SURROGATE IMPLANTED MEDICAL DEVICE FOR ENERGY DISSIPATION OF EXISTING IMPLANTED LEADS DURING MRI SCANS
A surrogate implantable medical device includes a thermally conductive and electrically conductive housing. A header connector block includes a header block body, where the header block body is attached to the housing. At least one connector cavity is located within the header block body and configured to be attachable to an implantable lead. At least one conductive leadwire is disposed at least partially within the header block body having a first end and a second end. The at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing. The housing does not contain active electronics.
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This non-provisional application claims priority to provisional application 61/780,426 filed on Mar. 13, 2013; and this application if a continuation-in-part of application Ser. No. 14/192,835 filed on Feb. 27, 2014; the contents of which all applications are fully incorporated herein with this statement.
FIELD OF THE INVENTIONThe present invention generally relates to non-MRI approved active implantable medical devices (AIMDs) such as, cardiac pacemakers, implantable cardioverter defibrillators (ICD), cardiac resynchronization therapy (CRT) devices, neurostimulators and related leads. More specifically, the present invention relates to a surrogate AIMD that is MRI compatible for temporary attachment to implanted leads during MRI scans.
BACKGROUND OF THE INVENTIONTransvenous cardiac pacemakers and ICDs using leads threaded into the right sided chambers of the heart through the venous system have evolved over the years from single chamber (one implanted lead) to dual chamber (two implanted leads); then to single and eventually dual chamber ICDs. More recently with the wider recognition of the increased incidence of heart failure secondary to right sided pacing of the heart, as well to numerous other etiologies, CRT devices have been developed with left sided chamber leads delivered transvenously to endocardial locations, and/or on through the coronary sinus to left ventricular epicardial locations, and/or with a variety of transthoracic approaches to direct epicardial or intramyocardial left ventricular or left atrial stimulation sites.
In a typical prior art dual chamber defibrillator system, there is a trifurcated ventricular lead connector, with one arm providing low voltage IS-1 pace-sense function and two arms providing high voltage DF-1 connections. An advantage of this configuration was that if one of the high voltage or low voltage components of this type of lead failed, it could be corrected relatively simply by implanting a replacement single function lead, disconnecting the failed component from the pulse generator header and plugging the replacement lead's connector into that connector cavity thereby abandoning the failed lead. However, along with the AIMD, the trifurcated connector considerably increased the mass in a patient's pectoral (or other) pocket. Furthermore, the multitude of leads provided the opportunity for cross connections at the time of initial implant. Also, as the complexity of leads increased so did the chance of lead failure and increased the difficulty and risks associated with subsequent pulse generator or lead replacement/repair surgery.
The ISO 27186 Standard for DF4 and IS4 quadripolar connector systems evolved in order to replace the mechanically and functionally complex trifurcated connector with a single lead connector encompassing multiple sequential electrodes and functions requiring only a single set screw for lead fixation and electrical activation of the pin electrode. This minimized the number and size of connector cavities (ports) in defibrillator headers. In turn, this simplified surgical implant procedures and reduced the risk of technical errors. However, lead conductor failures, particularly of IS4 and DF4 style leads have still occurred.
Failure of an implanted medical lead can occur for a variety of reasons, including dislodgement at or migration from the electrode-tissue interface, complete or partial fracture or breakage of a lead conductor, abrasion or cracking or other forms of lead insulation disruption leading to low insulation resistance and low impedance measurements. Low insulation resistance can occur between a lead conductor and body fluid or between a lead conductor and adjacent lead conductors. Other reasons for failure include an increase in lead conductor impedance, an increase of the pacing capture threshold, or just the failure to deliver appropriate, effective or optimal therapy. As defined herein, a lead conductor failure may include one or more of any of the aforementioned conditions.
When a lead fails it is not always practical to extract an IS4 or DF4 lead even if a single conductor or function has failed. The lead extraction procedure becomes particularly more difficult as the duration of implantation lengthens. Over time, the lead typically becomes adhered to tissue due to the formation of scar tissue, tissue ingrowth and the like thus requiring a more invasive procedure to be performed. On the other hand, simply abandoning a defective IS4 or DF4 lead is problematic, because abandoning the old lead and implanting a new one can lead to venous occlusion and interference with closure of the tricuspid valve leaflets etc. Further, stacked ICD leads with large surface area and high voltage coil electrodes tend to induce significant fibrous tissue reaction, binding the leads together and to the surrounding tissues making extraction procedures even more hazardous. Yet extraction may in some cases become unavoidable because of the development of endocarditis or other complications.
Incorporation of the low and high voltage contacts of an older trifurcated connector defibrillator lead into the newer single DF4 (or its low voltage IS4 counterpart) has a number of functional limitations, but physically DF4 is a great improvement as it: (1) reduces the total volume of the implantable system; (2) reduces the number of set screws required to connect the lead to the defibrillator; (3) reduces the need for tissue dissection within the pocket during replacement; (4) reduces lead-on-lead interactions within the implant site or pocket; and (5) eliminates the potential for DF-1 connectors from being reversed in the defibrillator header. However all of these mechanical and procedural advantages are essentially lost if there is a failure of one of the multiple lead conductors, insulation (and/or their associated electrodes) either through damage or failure to deliver effective therapy.
A failure of one lead conductor in a DF4 system leaves the physician with several bad choices. The physician can put the patient, themselves and their surgical team through a potentially difficult lead explant/extraction surgery and then put in a new DF4 lead. This is not without significant risk. Or, the implanting physician could throw away the still functional defibrillator pulse generator and try to obtain a custom replacement pulse generator with all the original connector cavities including DF4, plus an additional DF-1 connector cavity for a case where a high voltage shocking coil component of the multifunctional lead system has failed, or, plus an additional IS-1 connector cavity where a component of the low voltage pace sense multifunctional lead system has failed. If this type of device was obtainable the physician could then plug the partially defective DF4 lead connector into the new DF4 header connector cavity, implant a new DF-1 lead or IS-1 lead, as indicated and in parallel with the pre-existing DF4 lead system, and insert it into the new header's additional DF-1 or IS-1 connector cavity. However, the new ICD would cost over $20,000 and would need to be specific to not only the DF4 component failure at hand, but also to the specific subtype of ICD being replaced, i.e., single chamber, dual chamber or resynchronization. Further, to date no manufacturer has agreed to produce the series of at least 6 custom ICDs necessary to repair all combinations of lead malfunction and ICD subtypes. The cost of maintaining the whole range of replacement devices in inventory would also be high.
There are a number of problems with abandoned leads, including the problem of MRI RF field-induced overheating of such a lead or its distal electrode. Prior art abandoned lead components are problematic during MRI scans because they can pick up high-power RF induced energy which can lead to overheating of the lead and/or its distal electrode, which can heat up or even burn surrounding heart tissue. Implanted leads are generally less dangerous when they are connected to a pulse generator. The reason for this is that prior art pulse generators, including pacemakers and defibrillators generally have a feedthrough filter capacitor at the point of lead conductor ingress through the hermetic seal of the active implantable medical device. At high frequencies, such as for MRI RF pulsed frequencies, this EMI filter provides a low impedance path between the lead conductors and the AIMD housing which acts as an energy dissipating surface. Accordingly, in a high power MRI environment, much of the RF energy that is induced in the lead is diverted by the feedthrough capacitor where it is dissipated as a small temperature rise on the relatively large surface area of the pacemaker housing, which is usually a titanium housing. However, when a lead is abandoned, there is no place for this MRI RF energy to go other than at the distal tip electrode, which can still be in contact with biological cells. This can lead to significant overheating. For additional information regarding the danger of abandoned lead conductors, one is referred to a published paper entitled, PACEMAKER LEAD TIP HEATING IN ABANDONED AND PACEMAKER-ATTACHED LEADS AT 1.5 TESLA MRI, published in the Journal of Magnetic Resonance Imaging 33:426-431 (2011).
The safety and feasibility of MRI in patients with cardiac pacemakers is an issue of gaining significance. The effects of MRI on patients' pacemaker systems have only been analyzed retrospectively in some case reports. There are a number of papers that indicate that MRI on new generation pacemakers can be conducted up to 0.5 Tesla (T). MRI is one of medicine's most valuable diagnostic tools. MRI is, of course, extensively used for imaging, but is also used for interventional medicine (surgery). In addition, MRI is used in real time to guide ablation catheters, neurostimulator tips, deep brain probes and the like. An absolute contra-indication for pacemaker patients means that pacemaker and ICD wearers are excluded from MRI. This is particularly true of scans of the thorax and abdominal areas. Because of MRI's incredible value as a diagnostic tool for imaging organs and other body tissues, many physicians simply take the risk and go ahead and perform MRI on a pacemaker patient. The literature indicates a number of precautions that physicians should take in this case, including limiting the power of the MRI RF Pulsed field (Specific Absorption Rate—SAR level), programming the pacemaker to fixed or asynchronous pacing mode, and then careful reprogramming and evaluation of the pacemaker and patient after the procedure is complete. There have been reports of latent problems with cardiac pacemakers or other AIMDs after an MRI procedure sometimes occurring many days later. Moreover, there are a number of recent papers that indicate that the SAR level is not entirely predictive of the heating that would be found in implanted lead wires or devices. For example, for magnetic resonance imaging devices operating at the same magnetic field strength and also at the same SAR level, considerable variations have been found relative to heating of implanted lead wires. It is speculated that SAR level alone is not a good predictor of whether or not an implanted device or its associated lead wire system will overheat.
There are three types of electromagnetic fields used in an MRI unit. The first type is the main static magnetic field designated B0 which is used to align protons in body tissue. The field strength varies from 0.5 to 3.0 Tesla in most of the currently available MRI units in clinical use. Some of the newer MRI system fields can go as high as 4 to 5 Tesla. At the recent International Society for Magnetic Resonance in Medicine (ISMRM), which was held on 5 and 6 Nov. 2005, it was reported that certain research systems are going up as high as 11.7 Tesla. This is over 100,000 times the magnetic field strength of the earth. A static magnetic field can induce powerful mechanical forces and torque on any magnetic materials implanted within the patient. This would include certain components within the cardiac pacemaker itself and or lead wire systems. It is not likely (other than sudden system shut down) that the static MRI magnetic field can induce currents into the pacemaker lead wire system and hence into the pacemaker itself. It is a basic principle of physics that a magnetic field must either be time-varying as it cuts across the conductor, or the conductor itself must move within the magnetic field for currents to be induced.
The second type of field produced by magnetic resonance imaging is the pulsed RF field which is generated by the body coil or head coil. This is used to change the energy state of the protons and illicit MRI signals from tissue. The RF field is homogeneous in the central region and has two main components: (1) the magnetic field is circularly polarized in the actual plane; and (2) the electric field is related to the magnetic field by Maxwell's equations. In general, the RF field is switched on and off during measurements and usually has a frequency of 21 MHz to 64 MHz to 128 MHz depending upon the static magnetic field strength. The frequency of the RF pulse varies with the field strength of the main static field where: RF PULSED FREQUENCY in MHz=(42.56) (STATIC FIELD STRENGTH IN TESLA).
The third type of electromagnetic field is the time-varying magnetic gradient fields designated B1 which are used for spatial localization. These change their strength along different orientations and operating frequencies on the order of 1 kHz. The vectors of the magnetic field gradients in the X, Y and Z directions are produced by three sets of orthogonally positioned coils and are switched on only during the measurements. In some cases, the gradient field has been shown to elevate natural heart rhythms (heart beat). This is not completely understood, but it is a repeatable phenomenon. The gradient field is not considered by many researchers to create any other adverse effects.
It is instructive to note how voltages and EMI are induced into an implanted lead wire system. At very low frequency (VLF), voltages are induced at the input to the cardiac pacemaker as currents circulate throughout the patient's body and create voltage drops. Because of the vector displacement between the pacemaker housing and, for example, the TIP electrode, voltage drop across the resistance of body tissues may be sensed due to Ohms Law and the circulating current of the RF signal. At higher frequencies, the implanted lead wire systems actually act as antennas where currents are induced along their length. These antennas are not very efficient due to the damping effects of body tissue; however, this can often be offset by extremely high power fields (such as MRI pulsed fields) and/or body resonances. At very high frequencies (such as cellular telephone frequencies), EMI signals are induced only into the first area of the lead wire system (for example, at the header block of a cardiac pacemaker). This has to do with the wavelength of the signals involved and where they couple efficiently into the system.
Magnetic field coupling into an implanted lead wire system is based on loop areas. For example, in a cardiac pacemaker, there is a loop formed by the lead wire as it comes from the cardiac pacemaker housing to its distal TIP, for example, located in the right ventricle. The return path is through body fluid and tissue generally straight from the TIP electrode in the right ventricle back up to the pacemaker case or housing. This forms an enclosed area which can be measured from patient X-rays in square centimeters. The average loop area is 200 to 225 square centimeters. This is an average and is subject to great statistical variation. For example, in a large adult patient with an abdominal implant, the implanted loop area is much larger (greater than 450 square centimeters).
Patients that have non-MRI approved AIMDs do not currently have good options in getting an MRI scan performed. A new MRI approved pacemaker can be implanted within the patient, yet the abandoned leads become problematic. An abandoned lead can heat during an MRI procedure just as an active lead would. However, the abandoned lead is not electrically coupled to an AIMD housing and is therefore not able to dissipate its energy safely into an AIMD housing away from vital body tissue. In some of the prior art, a lead cap has been used to attach to the proximal end of the abandoned lead. The abandoned lead cap can also comprise a significant amount of mass similar to the housing of an AIMD. The abandoned lead cap is then used to help divert energy from the lead itself during an MRI procedure. However, the efficiency and size of the abandoned lead cap is subject to available space limitations inside the human body. Furthermore, a plurality of abandoned lead caps may be required when more than one lead is being abandoned. This can result in too many lead caps being implanted into a patient. A patient could have the abandoned leads removed. However, as discussed earlier this is problematic due to tissue ingrowth and other complications.
Accordingly, there is a need for a solution for patients with non-MRI approved AIMDs that will allow them to safely and easily have an MRI scan. The present invention fulfills these needs and provides other related advantages.
SUMMARY OF THE INVENTIONAn exemplary embodiment of a surrogate implantable medical device includes a thermally conductive and electrically conductive housing. A header connector block includes a header block body, where the header block body is attached to the housing. At least one connector cavity is located within the header block body and configured to be attachable to an implantable lead. At least one conductive leadwire is disposed at least partially within the header block body having a first end and a second end. The at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing. The housing does not contain active electronics.
In other exemplary embodiments the at least one connector cavity may comprise a plurality of connector cavities. The at least one connector cavity may comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity.
A diverter element may be connected physically and electrically in series along the at least one conductive leadwire, wherein the diverter element comprises a short circuit, a resistor, a capacitor or an L-C trap filter.
The housing may comprise a hermetic terminal, wherein the at least one conductive leadwire passes through the hermetic terminal in non-conductive relation to the housing, and wherein the diverter element is disposed on an inside of the housing.
A lead adapter may be associated with the header connector block, the lead adapter comprising a header plug electrically connected to at least two auxiliary connector cavities, where the header plug is configured to physically insert into and electrically couple to the at least one connector cavity of the header block body and where the at least two auxiliary connector cavities are configured to be respectively attachable to at least two implantable leads, wherein when the lead adapter is connected to the header connector block the at least two auxiliary connector cavities are electrically coupled to the housing.
Each of the at least two auxiliary connector cavities of the lead adapter may comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity. The lead adapter may have a low profile conforming shape, including an intermediate conformal section between the header plug and the housing for placing the at least two auxiliary connector cavities adjacent to an exterior surface of the housing when the header plug is placed within the at least one connector cavity. The lead adapter may have an exterior surface which tightly conforms to an exterior surface of the housing.
The housing may comprise a plurality of fins. The plurality of fins may be attached to a silicone substrate, where the silicone substrate comprises a thermally and/or electrically conductive additive. The housing may comprise a solid block of metal.
The housing may comprise an exterior surface, wherein the exterior surface is selected from the group consisting of a convoluted surface, a roughened surface, a plasma etching surface, a sputtering surface, a chemical etching surface, a porous coating deposition surface, a physical vapor deposition surface, a chemical vapor deposition surface, an electron beam deposition surface, a fractal coating surface, a metal nitride coating surface, a titanium nitride coating surface, a metal oxide coating surface, a metal carbide coating surface, an iridium-oxide coating surface, a nucleate high surface area morphological structure coating surface, a columnar high surface area morphological structure surface and combinations thereof.
The housing may enclose a high thermal and/or electrical conductivity substance, where the substance is selected from the group consisting of a gel, a liquid, a paste, a phase-change material and a combination thereof.
Another exemplary embodiment of the present invention discloses an auxiliary implantable medical device including a thermally conductive and electrically conductive housing receiver. A connector block comprises a block body, where the block body is attached to the housing receiver. At least one connector cavity is located within the block body and configured to be attachable to an implantable lead. At least one conductive leadwire is disposed within the block body having a first end and a second end, wherein the at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing receiver. The housing receiver is configured to receive a housing of an active implantable medical device.
In other exemplary embodiments the housing receiver may comprise a clip, where the clip may be configured to slide onto and grip the housing of the active implantable medical device. The at least one connector cavity may comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity. The at least one connector cavity may comprise a plurality of connector cavities, where each of the at least one connector cavities comprises an ISO IS-1, IS4, DF-1 or DF4 connector cavity.
A lead adapter may be associated with the connector block, where the lead adapter comprises a connector plug electrically connected to at least two auxiliary connector cavities, where the connector plug is configured to physically insert into and electrically couple to the at least one connector cavity of the block body and where the at least two auxiliary connector cavities are configured to be respectively attachable to at least two implantable leads, wherein when the lead adapter is connected to the connector block the at least two auxiliary connector cavities are electrically coupled to the housing receiver.
Each of the at least two auxiliary connector cavities of the lead adapter may comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity, and wherein the connector plug comprises an ISO IS-1, IS4, DF-1 or DF4 connector plug.
Another exemplary embodiment of the present invention is a method of performing an MRI scan on a patient with an active implanted medical device (AIMD). The method includes providing a patient with an AIMD for surgery, then providing a surrogate implantable medical device (SIMD), then removing the AIMD from the patient's pre-existing AIMD pocket, then unplugging at least one proximal plug of a pre-existing implanted lead from the AIMD, then plugging the at least one proximal plug of the pre-existing implanted lead into the at least one connector cavity of the SIMD, then implanting the SIMD into the patient's pre-existing AIMD pocket, then performing and completing an MRI scan of the patient, then removing the SIMD from the patient's pre-existing AIMD pocket, then unplugging the at least one proximal plug of the pre-existing implanted lead from the SIMD, then plugging the at least one proximal plug of the pre-existing implanted lead into the AIMD or a new AIMD, and then implanting the AIMD or the new AIMD into the pre-existing AIMD pocket.
The method may also include the step of filing the patient's pre-existing AIMD pocket with sterile saline before the step of performing and completing the MRI scan of the patient.
Another exemplary embodiment of the present invention is a method of performing an MRI scan on a patient with an active implanted medical device (AIMD). The method includes providing a patient with an AIMD for surgery, then providing an auxiliary implantable medical device (IMD), then implanting the auxiliary IMD into the patient's pre-existing AIMD pocket while also attaching the auxiliary IMD's housing receiver onto a housing of the AIMD, then unplugging at least one proximal plug of a pre-existing implanted lead from the AIMD, then plugging the at least one proximal plug of the pre-existing implanted lead into the at least one connector cavity of the auxiliary IMD, then performing and completing an MRI scan of the patient, then unplugging the at least one proximal plug of the pre-existing implanted lead from the auxiliary IMD, then removing the auxiliary IMD from the patient's pre-existing AIMD pocket, and the plugging the at least one proximal plug of the pre-existing implanted lead into the AIMD.
The method may also include step of filing the patient's pre-existing AIMD pocket with sterile saline before the step of performing and completing the MRI scan of the patient.
Other features and advantages of the present invention will become apparent from the following more detailed description, when taken in conjunction with the accompanying drawings, which illustrate, by way of example, the principles of the invention.
The accompanying drawings illustrate the invention. In such drawings:
Reference is made to section 3 of ISO Standard 27186 as providing definitions to terms and terminology which are used to describe the present invention. Accordingly, as used herein: “bipolar” means having two poles or electrodes; “connector system” refers to an assembly consisting of a lead connector and a connector cavity that are electrically and mechanically joined; “connector cavity” is defined as a cavity within the pulse generator which is intended to receive a lead connector and an identical cavity within a secondary header; “fixation zone” is a zone located in the lead connector pin and within the connector cavity where the lead connector is mechanically secured within the connector cavity; “high-voltage” is defined as electrical potentials greater than 20 volts up to 2000 volts (Note: High-voltages are generally used for defibrillating the heart); “lead connector” or “plug” is the part of the lead that is intended for insertion into the connector cavity of a pulse generator; “lead connector contacts” are defined as conductive elements on the lead connector which include the lead connector pin and lead connector rings; “lead connector pin” is defined as the most proximal conductive element of a lead connector provided for making electrical contact as well as for securing the lead connector within the connector cavity; “lead connector ring” defines angular conductive elements on the lead connector intended for making electrical contact within the connector cavity (Note: the 4-pole or quadpolar connector (DF4 or IS4) has up to 3 lead connector rings and a lead connector pin); “lead electrode” is the distal part of a lead through which electrical impulses are transmitted to or from cardiac tissue (Note: high-voltage electrodes are capable of delivering high-voltage electrical impulses; Low-voltage electrodes are used for transmitting and sensing low-voltage impulses and are generally not suitable for delivering high-voltage); “low-voltage” defines electrical potentials less than or equal to 20 volts; “pulse generator” is any type of active implantable medical device (AIMD) and particularly those devices that deliver electrical energy to effect cardiac rhythms; “securing mechanism” is defined as a mechanism within the connector cavity intended for mechanically securing the lead connector (Note: a securing mechanism can be an active mechanism, such as a set screw or it can be a passive mechanism, such as a spring contact or self-engaging latch; It can also serve a second function of providing electrical contact with the lead connector, as is the case with a set screw); “tripolar” means having three poles or electrodes.
In
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Cardiac pacemakers have been used to illustrate both the difficulty of explanting pre-existing leads and the ease by which a surrogate AIMD could be installed to enable the MRI procedure. As previously mentioned, the surrogate AIMD provides a high energy dissipation surface to remove unwanted MRI induced energy from the lead. It is important that the surrogate AIMD be of relatively low cost compared to an actual functioning AIMD. As previously mentioned the surrogate AIMD has no battery, no internal electronic circuits and not even a hermetic seal 124 that has been previously described. The surrogate AIMD is therefore limited to the can, the header block and the header block connector ports 116 and 118. In general, the surrogate AIMD will be removed and discarded after the MRI imaging procedures are completed. It will be possible, in certain embodiments, that the surrogate AIMD could be desterilized and used again.
So far, a cardiac pacemaker has been used to illustrate the principles of the present invention. It will be appreciated that lead extraction is even more difficult for other types of AIMDs, such as cochlear implants, deep brain stimulators, spinal cord stimulators and the like. In each of these cases there is a AIMD housing with a casing and then implanted leads. For example, in a cochlear implant, the implanted leads are literally shoved up into the cochlear area where they become overgrown when in contact with auditory nerves. Ripping that cochlear implant bundle back out literally would destroy the nerves that are associated with it. In other words, lead extraction, in that case, is simply not possible. Deep brain stimulators and spinal cord stimulators and other types of neurostimulators present similar challenges. For example, once a deep brain electrode is placed and it becomes overgrown by deep brain tissue, one can see that extracting it would it cause great trauma to surrounding brain tissues. Then one would have to go through a re-implantation procedure, which would cause even more brain trauma. Accordingly, in these cases, the surrogate AIMD of the present invention becomes very important. One only need remove the AIMD housing and replace it with the surrogate housing to safely perform procedures on all of the aforementioned structures and those devices as previously described in
In review, an implantable medical device includes a housing and a header block body. A connector cavity is located within the header block and configured to attach to an implanted lead. A conductive leadwire is electrically connected to the connector cavity at one end and at its other end connected to or through a hermetic terminal of the implanted medical device housing. The conductive leadwire is grounded to the IMD housing. In a further embodiment, the connector cavity can include a plurality of connector cavities including IS-1, DF-1, IS4 or DF4 connector cavities. When a patient with a need for an MRI has a non-MRI approved AIMD it can be temporarily replaced with the present invention that can dissipate energy from the implanted leads during the MRI scan.
Although several embodiments have been described in detail for purposes of illustration, various modifications may be made to each without departing from the scope and spirit of the invention. Accordingly, the invention is not to be limited, except as by the appended claims.
Claims
1. A surrogate implantable medical device, comprising:
- a thermally conductive and electrically conductive housing;
- a header connector block comprising a header block body, the header block body attached to the housing;
- at least one connector cavity located within the header block body configured to be attachable to an implantable lead; and
- at least one conductive leadwire disposed at least partially within the header block body having a first end and a second end, wherein the at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to an outside or an inside of the housing;
- wherein the housing does not contain active electronics.
2. The device of claim 1, wherein the at least one connector cavity comprises a plurality of connector cavities.
3. The device of claim 1, wherein the at least one connector cavity comprises an ISO IS-1, IS4, DF-1 or DF4 connector cavity.
4. The device of claim 1, including a diverter element connected physically and electrically in series along the at least one conductive leadwire, wherein the diverter element comprises a short circuit, a resistor, a capacitor, a resistor in series with a capacitor, an L-C trap filter or an R-L-C trap filter.
5. The device of claim 4, wherein the housing comprises a hermetic terminal, wherein the at least one conductive leadwire passes through the hermetic terminal in non-conductive relation to the housing, and wherein the diverter element is disposed inside of the housing.
6. The device of claim 1, including a lead adapter associated with the header connector block, the lead adapter comprising a header plug electrically connected to at least two auxiliary connector cavities, where the header plug is configured to physically insert into and electrically couple to the at least one connector cavity of the header block body and where the at least two auxiliary connector cavities are configured to be respectively attachable to at least two implantable leads, wherein when the lead adapter is connected to the header connector block the at least two auxiliary connector cavities are electrically coupled to the housing.
7. The device of claim 6, wherein each of the at least two auxiliary connector cavities of the lead adapter comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity, and wherein the header plug comprises an ISO IS-1, IS4, DF-1 or DF4 connector plug.
8. The device of claim 6, wherein the lead adapter has a low profile conforming shape, including an intermediate conformal section between the header plug and the housing for placing the at least two auxiliary connector cavities adjacent to an exterior surface of the housing when the header plug is placed within the at least one connector cavity.
9. The device of claim 6, wherein the lead adapter has an exterior surface which tightly conforms to an exterior surface of the housing.
10. The device of claim 1, wherein the housing comprises a plurality of fins.
11. The device of claim 10, wherein the plurality of fins are attached to a silicone substrate, where the silicone substrate comprises a thermally and/or electrically conductive additive.
12. The device of claim 1, wherein the housing comprises a solid block of metal.
13. The device of claim 1, wherein the housing comprises an exterior surface, wherein the exterior surface is selected from the group consisting of a convoluted surface, a roughened surface, a plasma etching surface, a sputtering surface, a chemical etching surface, a porous coating deposition surface, a physical vapor deposition surface, a chemical vapor deposition surface, an electron beam deposition surface, a fractal coating surface, a metal nitride coating surface, a titanium nitride coating surface, a metal oxide coating surface, a metal carbide coating surface, an iridium-oxide coating surface, a nucleate high surface area morphological structure coating surface, a columnar high surface area morphological structure surface and combinations thereof.
14. The device of claim 1, wherein at least a portion of the housing contains a high thermal and/or electrical conductivity substance, where the substance is selected from the group consisting of a gel, a liquid, a paste, a phase-change material and a combination thereof.
15. An auxiliary implantable medical device, comprising:
- a thermally conductive and electrically conductive housing receiver;
- a connector block comprising a block body, the block body attached to the housing receiver;
- at least one connector cavity located within the block body configured to be attachable to an implantable lead; and
- at least one conductive leadwire disposed within the block body having a first end and a second end, wherein the at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing receiver;
- wherein the housing receiver is configured to receive and electrically connect to at least a portion of a housing of an active implantable medical device.
16. The device of claim 15, wherein the housing receiver comprises a clip, the clip configured to slide onto and grip the housing of the active implantable medical device.
17. The device of claim 15, wherein the at least one connector cavity comprises an ISO IS-1, IS4, DF-1 or DF4 connector cavity.
18. The device of claim 15, wherein the at least one connector cavity comprises a plurality of connector cavities, where each of the at least one connector cavities comprises an ISO IS-1, IS4, DF-1 or DF4 connector cavity.
19. The device of claim 15, including a lead adapter associated with the connector block, the lead adapter comprising a connector plug electrically connected to at least two auxiliary connector cavities, where the connector plug is configured to physically insert into and electrically couple to the at least one connector cavity of the block body and where the at least two auxiliary connector cavities are configured to be respectively attachable to at least two implantable leads, wherein when the lead adapter is connected to the connector block the at least two auxiliary connector cavities are electrically coupled to the housing receiver.
20. The device of claim 19, wherein each of the at least two auxiliary connector cavities of the lead adapter comprise an ISO IS-1, IS4, DF-1 or DF4 connector cavity, and wherein the connector plug comprises an ISO IS-1, IS4, DF-1 or DF4 connector plug.
21. A method of performing an MRI scan on a patient with an active implanted medical device (AIMD), the method comprising:
- providing a patient with an AIMD for surgery;
- providing a surrogate implantable medical device (SIMD), comprising: a thermally conductive and electrically conductive housing; a header connector block comprising a header block body, the header block body attached to the housing; at least one connector cavity located within the header block body configured to be attachable to an implantable lead; and at least one conductive leadwire disposed at least partially within the header block body having a first end and a second end, wherein the at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to an outside or an inside of the housing; wherein the housing does not contain active electronics;
- removing the AIMD from the patient's pre-existing AIMD pocket;
- unplugging at least one proximal plug of a pre-existing implanted lead from the AIMD;
- plugging the at least one proximal plug of the pre-existing implanted lead into the at least one connector cavity of the SIMD;
- implanting the SIMD into the patient's pre-existing AIMD pocket;
- performing and completing an MRI scan of the patient;
- removing the SIMD from the patient's pre-existing AIMD pocket;
- unplugging the at least one proximal plug of the pre-existing implanted lead from the SIMD;
- plugging the at least one proximal plug of the pre-existing implanted lead into the AIMD or a new AIMD; and
- implanting the AIMD or the new AIMD into the pre-existing AIMD pocket.
22. The method of claim 21, including the step of filing the patient's pre-existing AIMD pocket with sterile saline before the step of performing and completing the MRI scan of the patient.
23. The method of claim 21, including the step of surgically closing the patient's pre-existing AIMD pocket with stitches or sutures after the step of implanting the SIMD in the patient's pre-existing AIMD pocket.
24. The method of claim 21, including the step of temporarily surgically closing the patient's pre-existing AIMD pocket with tape or adhesives after the step of implanting the SIMD in the patient's pre-existing AIMD pocket.
25. A method of performing an MRI scan on a patient with an active implanted medical device (AIMD) having a conductive housing, the method comprising:
- providing a patient with an AIMD for surgery;
- providing an auxiliary implantable medical device (IMD), comprising: a thermally conductive and electrically conductive housing receiver; a connector block comprising a block body, the block body attached to the housing receiver; at least one connector cavity located within the block body configured to be attachable to an implantable lead; and at least one conductive leadwire disposed within the block body having a first end and a second end, wherein the at least one conductive leadwire's first end is electrically connected to the at least one connector cavity and the at least one conductive leadwire's second end is electrically connected to the housing receiver; wherein the housing receiver is configured to receive and electrically connect to a conductive housing of the AIMD;
- implanting the auxiliary IMD into the patient's pre-existing AIMD pocket while also attaching the auxiliary IMD's housing receiver onto at least a portion of the conductive housing of the AIMD;
- unplugging at least one proximal plug of a pre-existing implanted lead from the AIMD;
- plugging the at least one proximal plug of the pre-existing implanted lead into the at least one connector cavity of the auxiliary IMD;
- performing and completing an MRI scan of the patient;
- unplugging the at least one proximal plug of the pre-existing implanted lead from the auxiliary IMD;
- removing the auxiliary IMD from the patient's pre-existing AIMD pocket; and
- plugging the at least one proximal plug of the pre-existing implanted lead into the AIMD.
26. The method of claim 25, including the step of filing the patient's pre-existing AIMD pocket with sterile saline before the step of performing and completing the MRI scan of the patient.
27. The method of claim 25, including the step of surgically closing the patient's pre-existing AIMD pocket with stitches or sutures after the step of implanting the auxiliary IMD into the patient's pre-existing AIMD pocket.
28. The method of claim 25, including the step of temporarily surgically closing the patient's pre-existing AIMD pocket with tape or adhesives after the step of implanting the auxiliary IMD into the patient's pre-existing AIMD pocket.
29. The method of claim 25, wherein the housing receiver comprises a conductive clip.
Type: Application
Filed: Mar 12, 2014
Publication Date: Sep 18, 2014
Applicant: Greatbatch Ltd. (Clarence, NY)
Inventors: Robert A. Stevenson (Canyon Country, CA), Richard L. Brendel (Carson City, NV)
Application Number: 14/206,152
International Classification: A61N 1/08 (20060101);