ATOMIC LAYER DEPOSITION REACTOR FOR PROCESSING A BATCH OF SUBSTRATES AND METHOD THEREOF
The invention relates to a method that includes providing a reaction chamber module of an atomic layer deposition reactor for processing a batch of substrates by an atomic layer deposition process, and loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing. The invention also relates to a corresponding apparatus.
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The present invention generally relates to deposition reactors. More particularly, but not exclusively, the invention relates to such deposition reactors in which material is deposited on surfaces by sequential self-saturating surface reactions.
BACKGROUND OF THE INVENTIONAtomic Layer Epitaxy (ALE) method was invented by Dr. Tuomo Suntola in the early 1970's. Another generic name for the method is Atomic Layer Deposition (ALD) and it is nowadays used instead of ALE. ALD is a special chemical deposition method based on the sequential introduction of at least two reactive precursor species to a substrate. The substrate is located within a reaction space. The reaction space is typically heated. The basic growth mechanism of ALD relies on the bond strength differences between chemical adsorption (chemisorption) and physical adsorption (physisorption). ALD utilizes chemisorption and eliminates physisorption during the deposition process. During chemisorption a strong chemical bond is formed between atom(s) of a solid phase surface and a molecule that is arriving from the gas phase. Bonding by physisorption is much weaker because only van der Waals forces are involved. Physisorption bonds are easily broken by thermal energy when the local temperature is above the condensation temperature of the molecules.
The reaction space of an ALD reactor comprises all the heated surfaces that can be exposed alternately and sequentially to each of the ALD precursor used for the deposition of thin films. A basic ALD deposition cycle consists of four sequential steps: pulse A, purge A, pulse B and purge B. Pulse A typically consists of metal precursor vapor and pulse B of non-metal precursor vapor, especially nitrogen or oxygen precursor vapor. Inactive gas, such as nitrogen or argon, and a vacuum pump are used for purging gaseous reaction by-products and the residual reactant molecules from the reaction space during purge A and purge B. A deposition sequence comprises at least one deposition cycle. Deposition cycles are repeated until the deposition sequence has produced a thin film of desired thickness.
Precursor species form through chemisorption a chemical bond to reactive sites of the heated surfaces. Conditions are typically arranged in such a way that no more than a molecular monolayer of a solid material forms on the surfaces during one precursor pulse. The growth process is thus self-terminating or saturative. For example, the first precursor can include ligands that remain attached to the adsorbed species and saturate the surface, which prevents further chemisorption. Reaction space temperature is maintained above condensation temperatures and below thermal decomposition temperatures of the utilized precursors such that the precursor molecule species chemisorb on the substrate(s) essentially intact. Essentially intact means that volatile ligands may come off the precursor molecule when the precursor molecules species chemisorb on the surface. The surface becomes essentially saturated with the first type of reactive sites, i.e. adsorbed species of the first precursor molecules. This chemisorption step is typically followed by a first purge step (purge A) wherein the excess first precursor and possible reaction by-products are removed from the reaction space. Second precursor vapor is then introduced into the reaction space. Second precursor molecules typically react with the adsorbed species of the first precursor molecules, thereby forming the desired thin film material. This growth terminates once the entire amount of the adsorbed first precursor has been consumed and the surface has essentially been saturated with the second type of reactive sites. The excess of second precursor vapor and possible reaction by-product vapors are then removed by a second purge step (purge B). The cycle is then repeated until the film has grown to a desired thickness. Deposition cycles can also be more complex. For example, the cycles can include three or more reactant vapor pulses separated by purging steps. All these deposition cycles form a timed deposition sequence that is controlled by a logic unit or a microprocessor.
Thin films grown by ALD are dense, pinhole free and have uniform thickness. For example, in an experiment aluminum oxide has been grown by thermal ALD from trimethylaluminum (CH3)3Al, also referred to as TMA, and water at 250-300° C. resulting in only about 1% non-uniformity over a substrate wafer.
General information on ALD thin film processes and precursors suitable for ALD thin film processes can be found in Dr. Riikka Puurunen's review article, “Surface chemistry of atomic layer deposition: a case study for the trimethylaluminum/water process”, Journal of Applied Physics, vol. 97, 121301 (2005), the said review article being incorporated herein by reference.
Recently, there has been increased interest in batch ALD reactors capable of increased deposition throughput.
SUMMARYAccording to a first example aspect of the invention there is provided a method comprising:
providing a reaction chamber module of an atomic layer deposition reactor for processing a batch of substrates by an atomic layer deposition process; and
loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing.
In certain embodiments, the substrates comprise silicon wafers, glass plates, metal plates or polymer plates.
In certain embodiments, the batch of substrates (generally at least one batch of substrates) is loaded from a different side of the reaction chamber module than the at least one batch of substrates is unloaded from the reaction chamber module. The loading and unloading may be performed on opposite sides of the reaction chamber module or reactor. The loading and unloading may be performed horizontally.
In certain embodiments, the method comprises:
pre-processing the batch of substrates in a pre-processing module of the atomic layer deposition reactor;
processing the pre-processed batch of substrates by the atomic layer deposition process in the reaction chamber module of the reactor; and
post-processing the processed batch of substrates in a post-processing module of the reactor, where the pre-processing module, the reaction chamber module, and the post-processing module are located in a row.
In certain embodiment, the modules have been integrated into a single device. In certain embodiments, there is a continuous route through the modules. In certain embodiments, the profile of each of the modules is the same.
In certain embodiments, said processing by an atomic layer deposition process comprises depositing material on the batch of substrates by sequential self-saturating surface reactions.
In certain embodiments, said pre-processing module is a pre-heating module and said pre-processing comprises pre-heating the batch of substrates.
In certain embodiments, said post-processing module is a cooling module and said post-processing comprises cooling the batch of substrates.
In certain embodiments, the method comprises transporting the batch of substrates in one direction through the whole processing line, the processing line comprising the pre-processing, reaction chamber and post-processing modules.
In certain embodiment, the modules lie in a horizontal row. The transport mechanism through the modules is one-way through each of the modules.
In certain embodiment, pre-processed substrates are loaded into the reaction chamber module from one side of the module and the ALD processed substrates are unloaded from the module from the opposite side of the module. In an embodiment, the shape of the reaction chamber module is an elongated shape.
In certain embodiments, the pre-processing module is a first load lock, and the method comprises pre-heating the batch of substrates in a raised pressure in the first load lock by means of heat transport.
The raised pressure may refer to a pressure higher than vacuum pressure, such as room pressure. Heat transport comprises thermal conduction, convection and electromagnetic radiation. At low pressures heat is transported through the gas space mostly by electromagnetic radiation which is typically infrared radiation. At raised pressure heat transport is enhanced by the thermal conduction through the gas and by convection of the gas. Convection can be natural convection due to temperature differences or it can be forced convection carried out by a gas pump or a fan. The batch of substrates may be heated by heat transport with the aid of inactive gas, such as nitrogen or similar. In certain embodiment, inactive gas is guided into the pre-processing module and said inactive gas is heated by at least one heater.
In certain embodiments, the post-processing module is a second load lock, and the method comprises cooling the batch of substrates in a raised pressure higher than vacuum pressure in the second load lock by means of heat transport.
In certain embodiments, the method comprises dividing the batch of substrates into substrate subsets, and processing each of the subsets simultaneously in the reaction chamber module, each subset having its own gas flow inlet and gas flow outlet.
In certain embodiments, each subset are processed in a confined space formed be interior dividing walls.
In certain embodiments, the method comprises depositing aluminum oxide on solar cell structure.
In certain embodiments, the method comprises depositing Zn1-xMgxO or ZnO1-xSx buffer layer on solar cell structure.
According to a second example aspect of the invention there is provided an apparatus comprising:
a reaction chamber module of an atomic layer deposition reactor configured to process a batch of substrates by an atomic layer deposition process; and
a loading and unloading arrangement allowing loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing.
The apparatus may be an atomic layer deposition reactor, an ALD reactor.
In certain embodiments, the apparatus comprises:
a pre-processing module of the atomic layer deposition reactor configured to pre-process the batch of substrates;
the reaction chamber module of the reactor configured to process the pre-processed batch of substrates by the atomic layer deposition process; and
a post-processing module of the reactor configured to post-process the processed batch of substrates, where the pre-processing module, the reaction chamber module, and the post-processing module are located in a row.
In certain embodiments, said processing by an atomic layer deposition process comprises depositing material on the batch of substrates by sequential self-saturating surface reactions.
In certain embodiments, said pre-processing module is a pre-heating module configured to pre-heat the batch of substrates to a temperature above room temperature.
In certain embodiments, said post-processing module is a cooling module configured to cool the batch of substrates to a temperature below the ALD process temperature.
In certain embodiments, the apparatus is configured for transporting the batch of substrates in one direction through the whole processing line, the processing line comprising the pre-processing, reaction chamber and post-processing modules.
In certain embodiments, the pre-processing module is a first load lock configured to pre-heat the batch of substrates in a raised pressure by means of heat transport.
In certain embodiments, the post-processing module is a second load lock configured to cool the batch of substrates in a raised pressure by means of heat transport.
In certain embodiments, the reaction chamber module comprises partition walls or is configured to receive partition walls dividing the batch of substrates into substrate subsets, each subset having its own gas flow inlet and gas flow outlet.
According to a third example aspect of the invention there is provided an apparatus comprising:
a reaction chamber module of an atomic layer deposition reactor configured to process a batch of substrates by an atomic layer deposition process; and
means for loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing.
Different non-binding example aspects and embodiments of the present invention have been illustrated in the foregoing. The above embodiments are used merely to explain selected aspects or steps that may be utilized in implementations of the present invention. Some embodiments may be presented only with reference to certain example aspects of the invention. It should be appreciated that corresponding embodiments may apply to other example aspects as well. Any appropriate combinations of the embodiments may be formed.
The invention will now be described, by way of example only, with reference to the accompanying drawings, in which:
In the following description, Atomic Layer Deposition (ALD) technology is used as an example. Unless specifically restricted by the appended patent claims, the embodiments of the present invention are not strictly limited to that technology and to an equivalent technology, but certain embodiments may be applicable also in methods and apparatus utilizing another comparable atomic-scale deposition technology or technologies.
The basics of an ALD growth mechanism are known to a skilled person. Details of ALD methods have also been described in the introductory portion of this patent application. These details are not repeated here but a reference is made to the introductory portion with that respect.
The reaction chamber module 110 comprises gates 111 and 112 at respective ends of the module 110 for loading and unloading a carriage 115 carrying substrate holders each carrying a batch of substrates 120. The gates 111 and 112 may open as shown in
Each batch of substrates may reside in its own semiconfined space formed by flow guides or guide plates 121 which surround each of the batches on the sides. Each semiconfined space therefore forms a kind of a box that has at least partially open top and bottom side allowing exposure of substrates in the box to process gases and removal of process gases from the box. The flow guides 121 may form a permanent structure of the carriage 115. A substrate holder carrying a batch of substrates can be transferred into such a box by a loading robot or similar before processing. Alternatively, the flow guides 121 may be integrated to a substrate holder. In those embodiments, and in other embodiments, a robot or similar may move a batch of substrates from a regular plastic wafer carrier cassette or substrate holder into a substrate holder (made of aluminum, stainless steel or silicon carbide, for example) which can tolerate the processing temperatures and precursors of ALD. These substrate holders, which may have the flow guides 121 forming the box walls, are then loaded into the carriage 115.
The substrates 120 may be round substrate wafers as shown in
The reaction chamber module 110 shown in
There may be inlet openings in the in-feed lines allowing gases and vapors leave the in-feed lines and enter the reaction chamber. In an embodiment, the in-feed lines therefore are perforated pipelines. The position of the inlet openings depends on the embodiment. They may be, for example, in an upper and/or lower and/or side surface of the in-feed lines. The feedthrough of the in-feed lines into the reaction chamber may be implemented in various ways depending on the implementation. One possibility is to implement at least one feedthrough for each in-feed line through the ceiling of the reaction chamber. Another possibility is to implement at least one feedthrough for each in-feed line through a side wall of the reaction chamber.
The reaction chamber module 110 comprises an exhaust channel 136 below the support surface practically along the whole length of the module 110. During processing, reaction by-products and surplus reactant molecules are purged and/or pumped to a vacuum pump 137 via the exhaust channel 136.
In an embodiment, the reaction chamber module 110 comprises at least one heater heating the inside of the reaction chamber, that is, practically the reaction space. One possible heating arrangement is shown later in this description in connection with
The carriage 115 comprises wheels 117 or other moving means so that the carriage 115 can move or slide into and inside the module 110 along a track or rails 125 or along other support surface. The support surface comprises recesses 127 or other reception means for locking the carriage 115 into a right position for processing. In the embodiment shown in
In
Initially, the reaction chamber is in room pressure. The loading hatch or gate 111 which was opened during loading has been closed after the reaction chamber has been loaded with the batches of substrates 120. The reaction chamber is then pumped into vacuum by the vacuum pump 137. The loaded batches may have been pre-processed, for example, pre-heated into the processing temperature range (meaning the actual processing temperature or at least close to the processing temperature) in a fixed or mobile pre-processing module. Alternatively, they may be heated in the reaction chamber.
Inactive purge (carrier) gas, such as nitrogen or similar, flows from the in-feed lines 135 into each of the boxes, as depicted by arrows 145. The balance between the flow rate of inactive purge (carrier) gas to the reaction chamber and the pumping speed of gas out of the reaction chamber keeps the reaction chamber pressure typically in the rage of about 0.1-10 hPa, preferably about 0.5-2 hPa during the deposition process.
A deposition process consists of one or more consecutive deposition cycles. Each deposition cycle (ALD cycle) may consist of a first precursor pulse (or pulse period) followed by a first purge step (or period), which is followed by a second precursor pulse (or pulse period) followed by a second purge step (or period).
After a second purge period, the deposition cycle is repeated as many times as needed to grow a material layer of desired thickness onto the substrates 120.
In an example ALD deposition process, aluminum oxide Al2O3 is grown on batches of substrates 120 using trimethyl aluminum TMA as the first precursor and water H2O as the second precursor. In an example embodiment, the substrates 120 comprise solar cell structures onto which aluminum oxide is grown. In an example embodiment, the processing temperature is about 200° C.
After processing, the reaction chamber module 110 is reverted back into room pressure. The carriage 115 is raised from the recesses 127 as shown in
The embodiment shown in
In an alternative embodiment, the support surface (reference numeral 125,
In another alternative embodiment, the mesh can be attached to the support surface part. In this embodiment, the carriage can be moved on the support surface but the carriage would not typically have the lower guiding means or plates.
The embodiments in which a mesh is present can be implemented without forming the boxes at all. Instead the mesh can be designed such that the gas flow in the reaction space is as uniform as possible so that a uniform growth on each surface of the substrates can be achieved. For example, the size of the openings in the mesh can be different depending on the distance from a feedthrough conduit to the vacuum pump.
After pre-processing, the pre-processing module 251 is pumped into vacuum, the gate valve 111 is opened and the carriage or substrate holder carrying the pre-processed at least one batch of substrates is moved into the reaction chamber module 110 for ALD processing.
In a second (opposite) side of the reaction chamber module 110 the reactor comprises a post-processing module 252. It may be a load lock that is mechanically coupled to the reaction chamber module 110 by the gate valve 112 or similar. After processing, the gate valve 112 is opened and the carriage or substrate holder carrying the ALD processed at least one batch of substrates is moved into the post-processing module 252 for post-processing. For example, the processed at least one batch of substrates can be cooled in the post-processing module 252 by heat transport. In an embodiment, inactive gas, such as nitrogen or similar, is conducted into the post-processing module 252 from an inactive gas source. The pressure of the post-processing module 252 can be raised (into room pressure, for example) and the at least one batch of substrates in the post-processing module 252 is cooled by heat transport from the at least one batch of substrates comprising heat conduction through the inactive gas and natural and/or forced convection of the inactive gas. The walls of the post-processing module can be cooled for example with water-cooled piping. Warmed inactive gas can be conducted into an external heat exchange unit, cooled in the external heat exchange unit and returned by pumping to the post-processing module 252.
After post-processing, the hatch or gate 212 is opened and the carriage or substrate holder carrying the post-processed at least one batch of substrates is moved out of the post-processing module 252.
The embodiment shown in
In the embodiment shown in
In the embodiment shown in
In the embodiment shown in
Otherwise the reference numbering and the operations in
The foregoing description has provided by way of non-limiting examples of particular implementations and embodiments of the invention a full and informative description of the best mode presently contemplated by the inventors for carrying out the invention. It is however clear to a person skilled in the art that the invention is not restricted to details of the embodiments presented above, but that it can be implemented in other embodiments using equivalent means without deviating from the characteristics of the invention.
Furthermore, some of the features of the above-disclosed embodiments of this invention may be used to advantage without the corresponding use of other features. As such, the foregoing description should be considered as merely illustrative of the principles of the present invention, and not in limitation thereof. Hence, the scope of the invention is only restricted by the appended patent claims.
Claims
1. A method comprising:
- providing a reaction chamber module of an atomic layer deposition reactor for processing a batch of substrates by an atomic layer deposition process; and
- loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing.
2. The method of claim 1, comprising:
- pre-processing the batch of substrates in a pre-processing module of the atomic layer deposition reactor;
- processing the pre-processed batch of substrates by the atomic layer deposition process in the reaction chamber module of the reactor; and
- post-processing the processed batch of substrates in a post-processing module of the reactor, where the pre-processing module, the reaction chamber module, and the post-processing module are located in a row.
3. The method of claim 2, wherein said processing by an atomic layer deposition process comprises depositing material on the batch of substrates by sequential self-saturating surface reactions.
4. The method of claim 2, wherein said pre-processing module is a pre-heating module and said pre-processing comprises pre-heating the batch of substrates.
5. The method of claim 2, wherein said post-processing module is a cooling module and said post-processing comprises cooling the batch of substrates.
6. The method of claim 2, comprising transporting the batch of substrates in one direction through the whole processing line, the processing line comprising the pre-processing, reaction chamber and post-processing modules.
7. The method of claim 2, wherein the pre-processing module is a first load lock, and the method comprises pre-heating the batch of substrates in a raised pressure in the first load lock by means of heat transport.
8. The method claim 2, wherein the post-processing module is a second load lock, and the method comprises cooling the batch of substrates in a raised pressure in the second load lock by means of heat transport.
9. The method of claim 1, comprising dividing the batch of substrates into substrate subsets, and processing each of the subsets simultaneously in the reaction chamber module, each subset having its own gas flow inlet and gas flow outlet.
10. The method of claim 1, comprising depositing aluminum oxide on solar cell structure.
11. An apparatus comprising:
- a reaction chamber module of an atomic layer deposition reactor configured to process a batch of substrates by an atomic layer deposition process; and
- a loading and unloading arrangement allowing loading the batch of substrates before processing into the reaction chamber module via a different route than the batch of substrates is unloaded after processing.
12. The apparatus of claim 11, comprising:
- a pre-processing module of the atomic layer deposition reactor configured to pre-process the batch of substrates;
- the reaction chamber module of the reactor configured to process the pre-processed batch of substrates by the atomic layer deposition process; and
- a post-processing module of the reactor configured to post-process the processed batch of substrates, where the pre-processing module, the reaction chamber module, and the post-processing module are located in a row.
13. The apparatus of claim 12, wherein said processing by an atomic layer deposition process comprises depositing material on the batch of substrates by sequential self-saturating surface reactions.
14. The apparatus of claim 12, wherein said pre-processing module is a pre-heating module configured to pre-heat the batch of substrates.
15. The apparatus of claim 12, wherein said post-processing module is a cooling module configured to cool the batch of substrates.
16. The apparatus of claim 12, wherein the apparatus is configured for transporting the batch of substrates in one direction through the whole processing line, the processing line comprising the pre-processing, reaction chamber and post-processing modules.
17. The apparatus of claim 12, wherein the pre-processing module is a first load lock configured to pre-heat the batch of substrates in a raised pressure by means of heat transport.
18. The apparatus of claim 12, wherein the post-processing module is a second load lock configured to cool the batch of substrates in a raised pressure by means of heat transport.
19. The apparatus of claim 11, wherein the reaction chamber module comprises partition walls or is configured to receive partition walls dividing the batch of substrates into substrate subsets, each subset having its own gas flow inlet and gas flow outlet.
Type: Application
Filed: Nov 22, 2011
Publication Date: Nov 13, 2014
Applicant: PICOSUN OY (Espoo)
Inventors: Sven Lindfors (Espoo), Pekka J Soininen (Espoo)
Application Number: 14/359,775
International Classification: C23C 30/00 (20060101);