MULTICHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
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This application is a Continuation-In-Part of pending U.S. patent application Ser. No. 12/557,462, filed on Sep. 10, 2009, and entitled “LED PACKAGE STRUCTURE FOR FORMING A STUFFED CONVEX LENS TO ADJUST LIGHT-PROJECTING ANGLE AND METHOD FOR MANUFACTURING THE SAME”, which claims priority of Taiwan Patent Application No. 098122751, filed on Jul. 6, 2009, the entirety of which is incorporated by reference herein.
BACKGROUND OF THE INVENTION1. Field of the Invention
The instant disclosure relates to a multichip package structure and a method of manufacturing the same, in particular, to a multichip package structure for forming a stuffed convex lens to adjust the light-projecting angle thereof and a method for manufacturing the same.
2. Description of Related Art
The invention of the lamp greatly changed the style of building construction and the living style of human beings, allowing people to work during the night. Without the invention of the lamp, we may stay in the living conditions of ancient civilizations.
The LED lamp has a plurality of LED chips and a white frame surrounding the LED chips for increasing the light-emitting efficiency of the LED lamp. However, the white frame is manufactured by a prefabricated frame mold, thus the manufacturing cost is increased. In addition, when the shape of the white frame needs to be changed, the frame mold also needs to be changed according to the new shape of the white frame, thus the shape of the frame mold follows the shape of the white frame. Hence, when a new white frame is created for a new product, a new frame mold needs to be developed.
SUMMARY OF THE INVENTIONOne aspect of the instant disclosure relates to a multichip package structure and a method of manufacturing the same. The multichip package structure includes a semidrying surrounding light-reflecting frame formed without using any frame mold.
One of the embodiments of the instant disclosure provides a multichip package structure, comprising: a substrate unit, a light-emitting unit, a frame unit and a package unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of light-emitting chips disposed on the substrate body and electrically connected to the substrate body. The frame unit includes a semidrying surrounding light-reflecting frame surroundingly disposed on the substrate body, wherein the light-emitting chips are surrounded by the semidrying surrounding light-reflecting frame, and the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body. The package unit includes a package colloid body disposed on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
Another one of the embodiments of the instant disclosure provides a method of manufacturing a multichip package structure, comprising the steps of: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body. Furthermore, after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame.
Yet another one of the embodiments of the instant disclosure provides a method of manufacturing a multichip package structure, comprising the steps of: providing a substrate body; surroundingly forming surrounding liquid colloid on the substrate body; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body and surrounded by the semidrying surrounding light-reflecting frame; and then forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body. Furthermore, after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame.
Moreover, the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof. The semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same. The semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid. The substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads. The positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads.
Therefore, the semidrying surrounding light-reflecting frame can be formed on the substrate body without using any frame mold in the instant disclosure.
To further understand the techniques, means and effects of the instant disclosure applied for achieving the prescribed objectives, the following detailed descriptions and appended drawings are hereby referred, such that, through which, the purposes, features and aspects of the instant disclosure can be thoroughly and concretely appreciated. However, the appended drawings are provided solely for reference and illustration, without any intention to limit the instant disclosure.
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In conclusion, when the position of the package colloid body 40 can be limited in the colloid position limiting space 300 by using the dried surrounding light-reflecting frame 30, the usage quantity of the package colloid body 40 can be controlled by the designer. In addition, the surface shape and the height of the package colloid body 40 can be adjusted by control the usage quantity of the package colloid body 40, thus light-projecting angle of the white light beams L2 can be adjusted by different surface shapes and heights of the package colloid body 40. Moreover, the blue light beams L1 generated by the light-emitting chips 20 can be reflected by an inner wall of the dried surrounding light-reflecting frame 30 in order to increase the light-emitting efficiency of the multichip package structure of the instant disclosure. In other words, the position of the package colloid body 40 such as the phosphor resin body can be limited inside the colloid position limiting space 300 by using the dried surrounding light-reflecting frame 30, and the shape of the package colloid body 40 can be adjusted by using the dried surrounding light-reflecting frame 30, thus the light-emitting efficiency and the light-projecting angle of the multichip package structure of the instant disclosure can be increased.
Second EmbodimentReferring to
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Referring to FIGS. 11 and 11A-14B, the detail descriptions of the third embodiment of the instant disclosure are shown as follows:
Referring to FIGS. 11 and 11A-11B (
However, the above-mentioned definition of the substrate body 10a does not limit the instant disclosure. Any types of substrate can be applied to the instant disclosure. For example, the substrate body 10a can be a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.
Referring to FIGS. 11 and 12A-12B (
Referring to FIGS. 11 and 13A-13B (
Moreover, the annular reflecting resin body 30a has an arc shape formed on a top surface thereof. The annular reflecting resin body 30a has a radius tangent T, and the angle θ of the radius tangent T relative to the top surface of the substrate body 10a is between 40° and 50°. The maximum height H of the annular reflecting resin body 30a relative to the top surface of the substrate body 10a is between 0.3 mm and 0.7 mm, and the width of a bottom side of the annular reflecting resin body 30a is between 1.5 mm and 3 mm. The thixotropic index of the annular reflecting resin body 30a is between 4 and 6. In addition, the resin position limiting space 300a has a cross section that can be a circular shape, an elliptical shape or a polygonal shape (such as a square or a rectangular shape etc). In the third embodiment, the cross section of the resin position limiting space 300a is a circular shape.
Referring to FIGS. 11 and 13A-13B (
Referring to FIGS. 11 and 14A-14B (
Moreover, the viscosity of the convex package resin body 40a can be 900±200 cps (centipoises). The resin position limiting space 300a can be a circular form, a square or any shape. For example, when the resin position limiting space 300a is a circular form, the predetermined proportion of the weight of the convex package resin body and the plane area of the resin position limiting space is 0.5±0.05 g:572±0.5 mm2 or 1.5±0.05 g:1320±0.5 mm2. When the resin position limiting space 300a is a square, the predetermined proportion of the weight of the convex package resin body and the plane area of the resin position limiting space is 0.5±0.05 g:800±0.5 mm2.
In the third embodiment, each LED chip 20a can be a blue LED chip, and the convex package resin body 40a can be a phosphor body. Hence, blue light beams L1 generated by the LED chips 20a (the blue LED chips) can pass through the convex package resin body 40a (the phosphor body) to generate white light beams L2 that are similar to the light source generate by sun lamp.
In other words, the convex package resin body 40a is limited in the resin position limiting space 300a by using the annular reflecting resin body 30a in order to control the usage quantity of the convex package resin body 40a. In addition, the surface shape and the height of the convex package resin body 40a can be adjusted by control the usage quantity of the convex package resin body 40a in order to light-projecting angles of the white light beams L2. Moreover, the blue light beams L1 generated by the LED chips 20a can be reflected by an inner wall of the annular reflecting resin body 30a in order to increase the light-emitting efficiency of the LED package structure of the instant disclosure.
Fourth EmbodimentReferring to
Referring to FIGS. 15 and 15A-15C, the detail descriptions of the fourth embodiment of the instant disclosure are shown as follows:
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Moreover, the annular reflecting resin body 30b has an arc shape formed on a top surface thereof. The annular reflecting resin body 30b has a radius tangent T, and the angle θ of the radius tangent T relative to the top surface of the substrate body 10b is between 40° and 50°. The maximum height H of the annular reflecting resin body 30b relative to the top surface of the substrate body 10b is between 0.3 mm and 0.7 mm, and the width of a bottom side of the annular reflecting resin body 30b is between 1.5 mm and 3 mm. The thixotropic index of the annular reflecting resin body 30b is between 4 and 6. In addition, the resin position limiting space 300b has a cross section that can be a circular shape, an elliptical shape or a polygonal shape (such as a square or a rectangular shape etc).
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Of course, the steps of 5406 and 5408 can be reverse. In other words, firstly, the LED chips 20b can be electrically disposed on the chip-placing area 11b of the substrate unit 1b, and next the inner surface of the annular reflecting resin body 30b is cleaned to form a clean surface S by plasma.
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Moreover, the viscosity of the convex package resin body 40a can be 900±200 cps (centipoises). The resin position limiting space 300a can be a circular form, a square or any shape. For example, when the resin position limiting space 300a is a circular form, the predetermined proportion of the weight of the convex package resin body and the plane area of the resin position limiting space is 0.5±0.05 g:572±0.5 mm2 or 1.5±0.05 g:1320±0.5 mm2. When the resin position limiting space 300a is a square, the predetermined proportion of the weight of the convex package resin body and the plane area of the resin position limiting space is 0.5±0.05 g:800±0.5 mm2.
In the fourth embodiment, each LED chip 20b can be a blue LED chip, and the convex package resin body 40b can be a phosphor body. Hence, blue light beams L1 generated by the LED chips 20b (the blue LED chips) can pass through the convex package resin body 40b (the phosphor body) to generate white light beams L2 that are similar to the light source generate by sun lamp.
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The substrate unit (1a, 1b) has a substrate body (10a, 10b) and a chip-placing area (11a, 11b) disposed on a top surface of the substrate body (10a, 10b). The light-emitting unit (2a, 2b) has a plurality of LED chips (20a, 20b) electrically disposed on the chip-placing area (11a, 11b).
Moreover, the light-reflecting unit (3a, 3b) has an annular reflecting resin body (30a, 30b) surroundingly formed on the top surface of the substrate body (10a, 10b) by coating. The annular reflecting resin body (30a, 30b) surrounds the LED chips (20a, 20b) that are disposed on the chip-placing area (11a, 11b) to form a resin position limiting space (300a, 300b) above the chip-placing area (11a, 11b), and the annular reflecting resin body (3a, 3b) has an inner surface that has been cleaned by plasma to form a clean surface S.
In addition, the convex package unit (4a, 4b) has a convex package resin body (40a, 40b) disposed on the top surface of the substrate body (10a, 10b) in order to cover the LED chips (20a, 20b). In addition, the convex package resin body (40a, 40b) is filled into the resin position limiting space (300a, 300b), the convex package resin body (40a, 40b) has a peripheral surface tightly touched the clean surface S of the annular reflecting resin body (30a, 30b), the position and the volume of the convex package resin body (40a, 40b) is limited in the resin position limiting space (300a, 300b), and the weight of the convex package resin body (40a, 40b) and the plane area of the resin position limiting space (300a, 300b) show a predetermined proportion.
Furthermore, the substrate unit (1a, 1b) and the light-reflecting unit (3a, 3b) can be combined to form a LED package structure for forming a stuffed convex lens to adjust light-projecting angle. In other words, any types of light-emitting elements can be applied to the LED package structure.
Fifth EmbodimentReferring to
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In conclusion, the semidrying surrounding light-reflecting frame 30′ can be formed on the substrate body 10 without using any frame mold in the instant disclosure. Moreover, the instant disclosure can form an annular reflecting resin body (an annular white resin body) with any shapes by coating method. In addition, the position of a convex package resin body such as phosphor resin can be limited in the resin position limiting space by using the annular reflecting resin body, and the shape of the convex package resin body can be adjusted by using the annular reflecting resin body. Therefore, the instant disclosure can apply to increase light-emitting efficiency of LED chips and control light-projecting angle of LED chips.
In other words, the convex package resin body is limited in the resin position limiting space by using the annular reflecting resin body in order to control the usage quantity of the convex package resin body. In addition, the surface shape and the height of the convex package resin body can be adjusted by control the usage quantity of the convex package resin body in order to light-projecting angles of the white light beams. Moreover, the blue light beams generated by the LED chips can be reflected by an inner wall of the annular reflecting resin body in order to increase the light-emitting efficiency of the LED package structure of the instant disclosure.
Moreover, the inner surface of the annular reflecting resin body is cleaned by plasma to form a clean surface, so that the peripheral surface can be tightly touched the clean surface of the annular reflecting resin body. In addition, the weight of the convex package resin body (40a, 40b) and the plane area of the resin position limiting space (300a, 300b) show a predetermined proportion.
The above-mentioned descriptions merely represent the preferred embodiments of the instant disclosure, without any intention or ability to limit the scope of the instant disclosure which is fully described only within the following claims. Various equivalent changes, alterations or modifications based on the claims of instant disclosure are all, consequently, viewed as being embraced by the scope of the instant disclosure.
Claims
1. A multichip package structure, comprising:
- a substrate unit including a substrate body;
- a light-emitting unit including a plurality of light-emitting chips disposed on the substrate body and electrically connected to the substrate body;
- a frame unit including a semidrying surrounding light-reflecting frame surroundingly disposed on the substrate body, wherein the light-emitting chips are surrounded by the semidrying surrounding light-reflecting frame, and the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and
- a package unit including a package colloid body disposed on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
2. The multichip package structure of claim 1, wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof.
3. The multichip package structure of claim 1, wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same.
4. The multichip package structure of claim 1, wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.
5. The multichip package structure of claim 1, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads.
6. The multichip package structure of claim 5, wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads.
7. A method of manufacturing a multichip package structure, comprising the steps of:
- providing a substrate body;
- placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body;
- surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips;
- naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and
- forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
8. The method of claim 7, wherein after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame.
9. The method of claim 7, wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof.
10. The method of claim 7, wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same.
11. The method of claim 7, wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.
12. The method of claim 7, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads.
13. The method of claim 12, wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads.
14. A method of manufacturing a multichip package structure, comprising the steps of:
- providing a substrate body;
- surroundingly forming surrounding liquid colloid on the substrate body;
- naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, wherein the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body;
- placing a plurality of light-emitting chips on the substrate body, wherein the light-emitting chips are electrically connected to the substrate body and surrounded by the semidrying surrounding light-reflecting frame; and
- forming a package colloid body on the substrate body to cover the light-emitting chips, wherein the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
15. The method of claim 14, wherein after the step of forming the package colloid body, the method further comprises: solidifying the semidrying surrounding light-reflecting frame by natural drying at the predetermined room temperature or curing at a predetermined curing temperature to form a dried surrounding light-reflecting frame.
16. The method of claim 14, wherein the semidrying surrounding light-reflecting frame has a convex junction portion or a concave junction portion formed on the top surface thereof.
17. The method of claim 14, wherein the semidrying surrounding light-reflecting frame is extended from an initial point to a terminal point, and the position of the initial point and the position of the terminal point are substantially the same.
18. The method of claim 14, wherein the semidrying surrounding light-reflecting frame has an arc shape formed on the top surface thereof, the semidrying surrounding light-reflecting frame has a radius tangent and the angle of the radius tangent relative to the top surface of the substrate body is between 40° and 50°, the maximum height of the semidrying surrounding light-reflecting frame relative to the top surface of the substrate body is between 0.3 mm and 0.7 mm, the width of the bottom side of the semidrying surrounding light-reflecting frame is between 1.5 mm and 3 mm, the thixotropic index of the semidrying surrounding light-reflecting frame is between 4 and 6, and the semidrying surrounding light-reflecting frame is formed by mixing inorganic additive with white thermohardening colloid.
19. The method of claim 14, wherein the substrate unit includes a plurality of positive pads disposed on the top surface of the substrate body and a plurality of negative pads disposed on the top surface of the substrate body, wherein each light-emitting chip has a positive electrode and a negative electrode, the positive electrode of each light-emitting chip corresponds to at least two of the positive pads, and the negative electrode of each light-emitting chip corresponds to at least two of the negative pads.
20. The method of claim 19, wherein the positive electrode of each light-emitting chip is electrically connected to one of the two corresponding positive pads, and the negative electrode of each light-emitting chip is electrically connected to one of the two corresponding negative pads.
Type: Application
Filed: Oct 3, 2012
Publication Date: Jan 31, 2013
Applicant: PARAGON SEMICONDUCTOR LIGHTING TECHNOLOGY CO., LTD. (New Taipei City)
Inventor: PARAGON SEMICONDUCTOR LIGHTING TECHN (New Taipei City)
Application Number: 13/633,877
International Classification: H01L 33/60 (20100101); H01L 33/52 (20100101);