METHOD OF PROVIDING AN ERASE ACTIVATION ENERGY OF A MEMORY DEVICE

Abstract

A write-once read-many times memory device is made up of first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The present method provides for the programmed memory device a second erase activation energy greater than the first erase activation energy.

Description

BACKGROUND OF THE INVENTION

1. Technical Field

This invention relates generally to memory devices, and more particularly, to a write-once read-many times memory.

2. Background Art

A write-once read-many times memory is a storage medium to which data can be written only a single time, but can be read a large number of times. Such a storage medium provides substantially longer “shelf life” than a magnetic storage medium, and thus is highly useful when data must be preserved for a long time. Typically, such a memory takes the form of an optical disk, for example, a compact disc on which data is permanently etched during the write process. In addition to long data retention, is desirable that the memory provides high density and low power usage, accompanied by fast write and read speeds.

While this form of write-once read-many times memory has proven advantageous, it will be understood that improvements in data density, power usage, and write and read speeds is constantly being sought.

FIG. 1 illustrates a programmable and erasable memory device 30. The memory device 30 includes a Cu electrode 32, a Cu₂S passive layer 34 on the electrode 32, a Cu₂O active layer 36 on the layer 34, and a Ti electrode 38 on the active layer 36. Initially, assuming that the memory device 30 is unprogrammed, in order to program the memory device 30, an increasingly negative voltage is applied to the electrode 38, while the electrode 32 is held at ground, so that an increasing electrical potential is applied across the memory device 30 from a higher to a lower potential in the direction from electrode 32 to electrode 38, until electrical potential V_pg (the electrical potential required to program the memory device 30) is reached (see FIG. 2, a plot of memory device current vs. electrical potential applied across the memory device 30). This potential V_pg is sufficient to cause copper ions to be attracted from the supertonic layer 34 toward the electrode 38 and into the active layer 36, causing the active layer 36 (and the overall memory device 30) to switch to a low-resistance or conductive state (A). Upon removal of such potential (B), the copper ions drawn into the active layer 36 during the programming step remain therein, so that the active layer 36 (and memory device 30) remain in a conductive or low-resistance state, as indicated by the resistance characteristic (B).

In order to erase the prior art memory device (FIG. 2), an increasingly positive voltage is applied to the electrode 38, while the electrode 32 is held at ground, so that an increasing electrical potential is applied until electrical potential V_er (the “erase” electrical potential) is applied across the memory device 30 from a higher to a lower electrical potential in the reverse direction. With bonding between the copper ions and the active layer not being strong, this potential V_er is sufficient to cause copper ions to be repelled from the active layer 36 toward the electrode 32 and into the superionic layer 34 (C), in turn causing the active layer 36 (and the overall memory device 30) to be in a high-resistance or substantially non-conductive state. This state remains upon removal of such potential from the memory device 30.

FIG. 2 also illustrates the read step of the memory device 30 in its programmed (conductive) state and in its erased (nonconductive) state. An electrical potential V_r(the “read” electrical potential) is applied across the memory device 30 from a higher to a lower electrical potential in the same direction as the electrical potential V_pg. This electrical potential is less than the electrical potential V_pg applied across the memory device 30 for programming (see above). In this situation, if the memory device 30 is programmed, the memory device 30 will readily conduct current (level L1), indicating that the memory device 30 is in its programmed state. If the memory device 30 is erased, the memory device 30 will not conduct current (level L2), indicating that the memory device 30 is in its erased state.

Reference is made to the paper THEORY OF COPPER VACANCY IN CUPROUS OXIDE by A. F. Wright and J. S. Nelson, Journal of Applied Physics, Volume 92, Number 10, pages 5849-5851, Nov. 15, 2002, which is hereby incorporated by reference. That paper describes the process of diffusion of copper ions through Cu₂O. In the diffusion process, typically involving a vacancy mechanism wherein atoms jump from a first (atom) state to a second (vacancy) state, atoms need energy to break bonds with neighbors and to provide necessary distortion of the material between the states. The above-cited paper indicates that the activation energy E_a for moving a copper ion from one state to the next in the Cu₂O is approximately 0.3 eV. FIG. 3, a graph illustrating this movement, shows movement (arrow F) from state 1 (unprogrammed) to state 2 (programmed). In such process, the activation energy is indicated by the arrow E_a1. FIG. 4 illustrates movement (arrow G) from state 2 (programmed) to state 1 (unprogrammed). In such process, the activation energy is indicated by the arrow E_a2. With the relatively low activation energy E_a2 required to move copper ions and from state 2 (programmed) to state 1 (unprogrammed), programmed data may be easily lost.

This type of memory device provides many advantages, in particular, very high density, low power requirements, and very fast read and write capabilities. However, the memory device 30 as described, being readily erased, is not intended to meet the specification of a write-once read-many times memory.

What is needed a memory device which includes the advantages of the memory device 30 described above, i.e., high density, low power usage, and high read and write speeds, meanwhile being a write-once read-many times memory.

DISCLOSURE OF THE INVENTION

Broadly stated, in the present method of undertaking an operation on a memory device, the memory device comprises first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrode. The memory device is programmed by providing a charged species from the passive layer into the active layer. The memory device may be programmed to have for the programmed memory device a first erase activation energy. The method comprises providing for the programmed memory device a second, increased erase activation energy.

The present invention is better understood upon consideration of the detailed description below, in conjunction with the accompanying drawings. As will become readily apparent to those skilled in the art from the following description, there are shown and described embodiments of this invention simply by way of the illustration of the best mode to carry out the invention. As will be realized, the invention is capable of other embodiments and its several details are capable of modifications and various obvious aspects, all without departing from the scope of the invention. Accordingly, the drawings and detailed description will be regarded as illustrative in nature and not as restrictive.

BRIEF DESCRIPTION OF THE DRAWINGS

The novel features believed characteristic of the invention are set forth in the appended claims. The invention itself, however, as well as said preferred mode of use, and further objects and advantages thereof, will best be understood by reference to the following detailed description of illustrative embodiments when read in conjunction with the accompanying drawings, wherein:

FIG. 1 is a cross-sectional view of a typical memory device;

FIG. 2 is a plot of current vs. voltage in the programming, erasing, and reading of the memory device of FIG. 1;

FIGS. 3 and 4 are graphs illustrating activation energy of the device of FIG. 1;

FIG. 5 is a cross-sectional view of the present memory device;

FIG. 6 is a graph illustrating the present method; and

FIG. 7 is a schematic illustration of a memory array incorporating the invention of FIG. 5.

BEST MODE(S) FOR CARRYING OUT THE INVENTION

Reference is now made in detail to specific embodiments of the present invention which illustrate the best mode presently contemplated by the inventors for practicing the invention.

FIG. 5 illustrates the present memory device 130, similar to the previously described memory device 30. As such, the memory device 130 includes a Cu electrode 132, a copper sulfide passive layer 134 (Cu_xS where 1.75<X<2) over and on the electrode 132, an active layer 136 over and on the passive layer 134, and a Ti electrode 138 over and on the active layer 136, so that the passive and active layers 134, 136 are between the electrodes 132, 138. The active layer 136 may be an inorganic dielectric material such Cu₂O, SiO₂, Ta₂O₅, WO₃, TiO₂, or SiON, an organic dielectric layer such as polyimide, poly(arylene ether), benzocyclobutene, and parylene-F, an organic low conductive semiconductor material such as poly(phenylene), poly(pyridine), poly(para-phenylene vinylene), polyacetylene, and polyprrole, and mixtures of any of these inorganic and organic materials.

In a first embodiment, in programming the present memory device 130, an increasingly negative voltage is applied to the electrode 138, while the electrode 132 is held at ground, so that an increasing electrical potential is applied across the memory device 130 from a higher to a lower potential in the direction from electrode 132 to electrode 138. However, rather than programming the memory device 130 with the electrical potential V_pg required to program the memory device as described above, the electrical potential so applied is increased to a level V_pg1 which is substantially greater than the electrical potential V_pg. This substantially increased electrical potential V_pg1 provides more rapid programming of the memory device 130 and is sufficient to cause strong chemical bonding and/or strong ionic bonding between the copper ions and the active layer. As previously described with regard to FIG. 4, and repeated in FIG. 6, the activation energy from the (prior art) state 2 energy level is indicated by the arrow E_a2 . However, in the present approach, with the strong bonding between the copper ions and active layer 136, or sufficient Cu to form a stable metal cluster as a conduction path, the activation energy from the state 2A energy level is greatly increased over the activation energy E_a2, as indicated by the arrow E_a3. This greatly increased activation energy in the erase direction greatly inhibits movement of copper ions within and through the active layer 136 from state 2A (programmed state) to state 1 (unprogrammed state) into the passive layer 134. Because of this greatly increased erase energy requirement, once the memory device 130 is programmed, the memory device 130 retains its programmed, conductive, low resistance state over a long period of time so that the programmed state of the memory device 130 can be read many times without loss of data Thus, the memory device 130 is rapidly programmed, and when so programmed, is in a very stable state that can be read many times over a long period of time.

In another embodiment, when programming the memory device 130, the temperature of the memory device 130 is raised to a level substantially above that of the ambient, for example room temperature by increasing current therethrough and/or increasing programming time. In this situation, when using the original electrical potential V_pg to program the memory device 130, the elevated temperature causes strong chemical bonding and/or strong ionic bonding between the copper ions and the active layer 136. Again, with the strong bonding between the copper ions and layer 136, the activation energy from the state 2A energy level is greatly increased when compared to the activation energy from state 2, as indicated by the arrow E_a3. This greatly increased activation energy in the erase direction greatly inhibits movement of copper ions within and through the active layer 136 from state 2A (programmed state) to state 1 (unprogrammed state) into the passive layer 134. Because of this greatly increased erase energy requirement, once the memory device 130 is programmed, the memory device 130 retains its programmed, conductive, low resistance state over a long period of time so that the programmed state of the memory device 130 can be read many times without loss of data. Thus, the memory device 130 is rapidly programmed, and when so programmed, is in a very stable state that can be read many times over a long period of time.

It will be understood that the methods described above, i.e., increased electric field and increased temperature (due to increased current), can be used simultaneously in combination, if so desired, increasing the efficiency of the method.

It will be understood that the memory device 130 can take different forms. For example, the passive layer can be silver sulfide (Ag_xS where X˜2), with Ag ions being the charged species involved, or a mixture of copper sulfide and silver sulfide.

FIG. 7 illustrates a memory cell array 40 which incorporates memory cells 30 of the type described above. As illustrated in FIG. 7, the memory cell array 40 includes a first plurality 42 of parallel conductors (bit lines) BL₀, BL₁, . . . BL_n, and a second plurality 44 of parallel conductors (word lines) WL₀, WL₁, . . . WL_n overlying and spaced from, orthogonal to, and crossing the first plurality of conductors 42. A plurality of memory cells 30 of the type described above are included, each associated with a select diode 50 having a (forward) threshold V_t and a (reverse) breakdown voltage V_b, to form a memory cell-diode structure. Each memory cell 30 is connected in series with a select diode 50 between a conductor BL of the first plurality 42 thereof and a conductor WL of the second plurality 44 thereof at the intersection of those conductors, with the diode 50 oriented in a forward direction from the conductor BL of the first plurality 42 thereof to the conductor WL of the second plurality 44 thereof. For example, as shown in FIG. 3, memory cell 30₀₀ and diode 50₀₀ in series connect conductor BL₀ of the first plurality of conductors 42 with conductor WL₀ of the second plurality of conductors 44 at the intersection of those conductors BL₀, WL₀, memory cell 30₁₀ and diode 50₁₀ in series connect conductor BL₁ of the first plurality of conductors 42 with conductor WL₀ of the second plurality of conductors 44 at the intersection of those conductors BL₁, WL₀, etc. (it will be understood that select transistors may be used in place of the select diodes 50). Individual memory cells 30 may be programmed and read by applying appropriate voltages to the associated bit lines and word lines.

It will be seen that herein is provided an approach wherein rapid programming of a memory device is achieved, meanwhile with it being insured that the programmed state of the memory device retains its programmed state in a highly stable manner, i.e., with minimal degradation. This results in a programmed memory device which can be read many times over a long period of time, adding to the operational efficiency of the memory structure made up of such memory devices.

The foregoing description of the embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Other modifications or variations are possible in light of the above teachings.

The embodiments were chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill of the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. All such modifications and variations are within the scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly, legally and equitably entitled.

Claims

1-27. (canceled)

28. A system comprising:

a processor and a memory for storing instructions, that when executed by the processor performs a method for an operation on a memory device comprising:

programming the memory device by providing a charged species from a passive layer of the memory device into an active layer of the memory device, wherein the memory device comprises first and second electrodes with the passive layer and the active each between the first and second electrodes, and wherein the programmed memory device is programmed for a first erase activation energy; and

providing for the programmed memory device a second erase activation energy greater than the first erase activation energy.

29. The system of claim 28, wherein providing the second erase activation energy greater than the first erase activation energy comprises applying an electrical potential to the memory device.

30. The system of claim 29, wherein the electrical potential applied to the memory device is sufficient to program the memory device.

31. The system of claim 30, wherein the active layer comprises inorganic material.

32. The system of claim 31, wherein the active layer comprises at least one of Cu2O, SiO2, Ta2O5, WO3, TiO2, and SiON, and mixtures thereof.

33. The system of claim 30, wherein the active layer comprises organic material.

34. The system of claim 33, wherein the active layer comprises at least one of polyimide, poly(arylene ether), benzocyclobutene, and parylene-F, and mixtures thereof.

35. The system of claim 30, wherein the active layer comprises low conductive semiconductor material.

36. The system of claim 35, wherein the active layer comprises at least one of poly(phenylene), poly(pyridine), poly(paraphenylene vinylene), polyacetylene, and polyrrole, and mixtures thereof.

37. The system of claim 30, wherein the active layer comprises at least one of Cu2O, SiO2, Ta2O5, WO3, TiO2, SiON, polyimide, poly(arylene ether), benzocyclobutene, parylene-F, poly(phenylene), poly(pyridine), poly(para-phenylene vinylene), polyacetylene, and polyprrole, and mixtures thereof.

38. The system of claim 30, wherein the passive layer comprises at least one of copper sulfide and silver sulfide and mixtures thereof.

39. The system of claim 28, wherein providing for the programmed memory device the second erase activation energy greater than the first erase activation energy comprises providing that the temperature of the memory device is sufficient to provide that the second erase activation energy is greater than the first erase activation energy.

40. The system of claim 39, wherein providing that the temperature of the memory device is sufficient to provide that the second erase activation energy is greater than the first erase activation energy comprises providing current through the memory device.

41. The system of claim 39, wherein providing that the temperature of the memory device is sufficient to provide that the second erase activation energy is greater than the first erase activation energy comprises providing a programming time sufficient to provide that the second erase activation energy is greater than the first erase activation energy of the memory device.

42. The system of claim 39 and further comprising programming the memory device while providing that the temperature of the memory device is sufficient to provide that the second erase activation energy is greater than the first erase activation energy.

43. The system of claim 39, wherein the active layer comprises inorganic material.

44. The system of claim 43, wherein the active layer comprises at least one of Cu2O, SiO2, Ta2O5, WO3, TiO2, SiON, and mixtures thereof.

45. The system of claim 39, wherein the active layer comprises organic material.

46. The system of claim 45, wherein the active layer comprises at least one of polyimide, poly(arylene ether), benzocyclobutene, and parylene-F, and mixtures thereof.

47. The method of claim 39, wherein the active layer comprises low conductive semiconductor material.

48. The method of claim 47, wherein the active layer comprises at least one of poly(phenylene), poly(pyridine), poly(paraphenylene vinylene), polyacetylene, and polyrrole, and mixtures thereof.

49. The system of claim 39, wherein the active layer comprises at least one of Cu2O, SiO2, Ta2O5, WO3, TiO2, SiON, polyimide, poly(arylene ether), benzocyclobutene, parylene-F, poly(phenylene), poly(pyridine), poly(para-phenylene vinylene), polyacetylene, and polyprrole, and mixtures thereof.

50. The system of claim 39, wherein the passive layer comprises at least one of copper sulfide and silver sulfide and mixtures thereof.

51. The system of claim 39, wherein providing for the programmed memory device a second erase activation energy greater than the first erase activation energy further comprises applying an electrical potential to the memory device.

52. The system of claim 51, wherein the electrical potential applied to the memory device is sufficient to program the memory device.

53. A write-once read-many times memory comprising first and second electrodes, a passive layer between the first and second electrodes, and an active layer between the first and second electrodes.