Plural Light Emitting Devices (e.g., Matrix, 7-segment Array) Patents (Class 257/88)
  • Patent number: 10347509
    Abstract: Disclosed is a method of manufacturing a semiconductor device that includes molding and curing a framing member having an upper side that defines an array of indentations. Semiconductor dies are then adhered to the framing member within respective indentations. The upper side of the framing member and the dies are covered with an RDL. Formation of the RDL includes deposition of a dielectric material that also fills gaps between the dies and the framing member within the indentations. The framing member can be molded to have a thickness that can provide mechanical strength to resist damage to the dies during the formation of the RDL or other manufacturing processes, for example due to warping of the dies. After the RDL is completed, this excess framing member material can then be removed from lower side of the framing member and the structure can be diced to separate the dies into respective semiconductor devices.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 9, 2019
    Assignee: DIDREW TECHNOLOGY (BVI) LIMITED
    Inventor: Minghao Shen
  • Patent number: 10342091
    Abstract: Provided is a light-emitting device that is able to adjust a color temperature by power supplied from a single power source. The light-emitting device includes an anode electrode land, a cathode electrode land, and three or more wires that are provided in parallel and are connected to the anode electrode land and the cathode electrode land, in which at least three wires among the three or more wires have different forward current-forward voltage characteristics and are connected to different light emitting portions, and the color temperature of light emitted from the whole of the light-emitting portions is able to be adjusted.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: July 2, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kazuaki Kaneko, Makoto Matsuda, Hiroaki Onuma
  • Patent number: 10340257
    Abstract: A display device using a semiconductor light emitting device and a fabrication method thereof is disclosed. A display device includes a plurality of semiconductor light emitting device packages; a wiring substrate coupled to the plurality of semiconductor light emitting device packages; and a plurality of wiring electrodes. A semiconductor light emitting device package includes a plurality of semiconductor light emitting devices; a support substrate coupled to the plurality of semiconductor light emitting devices; and a conversion layer configured to convert a color of light emitted from at least some of the plurality of semiconductor light emitting devices to a different color, forming a red sub-pixel, a green sub-pixel, and a blue sub-pixel. A semiconductor light emitting device corresponding to the red or green sub-pixel and a semiconductor light emitting device corresponding to the blue sub-pixel may have light emitting areas that are of different sizes.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: July 2, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Junho Sung, Minwoo Lee
  • Patent number: 10340469
    Abstract: A light-emitting diode chip includes an electrical connection layer is arranged over the light-emitting surface of the light-emitting epitaxial laminated layer, which is not connected with isolation of the dielectric layer. After CMP treatment, the flat surface is plated with a transparent current spreading layer, which reduces horizontal conduction resistance of the transparent current spreading layer and replaces the metal spreading finger for horizontal conduction.
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: July 2, 2019
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shu-fan Yang, Chun-Yi Wu, Chaoyu Wu, Duxiang Wang
  • Patent number: 10338712
    Abstract: A display device includes a display substrate in which a plurality of sub-pixel areas is defined, a light-emitting diode (“LED”) on the display substrate, a touch sensor electrode on the display substrate and including at least one touch electrode, and a bank separating the plurality of the sub-pixel areas, where each of the plurality of the sub-pixel areas may include a first area in which the LED is disposed and a second area in which the touch sensor electrode is disposed.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seunglyong Bok, Mugyeom Kim
  • Patent number: 10340414
    Abstract: A light emitting device includes: a substrate; a first electrode and a second electrode provided at a distance from each other on the substrate and extending in one direction; a plurality of light emitting diodes provided between the first electrode and the second electrode, and connected to the first electrode and the second electrode; and a residual pattern provided between at least one of the plurality of light emitting diodes and the substrate.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: July 2, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yeoung Keol Woo, Chul Min Bae
  • Patent number: 10334674
    Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: June 25, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Ghulam Hasnain, Syn-Yem Hu, Steven D. Lester
  • Patent number: 10330855
    Abstract: A lighting device (100A) includes: at least one light-emitting device (10) that emits light; and a light guide plate (20) having a light-receiving end face (20a) that receives light which is emitted from the at least one light-emitting device (10) and an outgoing face (20b) that crosses the light-receiving end face (20a). The lighting device (100A) further includes a substrate (30) of a rectangular ring shape, the substrate having four side portions (30a, 30b, 30c, 30d). The at least one light-emitting device (10) is provided on the substrate (30).
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: June 25, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventor: Kenji Takase
  • Patent number: 10333105
    Abstract: An OLED packaging method and an OLED package structure are disclosed. The OLED packaging method combines a dam packaging technology and a thin film encapsulation technology. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs. The OLED packaging structure combines a dam packaging structure and a thin film encapsulation structure. A dam is used to coffer an organic layer and limit a size thereof to ensure that each organic layer is completely covered an inorganic layer disposed thereon to improve a packaging effect. One mask can be used to produce multiple inorganic layers so an amount of masks is decreased to save costs.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 25, 2019
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Wenjie Li, Jiajia Qian
  • Patent number: 10330977
    Abstract: A display device includes a substrate and a thin-film transistor (TFT) array layer located on the substrate and including a first transistor and a second transistor. The display device further includes a first electrode and a second electrode located on the thin-film transistor array layer. The first electrode is connected to an output electrode of the first transistor and the second electrode is connected to an output electrode of the second transistor. The display device additionally includes a light-emitting diode (LED) located on the first electrode. The display device further includes a capping layer covering the LED and including liquid-crystal molecules and a polymer material. The display device additionally includes a transparent electrode located on the capping layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jaeik Lim, Haeyun Choi, Wonsang Park
  • Patent number: 10334726
    Abstract: A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; and a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer. Furthermore, the method for forming the circuit board with silicon substrate is proposed, in that a method for forming a circuit board suitable for etching and a method for forming a circuit board for screen printing are proposed.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: June 25, 2019
    Inventor: Wen Yao Chang
  • Patent number: 10325894
    Abstract: Integrated active-matrix multi-color light emitting pixel arrays based displays and methods of fabricating the integrated displays are provided. An example integrated device includes a backplane device and different color light emitting diodes (LEDs) devices arranged in different height planar layers on the backplane device. The backplane device includes at least one backplane having a number of pixel circuits. Each LED device includes an array of LEDs each operable to emit light with a particular color and conductively coupled to respective pixel circuits in the backplane to form active-matrix LED sub-pixels. The different color LED sub-pixels form an array of active-matrix multi-color display pixels. Plug vias can be arranged in different planar layers to conductively couple upper-level LEDs to respective pixel circuits in respective regions over the backplane device. The plug vias can extend from an upper planar layer into a lower planar layer to fix the two planar layers together.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 18, 2019
    Inventor: Shaoher Pan
  • Patent number: 10323803
    Abstract: A light emitting device and a vehicular lamp are provided. The light emitting device comprises: a first light emitting unit; a second light emitting unit separated from the first light emitting unit; and a sidewall surrounding side surfaces of the first and second light emitting units while adjoining the side surfaces of the first and second light emitting units, wherein the first light emitting unit and the second light emitting unit emit light have different peak wavelengths.
    Type: Grant
    Filed: November 18, 2015
    Date of Patent: June 18, 2019
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Yoon Seop Lee, Da Hye Kim, Sang Hong Lee, Byoung Kyu Park, Dae Wook Kim, Jae Hyun Park
  • Patent number: 10326064
    Abstract: A light emitting device includes a light emitting element, a light transmissive member, and a cover member. The light transmissive member is disposed on an upper face of the light emitting element. The cover member covers a lateral face of the light emitting element and a lateral face of the light transmissive member, and includes first and second cover members. The first cover member is disposed adjacent to the lateral face of the light emitting element and the lateral face of the light transmissive member, and contains a first light reflecting material and a fluorine-based first resin. The second cover member covers the first cover member, and contains a second light reflecting material and a second resin. A refractive index difference between the first light reflecting material and the first resin is larger than a refractive index difference between the second light reflecting material and the second resin.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 18, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Shusaku Bando, Dai Wakamatsu, Takeshi Kususe
  • Patent number: 10326045
    Abstract: A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: June 18, 2019
    Assignee: PlayNitride Inc.
    Inventors: Yu-Yun Lo, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 10326057
    Abstract: A light emitting device package includes a package frame in which a recessed portion is defined in a center thereof, the package frame including, an interior wall surrounding the recessed portion, a step portion contacting the interior wall and a bottom surface of the recessed portion, a light source disposed inside the recessed portion and emitting first light, a substrate disposed on the light source, and fixed on an upper surface of the step portion and spaced apart from the light source, a light conversion layer disposed on the substrate and including quantum dots that absorbs the first light and emits second light having a different wavelength from the first light, and barrier layer at least covering the light conversion layer, where barrier layer includes a first inorganic barrier layer and a first organic barrier layer.
    Type: Grant
    Filed: January 6, 2018
    Date of Patent: June 18, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Hyung Kim, Chul Hee Yoo, Hyun A Kang, Jung Woo Lee, Jeong Hee Lee, Eun Joo Jang
  • Patent number: 10317020
    Abstract: A paint color matching light is disclosed. The light includes a housing, a power supply mounted in the housing, and a bulb mounted in the housing and electrically coupled to the power supply. The bulb has a color reading index over 80. The light has an absence of a cooling fan.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: June 11, 2019
    Inventor: Thomas McChesney
  • Patent number: 10316112
    Abstract: A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness. Plasma etching rate(nm/min)=(T0?T1)/M,??<Formula 1> wherein T0, T1, and M are set forth in the specification.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: June 11, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hye Jin Kim, Seong Ryong Nam, Sung Min Ko, Mi Sun Kim, Ji Yeon Lee
  • Patent number: 10312408
    Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: June 4, 2019
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Che-Hsuan Huang, Hsin-Lun Su, Shu-Hsiu Chang, Chih-Hao Lin, Tzong-Liang Tsai
  • Patent number: 10312472
    Abstract: A display panel includes a pixel array layer and a light-blocking layer. The pixel array layer has a plurality of pixel blocks, and each pixel block has a first side. The light-blocking layer disposed above the pixel array layer and has a plurality of first light-blocking belts corresponding to the pixel blocks. The first light-blocking belt at least partially extends along the first side of its corresponding pixel block. Accordingly, the outgoing light emitted at a larger angle from the pixel blocks can be at least partially blocked.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 4, 2019
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Yi-Hong Chen, Chung-Chia Chen, Meng-Ting Lee
  • Patent number: 10310341
    Abstract: Disclosed is a display device and a method of manufacturing the same, wherein an end portion of a pad provided on a first substrate is spaced apart and separated from an upper surface of the first substrate, and a connection electrode electrically connected with the pad is in contact with a lateral surface of the pad and a lower surface of the pad.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: June 4, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: WonJun Choi, SungLim Nam, Misun Park, Jaewoong Choi, Younghyun Kong
  • Patent number: 10312307
    Abstract: Disclosed are an electroluminescent display device and a method of manufacturing the same. The electroluminescent display device includes a first bank on a substrate, an anode electrode extending to one side and another side of the first bank in an area exposed by the first bank, a second bank on each of one side and another side of the anode electrode, a light emitting layer on an upper surface of the anode electrode exposed by the second bank, and a cathode electrode on the light emitting layer. Since the anode electrode is provided on the first bank, the anode electrode is prevented from being damaged in a process of patterning the first bank.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: June 4, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: SeungHan Paek, Jeongwon Lee, Jonghoon Yeo, Jihoon Lee
  • Patent number: 10312470
    Abstract: Embodiments relate to a method of forming an organic light emitting diode (OLED) display device. A first inorganic layer, a first organic layer, and a second inorganic layer are formed on pixel regions of an OLED display device. At least part of a first inorganic layer is formed using atomic layer deposition (ALD), such that the first inorganic layer completely covers particles generated on the OLED. Embodiments also relate to an OLED display device with pixel regions, each pixel region including an OLED, a bank layer across a boundary between adjacent pixel regions, and a first inorganic layer on at least a portion of the OLED and the bank layer. The first inorganic layer includes a first inorganic sub-layer and a second inorganic sub-layer.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: June 4, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: Jae-Young Lee, Ji-Min Kim, Gi-Youn Kim, Sang-Hoon Oh
  • Patent number: 10302288
    Abstract: The present invention relates to a device carrier (10) for a strip-lighting luminaire, comprising: first lines (14) for forming a first power supply circuit; second lines (14) for forming a second power supply circuit; and at least one converter unit (12) for electrically coupling the first to the second power supply circuit, said converter unit being mounted on the device carrier (10). The first lines (14) are arranged on a rear face of the device carrier (10) so that the first lines (14) are concealed by the device carrier (10) in the mounted state of the strip-lighting luminaire. The invention further relates to a strip-lighting luminaire comprising at least one device carrier (10) according to the invention.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: May 28, 2019
    Assignee: ZUMTOBEL LIGHTING GMBH
    Inventors: Martin Bader, Wolfgang Bechter, Wolfgang Gadner, Gerald Ladstatter
  • Patent number: 10304375
    Abstract: A display panel with integrated micro-reflectors. The display panel also includes an array of pixel light sources (e.g., micro-LEDs) electrically coupled to corresponding pixel driver circuits (e.g., FETs). The micro-LEDs produce light and the micro-reflectors reduce the divergence of the light produced by the micro-LEDs. Different designs are possible. The micro-reflectors can have different shapes, include the shape of their sidewalls and the shape of their plan cross-section. The array schemes can also vary, including the number of LEDs per micro-reflector. Different fabrication approaches are also possible. In one approach, a support structure is integrated between micro-LEDs. The sides of the support structure are reflective and serve as the reflective sidewalls of the micro-reflector. Alternately, the LED mesa itself can serve as the support structure.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: May 28, 2019
    Assignee: HONG KONG BEIDA JADE BIRD DISPLAY LIMITED
    Inventors: Yijing Chen, Fang Ou, Wing Cheung Chong, Lei Zhang, Qiming Li
  • Patent number: 10305011
    Abstract: A light emitting apparatus includes a package having a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view. The package includes first and second leadframes and a resin portion. The first leadframe has a first leadframe main portion and a first leadframe extension portion which has narrower width than that of the first leadframe main portion. The second leadframe has a second leadframe main portion and a second leadframe extension portion which has narrower width than that of the second leadframe main portion. An inclined portion is formed between the first leadframe and the second leadframe as viewed in plan view. An upper end of the inclined portion is shifted from a lower end of the inclined portion.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: May 28, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Shimpei Sasaoka, Takuya Nakabayashi
  • Patent number: 10292235
    Abstract: A display device is provided. The display device includes a substrate and a light emitting unit disposed on the substrate. The light emitting unit includes an electrode electrically connected to a semiconductor layer. The electrode has a first surface farthest from the semiconductor layer and the semiconductor layer has a second surface adjacent to the electrode. A roughness of the first surface is greater than a roughness of the second surface.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: May 14, 2019
    Assignee: INNOLUX CORPORATION
    Inventors: Tsung-Han Tsai, Kuan-Feng Lee, Yu-Hsien Wu, Yuan-Lin Wu
  • Patent number: 10290782
    Abstract: A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: May 14, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Siegfried Herrmann, David O'Brien, David Racz
  • Patent number: 10290832
    Abstract: A display unit includes a plurality of pixels, a reflector layer, and an auxiliary electrode. Each of the plurality of pixels has a first electrode, an organic layer, and a second electrode in this order. The organic layer and the second electrode are provided on the first electrode. The organic layer includes a light-emitting layer. The reflector layer has a light-reflecting surface around each of the pixels. The auxiliary electrode is provided on the reflector layer and is projected from an upper end of the light-reflecting surface. The auxiliary electrode has a portion which is exposed from the organic layer, and the exposed portion is covered with the second electrode.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: May 14, 2019
    Assignee: SONY CORPORATION
    Inventor: Daisuke Ueda
  • Patent number: 10290675
    Abstract: The invention provides an LED module having a concentrated light output window. Light output from a first output window of an LED assembly (e.g. from a plurality of LEDs) is passed to an input window of a light directing element and redirected to be emitted from a second, smaller output window of a light directing element. This difference in size thereby concentrates the light output by the light directing element. The second output window (of the light directing element) is substantially perpendicular to the first output window, allowing for the size of the LED assembly in a particular dimension to not be necessarily constrained by the size of the second output window.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: May 14, 2019
    Assignee: Lumileds Holding B.V.
    Inventors: Norbertus Antonius Maria Sweegers, Marc André De Samber
  • Patent number: 10290786
    Abstract: A transparent light emitting diode film is disclosed. The transparent light emitting diode film includes a base, an electrode layer positioned on the base and having at least one pattern, a pad formed on at least a portion of the electrode layer, a light emitting diode positioned on the pad, and an adhesive layer formed on at least another portion of the electrode layer. The adhesive layer includes first and second adhesive layers each having a different adhesive strength.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: May 14, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Daewoon Hong, Sangtae Park, Jeongsik Choi, Dongjin Yoon
  • Patent number: 10292220
    Abstract: Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: May 14, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Chung Hoon Lee, James S. Speck, Hong San Kim, Jae Jo Kim, Sung Han Kim, Jae Ho Lee
  • Patent number: 10288231
    Abstract: A light engine for a tube lamp has a substrate defining a longitudinal direction, having at least three conductive traces extending in the longitudinal direction. At least two of the conductive traces are divided into a plurality of trace sections. The light engine further includes a plurality of semiconductor light emitting elements, each light emitting element having two electric terminals and being arranged perpendicular to the longitudinal direction and electrically connected with a first electric terminal to one of the conductive traces and with a second electric terminal to another one of the conductive traces.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: May 14, 2019
    Assignee: LEDVANCE GMBH
    Inventors: Bernhard Rieder, Christoph Strauß, Florian Wagner, Xiongqiang He
  • Patent number: 10283532
    Abstract: Provided is a novel semiconductor device. The semiconductor device comprises a first transistor and a second transistor. The first transistor comprises a first gate electrode; a first insulating film over the first gate electrode; a first oxide semiconductor film over the first insulating film; a first source electrode and a first drain electrode over the first oxide semiconductor film; a second insulating film over the first oxide semiconductor film, the first source electrode, and the first drain electrode; and a second gate electrode over the second insulating film.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 7, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Hiroyuki Miyake, Kenichi Okazaki, Yasuharu Hosaka, Yukinori Shima
  • Patent number: 10281123
    Abstract: An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: May 7, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Chih-Ping Ho, Chih-Wei Liao, Shyi-Ming Pan
  • Patent number: 10283363
    Abstract: A quasi-vertical Schottky diode architecture includes a topside anode contact that connects to external circuitry through an airbridge finger, a thin mesa of semiconductor material with epilayers including a bottomside highly-doped layer, a bottomside ohmic contact directly below the anode, and a host substrate onto which the diode material is bonded by a thin adhesive layer. A method of fabricating the diode architecture includes preparation of the semiconductor wafer for processing (including initial etching to expose the highly-doped epilayer, deposition of metals and annealing to form the ohmic contact, application of the adhesive layer to the host substrate, thermal compression bonding of diode wafer and host wafer, with ohmic contact side facing host wafer to form a composite wafer, etching and formation of diode mesas to isolate devices on the host substrate, lithography and formation of topside anode contact and external circuitry on host wafer).
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: May 7, 2019
    Assignee: UNIVERSITY OF VIRGINIA PATENT FOUNDATION
    Inventors: Naser Alijabbari, Robert M. Weikle, II, Matthew Bauwens
  • Patent number: 10283732
    Abstract: The present invention provides an OLED packaging method and an OLED package structure. The OLED packaging method according to the present invention is such that a first outer bound confinement layer is first formed and then, a first organic layer is formed on the first inorganic layer in an area enclosed by the first outer bound confinement layer so that facilities for forming the first organic layer can be diversified and an organic material used to form the first organic layer is not subjected to constraint in respect of viscosity thereof, whereby using an organic material with a reduced viscosity allows for better homogeneity of the first organic layer, the thickness reduced, and thus helping reduce a curving radius of the OLED package structure to realize rollable displaying with a reduced curving radius.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: May 7, 2019
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Jiangjiang Jin, Hsianglun Hsu
  • Patent number: 10283497
    Abstract: The present invention provides a light-emitting diode (LED) chip. The LED chip includes a LED structure and an electrostatic discharge (ESD) protection structure. The ESD protection structure is in a corner of the LED chip and connects with the LED structure in anti-parallel. An interface between the LED structure and the ESD protection structure is a straight line from a top view.
    Type: Grant
    Filed: November 27, 2016
    Date of Patent: May 7, 2019
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Shiou-Yi Kuo, Chao-Hsien Lin, Ya-Ru Yang
  • Patent number: 10276759
    Abstract: A process method for bond-packaging an LED using a special-shaped organic silicone resin photoconverter includes the following continuous process flow: roll-molding of a refined photoconversion sheet, roll-shaping of a photoconversion sheet array, sheet melting for the photoconversion sheet array, preparation of a flip chip LED array sheet, forming of LED package elements by roll-bonding, curing of the LED package elements, and cutting of the LED package elements. The present invention has a significant advantage of bond-packaging an LED by continuous rolling, and can meet a condition requirement of bond-packaging an LED using a special-shaped organic silicone resin photoconverter, thereby enhancing the production efficiency and yield of LED packages in industrialized batch production.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: April 30, 2019
    Assignee: Jiangsu Cherrity Optronics Co., Ltd.
    Inventor: Jinhua He
  • Patent number: 10276766
    Abstract: The light-emitting device of the present invention includes: a support; a plurality of light-emitting elements arranged in a row on the support; and a conductor trace portion configured from a plurality of conductor traces which extend on the support from one end portion of the row to the other end portion of the row which are each electrically connected to each of the plurality of light-emitting elements. Each of the plurality of conductor traces is configured such that the trace width in the direction of extension in a region under one light-emitting element to which the conductor trace is electrically connected is greater than the trace width in a region extending in the direction of extension side by side with a conductor trace connected to a light-emitting element disposed closer to the one end portion than the one light-emitting element is.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: April 30, 2019
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventors: Ryosuke Kawai, Mamoru Miyachi
  • Patent number: 10274143
    Abstract: A light emitting device including: a substrate; first and second light emitting units disposed on the substrate separate from each other and respectively including first and second light emitting diodes, on which first and second wavelength converters are respectively disposed; first and second bonding layers interposed between the substrate and the first and second light emitting units, respectively; a sidewall disposed surrounding and adjoining side surfaces of the first and second light emitting units; and a filler evenly disposed in the sidewall and capable of reflecting light from the first and second light emitting units, wherein the substrate includes plurality electrodes, wherein a first portion of the sidewall directly contacts both of the first light emitting diode and the second light emitting diode, and wherein a second portion of the sidewall separates and directly contacts the first wavelength converter and the second wavelength converter.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: April 30, 2019
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Yoon Seop Lee, Da Hye Kim, Sang Hong Lee, Byoung Kyu Park, Dae Wook Kim, Jae Hyun Park
  • Patent number: 10269829
    Abstract: An array substrate and a flexible display panel are provided. The array substrate includes a flexible substrate, a thin film transistor, a first metal layer, a second metal layer and a stacked structure including multiple inorganic layers. The thin film transistor includes a source, a drain, a channel and a gate. The gate of the thin film transistor is insulated from the source, the channel and the drain. The multiple inorganic layers include one or more buffer layers between the flexible substrate and the thin film transistor, one or more gate insulating layers between a channel area and the gate, and a first isolating layer between the thin film transistor and the second metal layer. At least one inorganic layer of the multiple inorganic layers has multiple openings at a position corresponding to a display area.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 23, 2019
    Assignees: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD., TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Chuanli Leng, Sera Kenji, Haijing Chen
  • Patent number: 10263151
    Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to light emitting diodes and methods of manufacture. The method includes: forming fin structures with a doped core region, on a substrate material; forming a first color emitting region by cladding the doped core region of a first fin structure of the fin structures, while protecting the doped core regions of a second fin structure and a third fin structure of the fin structures; forming a second color emitting region by cladding the doped core region of the second fin structure, while protecting the doped core regions of the first fin structure and the third fin structure; and forming a third color emitting region by cladding the doped core region of the third fin structure, while protecting the doped core regions of the first fin structure and the second fin structure.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: April 16, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Ajey P. Jacob, Srinivasa Banna, Deepak Nayak
  • Patent number: 10255855
    Abstract: A pixel of an organic light emitting diode display device includes a scan transistor configured to connect a data line to a first node in response to a scan signal, a storage capacitor connected between the first node and a first power supply voltage, a compensation capacitor connected between the first node and a second node, a driving transistor having a gate connected to the second node, a source connected to the first power supply voltage, and a drain connected to a third node, a compensation transistor configured to connect the second node to the third node in response to a compensation control signal, an organic light emitting diode connected between the third node and a second power supply voltage, and an initialization transistor configured to transfer an initialization voltage in response to an initialization control signal.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: April 9, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Kyong-Tae Park, Kyu-Sik Cho, Jin-A Lee
  • Patent number: 10256217
    Abstract: A light emitting device includes a circuitry substrate and multiple light emitting diodes (LEDs) bonded to the circuitry substrate in a spaced array. The light emitting device also includes a continuous and substantially flat wavelength conversion member covering the light emitting diodes (LEDs) configured to convert the electromagnetic radiation emitted by the light emitting diodes (LEDs) into another wavelength range. The light emitting device also includes a planarized layer configured to support the wavelength conversion member on the circuitry substrate. The light emitting device can also include a light shaper on the wavelength conversion member configured to form emitting windows for the electromagnetic radiation transmitted through the wavelength conversion member forming an output light beam having a desired emitting window size, shape, and edge and to block and minimize scattered electromagnetic radiation from the wavelength conversion layer.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: April 9, 2019
    Assignee: TSLC CORP.
    Inventors: Po-Wei Lee, C. Chu, Tzu-Han Lin
  • Patent number: 10253963
    Abstract: An LED module with high flame retardant grade includes a base, lens group, flame retardant film and at least one LED luminary unit. The flame retardant film is provided on a first side of the base with at least one hole on the flame retardant film. The LED luminary unit is provided on the first side of the base and passes through the hole with the lens group being covered onto the first side of the base. A first closed space is formed between the lens group and base. The flame retardant film can effectively cut off circuit sparks generated by a circuit layer or by a PCB board on the base, effectively reducing security risks. The module has a high flame retardant grade after being provided with the flame retardant film and the LED module has a simple structure and is easy to process and implement.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: April 9, 2019
    Assignee: HANGZHOU HPWINNER OPTO CORPORATION
    Inventors: Kai Chen, Jianming Huang
  • Patent number: 10256383
    Abstract: A light emitting device includes an LED chip to emit light, and a light emitting element holding member that includes a base on which the LED chip is disposed and a wall standing from the base such that the wall has an inner surface that faces the LED chip. The wall includes inner surfaces that are formed in black, and inner surfaces that are formed in white. The inner surfaces that are formed in black mutually oppose each other. The inner surfaces that are formed in white mutually oppose each other in a direction orthogonal to the direction in which the inner surfaces that are formed in black mutually oppose each other.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: April 9, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Masato Teranishi, Satoru Kiridoshi
  • Patent number: 10256281
    Abstract: An organic light emitting display device includes, a light emitting structure, a pixel defining structure that includes first and second pixel defining layers, and a first wiring. The light emitting structure is disposed on a substrate and includes a pixel electrode, an organic light emitting layer and an opposite electrode. The first pixel defining layer is disposed on the substrate and partially covers the pixel electrode. The second pixel defining layer is disposed on the first pixel defining layer. The first wiring is disposed between the substrate and the first pixel defining layer and between the substrate and the second pixel defining layer, and is in contact with the first pixel defining layer and the second pixel defining layer. An adhesive strength between the second pixel defining layer and the first wiring is greater than an adhesive strength between the second pixel defining layer and the first pixel defining layer.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Jae-Hoon Kim
  • Patent number: 10249803
    Abstract: A light-emitting device and a method of manufacturing a light-emitting device are provided. The light-emitting device includes a transparent substrate having a first surface and a second surface opposite to the first surface, a light-emitting structure disposed on the first surface of the transparent substrate, a sealing layer, a carrier board, and a positive electrode and a negative electrode. The transparent substrate, the light-emitting structure, the sealing layer and the carrier board have corresponding through holes respectively, and at least one of the positive electrode and the negative electrode is disposed on the second surface of the transparent substrate.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: April 2, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Hsuan-Yu Lin, Ting-Yu Wang, Chih-Ming Lai
  • Patent number: RE47504
    Abstract: The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: July 9, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Toshiyuki Hashimoto