HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER
An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.
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1. Technical Field
The present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating a heat spreader.
2. Description of Related Art
Electronic components, such as central processing units (CPUs) comprising numerous circuits operate at high speed and generate substantive heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably. Typically, a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
However, as the operating speed of the electronic components has been continually upgraded, these kinds of conventional heat dissipation devices can no longer meet the heat dissipation requirements of modern electronic components.
What is needed, therefore, is a heat dissipation device which can overcome the above-described problems.
Many aspects of the present heat dissipation device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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The covering plate 13 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof. The covering plate 13 has a rectangular profile. A center portion of the covering plate 13 is protruded upwardly, thereby forming a second receiving portion 130. A periphery of the covering plate 13 is an annular frame 132 surrounding the second receiving portion 130 (as shown in
The fin set 20 comprises a plurality of parallel fins 21. A passage (not labeled) is defined between every two adjacent fins 21 to allow airflow to flow therethrough. Each of the fins 21 comprises an upright sheet body and a pair of flanges bent horizontally from top and bottom of the sheet body and engaging the sheet body of an adjacent fin 21. The flanges at a bottom face of the fin set 20 thermally contact a top face of the covering plate 13. The fin set 20 occupies substantially the whole top face of the covering plate 13 except locations where the through holes 100 are located.
In use of the heat dissipation device, the base 11 of the heat spreader 10 thermally contacts and absorbs heat from the electronic component. The working medium in the first chamber 111 is heated and vapored upwardly to reach the partition board 12 of the heat spreader 10. At the partition board 12, the vapored working medium exchanges heat with the partition board 12 and then is condensed to liquid. The liquid refluences to the base 11 via the second wick structure 120 and the first wick structure 114. As heat accumulated in the partition board 12, the working medium in the second chamber 131 is heated and vapored upwardly to reach the covering plate 13 of the heat spreader 10. Then the vapored working medium exchanges heat with the covering plate 13 and then is condensed to liquid. The liquid refluences to the partition board 12 via the fourth wick structure 134 and the third wick structure 122. The vapored and condensed cycle continues, so heat absorbed by the heat spreader 10 is efficiently transferred to the fin set 20 placed on the covering plate 13 to be dissipated into ambient. Thus, heat dissipation efficiency of the heat dissipation device is greatly improved.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A heat dissipation device comprising:
- a heat spreader comprising a base for absorbing heat from a heat source, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board, a first chamber sealed being defined between the base and the partition board, and a second sealed chamber being defined between the partition board and the covering plate, the second chamber being remote from the base; and
- a fin set placed on the heat spreader.
2. The heat dissipation device of claim 1, wherein a central portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber.
3. The heat dissipation device of claim 2, wherein an empty zone is defined under a periphery of the base and surrounds the first chamber.
4. The heat dissipation device of claim 2, wherein a central portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber.
5. The heat dissipation device of claim 4, wherein an area of the first chamber is smaller than that of the second chamber.
6. The heat dissipation device of claim 4, wherein a first wick structure is formed on an inner face of the first receiving portion.
7. The heat dissipation device of claim 6, wherein a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure.
8. The heat dissipation device of claim 4, wherein a fourth wick structure is formed on an inner face of the second receiving portion.
9. The heat dissipation device of claim 8, wherein a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure.
10. The heat dissipation device of claim 1, wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate working medium therein.
11. The heat dissipation device of claim 1, wherein the second chamber is located above the first chamber.
12. A heat spreader comprising:
- a base for absorbing heat from a heat source;
- a partition board hermetically placed on the base, and a first chamber being defined between the base and the partition board; and
- a covering plate hermetically placed on the partition board, a second chamber being defined between the partition board and the covering plate, and the second chamber being separated from the base by the partition board.
13. The heat spreader of claim 12, wherein a center portion of the base is recessed downwardly to form a first receiving portion, and the partition board seals the first receiving portion to form the first chamber.
14. The heat spreader of claim 13, wherein a plurality of empty zones are defined at a bottom of the base and surround the first chamber.
15. The heat spreader of claim 13, wherein a center portion of the covering plate is protruded upwardly to form a second receiving portion, and the partition board seals the second receiving portion to form the second chamber.
16. The heat spreader of claim 15, wherein an area of the first chamber is smaller than that of the second chamber.
17. The heat spreader of claim 15, wherein a first wick structure is formed on an inner face of the first receiving portion, a second wick structure is formed on a bottom face of the partition board, and an outer periphery of the second wick structure is communicated with the first wick structure.
18. The heat spreader of claim 15, wherein a fourth wick structure is formed on an inner face of the second receiving portion, a third wick structure is formed on a top face of the partition board, and an outer periphery of the third wick structure is communicated with the fourth wick structure.
19. The heat spreader of claim 12, wherein the first chamber and the second chamber are both vacuum-exhausted, and accommodate a working medium or fluid therein.
20. A heat spreader comprising a base and a cover cooperatively defining a sealed space therein, a partition board being placed on the sealed base and dividing the sealed base into two separated chambers, each of the two separated chambers accommodating working medium therein.
Type: Application
Filed: Sep 7, 2011
Publication Date: Feb 28, 2013
Applicants: FOXCONN TECHNOLOGY CO., LTD. (Tu-Cheng), FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. (Shenzhen City)
Inventors: JUN XIAO (Shenzhen City), MIN LI (Shenzhen City), MENG FU (Shenzhen City), CHUN-CHI CHEN (Tu-Cheng)
Application Number: 13/227,460
International Classification: F28D 15/04 (20060101);