Plural Light Emitting Devices (e.g., Matrix, 7-segment Array) Patents (Class 257/88)
  • Patent number: 11031523
    Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 8, 2021
    Assignees: SYNDIANT INC., XDMICRO (ZHONGSHAN) OPTOELECTRONIC SEMICONDUCTOR CO., LTD.
    Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
  • Patent number: 11032924
    Abstract: A display device, and a method and apparatus for manufacturing the display device, are provided. The display device includes a cover window including a curved portion, and a display panel smaller in at least one of length or width than the cover window and laminated on a flat portion of the cover window.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: June 8, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyung-Su Lee, Kwan-Young Han, Jong-Hwan Kim, Yong-Youl Cho
  • Patent number: 11031451
    Abstract: An organic EL display device according to an embodiment of the present invention includes: a substrate, a plurality of pixels that are disposed on the substrate, a first inorganic insulating layer that covers the plurality of pixels, a conductive layer that is disposed on a side of the first inorganic insulating layer opposite to the plurality of pixels and covers the plurality of pixels, and a second inorganic insulating layer that is disposed on a side of the conductive layer opposite to the first inorganic insulating layer and covers the plurality of pixels.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: June 8, 2021
    Assignee: Japan Display Inc.
    Inventors: Hiraaki Kokame, Akinori Kamiya
  • Patent number: 11031452
    Abstract: A display panel includes a first substrate having a display area and a peripheral area. The display area includes pixels with first output wires connected to the pixels. A first driver is connected to the first output wires and positioned in the peripheral area at a first side of the display area. The first substrate includes a notch portion having a curved edge and the display area has a first display portion and a second display portion with the notch portion therebetween. At least one of the first output wires is a first main line at the first display portion, a second main line at the second display portion, and a first connecting line that is connected to the first main line and the second main line and is at the peripheral area between the first display portion and the second display portion.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 8, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung-Hwan Cho, Doo Hwan Kim, Tae Jin Kim, Tae Hyun Kim, Joo Sun Yoon, Min Jae Jeong, Jong Hyun Choi
  • Patent number: 11031380
    Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 8, 2021
    Assignees: SYNDIANT INC., XDMICRO (ZHONGSHAN) OPTOELECTRONIC SEMICONDUCTOR CO., LTD.
    Inventors: Chun Chiu Daniel Wong, Hiap Liew Ong, Min Hwang Michael Lyu, Liming Wang
  • Patent number: 11024687
    Abstract: The present application provides a display substrate, including an array substrate and a pixel defining layer. The pixel defining layer is formed on the array substrate and defines a plurality of sub-pixel areas. The pixel defining layer further defines a first groove, and the first groove is arranged to surround a sub-pixel area of the plurality of sub-pixel areas. When the display panel receives a falling impact, the impact is transferred to the pixel defining layer, so that the pixel defining layer expands in its extending direction. The groove is similar to a structure of a wall performing a function of releasing stresses and reducing expansion of the pixel defining layer. The present application further discloses a method for manufacturing a display substrate, and a display panel.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: June 1, 2021
    Assignee: YUNGU (GU'AN) TECHNOLOGY CO., LTD.
    Inventor: Panlong Zhang
  • Patent number: 11016139
    Abstract: The present application provides a test assembly, including: a detection pin (11), a pressure sensor (12) connected to the detection pin (11), and a drive mechanism (18) configured to drive each detection pin (11), and each pressure sensor (12) is configured to detect the pressure applied to the detection pin (11) in real time.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: May 25, 2021
    Assignees: CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD., HKC CORPORATION LIMITED
    Inventor: Tianhui Qiu
  • Patent number: 11018195
    Abstract: A full-color light emitting diode (LED) display having an improved luminance is provided herein. More specifically, provided herein are a full-color LED display, in which an amount of light blocked by electrodes and not extracted is minimized and ultra-small LED devices are connected to ultra-small electrodes without defects such as electrical short circuits and the like, wherein the full-color LED display exhibits a further improved luminance when a direct current (DC) driving voltage is used and each pixel of the full-color LED display exhibits uniform luminance when the DC driving voltage is used, and a method of manufacturing the same.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: May 25, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young Rag Do, Yun Jae Eo, Yeon Goog Sung
  • Patent number: 11018285
    Abstract: A display device and a manufacturing method thereof, wherein the display device includes a light emitting diode chip, including: a light emitting structure which includes a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers; a second electrode which is electrically connected to the second conductive semiconductor layer; an insulation unit which is disposed to cover a part of the top surface of the second electrode and side surfaces of the light emitting structure; and a second fixed part which covers the top surface of the insulation unit and is electrically connected to the second electrode, and at least a part of which extends to the side surfaces of the light emitting structure.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: May 25, 2021
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Young Hyun Kim, Motonobu Takeya, Jong Ik Lee, Sung Su Son
  • Patent number: 11013086
    Abstract: In some embodiments, a driver circuit for a light emitting diode (LED) lightbulb having a plurality of series-coupled LED strings, includes a power supply circuit coupled to a first LED string of the plurality of LED strings, an energy storage circuit coupled to the power supply circuit, and a current steering circuit coupled to the power supply circuit and coupled to at least one LED string of the plurality of LED strings. Power delivered to the LED strings is the power from the power supply circuit, plus a discharge power from the energy storage circuit, minus power diverted from the power supply circuit and directed to the energy storage circuit. The energy storage circuit stores energy during a first portion of a rectified AC power waveform and provides power during a second portion of the rectified AC power waveform.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: May 18, 2021
    Assignee: i Sine Inc.
    Inventor: Louis J. Morales
  • Patent number: 11011677
    Abstract: A display device is provided. The display device includes a substrate and a light-emitting unit disposed on the substrate. The light-emitting unit includes a transporting layer having a first semiconductor region and a second semiconductor region, and a conductive layer having a contact region that is in contact with the second semiconductor region. The distance between an edge of the contact region and an edge of the transporting layer is greater than or equal to 0.1 ?m.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: May 18, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Shun-Yuan Hu, Tsau-Hua Hsieh
  • Patent number: 11002427
    Abstract: A light emitting device has a covering member. The covering member includes light reflecting material and a second fluorescent material, and a dominant wavelength of an emission spectrum of the second fluorescent material differs from a dominant wavelength of an emission spectrum of the light emitting device by 30 nm or less. The light emitting device emits light with chromaticity that is within a four-sided region on a CIE 1931 chromaticity diagram, where chromaticity coordinates (x, y) are (0.645, 0.335) at a first point, (0.665, 0.335) at a second point, (0.735, 0.265) at a third point, (0.721, 0.259) at a fourth point, and a first line joins the first and second points, a second line joins the second and third points, a third line joins the third and fourth points, and a fourth line joins the fourth and first points to define the four-sided region of the chromaticity diagram.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: May 11, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Makiko Iwasa, Yuji Sato, Hiroki Fukuta
  • Patent number: 11004997
    Abstract: An infrared thermal emitter includes a substrate, a light-emitting unit and an infrared-emitting unit. The light-emitting unit is disposed on the substrate in a laminating direction and has a light-exiting surface away from the substrate. The infrared-emitting unit is disposed on the substrate in the laminating direction to cover the light-emitting unit and includes a layered structure having a light-absorbing layer that is aligned with the light-emitting unit in the laminating direction. The light-absorbing layer absorbs light emitted from the light-emitting unit so as to be heated up and to generate infrared radiation.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: May 11, 2021
    Assignees: GODSMITH SENSOR INC., OPTO TECH CORPORATION
    Inventors: Jin-Shown Shie, Yi-Chun Liao, Chieh-Yi Chen, Chung-Cheng Lin, Cheng-Wei Yang, Chi-Tseng Chang
  • Patent number: 10989376
    Abstract: Embodiments relate to fabricating a display device by assembling strips of ?LED devices onto a backplane instead of individually picking and placing each ?LED device onto the backplane. A strip of first ?LED devices is coupled to a set of interconnections on the backplane. Then, the first fabrication substrate is removed from the strip of first ?LED devices. A strip of second ?LED devices producing another color (e.g., green) is attached to a second fabrication substrate. The strip of second ?LED devices is coupled to another set of interconnections on the backplane. The process may be repeated for a strip of third ?LED devices producing yet another color (e.g., blue). After attaching the second and third ?LED devices, fabrication substrates on the second and third ?LED devices are simultaneously removed by laser based lift-off (LLO) method.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 27, 2021
    Assignee: Facebook Technologies, LLC
    Inventor: Celine Claire Oyer
  • Patent number: 10991917
    Abstract: An array substrate, includes a base substrate and a plurality of pixel units arranged in an array on the base substrate. Each pixel unit includes an OLED and a pixel driver circuit. Each pixel unit of at least one of the plurality of pixel units further includes a repair line. An orthographic projection of the repair line on the base substrate partially overlaps with an orthographic projection of an anode of the OLED on the base substrate. The repair line is coupled to a pixel driving circuit in an adjacent pixel unit adjacent to the pixel unit of the plurality of pixel units.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: April 27, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Hongfei Cheng
  • Patent number: 10991726
    Abstract: A pixel array substrate includes a substrate, pixels, and connection wires. The substrate has a transparent window, a wire region, and an active region. The connection wires are disposed in the wire region. Each connection wire is electrically connected to first signal lines of the pixels respectively located on two opposite sides of the transparent window. The connection wires include first and second wire groups. The first wire group includes first connection wires. Each first connection wire has a first segment and a second segment. A first insulation layer is disposed between the first and second segments that are electrically connected to each other. The second wire group includes second connection wires. The first segments of the first connection wires and the second connection wires are overlapped, and the first insulation layer is disposed between the first segments of the first connection wires and the second connection wires.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: April 27, 2021
    Assignee: Au Optronics Corporation
    Inventors: Yao-Jiun Tsai, Ming-Hung Chuang
  • Patent number: 10985304
    Abstract: A light emitting diode including a first semiconductor layer, a mesa disposed thereon and including a second semiconductor layer and an active layer, an ohmic reflection layer disposed on the mesa to form an ohmic contact with the second semiconductor layer, a lower insulation layer covering the mesa and the ohmic reflection layer and partially exposing the first semiconductor layer and the ohmic reflection layer, a first pad metal layer disposed on the lower insulation layer and electrically connected to the first semiconductor layer, a metal reflection layer disposed on the lower insulation layer and laterally spaced apart from the first pad metal layer, and an upper insulation layer covering the first pad metal layer and the metal reflection layer, and having a first opening exposing the first pad metal layer, in which at least a portion of the metal reflection layer covers a side surface of the mesa.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: April 20, 2021
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Se Hee Oh, Hyun A Kim, Joon Sup Lee, Min Woo Kang, Hyoung Jin Lim
  • Patent number: 10985305
    Abstract: A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: April 20, 2021
    Assignee: KYOCERA CORPORATION
    Inventors: Shou Yamasaki, Mitsuharu Sakai, Natsumi Ochi, Yukio Morita, Toshihiro Hashimoto
  • Patent number: 10985144
    Abstract: Disclosed is a light emitting apparatus including: first and second substrates having light transmissive property and flexibility arranged to face each other; a plurality of light emitting element groups arranged along a predetermined straight line between the first and second substrates and each of the light emitting element groups includes a first light emitting element and a second light emitting element; and a conductor pattern formed on the first substrate and including respective individual line patterns individually connected to the first and second light emitting elements and a common line pattern commonly connected to the first and second light emitting elements. The individual line patterns are routed to one side and the other side of the straight line centered on at least a part of the common line pattern.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: April 20, 2021
    Assignee: Toshiba Hokuto Electronics Corporation
    Inventor: Tomotsugu Jingi
  • Patent number: 10986725
    Abstract: A light-emitting module is provided. The light-emitting module includes a light-emitting structure and a carrying substrate. The light-emitting structure includes a plurality of light-emitting elements and a first positioning mark. The carrying substrate includes a second positioning mark. The light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: April 20, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Chi-Liang Chang, Wen-Chang Tsai, Meng-Chieh Cheng
  • Patent number: 10985194
    Abstract: A display panel and a display device are provided. The display panel comprises a display area; a non-display area surrounding the display area; a first edge; and a first insulating layer. The non-display area includes a binding area disposed between the display area and the first edge, and the binding area includes a plurality of bonding pads. The first insulating layer includes a plurality of through-holes disposed at the binding area and one-to-one corresponding the plurality of bonding pads, and a through-hole at least partially exposes a corresponding bonding pad. The first insulating layer includes a sub-edge arranged adjacent to the first edge, and a distance between the sub-edge and the first edge is D1, and the bonding pad has a first bonding pad edge arranged adjacent to the first edge, and a distance between the first bonding pad edge and the first edge is D2, where D1?D2.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 20, 2021
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventor: Xiaodong Luo
  • Patent number: 10978435
    Abstract: The present invention relates to a display device using a semiconductor light-emitting element and, particularly, to a display device using a semiconductor light-emitting element. A display device according to the present invention comprises: a substrate including a driving thin-film transistor; a semiconductor light-emitting element including a first conductive electrode and a second conductive electrode; and a planarization layer formed to cover the driving thin-film transistor and including a reception hole in which the semiconductor light-emitting element is received, wherein a height adjustment layer is formed between the substrate and the planarization layer so as to make one of the first and the second conductive electrode and one surface of the planarization layer coincide with each other in height.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 13, 2021
    Assignee: LG ELECTRONICS INC.
    Inventor: Seonhoo Kim
  • Patent number: 10976878
    Abstract: A display device in an embodiment includes a first light emitting region; a second light emitting region located at a position away from the first light emitting region by a first distance in a first direction; a third light emitting region located at a position away from the second light emitting region by a second distance shorter than the first distance in the first direction; a first conductive portion located between the first light emitting region and the second light emitting region as seen from a display plane, the first conductive portion having a first width in the first direction, and a second conductive portion located between the second light emitting region and the third light emitting region as seen from the display plane, the second conductive portion having a second width shorter than the first width in the first direction.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: April 13, 2021
    Assignee: Japan Display Inc.
    Inventors: Yusuke Tada, Hajime Akimoto
  • Patent number: 10971668
    Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-hoon Yun, Jong-sup Song, Seol-young Choi
  • Patent number: 10971664
    Abstract: A display apparatus includes a substrate; a light-emitting diode on the substrate; a pixel separating layer surrounding the light-emitting diode; and a light dispersion layer on the light-emitting diode and the pixel separating layer.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jaejoong Kwon, Yunseon Do, Chio Cho
  • Patent number: 10971691
    Abstract: A display device comprises: a light emitting array including a plurality of light emitting elements on a substrate and an insulating pattern disposed between the light emitting elements; a color conversion array including a plurality of sub-color conversion parts corresponding to the respective light emitting elements; and a printed circuit board having a first contact electrode connected to each of the light emitting elements, the printed circuit board driving the light emitting elements, wherein the plurality of sub-color conversion parts include first to third sub-color conversion parts that convert the light provided from corresponding light emitting elements into lights of first to third colors and emitting the converted lights, wherein each of the plurality of light emitting elements is electrically insulated from an adjacent light emitting elements.
    Type: Grant
    Filed: December 24, 2018
    Date of Patent: April 6, 2021
    Inventors: Sang Chul Byun, Hyuk Hwan Kim, Seok Hyun Nam
  • Patent number: 10971651
    Abstract: Disclosed is in the embodiment is a semiconductor device comprising: a first conductive semiconductor layer; a second conductive semiconductor layer; an active layer disposed between the second conductive semiconductor layer and the second conductive semiconductor layer; a first electrode electrically connected to the first conductive semiconductor layer; and a second electrode electrically connected to the second conductive semiconductor layer, wherein the first conductive semiconductor layer includes a first sub semiconductor layer, a third sub semiconductor layer and a second sub semiconductor layer disposed between the first sub semiconductor layer and the third sub semiconductor layer, wherein proportion of aluminum in the first sub semiconductor layer and the third sub semiconductor layer is larger than an proportion of aluminum in the active layer, and an proportion of aluminum in the second sub semiconductor layer is smaller than the proportion of aluminum in the first sub semiconductor layer and the
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: April 6, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Youn Joon Sung, Min Sung Kim
  • Patent number: 10960645
    Abstract: A luminous laminated glazed roof of a vehicle includes a first glazing, forming an exterior glazing, with first and second main faces; a lamination interlayer made of polymeric material of thickness e1 of at most 1.8 mm; a second glazing, forming an interior glazing, with third and fourth main faces, the second and third main faces being the internal faces of the laminated glazing; a lamination interlayer with through or blind apertures housing diodes; and collimating optics between the diodes and the third main face.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: March 30, 2021
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Mathieu Berard, Olivier Delrieu, Pascal Bauerle
  • Patent number: 10966300
    Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: March 30, 2021
    Assignee: BRIDGELUX, INC.
    Inventors: Ghulam Hasnain, Syn-Yem Hu, Steven D. Lester
  • Patent number: 10964772
    Abstract: An OLED plate comprises: a substrate; a plurality of OLED devices, disposed on one side of the substrate and located in the display area; and an auxiliary cathode, disposed on the one side of the substrate and at least located in the peripheral area. Each of the OLED devices includes a reflective anode, an organic material functional layer and a transparent cathode disposed in a direction distal from the substrate in sequence. A portion of the auxiliary cathode located in the peripheral area is electrically connected to transparent cathodes of the plurality of OLED devices, and resistivity of the auxiliary cathode is less than resistivity of a transparent cathode of the plurality of OLED devices.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: March 30, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Pan Xu, Yicheng Lin, Ling Wang, Cuili Gai, Guoying Wang, Yongqian Li
  • Patent number: 10964864
    Abstract: A light emitting structure including mixing cups are described. In an embodiment, a light emitting structure includes a light emitting diode (LED) bonded to a substrate, a diffuser layer adjacent the LED, an angular filter directly over the diffuser layer and the LED, and an overcoat layer directly over the angular filter and the LED.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: March 30, 2021
    Inventors: James Michael Perkins, Sergei Y. Yakovenko, Dmitry S. Sizov
  • Patent number: 10957736
    Abstract: Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125°. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: March 23, 2021
    Assignee: Cree, Inc.
    Inventors: Aaron J. Francis, Jasper Sicat Cabalu, Colin Kelly Blakely
  • Patent number: 10957268
    Abstract: An active-matrix substrate according to an embodiment of the present invention includes a plurality of first TFTs that are arranged within a display area, an inorganic insulating layer that covers the plurality of first TFTs, an organic insulating layer that is provided on the inorganic insulating layer, a plurality of second TFTs that are arranged within a non-display area, and a source and gate metal connection portion that is positioned within the non-display area, a first conductive layer that is formed from an identical conductive film with a gate wiring line and a second conductive layer that is formed from an identical conductive film with a source wiring line being connected to each other at the source and gate metal connection portion. Each of the plurality of first TFTs is an oxide semiconductor TFT. At least one second TFT among the plurality of second TFTs is covered with the organic insulating layer. The source and gate metal connection portion is not covered with the organic insulating layer.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: March 23, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Tetsuo Kikuchi, Hajime Imai, Takashi Terauchi, Shinya Ohira, Isao Ogasawara, Satoshi Horiuchi
  • Patent number: 10957871
    Abstract: Provided is an organic light emitting device including an overcoat layer on a substrate, a first electrode disposed on the overcoat layer, an organic light emitting layer disposed on the first electrode and including a convex or concave curve; and a second electrode disposed on the organic light emitting layer.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 23, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Jihyang Jang, Sookang Kim, Soyoung Jo, Wonhoe Koo, Hyunsoo Lim
  • Patent number: 10955350
    Abstract: A SiC wafer defect measuring method which includes a device management step of managing a defect measuring device by irradiating a reference sample made of a material having a light-emitting intensity that does not change with repeated irradiation by excitation light and which has a pattern made of recesses and/or protrusions in the surface, the irradiation by the excitation light being performed before measuring defects in a SiC wafer and under the same irradiation conditions as the measurement of the defects in the SiC wafer, and then measuring the S/N ratio of the pattern from a reflection image of the pattern.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: March 23, 2021
    Assignee: SHOWA DENKO K.K.
    Inventor: Koji Kamei
  • Patent number: 10948137
    Abstract: A color conversion panel includes a first color conversion layer, a second color conversion layer, and a light wavelength conversion layer. The first color conversion layer includes a first semiconductor nanocrystal set for providing red light. The second color conversion layer neighbors the first color conversion layer and includes a second semiconductor nanocrystal set for providing first green light. The light wavelength conversion layer neighbors the second light conversion layer, may provide blue light, and includes a third semiconductor nanocrystal set for providing second green light.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 16, 2021
    Inventors: Seon-Tae Yoon, Jung Hyun Kwon, Ki Soo Park, Hae Il Park, Moon Jung Baek
  • Patent number: 10950764
    Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: March 16, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Atsushi Bando, Kazuya Matsuda
  • Patent number: 10950769
    Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 16, 2021
    Assignee: Cree, Inc.
    Inventors: Michael John Bergmann, Colin Kelly Blakely, Arthur Fong-Yuen Pun, Jesse Colin Reiherzer
  • Patent number: 10950666
    Abstract: The present disclosure provides a pixel structure, an OLED display screen, and an evaporation mask. The pixel structure includes a plurality of pixel unit groups arranged in an array. Each of the pixel unit groups includes a first sub-pixel, a second sub-pixel and a third sub-pixel. An edge of the first sub-pixel close to the third sub-pixel is not parallel to an edge of the first sub-pixel away from the third sub-pixel. An edge of the second sub-pixel close to the third sub-pixel is not parallel to an edge of the second sub-pixel away from the third sub-pixel. At least two adjacent first sub-pixels and/or at least two adjacent second sub-pixels of at least two adjacent pixel unit groups are formed by a same mask opening in the evaporation mask.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: March 16, 2021
    Assignee: KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD.
    Inventors: Lifang Zhou, Junfeng Li, Mingxing Liu, Xuliang Wang, Feng Gao
  • Patent number: 10943532
    Abstract: The present disclosure relates to a monolithic full-color light-emitting diode (LED) display panel. The display panel includes a plurality of pixels and each pixel includes a first LED for emitting light having a first primary color, a second LED for emitting light having a second primary color, a third LED for emitting light having the first primary color, and a color converting layer for converting light generated by the third LED into light having a third primary color. Since the first, second and third LEDs of each pixel are formed with the same multi-layer semiconductor structure, the fabrication process of the display panel can be substantially simplified resulting in higher yield, increased throughput and lower cost.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: March 9, 2021
    Inventors: Kei May Lau, Xu Zhang
  • Patent number: 10937924
    Abstract: A display device and an electronics apparatus, the display device comprises: a display substrate; and at least two stacked layers on the display substrate, wherein each stacked layer includes one micro-LED array.
    Type: Grant
    Filed: October 8, 2016
    Date of Patent: March 2, 2021
    Assignee: GOERTEK. INC
    Inventors: Quanbo Zou, Zhe Wang, Peixuan Chen, Xiangxu Feng
  • Patent number: 10928691
    Abstract: An active matrix substrate 10 includes: switching elements 120 that are connected with gate lines and data lines provided on a substrate; pixel electrodes 130 that are connected with the switching elements 120; counter electrodes 140 that overlap with the pixel electrodes 130 when viewed in a plan view; a flattening film 154; and lines 142. The flattening film 154 covers the switching elements 120, and first contact holes CH1 that pass through the flattening film 154 are formed at positions that overlap with the lines 142 when viewed in a plan view. The pixel electrodes 130 and the counter electrodes 140 are arranged so that each of the same partially covers the flattening film 154. The line 142 and the counter electrode 140 are connected with each other in the first contact hole CH1.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: February 23, 2021
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Setsuji Nishimiya, Tohru Daitoh, Hajime Imai, Tetsuo Kikuchi, Masahiko Suzuki, Teruyuki Ueda, Masamitsu Yamanaka, Kengo Hara, Hitoshi Takahata
  • Patent number: 10930626
    Abstract: A display apparatus includes a semiconductor substrate, a transistor, and a light-emitting diode. The transistor is disposed on the semiconductor substrate and uses a portion of the semiconductor substrate as an active layer thereof. The light-emitting diode is disposed on the semiconductor substrate and is electrically connected to the transistor.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: February 23, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jongho Hong, Wonsang Park, Wonil Choi
  • Patent number: 10923544
    Abstract: A display device includes a first substrate including a circuit portion and a transmission portion, a first organic light emitting diode disposed over one surface of the first substrate and overlapping with the circuit portion, a second organic light emitting diode disposed over the other surface of the first substrate and overlapping with the transmission portion, and a second substrate facing one surface of the first substrate, in which the first organic light emitting diode and the second organic light emitting diode emit light to the second substrate.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: February 16, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Euitae Kim, Dahye Shim
  • Patent number: 10923023
    Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 16, 2021
    Inventors: Andreas Bibl, Xia Li, John A. Higginson, Vaibhav D. Patel, Kapil V. Sakariya, Imran Hashim, Tore Nauta, Thomas Charisoulis
  • Patent number: 10923527
    Abstract: A micro LED display panel includes a display area, a plurality of micro light-emitting elements and a plurality of micro control elements. The plurality of micro light-emitting elements is disposed in the display area and include a plurality of first color micro LEDs and a plurality of second color micro LEDs. A light wavelength of each of the first color micro LEDs is different from a light wavelength of each of the second color micro LEDs. The plurality of micro control elements is disposed in the display area, and include a plurality of first color micro circuit-chips and a plurality of second color micro circuit-chips. The plurality of first color micro circuit-chips control the plurality of first color micro LEDs, and the plurality of second color micro circuit-chips control the plurality of second color micro LEDs.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: February 16, 2021
    Assignee: PixeLED Display CO., LTD.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Ying-Tsang Liu, Yu-Chu Li, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10923641
    Abstract: This disclosure discloses a method of manufacturing a light-emitting device includes steps of providing a first substrate with a plurality of first light-emitting elements and adhesive units arranged thereon, providing a second substrate with a first group of second light-emitting elements and a second group of second light-emitting elements arranged thereon, and connecting the a second group of second light-emitting elements and the adhesive units. The first light-emitting elements and the first group of second light-emitting elements are partially or wholly overlapped with each other during connecting the second group of second light-emitting elements and the adhesive units.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: February 16, 2021
    Assignee: EPISTAR CORPORATION
    Inventor: Min-Hsun Hsieh
  • Patent number: 10923458
    Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: February 16, 2021
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. Bedell, Bing Dang, Ning Li, Frank R. Libsch, Devendra K. Sadana
  • Patent number: 10916598
    Abstract: Embodiments of the present disclosure provide an OLED array substrate, a method for fabricating an OLED array substrate, an OLED pixel circuit, an OLED array substrate including the OLED pixel circuit, and a display device including the OLED array substrate. The OLED array substrate includes a substrate, an OLED arranged on the substrate, and a photosensor positioned between the OLED and the substrate. The photosensor includes a first electrode, a photosensitive layer, and a second electrode sequentially arranged from bottom to top. The OLED includes an anode, an organic light-emitting layer, and a cathode sequentially arranged from bottom to top. The anode includes a first portion and a second portion.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: February 9, 2021
    Assignees: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Meng Li, Yongqian Li, Min He
  • Patent number: 10916532
    Abstract: A micro LED display panel includes a back plate, a plurality of micro LEDs on the back plate, a first partition wall on a side of the back plate having the plurality of micro LEDs, an insulating layer on the back plate, and a common electrode on the insulating layer and covering the plurality of micro LEDs. The first partition wall divides the back plate into a plurality of light-emitting regions independent from each other. Each of the light-emitting regions is provided with one of the micro LEDs. The insulating layer is located in each of the light-emitting regions and surrounds each of the micro LEDs.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: February 9, 2021
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jung-An Cheng, I-Wei Wu