Multizone Chamber Patents (Class 118/719)
  • Patent number: 10290523
    Abstract: A wafer processing apparatus includes a controller connected to a first robot and a second robot. The controller controls the first robot so that the wafer is placed on a first load lock stage in such a way that the center of the wafer is shifted from the center of the first load lock stage by a first position shift amount and another wafer is placed on a second load lock stage in such a way that the center of the wafer is shifted from the center of the second load lock stage by a second position shift amount. The controller controls the second robot so that the second robot simultaneously conveys two wafers between the first and second load lock stages, and a first processing stage and a second processing stage.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: May 14, 2019
    Assignee: ASM IP Holding B.V.
    Inventor: Toshihisa Nozawa
  • Patent number: 10269541
    Abstract: A plasma reactor has a microwave source including a microwave window with a channel extending through the window and a coolant source for flowing a coolant through the channel. The coolant is a liquid that does not absorb microwave power.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: April 23, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Michael W. Stowell, Qiwei Liang
  • Patent number: 10269603
    Abstract: A substrate processing apparatus includes a process chamber configured to process a substrate, a carrier mounting part configured to mount a carrier which accommodates the substrate, the substrate capable of being brought into and out of the carrier when a door of the carrier mounted on the carrier mounting part is opened, a carrier opener configured to open and close the door of the carrier mounted on the carrier mounting part, a purge gas supply part configured to supply an inert gas into the carrier with the door kept opened, and a control part configured to perform control so as to carry out at least one inert gas purge among a load purge, an unload purge and a standby purge.
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: April 23, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Yoshihiko Nakagawa, Hiroshi Kotani
  • Patent number: 10260147
    Abstract: A device is provided for depositing carbonaceous structures, for example layers in the form of nanotubes or graphene on a substrate, which is supported by a substrate support disposed in a process chamber housing. A process gas can be delivered onto the substrate through gas outlet openings of a gas inlet element disposed in the process chamber housing. The process chamber housing has two opposing walls which each have holding recesses. At least one plate-shaped component is disposed in the process chamber housing. The plate-shaped component has two edge portions directed away from one another that each are inserted respectively in the holding recess of one of the two opposing walls.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: April 16, 2019
    Assignee: AIXTRON SE
    Inventors: Alexandre Jouvray, David Eric Rippington, Kenneth B. K. Teo, Nalin L. Rupesinghe
  • Patent number: 10256305
    Abstract: An electronic device includes a trigonal crystal substrate defining a (0001) C-plane. The substrate may comprise Sapphire or other suitable material. A plurality of rhombohedrally aligned SiGe (111)-oriented crystals are disposed on the (0001) C-plane of the crystal substrate. A first region of material is disposed on the rhombohedrally aligned SiGe layer. The first region comprises an intrinsic or doped Si, Ge, or SiGe layer. The first region can be layered between two secondary regions comprising n+doped SiGe or n+doped Ge, whereby the first region collects electrons from the two secondary regions.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: April 9, 2019
    Assignee: The United States of America as represented by the Administrator of NASA
    Inventors: Sang Hyouk Choi, Yeonjoon Park, Glen C. King, Hyun-Jung Kim, Kunik Lee
  • Patent number: 10249487
    Abstract: A substrate processing method includes a substrate holding step of holding a substrate in a horizontal orientation by means of a substrate holding unit, a liquid film forming step of supplying a processing liquid to an upper surface of the substrate held by the substrate holding unit to form a liquid film, an upper surface covering step of discharging, above the substrate held by the substrate holding unit, an inert gas radially and parallel to the upper surface of the substrate from a center toward a peripheral edge of the substrate to form an inert gas stream flowing parallel to the upper surface of the substrate and covering the upper surface of the substrate, and a liquid film removing step of discharging an inert gas toward the upper surface of the substrate to remove the liquid film, formed by the liquid film forming step, from the upper surface of the substrate.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 2, 2019
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Manabu Okutani, Kenji Kobayashi, Naohiko Yoshihara
  • Patent number: 10233542
    Abstract: Disclosed is a substrate processing apparatus and method which facilitates to sequentially or repetitively carry out a thin film deposition process and a surface treatment process inside one process space, wherein the substrate processing apparatus comprises a process chamber for providing a process space; a substrate supporter for supporting at least one of substrates and moving the supported substrate in a predetermined direction; a chamber lid confronting the substrate supporter; and a gas distributor for spatially separating process gas for depositing a thin film on the substrate from a surface treatment gas for performing a surface treatment of the thin film, and locally distributing the process gas and the surface treatment gas on the substrate supporter, wherein the gas distributor confronting the substrate supporter is provided in the chamber lid.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: March 19, 2019
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventors: Jae Chan Kwak, Sung Kyu Kang, Hun Jung, Byoung Ha Cho
  • Patent number: 10214823
    Abstract: A coated metal component includes an aluminum alloy substrate and a protective aluminum coating on a substrate. An interfacial boundary layer between the coating and substrate enhances coating adhesion. The boundary layer includes isolated regions of copper or tin produced by a double zincating process. The protective aluminum coating exhibits improved adhesion and is formed by electrodeposition in an ionic liquid.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: February 26, 2019
    Assignee: United Technnologies Corporation
    Inventors: Rhonda R. Willigan, Lei Chen, Mark R. Jaworowski
  • Patent number: 10202690
    Abstract: Disclosed is an apparatus and method of processing substrate, which facilitates to improve deposition uniformity of a thin film deposited on a substrate, and to control quality of a thin film, wherein the apparatus includes a process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the bottom of the process chamber; a chamber lid confronting the substrate supporter, the chamber lid for covering an upper side of the process chamber; and a gas distributor for locally distributing activated source gas on the substrate, wherein the gas distributor locally confronting the substrate supporter is provided in the chamber lid, wherein the gas distributor forms plasma by the use of plasma formation gas, and activates the source gas by distributing the source gas to some of plasma area for formation of the plasma.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: February 12, 2019
    Assignee: JUSUNG ENGINEERING CO., LTD.
    Inventors: Chul Joo Hwang, Jeung Hoon Han, Young Hoon Kim, Seung Hoon Seo
  • Patent number: 10204790
    Abstract: In accordance with some embodiments herein, methods for deposition of thin films are provided. In some embodiments, thin film deposition is performed in a plurality of stations, in which each station provides a different reactant or combination of reactants. The stations can be in gas isolation from each other so as to minimize or prevent undesired chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) reactions between the different reactants or combinations of reactants.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: February 12, 2019
    Assignee: ASM IP Holding B.V.
    Inventors: Jun Kawahara, Suvi Haukka, Antti Niskanen, Eva Tois, Raija Matero, Hidemi Suemori, Jaako Anttila, Yukihiro Mori
  • Patent number: 10199256
    Abstract: In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.
    Type: Grant
    Filed: September 27, 2014
    Date of Patent: February 5, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Edward Ng, Jeffrey C. Hudgens, Ayan Majumdar, Sushant S. Koshti
  • Patent number: 10190216
    Abstract: A showerhead tilt adjustment mechanism is provided which supports a showerhead module in a top plate of a semiconductor substrate processing apparatus, the showerhead tilt adjustment mechanism including a differential screw which provides coarse and fine adjustments to adjust gap/tilt/planarization of a faceplate of the showerhead module with respect to an upper surface of a substrate pedestal module adjacent the faceplate in the semiconductor substrate processing apparatus.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: January 29, 2019
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Bin Luo, Timothy Scott Thomas, Damien Slevin, Dave Kamp
  • Patent number: 10186440
    Abstract: An adapter tool configured to be attached to a loadport of a wafer handling system includes a support member and first and second guiding elements attached to the support member and being juxtaposed to each other. The first guiding element is arranged for placing a first wafer magazine, and the second guiding element is arranged for placing a second wafer magazine. The adapter tool further includes a housing supported by the support member and configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: January 22, 2019
    Assignee: Infineon Technologies AG
    Inventors: Michael Larisch, Ulrich Beck, Michael Walser
  • Patent number: 10186401
    Abstract: In a known plasma-chemical coating apparatus, a plasma chamber is provided within which at least one linear antenna is arranged for producing a plasma by means of electromagnetic power, in which a supply for a carrier gas terminates and which comprises a plasma exit opening in the direction of a treatment chamber for a plasma-assisted modification of a substrate. Starting from this, to achieve cleaning cycles as in coating apparatuses with comparatively slow coating processes, it is suggested according to the invention that the plasma exit opening is configured as an elongated narrowing and defined preferably on both sides by cylinders which extend in parallel with each other and are rotatable about their cylinder axis, and that a cleaning zone is respectively provided for each of the cylinders, into which an area of the outer surface of the respective cylinder which is to be cleaned can be introduced by rotation about the cylinder axis.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: January 22, 2019
    Assignee: W & L Coating Systems GmbH
    Inventors: Michael Liehr, Hans-Dieter Wurczinger
  • Patent number: 10186422
    Abstract: A substrate processing apparatus is provided with a process module including a processing container, a rotary table installed within the processing container, the rotary table having a plurality of placing regions to receive substrates, and a process gas supply unit supplying a process gas to the placing regions, a load port in which a transfer container is placed, a dummy substrate receiving unit, a transfer chamber including a transfer mechanism delivering the product substrates or the dummy substrates between the transfer container or the dummy substrate receiving unit and the rotary table, a setting unit setting a placing region to which one of the product substrates is to be transferred, and a control unit outputting a control signal such that the dummy substrates are carried into the remaining placing regions.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: January 22, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Naohide Ito, Keiji Osada, Daisuke Morisawa
  • Patent number: 10167548
    Abstract: A continuous system for transmitting accelerating forces and decelerating forces by interlocking, consisting of at least one carrier system having at least two connecting elements, a plurality of transport systems arranged one behind the other, wherein each transport system has a cam drum or cylindrical cam having a helical groove and the connecting elements of the carrier system are suitable for interlockingly engaging with the groove of the cam drum, and at least one motor, which drives the cam drums.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: January 1, 2019
    Assignee: Singulus Technologies AG
    Inventors: Stefan Kempf, Holger Schramm
  • Patent number: 10170379
    Abstract: Disclosed herein is a wafer processing system for processing wafers one at a time, the wafer processing system including: a plurality of trays each configured to accommodate a wafer; a conveyor configured to transfer the wafers accommodated in the trays; first and second tray holding apparatuses arranged to be spaced from each other along the conveyor, the first and second tray holding apparatuses unloading the trays from the conveyor and loading the unloaded trays onto the conveyor; and first and second apparatuses provided for the first and second tray holding apparatuses, respectively, the first and second apparatuses including a processing unit configured to process the wafers transferred by the conveyor, and a loading/unloading unit configured to unload a wafer from or load a wafer onto one of the trays that is held by the first or second tray holding apparatus.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: January 1, 2019
    Assignee: DISCO CORPORATION
    Inventor: Kazuma Sekiya
  • Patent number: 10124492
    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: November 13, 2018
    Assignee: Lam Research Corporation
    Inventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
  • Patent number: 10115560
    Abstract: A metal surface modification apparatus having a tilting unit includes holding jigs having respective lower parts having curved surfaces to hold the implants; a movable holding base provided with a plurality of receiving depressions to have curved surfaces corresponding to the curved surfaces of the lower parts; and a stationary pushing plate disposed on the movable holding base to cover the movable holding base, and configured to be moved relative to the movable holding base and to have a plurality of through holes positioned to face the receiving depressions.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: October 30, 2018
    Assignee: Sodick Co., Ltd.
    Inventor: Motohiro Inoue
  • Patent number: 10100409
    Abstract: A chemical vapor deposition (CVD) reactor includes a double wall vacuum processing chamber with an inner wall and an outer wall and fluid passages between the walls. A layer of thermal insulation covers the outer wall. A layer of high temperature thermal insulation covers the inner wall. Heating elements are positioned in the interior of the processing chamber to heat a substrate mounted in the chamber. A gas inlet structure is positioned through the inner and outer walls of the chamber and oriented to direct a flow of reactant gas against the substrate to form a CVD coating on the substrate. A gas outlet structure connected to a vacuum and effluent management system is positioned through the inner and outer walls of the chamber.
    Type: Grant
    Filed: February 11, 2015
    Date of Patent: October 16, 2018
    Assignee: United Technologies Corporation
    Inventor: Kirk C. Newton
  • Patent number: 10103040
    Abstract: The invention relates to an apparatus for manufacturing a semiconductor device comprising a reaction chamber comprising a substrate holder for holding a substrate; and, a heater for heating the substrate. The heater may comprise a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate held by the substrate holder to heat the substrate.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: October 16, 2018
    Assignee: ASM IP Holding B.V.
    Inventors: Theodorus Oosterlaken, Chris de Ridder, Lucian Jdira
  • Patent number: 10062599
    Abstract: A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve having a first side and a second side, the first side of the isolation valve coupled to a second side of the process module. A replacement station is coupled to the second side of the isolation valve. The replacement station includes an exchange handler and a part buffer. The part buffer includes a plurality of compartments to hold new or used consumable parts. The process module includes a lift mechanism to enable placement of a consumable part installed in the process module to a raised position. The raised position provides access to the exchange handler to enable removal of the consumable part from the process module and store in a compartment of the part buffer. The exchange handler of the replacement station is configured to provide a replacement for the consumable part from the part buffer back to the process module.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: August 28, 2018
    Assignee: Lam Research Corporation
    Inventors: Damon Tyrone Genetti, Jon McChesney, Alex Paterson, Derek John Witkowicki, Austin Ngo
  • Patent number: 10056574
    Abstract: An organic EL display 1 includes a sealing film 2 provided on a plastic substrate 10 to cover an organic EL element 4. The sealing film 2 includes a first sealing layer 25 on a surface of the plastic substrate 10, three stress relief layers 26, 27, and 28 on a surface of the first sealing layer 25, and a second sealing layer 29 on a surface of the stress relief layer 28. The stress relief layers 26, 27, and 28 each have a higher coefficient of thermal expansion than the first and second sealing layers 25 and 29. The stress relief layer 27 interposed between the stress relief layers 26 and 28 has a higher coefficient of thermal expansion than the stress relief layers 26 and 28.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: August 21, 2018
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Mamoru Ishida, Tetsuya Okamoto, Takeshi Hirase, Tohru Senoo, Tohru Sonoda, Daichi Nishikawa
  • Patent number: 10049860
    Abstract: An apparatus includes a row of substrate transfer devices 3 which can deliver a wafer W within a transfer chamber; and rows of process modules PM, arranged at right and left sides of the row of the substrate transfer devices along the row, configured to perform processes to the wafer W. The rows of the process modules PM are arranged such that each of the processes can be performed by at least two process modules PM. Thus, when a single process module PM cannot be used, the wafer W can be rapidly transferred to another process module PM which can perform the same process as performed in the corresponding process module. Therefore, even when the single process module PM cannot be used, the processes can be continued to the wafers W without stopping an operation of the apparatus, so that the number of wasted wafers W can be reduced.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: August 14, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Atsushi Gomi, Tetsuya Miyashita, Shinji Furukawa, Koji Maeda, Masamichi Hara, Naoyuki Suzuki, Hiroshi Miki, Toshiharu Hirata
  • Patent number: 10029344
    Abstract: A polishing apparatus capable of enabling a user to know a frequency and a trend of a retry operation of retrying a substrate release operation is disclosed. The polishing apparatus includes: a substrate holder configured to press a substrate against a polishing pad; a fluid ejection system configured to eject a fluid into a gap between the substrate and a flexible membrane for releasing the substrate from a substrate holding surface; an operation controller configured to instruct the fluid ejection system to perform a retry operation of ejecting the fluid again in a case where the release of the wafer has failed; and a monitoring device configured to store a historical information of the retry operation.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: July 24, 2018
    Assignee: EBARA CORPORATION
    Inventor: Shuichi Kamata
  • Patent number: 10023385
    Abstract: An article storage facility is provided in which a back side transport device can be installed while reducing any reduction in the storage efficiency of the article storage facility. A back side transport device (4) is provided which can support and transport an article (W) between an outside location (P1) located rearward of a back face of the article storage rack (2) and an inside location (P2) located forwardly of the back face of the article storage rack (2). The inside location (P2) is defined between storage sections (1) arranged along the rack vertical direction. And the back side transport device (4) includes a receiving support portion (20) for receiving and supporting an article (W), and an actuating operation portion (21) for actuating the receiving support portion (20) in order to move the article (W) to the inside location (P2) and to the outside location (P1).
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: July 17, 2018
    Assignee: Daifuku Co., Ltd.
    Inventors: Suguru Shibata, Hiroshi Otsuka
  • Patent number: 10014261
    Abstract: A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: July 3, 2018
    Assignee: PALO ALTO RESEARCH CENTER INCORPORATED
    Inventors: Eugene M. Chow, JengPing Lu, Armin R. Volkel, Bing R. Hsieh, Gregory L. Whiting
  • Patent number: 10014196
    Abstract: A wafer transport assembly includes first and second wafer transport modules, and a buffer module coupled between the first and second wafer transport modules. The first and second wafer transport modules and the buffer module are aligned in a single directional axis. The buffer module includes a first buffer stack positioned at a first lateral end of the buffer module, and a second buffer stack positioned at a second lateral end of the buffer module. The first lateral end of the buffer module defines a first side protrusion nested between the first and second wafer transport modules and first and second process modules. The second lateral end of the buffer module defines a second side protrusion that is nested between the first and second wafer transport modules and third and fourth process modules. The first and second wafer transport modules and the buffer module define a continuous controlled environment.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 3, 2018
    Assignee: LAM RESEARCH CORPORATION
    Inventors: John Daugherty, David Trussell, Michael Kellogg, Christopher Pena, Richard Gould, Klay Kunkel
  • Patent number: 10014163
    Abstract: The invention relates to apparatus and a method for applying coatings to substrates such as, for example, a lens or electronic component. The apparatus includes a coating chamber in which there is provided one or more magnetrons which include, typically, an at least partially oxidized metal or metal alloy. A carrier is provided for the substrates to be moved and held in the coating chamber and the carrier is formed from a plurality of units on which the substrates are positioned and the units can be brought together to form the carrier.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: July 3, 2018
    Assignee: Vision Ease, LP
    Inventors: Allen Robert Waugh, Gareth William Hall, Steven Antony Stanley
  • Patent number: 10000847
    Abstract: Embodiments described herein include a susceptor for semiconductor processing including an oriented graphite plate that may have a thickness of at least 1 mm. The susceptor may have a support member, and the oriented graphite plate may be disposed on the support member. The support member may have a center thermal conduit and an edge thermal conduit, and may be substantially solid between the center thermal conduit and the edge thermal conduit.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: June 19, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Preetham Rao, Subramani Iyer, Kartik Shah, Mehran Behdjat
  • Patent number: 10001772
    Abstract: Recent trends of larger wafer and smaller lot sizes bring cluster tools with frequent lot switches. Practitioners must deal with more transient processes during such switches, including start-up and close-down processes. To obtain higher yield, it is necessary to shorten the duration of transient processes. Much prior effort was poured into the modeling and scheduling for the steady state of cluster tools. In the existing literature, no attention has been turned to optimize the close-down process for single-arm cluster tools with wafer residency constraints. This invention intends to do so by 1) developing a Petri net model to analyze their scheduling properties and 2) proposing Petri net-based methods to solve their close-down optimal scheduling problems under different workloads among their process steps. Industrial examples are used to illustrate the effectiveness and application of the proposed methods.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: June 19, 2018
    Assignee: Macau University of Science and Technology
    Inventors: Naiqi Wu, Qinghua Zhu, Mengchu Zhou, Yan Qiao
  • Patent number: 9970096
    Abstract: There is described an intaglio printing plate coating apparatus comprising a vacuum chamber having an inner space adapted to receive at least one intaglio printing plate to be coated, a vacuum system coupled to the vacuum chamber adapted to create vacuum in the inner space of the vacuum chamber, and a physical vapour deposition (PVD) system adapted to perform deposition of wear-resistant coating material under vacuum onto an engraved surface of the intaglio printing plate, which physical vapour deposition system includes at least one coating material target comprising a source of the wear-resistant coating material to be deposited onto the engraved surface of the intaglio printing plate. The vacuum chamber is arranged so that the intaglio printing plate to be coated sits substantially vertically in the inner space of the vacuum chamber with its engraved surface facing the at least one coating material target.
    Type: Grant
    Filed: May 6, 2017
    Date of Patent: May 15, 2018
    Assignee: KBA-NotaSys SA
    Inventors: Fran├žois Gremion, Laurent Claude
  • Patent number: 9966286
    Abstract: A space needed to transfer a substrate container is decreased. A substrate processing apparatus includes a locating part where a substrate container accommodating a substrate is located; a driving unit configured to drive the locating part vertically; a transfer robot configured to transfer the substrate container; and a controller configured to control the driving unit and the transfer robot to move the locating part downward after the transfer robot moves to under the locating part to transfer the substrate container from the locating part to the transfer robot.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: May 8, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Takashi Nogami, Tomoshi Taniyama, Kazuma Yoshioka
  • Patent number: 9957606
    Abstract: A circular PVD chamber has a plurality of sputtering targets mounted on a top wall of the chamber. A pallet in the chamber is coupled to a motor for rotating the pallet about its center axis. The pallet has a diameter less than the diameter of the circular chamber. The pallet is also shiftable in an XY direction to move the center of the pallet beneath any of the targets so all areas of a workpiece supported by the pallet can be positioned directly below any one of the targets. A scanning magnet is in back of each target and is moved, via a programmed controller, to only be above portions of the workpiece so that no sputtered material is wasted. For depositing a material onto small workpieces, a cooling backside gas volume is created between the pallet and the underside of sticky tape supporting the workpieces.
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: May 1, 2018
    Assignee: Tango Systems Inc.
    Inventors: Ravi Mullapudi, Srikanth Dasaradhi, Lee LaBlanc, Suresh Palanisamy, Venkata Dora Chowdary Kakarla
  • Patent number: 9941132
    Abstract: A plasma processing apparatus includes: a reaction chamber; a plasma generation unit; a stage disposed inside the reaction chamber; an electrostatic chuck mechanism including an electrode portion inside the stage; a heater inside the stage; a support portion which supports a conveyance carrier between a stage-mounted position on the stage and a transfer position distant from the stage upward; and an elevation mechanism which elevates and lowers the support portion relative to the stage. In a case in which the conveyance carrier is mounted on the stage by lowering the support portion, application of voltage to the electrode portion is started in a state that the stage is being heated, and the plasma generation unit generates plasma after at least a part of an outer circumferential portion of a holding sheet holding the conveyance carrier contacts the stage and also after the heating of the stage is stopped.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: April 10, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shogo Okita, Atsushi Harikai, Noriyuki Matsubara
  • Patent number: 9914994
    Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: March 13, 2018
    Assignee: INTEVAC, INC.
    Inventors: Patrick Leahey, Eric Lawson, Charles Liu, Terry Bluck, Kevin P. Fairbairn, Robert L. Ruck, Samuel D. Harkness, IV
  • Patent number: 9916923
    Abstract: Apparatus for controlling heat transfer between two objects. In one embodiment, an apparatus for controlled heat transfer is disclosed herein. The apparatus includes a first and second conductive elements, a container of magnetorheological fluid disposed between the first and second conductive elements, a first electromagnet disposed about the container, wherein the electromagnet is configured to produce a first magnetic field within the container of magnetorheological fluid and conductively couple the first and second conductive elements, and a second electromagnet configured to produce a second magnetic field perpendicular to the first magnetic field, wherein the second magnetic field is configured to conductively couple the first conductive element and the second conductive element.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: March 13, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Barron, Chelsie M. Peterson
  • Patent number: 9909552
    Abstract: To downsize an electromagnetic wave generation device in a plasma generation device that generates electromagnetic wave plasma by emitting to a target space an electromagnetic wave amplified by means of a solid state amplifying element. The plasma generation device includes the electromagnetic wave generation device that outputs the electromagnetic wave amplified by means of the solid state amplifying element, and an emission antenna for emitting the electromagnetic wave outputted from the electromagnetic wave generation device to the target space. The plasma generation device causes the emission antenna to emit the electromagnetic wave to the target space, thereby generating the electromagnetic wave plasma. The plasma generation device has a characteristic that an output waveform of the electromagnetic wave generation device has a peak during a rise, and is adapted to output the electromagnetic wave to the emission antenna without reducing the peak during the rise of the output waveform.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: March 6, 2018
    Assignee: IMAGINEERING, INC.
    Inventor: Yuji Ikeda
  • Patent number: 9911580
    Abstract: A conventional substrate processing apparatus for generating plasma cannot generate plasma with high density and thus throughput of substrate processing is low. In order to solve this problem, provided is a substrate processing apparatus including a reaction vessel having a tubular shape and provided with a coil installed at an outer circumference thereof; a cover installed at a first end of the reaction vessel; a gas introduction port installed at the cover; a first plate installed between the gas introduction port and an upper end of the coil; a second plate installed between the first plate and the upper end of the coil; a substrate processing chamber installed at a second end of the reaction vessel; and a gas exhaust part connected to the substrate processing chamber.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: March 6, 2018
    Assignee: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hidehiro Yanai, Shin Hiyama, Toru Kakuda, Toshiya Shimada, Tomihiro Amano
  • Patent number: 9887115
    Abstract: Provided is a substrate processing apparatus that can suppress the amount of inert gas and dry gas used and also can prevent reductions in throughput. A substrate processing apparatus is provided with: a loader module; an opener that removes a cover from a FOUP having a main body, an opening and the cover, to communicate the inside of the FOUP with the inside of the loader module through the opening; an N2 gas supply unit that is attached to the loader module and supplies N2 gas to the inside of the FOUP; and two slide cover plates movable respectively along an opening surface of the opening. The slide cover plates move toward each other until the gap therebetween is 1 mm to 3 mm to shield the opening of the FOUP that is attached to the loader module from the inside of the loader module.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: February 6, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Shinji Wakabayashi
  • Patent number: 9879341
    Abstract: Embodiments described herein provide a remote plasma system utilizing a microwave source. Additionally, generation and deposition techniques for 2D transition metal chalcogenides with large area uniformity utilizing microwave assisted generation of radicals is disclosed. Plasma may be generated remotely utilizing the microwave source. A processing platform configured to deposit 2D transition metal chalcogenides is also disclosed.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: January 30, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Kaushal K. Singh, Deepak Jadhav, Ashutosh Agarwal, Ashish Goel, Vijay Parihar, Er-Xuan Ping, Randhir P. S. Thakur
  • Patent number: 9873946
    Abstract: The present invention provides improved methods of preparing a low-k dielectric material on a substrate. The methods involve multiple operation ultraviolet curing processes in which UV intensity, wafer substrate temperature, UV spectral distribution, and other conditions may be independently modulated in each operation. Operations may be pulsed or even be concurrently applied to the same wafer. In certain embodiments, a film containing a structure former and a porogen is exposed to UV radiation in a first operation to facilitate removal of the porogen and create a porous dielectric film. In a second operation, the film is exposed to UV radiation to increase cross-linking within the porous film.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: January 23, 2018
    Assignee: Novellus Systems, Inc.
    Inventors: Jason Dirk Haverkamp, Dennis M. Hausmann, Kevin M. McLaughlin, Krishnan Shrinivasan, Michael Rivkin, Eugene Smargiassi, Mohamed Sabri
  • Patent number: 9875895
    Abstract: Provided is a substrate processing apparatus.
    Type: Grant
    Filed: November 16, 2012
    Date of Patent: January 23, 2018
    Assignee: EUGENE TECHNOLOGY CO., LTD.
    Inventors: Il-Kwang Yang, Sung-Tae Je, Byoung-Gyu Song, Yong-Ki Kim, Kyong-Hun Kim, Yang-Sik Shin
  • Patent number: 9870917
    Abstract: A process tuning kit for use in a chemical deposition apparatus wherein the process tuning kit includes a carrier ring, horseshoes and shims. The horseshoes have the same dimensions and the shims are provided in sets with different thicknesses to control the height of the horseshoes with respect to an upper surface of a pedestal assembly on which the horseshoes and shims are mounted. A semiconductor substrate is transported into a vacuum chamber of the chemical deposition apparatus by the carrier ring which is placed on the horseshoes such that minimum contact area supports lift the substrate from the carrier ring and support the substrate at a predetermined offset with respect to an upper surface of the pedestal assembly. During processing of the substrate, backside deposition can be reduced by using shims of desired thickness to control the predetermined offset.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: January 16, 2018
    Assignee: LAM RESEARCH CORPORATION
    Inventors: Hu Kang, Ishtak Karim, Purushottam Kumar, Jun Qian, Ramesh Chandrasekharan, Adrien LaVoie
  • Patent number: 9869019
    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus in which a process with respect to substrates is performed includes a lower chamber having an opened upper portion, the lower chamber having a passage, through which the substrates are accessible, in a side thereof, an external reaction tube closing the opened upper portion of the lower chamber to provide a process space in which the process is performed, a substrate holder on which the one or more substrates are vertically stacked, the substrate holder being movable between a stacking position at which the substrates are stacked within the substrate holder and a process position at which the process with respect to the substrates is performed, a gas supply unit supplying a reaction gas into the process space, and a processing unit disposed outside the external reaction tube to activate the reaction gas, thereby performing the process with respect to the substrates.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: January 16, 2018
    Assignee: EUGENE TECHNOLOGY CO., LTD.
    Inventors: Il-Kwang Yang, Byoung-Gyu Song, Yong-Ki Kim, Kyong-Hun Kim, Yang-Sik Shin
  • Patent number: 9859140
    Abstract: A load lock is provided for a semiconductor substrate processing system having a transport robot mounted therein. The load lock transport supplies substrates directly to a processing chamber without the need for a central transport robot. The load lock transport is a dual element robot designed for minimum clearance and space and operates within a matching load lock chamber of minimum volume.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: January 2, 2018
    Assignee: Brooks Automation, Inc.
    Inventor: Mark A. Talmer
  • Patent number: 9847241
    Abstract: A transport module for loading and unloading a process module of a semiconductor production device includes a housing, which has a chamber that can be evacuated. The chamber has an opening that can be closed in a gas-tight manner by a closure device, which opens out into a first coupling duct associated with the transport module. The first coupling duct is connected with a flange plate using an elastic intermediate element, wherein the flange plate can be seated in a plane parallel, sealing manner on a flange plate of a second coupling duct associated with the process module. After opening the closure device, an evacuated loading and unloading duct to the process module is created. An inner and outer mounting section of the intermediate element is spaced apart from one another in the radial direction, with respect to the axis of the first coupling duct, by a deformation zone.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 19, 2017
    Assignee: AIXTRON SE
    Inventors: Martin Freundt, Walter Franken
  • Patent number: 9847263
    Abstract: A substrate processing method which can increase the yield by reprocessing a substrate whose processing has been interrupted by a processing interruption command during a substrate processing is disclosed. A substrate processing method performs a predetermined processing of a substrate while sequentially transporting the substrate to a plurality of processing sections according to a preset recipe. The substrate processing method includes processing a substrate in one of the processing sections; interrupting the processing of the substrate by a processing interruption command during processing of the substrate; setting the substrate whose processing has been interrupted in a standby state; and customizing the recipe and performing reprocessing of the processing-interrupted substrate according to the customized recipe, or performing reprocessing of the processing-interrupted substrate according to a preset recipe for reprocessing.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: December 19, 2017
    Assignee: EBARA CORPORATION
    Inventors: Hirofumi Otaki, Tsuneo Torikoshi
  • Patent number: 9839940
    Abstract: A tool for depositing multilayer coatings onto a substrate. The tool includes a housing defining a vacuum chamber connected to a vacuum source, deposition stations each configured to deposit a layer of multilayer coating on the substrate, a curing station, and a contamination reduction device. At least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. In one tool configuration, the substrate may travel back and forth through the tool as many times as needed to achieve the desired number of layers of multilayer coating. In another, the tool may include numerous housings adjacently spaced such that the substrate may make a single unidirectional pass. The contamination reduction device may be configured as one or more migration control chambers about at least one of the deposition stations, and further includes cooling devices, such as chillers, to reduce the presence of vaporous layer precursors.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: December 12, 2017
    Assignee: Samsung Display Co., Ltd.
    Inventors: Charles C. Bonham, Paul E. Burrows, Xi Chu, Gordon Lee Graff, Mark Edward Gross, Peter Maclyn Martin, Lorenza Moro, Kenneth Jeffrey Nelson, John Chris Pagano, Mac R. Zumhoff
  • Patent number: 9837250
    Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, an apparatus for processing substrates includes a chamber body enclosing a processing volume, the chamber body comprising a chamber floor, a chamber wall coupled to the chamber floor, and a chamber lid removably coupled to the chamber wall, wherein at least one of the chamber floor, the chamber wall, and the chamber lid comprise passages for a flow of a thermal control media; a heater plate disposed adjacent to and spaced apart from the chamber floor; a sleeve disposed adjacent to and spaced apart from the chamber wall, the sleeve supported by the heater plate; and a first sealing element disposed at a first interface between the chamber wall and the chamber lid.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: December 5, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Joel M. Huston, Olkan Cuvalci, Michael P. Karazim, Joseph Yudovsky