Abstract: A display device and a method of manufacturing the same are provided. The display device comprises a first area which extends in a first direction, a second area which extends in the first direction and is alongside the first area in a second direction intersecting the first direction, at least one first light emitting element in the first area, at least one second light emitting element in the second area, at least one first wiring coupled to an end of the first light emitting element in the first area and that extends in the first direction and at least one second wiring coupled to an end of the second light emitting element in the second area and that extends in the first direction, wherein the first wiring and the second wiring are electrically isolated from each other.

Abstract: An optoelectronic device includes a substrate and wire-shaped light-emitting diodes the wire shape of which is elongate along a longitudinal axis. Each light-emitting diode has a doped first region including, over all or some of its height measured along the longitudinal axis, of a central first segment that is substantially elongate along the longitudinal axis, this segment being based on gallium nitride, and of an external second segment, this segment being based on aluminium and gallium nitride. The second segment includes an external first portion arranged laterally around the first segment (121), all or some of the first portion having a first average atomic concentration of aluminium, and of a lower second portion arranged at least between the first portion of the second segment and the substrate, the second portion having a second average atomic concentration of aluminium being electrically insulating.

Abstract: Disclosed in an embodiment are a semiconductor device and a light-emitting device package including same, the semiconductor device comprising: a substrate; a plurality of semiconductor structures arranged in a matrix shape in the central area of the substrate; passivation layers arranged on upper surfaces and lateral surfaces of the semiconductor structures and on the edge area of the substrate; a plurality of first wiring lines which are arranged at lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include first end parts extending from the central area to the edge area of the substrate; a plurality of second wiring lines which are arranged at the lower parts of the plurality of semiconductor structures and electrically connected thereto, and which include second end parts extending from the central area to the edge area of the substrate; a plurality of first pads penetrating the passivation layer so as to be connected to the plurality of first end parts;

Abstract: Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate. The packaging substrate includes an embedded metal inlay, vias in the packaging substrate and contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the vias. The method also includes forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a stop surface of the packaging substrate using a plurality of conductive connectors.

Abstract: Disclosed is a method for preparing a nitride light emitting diode (LED) and nondestructive interface separation. A two-dimensional atomic crystal layer on a transparent substrate is modified by using an atomic irradiation technology, to obtain an irradiated region; a nitride LED structure is prepared on a modified two-dimensional atomic crystal layer, and a support substrate is cured by means of a metal functional layer; visible laser is incident from a back surface of the transparent substrate to directionally destruct the irradiated region of the two-dimensional atomic crystal layer, so as to obtain a whole structure of the nitride LED structure, the metal functional layer and the support substrate that are separated from the transparent substrate. The present disclosure can nondestructively separate the interface and repeatedly use the transparent substrate.

Abstract: A display panel and a display device are described. In an embodiment, the display panel includes a first through-hole, a second through-hole, and a third through-hole that are provided in a display region. In an embodiment, a first non-display region surrounds the first through-hole and the second through-hole, and a second non-display region surrounds the third through-hole. In an embodiment, a minimum distance between the first through-hole and the second through-hole in a first direction is smaller than a minimum distance between the second through-hole and the third through-hole in the first direction. In an embodiment, the display region has a symmetry axis extending along a second direction. In an embodiment, the symmetry axis overlaps with the second through-hole, or is located between the second through-hole and the third through-hole. Thus, the overall symmetry of the display region is improved.

Abstract: A window member including a base substrate and a light shielding layer including a first light shielding pattern disposed in a first area of the base substrate and a second light shielding pattern disposed in a second area of the base substrate while being spaced apart from the first light shielding pattern and providing a signal transmission area at an inner side thereof. The second light shielding pattern includes an edge having a plurality of curved portions on a plane. This arrangement reduces an area of the light shielding pattern adjacent to the signal transmission area of the window member.

Abstract: A display panel having a pixel region includes a base substrate, a plurality of pixel circuits located in the pixel region, and a plurality of light-emitting structures located in the pixel region. Each pixel circuit includes a storage capacitor and a plurality of transistors. The light-emitting structures are configured to emit light of at least three primary colors. Each light-emitting structure includes a light-emitting device. Each pixel circuit is coupled to the light-emitting device in a corresponding light-emitting structure, and a surface of the light-emitting device proximate to the base substrate is a light exit surface. Among the light-emitting structures, an orthogonal projection of an effective light-emitting region, on the base substrate, of the light-emitting device in a first light-emitting structure with a shortest light-emitting wavelength, is spaced apart from orthogonal projections of all storage capacitors of the plurality of pixel circuits on the base substrate.

Abstract: A method for manufacturing a display panel (10), the display panel (10), and a display apparatus (20) are provided. The method includes the following. A first substrate (110) and a second substrate (120) are provided, where the first substrate (110) includes a growth substrate (111), an epitaxial structure (112), and a first metal layer (113) that are sequentially stacked, and the second substrate (120) includes a circuit substrate (121) and a second metal layer (122) stacked on the circuit substrate (121). An activation treatment is performed on the first metal layer (113) and the second metal layer (122). The first metal layer (113) and the second metal layer (122) are bonded after the activation treatment, to cause the growth substrate (111), the epitaxial structure (112), the first metal layer (113), the second metal layer (122), and the circuit substrate (121) sequentially stacked. The growth substrate (111) is lift off.

Abstract: A display device includes: a substrate; a first bank on the substrate, at least portions of the first bank being spaced apart from each other; a plurality of first electrodes on the substrate, at least portions of the first electrodes being on portions of the first bank; a second electrode on the substrate, the second electrode being spaced apart from and between adjacent ones of the first electrodes; and a plurality of light emitting elements on the first electrodes and the second electrode.

Abstract: The present invention discloses an omnidirectional bending light source system and light strip including a strip-shaped PCB and a plurality of LED chips, the PCB comprises an interconnected first bend and a second bend, and an angle A is formed therebetween; a first notch is on the first bend, while a second notch is on the second bend, wherein the first notch and the second notch are in an alternating arrangement uniformly along a longitudinal direction of the PCB; the plurality of LED chips are mounted on the first bend or the second bend, wherein at least one of the LED chips is located between the adjacent first and second notches; regardless of the direction in which the PCB is twisted, the angle allows a sufficient room for deformation, thereby ensuring that the electronic components and LED chips mounted on the PCB remain undamaged even during arbitrary bending or twisting.

Abstract: A display module and a mobile terminal are provided. The display module includes a display area and a non-display area located on a side of the display area. The non-display area includes: a support portion, a flexible display panel located on the support portion and including a bent portion, a flexible cover plate layer located on the flexible display panel, and a first flexible filling portion located between the bent portion and the flexible cover plate layer.

Abstract: The present application provides a method for transferring micro light emitting diodes and a transferring device. The device includes: a first substrate, having at least one surface arranged with a plurality of first adhesive region for a plurality of micro light emitting diodes to adhere thereon; and a transferring substrate, having at least one surface arranged with a plurality of second adhesive regions for at least a portion of the micro light emitting diodes to adhere on and being configured to transfer the at least a portion of the micro light emitting diodes to a driving back plate.

Abstract: An optical package includes: a Printed Circuit Board including a plurality of cut-out sections; a lens, including a first plurality of protrusions corresponding respectively to the plurality of cut-out sections, wherein when the lens is placed under the PCB, the protrusions will pass through the cut-out sections; and a sensor for attaching on to the lens and the PCB. The first plurality of protrusions has a shape from the group including: snap features, guide posts and guide posts with tight-fit ribs.

Abstract: A micro light-emitting diode is provided. The micro light-emitting diode includes a first-type semiconductor layer having a first doping type; a light-emitting layer over the first-type semiconductor layer; a first-type electrode over the first-type semiconductor layer; a second-type semiconductor layer having a second doping type over the light-emitting layer, wherein the second doping type is different from the first doping type; a second-type electrode over the second-type semiconductor layer; and a barrier layer under the first-type semiconductor layer and away from the first-type electrode and the second-type electrode, wherein the barrier layer includes a doped region having the second doping type.

Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

Abstract: A semiconductor device includes: a substrate; a first buried insulation layer disposed on the substrate; a first well which is disposed on the first buried insulation layer in a first region defined by a first element separation film, and includes a first portion extending along an upper surface of the first buried insulation layer, and a second portion extending from the first portion in a direction from the substrate toward the first buried insulation layer; a second buried insulation layer disposed on the first portion of the first well; a first semiconductor film disposed on the second buried insulation layer; a first transistor on the first semiconductor film; and a second element separation film which separates the second buried insulation layer and the first semiconductor film from the second portion of the first well, on the first portion of the first well, wherein an upper surface of the second portion of the first well is placed on the same plane as an upper surface of the first element separation f

Abstract: A method of fabricating a multi-color display includes dispensing a photo-curable fluid over a display having an array of light emitting diodes (micro-LEDs) disposed below a cover layer. The cover has an outer surface with a plurality of recesses, and the photo-curable fluid fills the recesses. The photo-curable fluid includes a color conversion agent. A plurality of LEDs in the array are activated to illuminate and cure the photo-curable fluid to form a color conversion layer in the recesses over the activated LEDs. This layer will convert light from these LEDs to light of a first color. An uncured remainder of the photo-curable fluid is removed. Then the process is repeated with a different photo-curable fluid having a different color conversion agent and a different plurality of LEDs. This forms a second color conversion layer in different plurality of recesses to convert light from these LEDs to light of a second color.

Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

Abstract: A stretchable display device comprises a display panel that includes a stretchable substrate where a plurality of emission elements is disposed, wherein the stretchable substrate is stretchable in at least one of a first direction and a second direction perpendicular to the first direction; a printed circuit film that includes a first driving circuit chip generating a drive control signal to be applied to the display panel and a second driving circuit chip receiving image data from outside and transferring the image data to the first driving circuit chip, wherein the printed circuit film is stretchable in at least one of the first direction and the second direction with respect to a stretch direction of the display panel.

Abstract: A display device includes a substrate including an emission area and a non-emission area and in which a plurality of sub-pixels are defined, first electrodes disposed in the plurality of sub-pixels, respectively, a bank that is disposed in the non-emission area between the plurality of sub-pixels, and exposes the first electrode through an opening, a protrusion disposed in a second non-emission area of the non-emission area which is divided into a first non-emission area at a flat top surface of the bank and the second non-emission area at an inclined top surface of the bank, an organic layer disposed on the first electrodes, and a second electrode disposed on the organic layer.

Abstract: A display panel and a display device are provided. The display panel includes: a pixel unit including a pixel circuit and a light-emitting element, the pixel circuit including a first transistor, the pixel unit including a first pixel unit and a second pixel unit located in a same row and adjacent columns; a first gate line and a second gate line, connected to gate electrodes of the first transistors of the first pixel unit and the second pixel unit; a first gate signal line, connected to the first pixel unit; a second gate signal line, connected to the second pixel unit; a first connection line connected with the first gate signal line through the first connection line; and a second connection line connected with the second gate signal line through the second connection line.

Abstract: A display device includes: a base layer including a display area (DA) and a non-DA; a circuit element layer on the base layer and including: a power supply electrode (PSE) overlapping the non-DA, circuit elements, and a shielding electrode connected to the PSE and overlapping some of the circuit elements; a display element layer on the circuit element layer and including: a light emitting element including a first electrode, a light emitting unit, and a second electrode, and a connection electrode connecting the second electrode to the PSE and including first through-holes; a thin film encapsulation layer (TFEL) on the display element layer and including an organic layer overlapping the DA; and an input sensing layer on the TFEL and including sensing electrodes and sensing signal lines connected to the sensing electrodes. The sensing signal lines overlap the connection electrode. Some of the first through-holes overlap the shielding electrode.

Abstract: A display substrate and a display device are disclosed. The display substrate includes a display area and a frame area, and the display substrate includes a substrate, a plurality of sub-pixels on a side of the substrate, the plurality of sub-pixels are configured to emit light in the display area, an encapsulation layer on a side of the plurality of sub-pixels away from the substrate, and a retaining wall located in the frame area, the retaining wall is located between the encapsulation layer and the substrate and includes a first sub-retaining wall, a second sub-retaining wall, and a transition area between the first sub-retaining wall and the second sub-retaining wall, the retaining wall includes at least one layer provided in the same layer, the at least one layer provided in the same layer continuously extends across the first sub-retaining wall, the second sub-retaining wall and the transition area.

Abstract: LED chips and related fabrication methods are disclosed. A LED chip includes an active layer arranged on or over a light-transmissive substrate having a light extraction surface. The light extraction surface comprises a microtextured etched surface having a non-repeating, irregular textural pattern (e.g., with an average feature depth in a range of from 120 nm to 400 nm, and preferably free of any plurality of equally sized, shaped, and spaced textural features). The microtextured etched surface may be formed by applying a micromask having first and second solid materials of different etching rates over the light extraction surface, and exposing the micromask to an etchant (e.g., via reactive ion etching) to form a microtextured etched surface having a non-repeating, irregular textural pattern. Lumiphoric material may be applied over the microtextured surface.

Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a first semiconductor layer, an active region, a p-type or n-type layer, and a first metal element-containing structure. The first semiconductor layer has a surface including a first portion and a second portion. The active region is located on the first portion and includes AlGaInAs, InGaAsP, AlGaAsP or AlGaInP. The p-type or n-type layer includes an oxygen element (O) and a metal element, and is located on the second portion. The first metal element-containing structure is located on the p-type or n-type layer. The p-type or n-type layer physically contacts the first metal element-containing structure and the first semiconductor layer.

Abstract: A display device includes a substrate, pixels each including at least one transistor, a storage capacitor connected to the at least one transistor, and a light emitting element connected to the at least one transistor, scan lines connected to each of the pixels, a data line connected to each of the pixels, and a power line supplying a first power voltage to the light emitting element. The power line includes a first conductive pattern that extends in a first direction, and is provided on a first insulating interlayer, a second conductive pattern that extends in the first direction, is provided on a second insulating interlayer, and is connected to the first conductive pattern through a first contact hole, and a third conductive pattern that extends in a second direction, is provided on a third insulating interlayer, and is connected to the second conductive pattern through a second contact hole.

Abstract: An organic light emitting diode comprises an emitting material layer implementing a delayed fluorescence and another emitting material layer disposed adjacently to the emitting material layer and implementing fluorescence or phosphorescence and an organic light emitting device including the diode. As exciton generated in the plural emitting material layer drops to a ground state through the luminous materials each of which has a controlled energy level, it is possible to implement excellent luminous efficiency derived from a delayed fluorescent material and improved color purity derived from a fluorescent or phosphorescent material having narrow FWHM.

Abstract: The present disclosure provides a gallium nitride substrate, where the gallium nitride substrate has a surface having a diameter not less than 50 mm; nine circular regions having a diameter not greater than 1 mm are taken on a surface of the gallium nitride substrate; threading dislocation densities and threading dislocation tilt angles are calculated at the nine circular regions using a multi-photon excitation photoluminescence spectrum; an average value of products of the threading dislocation densities in the nine circular regions and tangent values of the threading dislocation tilt angles is not greater than 1E6 cm?2; and a quotient of a difference between a maximum value and a minimum value of the products of the threading dislocation densities in the nine circular regions and the tangent values of the threading dislocation tilt angles divided by the average value is not greater than 50%.

Abstract: A display device includes a scan line extending in a first direction. A plurality of data lines cross the scan line. A driving voltage line crosses the scan line. An active pattern includes a plurality of channel regions and a plurality of conductive regions. A control line is connected to the plurality of data lines and the driving voltage line. The active pattern includes a shielding part overlapping at least one data line of the plurality of data lines. The control line includes a plurality of main line parts each extending in the first direction, and a detour part connecting two adjacent main line parts of the plurality of main line parts to each other. The detour part extends along a periphery of the active pattern and crosses the at least one data line of the plurality of data lines.

Abstract: Provided is a display device including a substrate, a transfer guiding mold provided on the substrate and including a plurality of openings, and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guiding mold is less than twice a height of each of the plurality of micro LEDs.

Abstract: A display device and a manufacturing method thereof are provided. A display device includes: a substrate; a first electrode and a second electrode on the substrate, the first electrode and the second electrode being arranged on a same layer to be spaced apart from each other; a first insulating layer on the first electrode and the second electrode; and a light emitting element on the first insulating layer. The first insulating layer includes a groove concave toward the substrate, and the light emitting element is in the groove.

Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: A light-emitting array includes a semiconductor LED structure, multiple transparent dielectric bodies, a set of multiple, independent first electrical contacts, and a set of second electrical contacts. The LED structure extends contiguously over the array. The second electrical contacts are in electrical contact with the second semiconductor layer. Each dielectric body protrudes away from the first semiconductor layer and has on its surface an electrically conductive layer in electrical contact with the first semiconductor layer, forming a portion of a corresponding one of the first electrical contacts. Each dielectric body and corresponding first electrical contact define a corresponding discrete, circumscribed pixel region within the contiguous area of the array, each pixel region separate from the others.

Abstract: A display device includes a display panel foldable with respect to a folding axis substantially parallel to a first direction and a support plate disposed under the display panel and including a folding plate foldable with respect to the folding axis. The folding plate includes at least one first support layer and at least one second support layer. The folding plate has a first elastic modulus corresponding to a bending strength with respect to a second direction intersecting the first direction and a second elastic modulus corresponding to a bending strength with respect to the first direction. The first elastic modulus is smaller than the second elastic modulus.

Abstract: To reduce crosstalk between bond wires, one illustrative integrated circuit includes an array of photoemitters arranged along a centerline, with adjacent photoemitters having contact pads on opposite sides of the centerline. An illustrative assembly includes an integrated circuit chip having an array of photoemitter contact pads; a printed circuit board having a recess in which the integrated circuit chip is mounted; and bond wires connecting the contact pads with respective contact pads on the printed circuit board. An illustrative cable connector includes a module that optically couples optical fibers to an array of photoemitters on an integrated circuit chip mounted to a printed circuit board. Each photoemitter has contact pads connected to the printed circuit board contact pads by bond wires, the bond wires for each photoemitter being routed in an opposite direction relative to the bond wires for any adjacent photoemitters in the array.

Abstract: A display device includes a base layer including a display area and a non-display area; and pixels disposed in the display area, each of the pixels including sub-pixels. Each of the sub-pixels includes a pixel circuit layer and a display element layer disposed on the pixel circuit layer. The display element layer includes a partition wall disposed in each of the sub-pixels; a bank disposed between adjacent ones of the sub-pixels; a first electrode and a second electrode disposed on the partition wall and spaced apart from each other; a reflective pattern disposed on the bank; and at least one light emitting element disposed between the first electrode and the second electrode.

Abstract: A display panel including: a substrate having a through hole, a conductive part disposed on an inner surface of the through hole and a resin part in the through hole and adjacent to the conductive part; a circuit layer disposed at a first side of the substrate; and a pad disposed at a second side of the substrate and electrically connected to the circuit layer by the conductive part, wherein a width of the through hole is larger near the first side or the second side of the substrate than at a center of the through hole.

Abstract: A method for testing light-emitting elements includes: providing a substrate having light-emitting elements and conductive wires; providing at least one coil structure including a first coil and two conductive plugs connected to the first coil; providing a metal rod and a second coil winding the metal rod and connected to an AC power supply. Each light-emitting element includes a positive electrode and a negative electrode connected to one conductive wire, respectively. The substrate defines pairs of through holes, each pair of through holes is aligning with two conductive wires connected to the positive electrode and the negative electrode of one light-emitting element. The testing method further includes inserting the two conductive plugs into one pair of through holes, starting the AC power supply and moving the metal rod towards the coil structure to form an induced current in the first coil configured for driving the one light-emitting element.

Abstract: A display panel includes a substrate including a first region, a second region, a non-display area that surrounds the first region and the second region, and a display area that surrounds the non-display area; a plurality of pixels arranged on the display area; a plurality of dummy pixels arranged on the non-display area and emitting no light; and a plurality of signal lines configured to electrically connect the plurality of pixels to the plurality of dummy pixels. Some of the plurality of dummy pixels are arranged between the first region and the second region.

Abstract: An organic light emitting display panel including a first electrode, a second electrode on the first electrode, an organic layer between the first electrode and the second electrode and including at least one light emitting layer, an organic cover layer disposed on the second electrode, a lower layer between the organic cover layer and the second electrode and including a first layer, a second layer, and a third layer, which are different from each other and are sequentially stacked, and an upper layer on the organic cover layer. The first layer contacts the second electrode. The second layer and the third layer each include a silicon compound.

Abstract: A display panel includes a substrate having a first area and a second area, a non-display area surrounding the first area and the second area, and a display area surrounding the non-display area, a plurality of display elements arranged in the display area, and a plurality of signal lines electrically connected to the plurality of display elements, wherein the plurality of signal lines includes a first signal line and a second signal line neighboring each other and extending in a first direction, wherein the first signal line bypasses in the non-display area along a first side of the first area, and the second signal line bypasses in the non-display area along a second side of the first area, and wherein the first and second signal lines are asymmetrical with respect to a virtual central line through a center of the first area in the first direction.

Abstract: A display backboard, a display panel and a method of manufacturing the same, and a display apparatus are provided. The display backboard includes a base substrate, a thin film transistor array layer on a surface of the base substrate, a flattening layer on a side of the thin film transistor array layer away from the base substrate, and a pixel-defining layer on a surface of the flattening layer away from the base substrate; wherein the pixel-defining layer comprises a first pixel-defining layer, the first pixel-defining layer defines a plurality of first openings, at least a portion of a sidewall of each first opening is provided with a reflective layer.

Abstract: The invention describes a light emitting diode array module (30) comprising a plurality of light emitting diode structures (10a, 10b), wherein the light emitting diode structures (10a,10b) are arranged such that there is an optical cross talk between the light emitting diode structures (10a, 10b) during operation of the light emitting diode array module (30), wherein at least a first light emitting diode structure (10a) of the plurality of light emitting diode structures (10a, 10b) is characterized by a first color, and wherein at least a second light emitting diode structure (10b) of the plurality of light emitting diode structures (10a, 10b) is characterized by a second color different than the first color, wherein the first color, the second color and the optical cross talk between the light emitting diodes are arranged to provide a predefined light distribution in a reference plane (40) perpendicular to an optical axis (50) of the light emitting diode an-ay module (30).

Abstract: High-voltage solid-state transducer (SST) devices and associated systems and methods are disclosed herein. An SST device in accordance with a particular embodiment of the present technology includes a carrier substrate, a first terminal, a second terminal and a plurality of SST dies connected in series between the first and second terminals. The individual SST dies can include a transducer structure having a p-n junction, a first contact and a second contact. The transducer structure forms a boundary between a first region and a second region with the carrier substrate being in the first region. The first and second terminals can be configured to receive an output voltage and each SST die can have a forward junction voltage less than the output voltage.

Abstract: Provided are a protective film for a foldable display and a foldable display device comprising the same.

Abstract: A light emitting device includes a substrate, a plurality of light emitting elements disposed in a light-emitting region on the substrate, at least one first wiring part surrounding the light-emitting region, at least one second wiring part, together with the at least one first wiring part, demarcating the light-emitting region into a plurality of demarcated regions, a first wall formed along and covering the at least one first wiring part to surround the light-emitting region, at least one second wall formed along and covering corresponding one or more of the at least one second wiring part, and a light-transmissive member containing a wavelength converting material, covering an entire light-emitting region.

Abstract: This specification discloses lighting device the includes a combination of a royal-blue and blue pump LEDs with a mixture of phosphors to provide light with a high melanopic content and maximize an m/p ratio while maintaining high color fidelity, and a tunable lighting system including the lighting device.

Abstract: According to an embodiment of the present invention, an active matrix substrate (100) includes a display region (DR) defined by a plurality of pixel regions (P) arranged in a matrix and a peripheral region (FR) located around the display region. The active matrix substrate includes a substrate (1), a first TFT (10), and a second TFT (20). The first TFT is supported by the substrate and disposed in the peripheral region. The second TFT is supported by the substrate and disposed in the display region. The first TFT includes a crystalline silicon semiconductor layer (11), which is an active layer. The second TFT includes an oxide semiconductor layer (21), which is an active layer. The first TFT and the second TFT each have a top-gate structure.

Abstract: A display device includes a first electrode disposed on a substrate, a second electrode disposed on the substrate and spaced apart from the first electrode, at least one light-emitting element extending in a direction, disposed between the first electrode and the second electrode, and electrically connected to the first electrode and the second electrode, and an insulating pattern layer disposed on the first electrode and the second electrode, the insulating pattern layer including a fixer disposed on at least part of the at least one light-emitting element, and a barrier surrounding the at least one light-emitting element.