208 may further have a defined source 230 and a defined drain 232. Memory cells 208 have their control gates 236 coupled to (and in some cases form) a word line 202.

A column of the memory cells 208 is a NAND string 206 or a plurality of NAND strings 206 coupled to a given bit line 204. A row of the memory cells 208 are memory cells 208 commonly coupled to a given word line 202. A row of memory cells 208 can, but need not include all memory cells 208 commonly coupled to a given word line 202. Rows of memory cells 208 may often be divided into one or more groups of physical pages of memory cells 208, and physical pages of memory cells 208 often include every other memory cell 208 commonly coupled to a given word line 202. For example, memory cells 208 commonly coupled to word line 202N and selectively coupled to even bit lines 204 (e.g., bit lines 2040, 2042, 2044, etc.) may be one physical page of memory cells 208 (e.g., even memory cells) while memory cells 208 commonly coupled to word line 202N and selectively coupled to odd bit lines 204 (e.g., bit lines 2041, 2043, 2045, etc.) may be another physical page of memory cells 208 (e.g., odd memory cells). Although bit lines 2043 2045 are not expressly depicted in FIG. 2A, it is apparent from the figure that the bit lines 204 of the array of memory cells 200A may be numbered consecutively from bit line 2040 to bit line 204M. Other groupings of memory cells 208 commonly coupled to a given word line 202 may also define a physical page of memory cells 208. For certain memory devices, all memory cells commonly coupled to a given word line might be deemed a physical page. The portion of a physical page (which, in some embodiments, could still be the entire row) that is read during a single read operation or programmed during a program operation (e.g., an upper or lower page memory cells) might be deemed a logical page.

FIG. 2B is another schematic of a portion of an array of memory cells 200B as could be used in a memory of the type described with reference to FIG. 1, e.g., as a portion of array of memory cells 104. Like numbered elements in FIG. 2B correspond to the description as provided with respect to FIG. 2A. FIG. 2B provides additional detail of one example of a three-dimensional NAND memory array structure. The three-dimensional NAND memory array 200B may incorporate vertical structures which may include semiconductor pillars where a portion of a pillar may act as a channel region of the memory cells of NAND strings 206. The NAND strings 206 may be each selectively connected to a bit line 2040-204M by a select transistor 212 (e.g., that may be drain select transistors, commonly referred to as select gate drain) and to a common source 216 by a select transistor 210 (e.g., that may be source select transistors, commonly referred to as select gate source). Multiple NAND strings 206 might be selectively connected to the same bit line 204. Subsets of NAND strings 206 can be connected to their respective bit lines 204 by biasing the select lines 2150-215L to selectively activate particular select transistors 212 each between a NAND string 206 and a bit line 204. The select transistors 210 can be activated by biasing the select line 214. Each word line 202 may be connected to multiple rows of memory cells of the memory array 200B. Rows of memory cells that are commonly connected to each other by a particular word line 202 may collectively be referred to as tiers.

Although the examples of FIGS. 2A and 2B are discussed in conjunction with NAND flash, the embodiments described herein are not limited to a particular array architecture or structure, and can include other structures (e.g., cross-point memory, DRAM, etc.) and other architectures (e.g., AND arrays, NOR arrays, etc.).

FIG. 3 is a schematic diagram illustrating one embodiment of an output data path 300. In one example, output data path 300 is a portion of the memory device 100 previously described and illustrated with reference to FIG. 1. Output data path 300 may include input nodes 3101 to 3104, data stages 3021 to 3024, and output nodes 3121 to 3124. Each data stage 3021 to 3024 may be substantially similar and includes an output latch 3041 to 3044, respectively. The clock input of each data stage 3021 to 3024 is electrically coupled to a clock signal path 306. The clock input of each output latch 3041 to 3044 is electrically coupled to a return clock signal path 308. Each input node 3101 to 3104 is electrically coupled to the data input of a data stage 3021 to 3024 through a data path 3141 to 3144, respectively. The data output of each output latch 3041 to 3044 is electrically coupled to an output node 3121 to 3124 through a data path 3161 to 3164, respectively.

The delay between each input node 3101 to 3104 and the corresponding output node 3121 to 3124 may vary based on the location of the corresponding data stage 3021 to 3024 and the length of each corresponding data path 3141 to 3144 and each corresponding data path 3161 to 3164. For example, in the output data path 300 illustrated in FIG. 3, there is a delay δ0 as indicated by 3131 between the first data (DIN_1) on input node 3101 arriving at the input of first data stage 3021 and the second data (DIN_2) on input node 3102 arriving at the input of second data stage 3022 since data path 3142 is longer than data path 3141. There is a delay δ0 as indicated by 3132 between the second data on input node 3102 arriving at the input of second data stage 3022 and the third data (DIN_3) on input node 3103 arriving at the input of third data stage 3023 since data path 3143 is longer than data path 3142. There is also a delay δ0 as indicated by 3133 between the third data on input node 3103 arriving at the input of third data stage 3023 and the fourth data (DIN_4) on input node 3104 arriving at the input of fourth data stage 3024 since data path 3144 is longer than data path 3143. In addition, there are delays δ0 as indicated by 3134, 3135, and 3136 prior to output nodes 3121 to 3124 due to the different lengths of data paths 3161 to 3164. Further, each data stage 3021 to 3024 includes a delay δ1 due to data processing within each data stage 3021 to 3024. Delays 3131 to 3136 would introduce skew up to six times δ0 between the data on output nodes 3121 to 3124 if output latches 3041 to 3044 were excluded. In other examples, delays δ0 indicated at 3131 to 3136 may be different from each other.

To minimize or effectively eliminate the skew between the data on output nodes 3121 to 3124 (DOUT_1, DOUT_2, DOUT_3, and DOUT_4, respectively), the return clock signal (CLK_RTN) from the data stage of the data path having the maximum delay is used to trigger data out of each data stage. In one example, the return clock signal from the data stage of the data path having the maximum delay is used to trigger data out of each data stage in order from the data path having the maximum delay to the data path having the minimum delay. In the example of FIG. 3, the data path having the maximum delay is the combination of data path 3144, fourth data stage 3024, and data path 3164 between input node 3104 and output node 3124. The data path having the shortest delay is the combination of data path 3141, first data stage 3021, and data path 3161 between input node 3101 and output node 3121. Accordingly, the return clock signal from fourth data stage 3024 is used to trigger the data out of the data stages in the following order: fourth data stage 3024, third data stage 3023, second data stage 3022, and first data stage 3021. The return clock signal triggers the data out of each data stage 3024 to 3021 by triggering output latches 3044 to 3041, respectively, to pass the data from each data stage 3024 to 3021 to the corresponding data path 3164 to 3161. Therefore, the data from data stages 3021 to 3024 is aligned at output nodes 3121 to 3124 and is aligned with the return clock signal on return clock signal path 308. The data at each output node 3121 to 3124 arrives after a delay of δ1+6*δ0 from when the data arrives at each input node 3101 to 3104.

FIG. 4 is a timing diagram 320 illustrating one embodiment of the data signals and the return clock signal of output data path 300 described with reference to FIG. 3. Timing diagram 320 includes the return clock signal (CLK_RTN) on return clock signal path 308 after output latch 3041, first output data (DOUT_1) on output node 3121, second output data (DOUT_2) on output node 3122, third output data (DOUT_3) on output node 3123, and fourth output data (DOUT_4) on output node 3124. As shown in FIG. 4, the skew indicated by 322 may be mitigated or effectively eliminated between the data signals and the return clock signal. Without the output latches 3041 to 3044 triggered by the return clock signal as described herein, the skew would be up to six times δ0 as indicated by 324.

FIG. 5 is a schematic diagram illustrating another embodiment of an output data path 400. In one example, output data path 400 is a portion of the memory device 100 previously described and illustrated with reference to FIG. 1. Output data path 400 may include sensing devices 4021 and 4022, buffers 4121, 4122, 430, and 438, a first in first out (FIFO) 416, data node(s) (e.g., pad(s)) DQ(s) 420, a read enable RE# clock signal node (e.g., pad) 422, a clock generator 426, and an address counter 434. While two sensing devices 4021 and 4022 are illustrated in FIG. 5, output data path 400 may include any suitable number of sensing devices. Each sensing device 4021 and 4022 includes a sense amplifier 4061 and 4062, a clock path 4081 and 4082, and an output latch 4041 and 4042, respectively.

RE# clock signal pad 422 is electrically coupled to the input of clock generator 426 through a signal path 424. An output of clock generator 426 is electrically coupled to the exit clock input (EXT) of FIFO 416, the input of buffer 430, and the input of address counter 434 through a clock signal path 428. The output of buffer 430 is electrically coupled to the input of each clock path 4081 and 4082 of each sensing device 4021 and 4022, respectively, through a clock signal path 432. The output of address counter 434 is communicatively coupled to the input of buffer 438 through an address signal path 436. Communicatively coupled components may be coupled by a single bit signal path or a multiple bit parallel signal path. The output of buffer 438 is communicatively coupled to the input of each sense amplifier 4061 and 4062 through an address signal path 440. The output of each sense amplifier 4061 and 4062 is communicatively coupled to the data input of output latch 4041 and 4042, respectively.

The output of each output latch 4041 and 4042 is communicatively coupled to the input of buffer 4121 and 4122 through a data path 4101 and 4102, respectively. The output of each buffer 4121 and 4122 is communicatively coupled to a data input of FIFO 416 through a data path 4141 and 4142, respectively. First sensing device 4021, data path 4101, buffer 4121 and data path 4141 provide a first data path, and second sensing device 4022, data path 4102, buffer 4122 and data path 4142 provide a second data path. The first data path has a first length and the second data path has a second length longer than the first length.

The output of clock path 4082 is electrically coupled to the clock input of each output latch 4041 and 4042 and the input of buffer 444 through a return clock signal path 442. The output of buffer 444 is electrically coupled to the entrance clock input (ENT) of FIFO 416 through a return clock signal path 446. The data output of FIFO 416 is communicatively coupled to DQ(s) 420 through a data path 418. The data width of FIFO 416 equals the data width of data paths 4141 and 4142. FIFO 416 may have any suitable number of stages based on the particular configuration of the memory device.

In one example, DQ(s) 420 is a single data pad, and data paths 4101 and 4102 and 4141 and 4142 are corresponding single bit data paths. In other examples, DQ(s) 420 are multiple data pads (e.g., eight data pads, sixteen data pads), and data paths 4101 and 4102 and 4141 and 4142 are multiple bit parallel data paths. A serializer (not shown) may be included on data path 418 between FIFO 416 and each DQ 420 to serialize parallel data from FIFO 416 for output on DQ(s) 420. In this case, the data width of FIFO 416 and data paths 4141 and 4142 may be a multiple of the number of DQ(s) 420. For example, for four DQs 420 and an eight bit serializer for each DQ 420, the data width of FIFO 416 and data paths 4141 and 4142 is 32 bits for a double data rate (DDR) memory.

Clock generator 426 receives the RE# clock signal and generates a clock signal on clock signal path 428. In one example, clock generator 426 reduces the clock rate of the RE# clock signal so that the data throughput on data paths 4141 and 4142 is equal to the number of DQs 420. For example, for eight DQs 420 and a data width of 8×8=64 bits, clock generator 426 divides the RE# clock signal by four to provide the clock signal on clock signal path 428. The internal data bus is clocked by a single edge per cycle of the divided-down clock while the serializers and DQs are clocked by both edges per RE# clock cycle. The reduced clock rate for the internal data bus may be used to relax the internal timing requirements. The more reduced the internal clock rate, however, the wider the internal data bus generally needs to be to maintain the data throughput. Since a wider data bus may add layout cost and design complexity, however, there is a tradeoff between the data bus width and the internal clock rate.

Buffer 430 may delay the clock signal on clock signal path 428 to provide the clock signal (CLK) on clock signal path 432. Address counter 434 generates an address signal for first sensing device 4021 and second sensing device 4022 in response to the clock signal on clock signal path 428. Address counter 424 provides the address signal on address signal path 436. Buffer 438 may delay the address signal on address signal path 436 to provide the address signal (ADDRESS) on address signal path 440. The clock signal on clock signal path 432 may be routed along with the address signal on address signal path 440 such that both the clock signal and the address signal are subjected to substantially the same delay (e.g., the same delay) due to the routing and PVT variations. The delay of buffers 430 and 438 may be adjusted to improve the alignment of the clock signal with the address signal.

First sensing device 4021 senses first data from an array of memory cells (e.g., memory array 104 of FIG. 1) based on the address signal on address signal path 440 in response to the clock signal on clock signal path 432. Likewise, second sensing device 4022 senses second data from the array of memory cells based on the address signal on address signal path 440 in response to the clock signal on clock signal path 432. In particular, sense amplifier 4062 provides the second data to output latch 4042 in response to the clock signal in clock path 4082. The output of clock path 4082 provides the return clock signal on return clock signal path 442. Clock path 4082 provides the return clock signal (CLK_RTN) since the data path between second sensing device 4022 and FIFO 416 is longer than the data path between first sensing device 4021 and FIFO 416. Therefore, the data path between second sensing device 4022 and FIFO 416 has the greatest delay. Output latch 4042 is triggered by the return clock signal to pass the second data (DOUT_2) from sense amplifier 4062 to data path 4102. Since the return clock signal is used to output the second data from sensing devices 4022, the return clock signal is aligned with the second data. With the data aligned with the return clock signal, the data is expected to be valid at a corresponding transition of the corresponding clock cycle of the return clock signal. The second data on data path 4102 may be delayed by buffer 4122 to provide the second data on data path 4142.

Sense amplifier 4061 provides the first data to output latch 4041 in response to the clock signal in clock path 4081. The clock signal is terminated after clock path 4081 since clock path 4082 provides the return clock signal. Output latch 4041 is triggered by the return clock signal to pass the first data (DOUT_1) from sense amplifier 4061 to data path 4101. Since the return clock signal is used to output the first data from sensing devices 4021, the return clock signal is aligned with the first data. The first data on data path 4101 may be delayed by buffer 4121 to provide the first data on data path 4141. The return clock signal on return clock signal path 442 may be delayed by buffer 444 to provide the return clock signal on return clock signal path 446.

The return clock signal on return clock signal path 442 may be routed along with the second data on data path 4102 from second sensing device 4022 to first sensing device 4021, where the return clock signal on return clock signal path 442 may then be routed along with both the second data on data path 4102 and the first data on data path 4101 such that the return clock signal, the second data, and the first data are subjected to substantially the same delay (e.g., the same delay) due to the routing and PVT variations. The delay of buffers 4122, 4121, and 444 may be adjusted to improve the alignment of the return clock signal with the first data and the second data. The return clock signal at the ENT input of FIFO 416 triggers the latching of the data at the input of FIFO 416 (i.e., DOUT_1 and DOUT_2) into FIFO 416. The clock signal on clock signal path 428 clocks data out of FIFO 416 to DQ(s) 420.

FIG. 6 is a timing diagram 450 illustrating one embodiment of the data signals and the return clock signal of output data path 400 described with reference to FIG. 5. Timing diagram 450 includes the return clock signal (CLK_RTN) on return clock signal path 442, first data (DOUT_1) on data path 4101, and second data (DOUT_2) on signal path 4102. As indicted in FIG. 6, the skew indicated by 452 may be mitigated or effectively eliminated between the data signals and the return clock signal due to triggering output latches 4041 and 4042 in response to the return clock signal from second sensing device 4022, which has the longest delay.

FIG. 7 is a timing diagram 460 illustrating one embodiment of the triggering of data out of a sense amplifier of output data path 400 described with reference to FIG. 5. Timing diagram 460 illustrates the data at a sense amplifier, such as sense amplifier 4061 or 4062, and the clock signal at the sense amplifier. As indicated at 462, the rising edge of the clock signal may trigger the data out of the sense amplifier to provide the data to an output latch, such as output latch 4041 or 4042, respectively.

FIG. 8 is a timing diagram 466 illustrating one embodiment of the latching of data into FIFO 416 of output data path 400 described with reference to FIG. 5. Timing diagram 466 illustrates the data at the input of FIFO 416, the return clock signal at the ENT input of FIFO 416, and the data latched in FIFO 416. The setup and hold time margin for the data at the data input of FIFO 416 is indicated at 468. As indicated at 470, the falling edge of the return clock signal may latch the data into FIFO 416. By using the falling edge of the return clock signal to latch the data into FIFO 416, the maximum setup and hold time indicated at 468 may be inherently provided since the falling edge of the return clock signal may be automatically located at the center of the data eye opening. Thus, any timing window loss at the FIFO input due to the variation of the rising edge shift delay may be mitigated or eliminated.

FIG. 9 is a flow diagram illustrating one embodiment of a method 500 for processing data through a wave pipeline. At 502, method 500 includes processing data in response to a clock signal through a plurality of data paths having different delays. At 504, method 500 includes providing a return clock signal based on the clock signal and the data path of the plurality of the data paths having a delay longer than the delay of the data path of each of the other data paths of the plurality of data paths. At 506, method 500 includes synchronizing the data on the plurality of data paths in response to the return clock signal. In one example, synchronizing the data on the plurality of data paths includes outputting data from a data stage of each of the plurality of data paths in response to the return clock signal. In another example, synchronizing the data on the plurality of data paths includes outputting data from the data stage of each of the plurality of data paths in order from the data path having a maximum delay to the data path having a minimum delay. Method 500 may further include latching the data on the plurality of data paths into a data latch in response to the return clock signal.

FIG. 10 is a flow diagram illustrating one embodiment of a method 520 for reading data from an array of memory cells. At 522, method 520 includes sensing first data from the array of memory cells via a first sensing device of a first data path in response to a clock signal, the first data path having a first length. At 524, method 520 includes sensing second data from the array of memory cells via a second sensing device of a second data path in response to the clock signal, the second data path having a second length greater than the first length. At 526, method 520 includes providing a return clock signal from the second sensing device. At 528, method 520 includes triggering the first data out of the first sensing device in response to the return clock signal such that the first data is aligned with the return clock signal. At 520, method 520 includes triggering the second data out of the second sensing device in response to the return clock signal such that the second data is aligned with the return clock signal.

Method 520 may further include latching the first data output from the first sensing device and the second data output from the second sensing device into a data latch in response to a falling edge of the return clock signal. In addition, method 520 may include triggering the data out of the data latch onto a data node in response to the clock signal. Further, method 520 may include generating the clock signal in response to a read enable signal. Method 520 may also include generating an address signal for the first sensing device and the second sensing device in response to the clock signal. In another example, method 520 includes buffering the address signal and buffering the clock signal such that the buffered clock signal is aligned with the buffered address signal. In yet another example, method 520 further includes buffering the first data output from the first sensing device, buffering the second data output from the second sensing device, and buffering the return clock signal such that the buffered return clock signal is aligned with the buffered first data and the buffered second data.

CONCLUSION

Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement that is calculated to achieve the same purpose may be substituted for the specific embodiments shown. Many adaptations of the embodiments will be apparent to those of ordinary skill in the art. Accordingly, this application is intended to cover any adaptations or variations of the embodiments.

Claims

1. A wave pipeline comprising:

a plurality of data paths each comprising an input node, an output node, and a data stage between the input node and the output node, each data path of the plurality of data paths having a different delay between the input node and the output node, and a first data path of the plurality of data paths having a first delay and each of the other data paths of the plurality of data paths having a delay less than the first delay;
a clock signal path to provide a clock signal to the data stage of each data path of the plurality of data paths; and
a single return clock signal path to provide a single return clock signal from the data stage of the first data path of the plurality of data paths, the single return clock signal to trigger data out of the data stage of each data path of the plurality of data paths.

2. The wave pipeline of claim 1, wherein the first delay is a maximum delay of the plurality of data paths, and

wherein the single return clock signal triggers data out of the data stage of each data path of the plurality of data paths in order from the first data path having the maximum delay of the plurality of data paths to the data path having a minimum delay of the plurality of data paths.

3. The wave pipeline of claim 1, further comprising:

a data latch to latch the data output from each of the plurality of data paths into the data latch in response to the single return clock signal on the single return clock signal path.

4. The wave pipeline of claim 3, wherein the single return clock signal is aligned with the data at the output of each of the plurality of data paths.

5. The wave pipeline of claim 3, wherein the data latch outputs data to a data node in response to the clock signal on the clock signal path.

6. The wave pipeline of claim 1, wherein a delay of each data stage of the plurality of data paths are equal.

7. The wave pipeline of claim 1, wherein each of the plurality of data paths have a different length.

8. A system comprising:

a clock signal path to provide a clock signal;
a first data path comprising a first sensing device to sense first data from an array of memory cells in response to the clock signal, the first data path having a first delay;
a second data path comprising a second sensing device to sense second data from the array of memory cells in response to the clock signal, the second data path having a second delay greater than the first delay; and
a single return clock signal path coupled to the clock signal path at the second sensing device to provide a single return clock signal,
wherein the single return clock signal triggers the second data out of the second sensing device and the first data out of the first sensing device such that the first data on the first data path is aligned with the second data on the second data path.

9. The system of claim 8, wherein the single return clock signal is aligned with the first data on the first data path and the second data on the second data path.

10. The system of claim 8, further comprising:

a data latch to latch the first data on the first data path and the second data on the second data path into the data latch in response to the single return clock signal on the single return clock signal path.

11. The system of claim 8, further comprising:

a clock generator to generate the clock signal.

12. The system of claim 8, further comprising:

an address counter to generate an address signal for the first sensing device and the second sensing device.

13. A memory comprising:

an array of memory cells;
a clock signal path to provide a clock signal;
a first sensing device of a first data path to sense first data from the array of memory cells in response to the clock signal, the first data path having a first length;
a second sensing device of a second data path to sense second data from the array of memory cells in response to the clock signal, the second data path having a second length longer than the first length;
a single return clock signal path to provide a single return clock signal from the second sensing device;
a first output latch to output the first data from the first sensing device in response to the single return clock signal such that the first data is aligned with the single return clock signal; and
a second output latch to output the second data from the second sensing device in response to the single return clock signal such that the second data is aligned with the single return clock signal.

14. The memory of claim 13, further comprising:

a data latch to latch the first data output from the first output latch and the second data output from the second output latch into the data latch in response to a falling edge of the single return clock signal.

15. The memory of claim 14, wherein the data latch outputs the first data and the second data to data nodes in response to a rising edge of the clock signal.

16. The memory of claim 13, further comprising:

a clock generator to receive a read enable signal and generate the clock signal based on the read enable signal.

17. The memory of claim 13, further comprising:

an address counter to generate an address signal for the first sensing device and the second sensing device in response to the clock signal.

18. The memory of claim 17, further comprising:

a first buffer to buffer the clock signal; and
a second buffer to buffer the address signal such that the buffered address signal is aligned with the buffered clock signal.

19. The memory of claim 13, further comprising:

a first buffer to buffer the first data output from the first output latch;
a second buffer to buffer the second data output from the second output latch; and
a third buffer to buffer the single return clock signal such that the buffered single return clock signal is aligned with the buffered first data and the buffered second data.

20. A method for processing data through a wave pipeline, the method comprising:

processing data in response to a clock signal through a plurality of data paths having different delays;
providing a single return clock signal based on the clock signal and the data path of the plurality of the data paths having a delay longer than the delay of the data path of each of the other data paths of the plurality of data paths; and
synchronizing the data on the plurality of data paths in response to the single return clock signal.

21. The method of claim 20, further comprising:

latching the data on the plurality of data paths into a data latch in response to the single return clock signal.

22. The method of claim 20, wherein synchronizing the data on the plurality of data paths comprises outputting data from a data stage of each of the plurality of data paths in response to the single return clock signal.

23. The method of claim 22, wherein synchronizing the data on the plurality of data paths comprises outputting data from the data stage of each of the plurality of data paths in order from the data path having a maximum delay to the data path having a minimum delay.

24. A method for reading data from an array of memory cells, the method comprising:

sensing first data from the array of memory cells via a first sensing device of a first data path in response to a clock signal, the first data path having a first length;
sensing second data from the array of memory cells via a second sensing device of a second data path in response to the clock signal, the second data path having a second length greater than the first length;
providing a single return clock signal from the second sensing device;
triggering the first data out of the first sensing device in response to the single return clock signal such that the first data is aligned with the single return clock signal; and
triggering the second data out of the second sensing device in response to the single return clock signal such that the second data is aligned with the single return clock signal.

25. The method of claim 24, further comprising:

latching the first data output from the first sensing device and the second data output from the second sensing device into a data latch in response to a falling edge of the single return clock signal.

26. The method of claim 25, further comprising:

triggering the data out of the data latch onto a data node in response to the clock signal.

27. The method of claim 24, further comprising:

generating the clock signal in response to a read enable signal.

28. The method of claim 24, further comprising:

generating an address signal for the first sensing device and the second sensing device in response to the clock signal.

29. The method of claim 28, further comprising:

buffering the address signal; and
buffering the clock signal such that the buffered clock signal is aligned with the buffered address signal.

30. The method of claim 24, further comprising:

buffering the first data output from the first sensing device;
buffering the second data output from the second sensing device; and
buffering the single return clock signal such that the buffered single return clock signal is aligned with the buffered first data and the buffered second data.
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Patent History
Patent number: 10410698
Type: Grant
Filed: Dec 7, 2017
Date of Patent: Sep 10, 2019
Patent Publication Number: 20190180802
Assignee: Micron Technology, Inc. (Boise, ID)
Inventors: Kaveh Shakeri (Saratoga, CA), Ali Feiz Zarrin Ghalam (Sunnyvale, CA)
Primary Examiner: Vu A Le
Assistant Examiner: Sung Il Cho
Application Number: 15/834,315
Classifications
Current U.S. Class: Mutual (reciprocal) Synchronization (370/507)
International Classification: G11C 7/22 (20060101); G11C 7/10 (20060101); G11C 8/04 (20060101); G11C 8/18 (20060101); G11C 8/06 (20060101); G11C 16/04 (20060101);