Multizone Chamber Patents (Class 118/719)
  • Patent number: 10669631
    Abstract: A gas injection apparatus, which can sequentially supply a substrate with at least two kinds of source gases reacting with each other in a container, and thin film deposition equipment including the gas injection apparatus, are provided. The gas injection apparatus includes a base plate, a first gas supply region protruding from the base plate, a second gas supply region protruding from the base plate and adjacent the first gas supply region, and a trench defined by a sidewall of the first gas supply region and a sidewall of the second gas supply region. The sidewall of the first gas supply region and the sidewall of the second gas supply region face each other and extend in a radial direction on the base plate.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: June 2, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-Chul Kim, Jung-Il Ahn, Jung-Hun Seo, Jong-Cheol Lee, Kyu-Hee Han, Seung-Han Lee, Jin-Pil Heo
  • Patent number: 10669627
    Abstract: A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: June 2, 2020
    Assignee: HzO, Inc.
    Inventors: Yang Yun, Max Sorenson, Chien-Lan Hsueh, Tining Su, Jim Dempster, Alex Anderson, Layton Baker
  • Patent number: 10655210
    Abstract: The present invention provides a roll-to roll sputtering process with a hybrid target comprising: unwinding a flexible polymer substrate from an unwinding axis; sputtering a hybrid target to the flexible polymer substrate for forming a first metal film, and a second metal film; and rewinding the flexible polymer substrate to a rewinding axis, and further comprising the following steps of: using laser to form a first electrode section and a second electrode section on the first metal film and the second metal film; and disposing a detecting substance layer on the second electrode section. Moreover, a product made by the roll-to-roll sputtering process is provided. Compared to the prior art, the hybrid target of the present invention is formed by multiple metals and can be sputtered to the substrate for forming multiple metal thin films. The present invention has an advantage of shortening the processing time and saving cost.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: May 19, 2020
    Assignee: Ace Medical Technology Co., Ltd.
    Inventors: Ching-Yu Chang, Chien-Fa Liao
  • Patent number: 10651063
    Abstract: The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: May 12, 2020
    Inventor: Frederick A. Flitsch
  • Patent number: 10636661
    Abstract: An apparatus and a method for wafer bonding are provided. The apparatus comprises a transfer module and a plasma module. The transfer module is configured to transfer a semiconductor wafer. The plasma module is configured to perform a plasma operation and a reduction operation to a surface of the semiconductor wafer to convert metal oxides on the surface of the semiconductor wafer to the metal.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: April 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yeong-Jyh Lin, Yeur-Luen Tu, Chin-Wei Liang
  • Patent number: 10629427
    Abstract: Methods for processing a substrate, such as bevel etch processing, are provided. In one embodiment, a method includes placing a substrate on a cover plate inside of a processing chamber, where the substrate has a center and a bevel edge and contains a dielectric layer thereon, the processing chamber contains a mask disposed above the substrate and an edge ring disposed under the substrate, the edge ring has an annular body, and the cover plate is disposed on a support assembly. The method further includes heating the substrate with a heater attached to the support assembly, raising the edge ring to contact the mask, flowing a process gas containing an etchant along an outer surface of the mask and to the bevel edge, where the process gas is ignited to produce a plasma, and exposing an upper surface of the substrate at the bevel edge to the process gas.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: April 21, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Zonghui Su, Vinay Prabhakar, Abdul Aziz Khaja, Jeongmin Lee
  • Patent number: 10611036
    Abstract: An apparatus and method for transporting a plurality of articles is disclosed. The apparatus includes a wheeled chassis, and a platform disposed on the wheeled chassis. The apparatus also includes a manipulator coupled to the wheeled chassis and operably configured to load a first article of the plurality of articles at a first position on the platform, or unload the first article of the plurality of articles from the first position on the platform. The apparatus further includes at least one actuator operably configured to cause successive relative rotational movements between the manipulator and the platform to provide access to successive rotationally spaced apart positions on the platform for loading or unloading each subsequent article in the plurality of articles.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: April 7, 2020
    Assignee: Advanced Intelligent Systems Inc.
    Inventor: Farhang Bidram
  • Patent number: 10607866
    Abstract: A vertically oriented treatment chamber for the processing of a flux-free solder ball (or plated solder ball) loaded wafer chip. A treatment chamber comprises a first or upper heater at an upper end of the treatment chamber and a second or lower heater at a lower end of the treatment chamber. The treatment chamber includes a centrally disposed, preloaded flux free solder ball loaded wafer chip support ring movable upwardly and downwardly within the treatment chamber in response to temperature sensed monitoring of a wafer chip supported on the wafer chip support ring.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 31, 2020
    Assignee: Boston Process Technologies, Inc
    Inventor: Jian Zhang
  • Patent number: 10603660
    Abstract: A modular device for treatment and/or analysis of substances comprises a supply device which supplies at least one functional fluid to at least one process device, wherein the supply device has multiple receiving means for receiving in each case one process device. The receiving means each have multiple supply ports, including an inflow supply port and an outflow supply port for transmission of a functional fluid. The process device has a functional region for the treatment and/or analysis of substances, a fluid line which encloses the functional region, and multiple coupling means for coupling to the supply ports of a receiving means. For each receiving means, a first valve device is provided in the region of the inflow supply port and a second valve device is provided in the region of the outflow supply port.
    Type: Grant
    Filed: September 8, 2015
    Date of Patent: March 31, 2020
    Assignee: INNOVATIVE THERMOANALYTIC INSTRUMENTS KG
    Inventors: Andrea Alles, Keith Stuart
  • Patent number: 10607875
    Abstract: An automated electrostatic bonding/de-bonding apparatus is used to automate a mating or separating process between a semiconductive wafer and a mobile electrostatic carrier (MESC). The apparatus includes a transfer enclosure, a robot arm, a bonding/de-bonding station, input/output (I/O) ports, I/O cassettes, and a control unit. The I/O cassettes house the different dispensable items that are used during the mating or separating process, such as semiconductive wafers, MESCs, and mated assemblies thereof. The robot arm moves the dispensable items between the I/O cassettes and the bonding/de-bonding station. The transfer enclosure prevents any external physical interference with the movement of the robot arm. The I/O ports integrated into the transfer enclosure allow the robot arm to access the I/O cassettes, which are located outside of the transfer enclosure. The control unit is used to manage the functionalities of the robot arm and the bonding/de-bonding station.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: March 31, 2020
    Inventor: Eryn Smith
  • Patent number: 10600610
    Abstract: A substrate treatment apparatus includes a chamber providing a reaction region and including first and second sides facing each other, a module connected to the first side, an upper electrode in the reaction region, a substrate holder facing the upper electrode, wherein a substrate is disposed on the substrate holder, and first and second points are defined on the substrate, wherein the first point corresponds to a center of the substrate, and the second point is distant from the first point toward the first side, and a feeding line for applying an RF power, the feeding line connected to the upper electrode corresponding to the second point.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: March 24, 2020
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventor: Ho Chul Kang
  • Patent number: 10597778
    Abstract: A deposition method, including providing a channel through a deposition apparatus, feeding precursor vapor into the channel, and depositing material from the precursor vapor onto a substrate on its way through the deposition apparatus by exposing the substrate to the precursor vapor and to alternating photon exposure and shade periods within the channel.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: March 24, 2020
    Assignee: Picosun Oy
    Inventor: Timo Malinen
  • Patent number: 10576040
    Abstract: Irregular, angular particles are produced by a manufacturing method that comprises forming a film on a substrate and then stretching the substrate along one or more axes to fracture the film into particle structures. The substrate may be moved continuously along a production line as the film is formed and may be stretched by accelerating that movement. The substrate may comprise a surface with elevated patterns to control the fracturing of the film. The particles are particularly suitable for the transdermal delivery of a biologically active substance into the body of a patient.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 3, 2020
    Assignee: NDM Technologies Limited
    Inventor: Dewan Fazlul Hoque Chowdhury
  • Patent number: 10559483
    Abstract: A loading station for a substrate processing system includes first and second vertically-stacked loading stations. The first loading station includes a first airlock volume and first and second valves arranged at respective ends of the first loading station. The first and second valves are configured to selectively provide access to the first airlock volume and include first and second actuators, respectively, configured to open and close the first and second valves, and the first and second actuators extend downward from the first loading station. The second loading station includes a second airlock volume and third and fourth valves arranged at respective ends of the second loading station. The third and fourth valves are configured to selectively provide access to the second airlock volume and include third and fourth actuators, respectively, configured to open and close the third and fourth valves.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: February 11, 2020
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Richard H. Gould, Candi Kristoffersen, Gustavo G. Francken, James Van Gogh, Benjamin W. Mooring
  • Patent number: 10553470
    Abstract: A substrate alignment device includes a plurality of state detection units, each of which is configured to move from a standby position to a detection position for detecting a positional state of a substrate and return back from the detection position back to the standby position, and a multidimensional robot arm configured to receive and support the substrate, transfer the substrate to a substrate detection site, and adjust the substrate in at least one orientation or position according to the detected positional state of the substrate to position the substrate to a target position for overlay mark measurements.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: February 4, 2020
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Liwan Yue, Qiang Wu
  • Patent number: 10526705
    Abstract: In a CVD reactor, flushing gases of different heat conductivities are used to flush a gap between a substrate holder and a heating system. The lower side of the substrate holder is configured differently in a central region with respect to the heat transmission from the heating system to the substrate holder, than in a circumferential region that surrounds the central region. The gap has such a gap height that, upon a change of a first flushing gas with a first heat conductivity to a second flushing gas with a second heat conductivity, the heat supplied from the heating system to the substrate holder changes differently in the circumferential region than in the central region.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 7, 2020
    Assignee: AIXTRON SE
    Inventors: Adam Boyd, Daniel Claessens, Hugo Silva
  • Patent number: 10513777
    Abstract: A processing chamber accommodating a mounting table includes a first region and a second region. As the mounting table rotates, a substrate mounting region of the mounting table moves in a circumferential direction around the axis to pass through the first region and the second region. A first gas supply unit supplies a precursor gas to the first region from an injection unit disposed to face the mounting table. An exhaust outlet exhausts an exhaust port formed to extend along a closed path surrounding the exhaust outlet. A second gas supply unit supplies purge gas from an injection port formed to extend along a closed path surrounding the exhaust port. A plasma generation unit generates plasma from a reaction gas in the second region. An angular range of the second region is larger than an angular range of the first region.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: December 24, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masahide Iwasaki, Satoshi Yonekura, Toshihiko Iwao
  • Patent number: 10508338
    Abstract: A device for atomic layer deposition includes: an injector installed to an opening of a film deposition chamber; and an injector adhesion preventive member installed by insertion into the opening, wherein the injector includes an injector raw material gas supply path, an injector reactant gas supply path, and an injector inert gas supply path, the respective paths being partitioned from each other, the injector adhesion preventive member includes an adhesion preventive member raw material gas supply path, an adhesion preventive member reactant gas supply path, and an adhesion preventive member inert gas supply path, the respective paths being partitioned from each other, and the adhesion preventive member inert gas supply path is provided such that the inert gas flows in a clearance between an outer peripheral side of the injector adhesion preventive member and an inner peripheral side of the opening.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: December 17, 2019
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Tatsuya Matsumoto, Keisuke Washio
  • Patent number: 10510573
    Abstract: A loading apparatus for processing a wafer cassette containing a plurality of wafers and an operating method thereof are provided. The operating method includes the following steps. The wafer cassette is loaded on a stage of the loading apparatus. The stage is configured to carry the wafer cassette and movably coupled to a main body of the loading apparatus to move within and out of a space of the main body. The stage is vertically moved among a standby position, a lifting position and an intermediate position; horizontally moved from the intermediate position to a door engaging position inside the space; positioned at the door engaging position, and a cassette door of the wafer cassette is opened. The stage is horizontally moved from the door engaging position to the intermediate position, and horizontally moved between the lifting position and an unloading position outside the space after opening the cassette door.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Hsuan Lee, Hsu-Shui Liu, Jiun-Rong Pai, Chih-Hung Huang, Yang-Ann Chu
  • Patent number: 10504697
    Abstract: Embodiments of the present disclosure generally relate to an apparatus and method for reducing particle generation in a processing chamber. In one embodiment, an apparatus for processing a substrate is disclosed. The apparatus includes a chamber body, a lid assembly disposed above the chamber body, the lid assembly comprising a top electrode and a bottom electrode positioned substantially parallel to the top electrode, a gas distribution plate disposed between a substrate processing region and the lid assembly, and a substrate support disposed within the chamber body, the substrate support supporting having a substrate supporting surface, wherein the top electrode is in electrical communication with a radio frequency (RF) power supply and a DC bias modulation configuration, and the DC bias modulation configuration is configured to operate the top electrode at a constant zero DC bias voltage during a process.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: December 10, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Jonghoon Baek, Soonam Park, Xinglong Chen, Dmitry Lubomirsky
  • Patent number: 10497543
    Abstract: A device for etching a substrate includes a first reaction chamber into which a first gas is introduced; a second reaction chamber into which a second gas is introduced; and a coil device that generates an electromagnetic alternating field. At least one first reactive species is generated by applying the electromagnetic alternating field to the first gas and at least one second reactive species is generated by applying the electromagnetic alternating field to the second gas. The device further includes a separating device that prevents a direct gas exchange between the first and second reaction chambers; an etching chamber configured to receive the substrate to be anisotropically etched; and a mixing device configured such that the reactive species enter the mixing device, are mixed together, and in the mixed state act on the substrate so as to anisotropically etch the substrate in the etching chamber.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: December 3, 2019
    Assignee: Robert Bosch GmbH
    Inventor: Franz Laermer
  • Patent number: 10497773
    Abstract: The present disclosure relates to a method of forming a MIM (metal-insulator-metal) capacitor using a post capacitor bottom metal (CBM) treatment process to reduce a roughness of a top surface of a capacitor bottom metal layer, and an associated apparatus. In some embodiments, the method is performed by forming a capacitor bottom metal layer having a first metal material over a semiconductor substrate. A top surface of the capacitor bottom metal layer is exposed to one or more post CBM treatment agents having oxygen. The one or more post CBM treatment agents reduce a roughness of the top surface and form an interface layer having the first metal material and oxygen onto and in direct contact with the top surface of the capacitor bottom metal layer. A capacitor dielectric layer is formed over the interface layer and a capacitor top metal layer is formed over the capacitor dielectric layer.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 3, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yao-Wen Chang, Hsing-Lien Lin, Cheng-Yuan Tsai, Chia-Shiung Tsai
  • Patent number: 10453726
    Abstract: An electronic device manufacturing system includes a factory interface that has a load port. The load port may include a panel having an opening therein and a carrier door opener that seals the opening when the door is closed. The carrier door opener may have a groove along an outer portion of the door. The groove may have a cross-sectional shape of a triangular prism frustum. A hollow O-ring may be seated in the groove and is configured to engage the panel when the carrier door opener is closed against the panel. Methods of assembling a factory interface for an electronic device manufacturing system are also provided, as are other aspects.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: October 22, 2019
    Assignee: Applied Materials, Inc.
    Inventors: David T. Blahnik, Paul B. Reuter, Luke W. Bonecutter, Douglas B. Baumgarten
  • Patent number: 10446418
    Abstract: The present disclosure generally relates to process chambers having modular design to provide variable process volume and improved flow conductance and uniformity. The modular design according to the present disclosure achieves improved process uniformity and symmetry with simplified chamber structure. The modular design further affords flexibility of performing various processes or processing substrates of various sizes by replacing one or more modules in a modular process chamber according to the present disclosure.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: October 15, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Andrew Nguyen, Yogananda Sarode Vishwanath, Tom K. Cho
  • Patent number: 10435781
    Abstract: There is provided a substrate processing apparatus to perform a predetermined process on a substrate on which a pattern mask is formed, comprising a compartment mechanism configured to switch between a compartmented state and an open state. The compartmented state includes a first section having the evaporation source formation part, and a second section configured to transfer the substrate between an outside of processing vessel and a mounting table. The substrate processing apparatus comprises a substrate transfer hole formed in the processing vessel and configured to open and close with respect to the second section being in the compartmented state; and an exhaust hole formed to connect to the second section and configured to exhaust the second section in the compartment state to remove a solvent atmosphere of the second section.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Shinji Kobayashi
  • Patent number: 10424498
    Abstract: A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: September 24, 2019
    Assignee: Persimmon Technologies Corporation
    Inventors: Christopher Hofmeister, Martin Hosek
  • Patent number: 10415138
    Abstract: A gas injector system is provided that allows for improved distribution and directional control of the vapor material in a CVD or CVI process. Gas injector systems may be used without experiencing significant clogging of gas injector tube apertures over multiple CVD procedures. Further, a gas injector system provided includes a dual aperture release system and/or allow vapor material to flow both substantially horizontally and substantially vertically.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: September 17, 2019
    Assignee: Goodrich Corporation
    Inventor: Vincent Fry
  • Patent number: 10418260
    Abstract: A system for fan out chip encapsulation processing is provided, wherein a plurality of microchips are encapsulated in molding compound, the system comprising: an atmospheric loading camber, configured to load substrates onto carriers in atmospheric environment; an entry loadlock arrangement configured to introduce the carriers into vacuum environment of the system; a degas chamber positioned downstream of the loadlock arrangement within the vacuum environment, the degas chamber comprising a heating element and a pumping arrangement to remove gases emitted from the molding compound; an etch chamber positioned downstream of the degas chamber and within the vacuum environment, the etch chamber comprising an ion beam generator and an ion neutralizer; a metal sputtering chamber positioned downstream of the etch chamber and inside the vacuum environment; and, an exit loadlock arrangement configured to remove carriers from the vacuum environment.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: September 17, 2019
    Assignee: INTEVAC, INC.
    Inventors: Terry Bluck, Terry Pederson, William Eugene Runstadler, Jr.
  • Patent number: 10403480
    Abstract: Methods and systems for depositing a thin film are disclosed. The methods and systems can be used to deposit a film having a uniform thickness on a substrate surface that has a non-planar three-dimensional geometry, such as a curved surface. The methods involve the use of a deposition source that has a shape in accordance with the non-planar three-dimensional geometry of the substrate surface. In some embodiments, multiple layers of films are deposited onto each other forming multi-layered coatings. In some embodiments, the multi-layered coatings are antireflective (AR) coatings for windows or lenses.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: September 3, 2019
    Assignee: Apple Inc.
    Inventor: Matthew S. Rogers
  • Patent number: 10403522
    Abstract: A heater or cooler chamber for a batch of more than one workpiece includes a heat storage block. In the block a multitude of pockets are provided, whereby each of the pockets may be closed or opened by a controllably operated door. A heater or cooler arrangement is applied. The pockets are tailored to surround a workpiece applied therein in a non-contact closely spaced manner.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: September 3, 2019
    Assignee: EVATEC AG
    Inventor: Jurgen Weichart
  • Patent number: 10403532
    Abstract: The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: September 3, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jason Shen, Wen-Yu Huang, Li-Jen Ko, Hsiang Yin Shen
  • Patent number: 10392676
    Abstract: A heat treatment device includes: a heating device that heats a treatment object; a cooling device including a cooling room that accommodates the treatment object heated by the heating device and into which a cooling medium used for cooling the treatment object is supplied; a pressurized gas supplier that supplies pressurized gas into the cooling room; a pressure relief valve that communicates internal and external areas of the cooling room with each other when the pressure relief valve is opened; a pressure sensor that measures the pressure inside the cooling room; and a controller that controls the pressure relief valve such that the pressure relief valve is opened when a measurement result of the pressure sensor is higher than or equal to a threshold value.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: August 27, 2019
    Assignees: IHI CORPORATION, IHI MACHINERY AND FURNACE CO., LTD.
    Inventors: Kazuhiko Katsumata, Kaoru Isomoto, Gen Nishitani, Akira Nakayama, Takahiro Nagata, Yuusuke Shimizu
  • Patent number: 10388546
    Abstract: Provided are methods and apparatus for ultraviolet (UV) assisted capillary condensation to form dielectric materials. In some embodiments, a UV driven reaction facilitates photo-polymerization of a liquid phase flowable material. Applications include high quality gap fill in high aspect ratio structures and por sealing of a porous solid dielectric film. According to various embodiments, single station and multi-station chambers configured for capillary condensation and UV exposure are provided.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: August 20, 2019
    Assignee: Lam Research Corporation
    Inventors: Jonathan D. Mohn, Nicholas Muga Ndiege, Patrick A. Van Cleemput, David Fang Wei Chen, Wenbo Liang, Shawn M. Hamilton
  • Patent number: 10385446
    Abstract: A group of inventions is related to process equipment to process surfaces in mass production, particularly, vacuum process equipment to apply thin film coatings with set optical, electrical and other parameters. The technical result is to ensure a capability of processing flexible large substrates, as well as small substrates with a high degree of coating uniformity, with an ability to utilize a wide range of technologies and process devices, as well as to have a highly effective useful operation of applied materials. The proposed technical result is obtained by a method of applying thin film coatings on substrates, which are placed on rotating drums, which consequently move along the processing zones with the same constant linear and angular speeds. Furthermore, a ratio between the linear and angular speeds of the drum is selected so that each surface point of the drum will complete at least two full revolutions while passing through the processing zone.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: August 20, 2019
    Assignee: THE BATTERIES SP. Z.O.O.
    Inventor: Ayrat Khamitovich Khisamov
  • Patent number: 10388547
    Abstract: Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between a side storage container and an equipment front end module; a side storage container received in the first chamber; and an exhaust conduit configured to be coupled to the side storage container received and extending to an exterior of the first chamber.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: August 20, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Devendra Channappa Holeyannavar, Sandesh Doddamane Ramappa, Dean C. Hruzek, Michael R. Rice, Jeffrey A. Brodine
  • Patent number: 10381257
    Abstract: A control unit of a substrate conveying robot makes a robot arm and a substrate holding device execute a blade member advancing operation, a substrate receiving operation, and a substrate placing operation. The substrate holding device is configured to be capable of being switched between a first working state that a pair of blade members are arranged in the vertical direction and a second working state that a pair of blade members are arranged in a position out of the vertical direction and a single blade member can be advanced into a substrate placing structure.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: August 13, 2019
    Assignees: KAWASAKI JUKOGYO KABUSHIKI KAISHA, KAWASAKI ROBOTICS (USA), INC.
    Inventors: Mark Tang, Eric Chan, Shigeki Ono, Shinya Kitano, Ming Zeng, Hirohiko Goto
  • Patent number: 10361104
    Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: July 23, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Shay Assaf, Andrew Constant, Jacob Newman, Charles Carlson, William Tyler Weaver, Stephen Hickerson
  • Patent number: 10347515
    Abstract: For vacuum treatment of workpieces by a multitude of distinct processing stations (P11-P1n, P21-P2m) the processing stations are grouped in two groups (I and II). The workpieces are handled towards and from the processing stations of the first group (I) simultaneously, whereat the workpieces are treated by the processing stations of the second group (II) in a selectable individual sequence.
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: July 9, 2019
    Assignee: EVATEC AG
    Inventor: Bernd Heinz
  • Patent number: 10290523
    Abstract: A wafer processing apparatus includes a controller connected to a first robot and a second robot. The controller controls the first robot so that the wafer is placed on a first load lock stage in such a way that the center of the wafer is shifted from the center of the first load lock stage by a first position shift amount and another wafer is placed on a second load lock stage in such a way that the center of the wafer is shifted from the center of the second load lock stage by a second position shift amount. The controller controls the second robot so that the second robot simultaneously conveys two wafers between the first and second load lock stages, and a first processing stage and a second processing stage.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: May 14, 2019
    Assignee: ASM IP Holding B.V.
    Inventor: Toshihisa Nozawa
  • Patent number: 10269541
    Abstract: A plasma reactor has a microwave source including a microwave window with a channel extending through the window and a coolant source for flowing a coolant through the channel. The coolant is a liquid that does not absorb microwave power.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: April 23, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Qiwei Liang
  • Patent number: 10269603
    Abstract: A substrate processing apparatus includes a process chamber configured to process a substrate, a carrier mounting part configured to mount a carrier which accommodates the substrate, the substrate capable of being brought into and out of the carrier when a door of the carrier mounted on the carrier mounting part is opened, a carrier opener configured to open and close the door of the carrier mounted on the carrier mounting part, a purge gas supply part configured to supply an inert gas into the carrier with the door kept opened, and a control part configured to perform control so as to carry out at least one inert gas purge among a load purge, an unload purge and a standby purge.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: April 23, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yoshihiko Nakagawa, Hiroshi Kotani
  • Patent number: 10260147
    Abstract: A device is provided for depositing carbonaceous structures, for example layers in the form of nanotubes or graphene on a substrate, which is supported by a substrate support disposed in a process chamber housing. A process gas can be delivered onto the substrate through gas outlet openings of a gas inlet element disposed in the process chamber housing. The process chamber housing has two opposing walls which each have holding recesses. At least one plate-shaped component is disposed in the process chamber housing. The plate-shaped component has two edge portions directed away from one another that each are inserted respectively in the holding recess of one of the two opposing walls.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: April 16, 2019
    Assignee: AIXTRON SE
    Inventors: Alexandre Jouvray, David Eric Rippington, Kenneth B. K. Teo, Nalin L. Rupesinghe
  • Patent number: 10256305
    Abstract: An electronic device includes a trigonal crystal substrate defining a (0001) C-plane. The substrate may comprise Sapphire or other suitable material. A plurality of rhombohedrally aligned SiGe (111)-oriented crystals are disposed on the (0001) C-plane of the crystal substrate. A first region of material is disposed on the rhombohedrally aligned SiGe layer. The first region comprises an intrinsic or doped Si, Ge, or SiGe layer. The first region can be layered between two secondary regions comprising n+doped SiGe or n+doped Ge, whereby the first region collects electrons from the two secondary regions.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 9, 2019
    Assignee: The United States of America as represented by the Administrator of NASA
    Inventors: Sang Hyouk Choi, Yeonjoon Park, Glen C. King, Hyun-Jung Kim, Kunik Lee
  • Patent number: 10249487
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate in a horizontal orientation by means of a substrate holding unit, a liquid film forming step of supplying a processing liquid to an upper surface of the substrate held by the substrate holding unit to form a liquid film, an upper surface covering step of discharging, above the substrate held by the substrate holding unit, an inert gas radially and parallel to the upper surface of the substrate from a center toward a peripheral edge of the substrate to form an inert gas stream flowing parallel to the upper surface of the substrate and covering the upper surface of the substrate, and a liquid film removing step of discharging an inert gas toward the upper surface of the substrate to remove the liquid film, formed by the liquid film forming step, from the upper surface of the substrate.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 2, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Manabu Okutani, Kenji Kobayashi, Naohiko Yoshihara
  • Patent number: 10233542
    Abstract: Disclosed is a substrate processing apparatus and method which facilitates to sequentially or repetitively carry out a thin film deposition process and a surface treatment process inside one process space, wherein the substrate processing apparatus comprises a process chamber for providing a process space; a substrate supporter for supporting at least one of substrates and moving the supported substrate in a predetermined direction; a chamber lid confronting the substrate supporter; and a gas distributor for spatially separating process gas for depositing a thin film on the substrate from a surface treatment gas for performing a surface treatment of the thin film, and locally distributing the process gas and the surface treatment gas on the substrate supporter, wherein the gas distributor confronting the substrate supporter is provided in the chamber lid.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: March 19, 2019
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventors: Jae Chan Kwak, Sung Kyu Kang, Hun Jung, Byoung Ha Cho
  • Patent number: 10214823
    Abstract: A coated metal component includes an aluminum alloy substrate and a protective aluminum coating on a substrate. An interfacial boundary layer between the coating and substrate enhances coating adhesion. The boundary layer includes isolated regions of copper or tin produced by a double zincating process. The protective aluminum coating exhibits improved adhesion and is formed by electrodeposition in an ionic liquid.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: February 26, 2019
    Assignee: United Technnologies Corporation
    Inventors: Rhonda R. Willigan, Lei Chen, Mark R. Jaworowski
  • Patent number: 10202690
    Abstract: Disclosed is an apparatus and method of processing substrate, which facilitates to improve deposition uniformity of a thin film deposited on a substrate, and to control quality of a thin film, wherein the apparatus includes a process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the bottom of the process chamber; a chamber lid confronting the substrate supporter, the chamber lid for covering an upper side of the process chamber; and a gas distributor for locally distributing activated source gas on the substrate, wherein the gas distributor locally confronting the substrate supporter is provided in the chamber lid, wherein the gas distributor forms plasma by the use of plasma formation gas, and activates the source gas by distributing the source gas to some of plasma area for formation of the plasma.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: February 12, 2019
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventors: Chul Joo Hwang, Jeung Hoon Han, Young Hoon Kim, Seung Hoon Seo
  • Patent number: 10204790
    Abstract: In accordance with some embodiments herein, methods for deposition of thin films are provided. In some embodiments, thin film deposition is performed in a plurality of stations, in which each station provides a different reactant or combination of reactants. The stations can be in gas isolation from each other so as to minimize or prevent undesired chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) reactions between the different reactants or combinations of reactants.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: February 12, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Jun Kawahara, Suvi Haukka, Antti Niskanen, Eva Tois, Raija Matero, Hidemi Suemori, Jaako Anttila, Yukihiro Mori
  • Patent number: 10199256
    Abstract: In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: February 5, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Edward Ng, Jeffrey C. Hudgens, Ayan Majumdar, Sushant S. Koshti
  • Patent number: 10190216
    Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: January 29, 2019
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, Dave Kamp