Signal transmission structure
A signal transmission structure includes at least one reference plane with a non-reference area, and a signal line with a salient protruding over the edge of the signal line and the salient is corresponding to the position of the non-reference area. When a signal passes through the signal line, the effect of the parasitic capacitance between the salient and the reference plane can improve the characteristic impedance mismatch. Therefore, the signal transmission structure can reduce the insertion loss and increase the reduction of the return loss in order to locally compensate the impedance mismatch.
Latest VIA Technologies, Inc. Patents:
This application claims the priority benefit of Taiwan application serial no. 92128843, filed on Oct. 17, 2003, the full disclosure of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION1. Field of the Invention
This invention generally relates to a signal transmission structure, and more particularly to a signal transmission structure for improving the characteristic impedance mismatch of the signal transmission structure.
2. Description of Related Art
The signal line in a printed circuit board with a large scale or a packaging substrate for connecting two devices or two terminals has to maintain a uniform line width in order to keep a constant characteristic impedance when an electronic signal is transmitted in the signal line. A good impedance matching design between the two terminals are required to reduce the reflection due to the impedance mismatch especially when the signal is transmitted in a high speed and a high frequency environment i.e., to reduce the insertion loss and increase the reduction of the return loss when transmitting the signals so that the quality of the signal transmission will not be affected.
In light of the above, the frequency increases, the return loss decreases and the corresponding characteristic impedance increases when the signal line passes through the non-reference area. Hence, the difference in the characteristic impedance from the original design is increased so that the impedance mismatch is much more serious. Therefore and for the foregoing reasons, there is a desperate need for a method or structure that is able to improve the characteristic impedance mismatch when the signal line passes through a non-reference area.
SUMMARY OF THE INVENTIONAn object of the present invention is to provide a signal transmission structure for improving the characteristic impedance mismatch when the signal line passes through a non-reference area.
The present invention provides a signal transmission structure for a circuit board, comprising: a reference plane having a non-reference area; and a signal line on a first side of the reference plane, wherein the signal line having at least a salient positioning corresponding to the non-reference area and protruding from a lateral side of the signal line.
In a preferred embodiment of the present invention, the reference plane is one of a power plane and a ground plane; the reference and the signal line can be overlapped but not co-planar; alternatively the reference plane and the signal line can be co-planar. A portion of the salient partially extends to an area outside the non-reference area when the reference and the signal line are overlapped. In addition, the salient extends into the opening forming a distance in between the salient and the reference plane when the reference plane and the signal line are co-planar. The opening forms the non-reference area.
The present invention uses a signal transmission structure with a salient. The position of the salient corresponds to the position of the non-reference area and protrudes from the edge of the signal line. When the signal transmits in the signal line, the parasitic capacitance formed between the salient and the reference plane can improve the characteristic impedance mismatch. To summarize, the signal transmission structure can reduce the insertion loss and increase the reduction of the return loss to locally compensate the impedance mismatch when the signal is transmitted in a high frequency/high speed environment.
The above is a brief description of some deficiencies in the prior art and advantages of the present invention. Other features, advantages and embodiments of the invention will be apparent to those skilled in the art from the following description, accompanying drawings and appended claims.
To calculate the impedance of the signal line, the characteristic impedance Z is approximately equal to
wherein L is the equivalent inductance of the signal line, and C is the equivalent capacitance of the signal line. In the conventional design, the equivalent inductance L of the signal line is increased when the signals pass through the non-reference area, thereby increasing the characteristic impedance Z. However, this embodiment increases the equivalent capacitance C of the signal line 230 so that the characteristic impedance Z can be reduced because of the increase of the parasitic capacitance at the non-reference area 222. As a result, the characteristic impedance Z of the signal line becomes uniform by locally compensating the characteristic impedance.
Because the equivalent capacitance C of the signal line 230 is proportional to the area A between the signal line 230 and the reference plane 220 and is inversely proportional to the distance d between the signal line 230 and the reference plane 220, the equivalent capacitance C can be increased by either increasing the area A or reducing the distance d between the signal line 230 and the reference plane 220. Hence, the parasitic capacitance increased due to the salient 232 can effectively improve the impedance mismatch of the signal line 230 when the signals pass through the widened salient 232 of the signal line 230.
The signal transmission structure 310 is for a circuit board. The signal transmission structure 310 includes at least a signal line 330 and a reference plane 320. The signal line 330, for example, can be above the reference plane 320, and the signal line 330 and the reference plane 320 are overlapped but not co-planar. Further, the salient 332 of the signal line 30 can be widened and extended longer to completely cover the non-reference area 322 without affecting the layout density of the adjacent signal lines. Moreover, a portion of the salient 332 can extend to an area outside the non-reference area 322 so that the area of the salient 332 is larger than that of the non-reference area 322, and therefore, the salient 322 is able to encircle the circumference of the non-reference area 322. Therefore, the characteristic impedance Z of the signal line 330 becomes uniform by locally compensating the characteristic impedance by increasing the equivalent capacitance C of the salient 332 of the signal line 330.
To summarize, the signal transmission structure of the present invention includes at least a signal line and a reference plane. The reference plane has a non-reference area. The signal line is on a side of the reference plane including a salient positioning corresponding to the non-reference area and protruding from a lateral side of the signal line. The reference plane is one of a power plane and a ground plane. The reference plane and the signal line can be overlapped but not co-planar, alternatively the reference plane and the signal line can be co-planar. A portion of the salient partially extends to an area outside the non-reference area when the reference and the signal lines are overlapped. The characteristic impedance of the signal line becomes uniform by using the salient of the signal line to compensate the characteristic impedance and to achieve the impedance match. The salient extends into the opening of the reference plane forming a distance in between the salient and the reference plane when the reference plane and the signal line are co-planar. The opening forms the non-reference area. Thus, the characteristic impedance of the signal line becomes uniform by using the salient of the signal line to compensate the characteristic impedance and to achieve the impedance match.
In light of the above, the signal transmission structure of the present invention has the following advantages
1. The present invention can overcome the high impedance generated when the signals pass through the non-reference area by increasing the equivalent capacitance of the salient. Therefore, the characteristic impedance of the signal line becomes uniform by locally compensating the characteristic impedance.
2. The present invention can increase the reduction of the return loss when the signals pass through the non-reference area by increasing the equivalent capacitance of the salient.
3. The present invention can reduce the insertion loss when the signals pass through the non-reference area by increasing the equivalent capacitance of the salient.
4. The signal transmission structure of the present invention can be widely applied in a printed circuit board with a large scale or a packaging substrate.
The above description provides a full and complete description of the preferred embodiments of the present invention. Various modifications, alternate construction, and equivalent may be made by those skilled in the art without changing the scope or spirit of the invention. Accordingly, the above description and illustrations should not be construed as limiting the scope of the invention which is defined by the following claims.
Claims
1. A signal transmission structure for a circuit board, comprising:
- a reference plane having a non-reference area; and
- a signal line on a first side of said reference plane, wherein said signal line having at least a salient positioning corresponding to said non-reference area and protruding from a lateral side of said signal line, wherein said reference plane and said signal line are co-planar, and wherein said reference plane has an opening, said opening being on a lateral side of said reference plane that adjacent to said signal line forming said non-reference area, said salient extending into said opening forming a distance in between said salient and said reference plane.
2. The signal transmission structure of claim 1, wherein said reference plane is one of a power plane and a ground plane.
3. The signal transmission structure of claim 1, wherein said reference plane and said signal line are overlapped.
4. The signal transmission structure of claim 3, wherein a portion of said salient partially extends to an area outside said non-reference area.
5. The signal transmission structure of claim 3, wherein said salient includes a first salient portion and a second salient portion, said first salient portion being on a side of said non-reference area that corresponding to said extended direction of said signal line, and said second salient portion being on the opposite side of said first salient portion.
6. A signal transmission structure comprising:
- a reference plane having an opening; and
- a signal line having a wider width region, wherein said wider width region including a salient for increasing a parasitic capacitance when said signal line protruding into opening, wherein said reference plane and said signal line are co-planar, and wherein said reference plane has an opening, said opening being on a lateral side of said reference plane that adjacent to said signal line forming said non-reference area, said salient extending into said opening forming a distance in between said salient and said reference plane.
7. The signal transmission structure of claim 6, wherein the width of said salient is larger than the width of said opening.
8. The signal transmission structure of claim 6, wherein said salient encircles a circumference of said opening.
9. The signal transmission structure of claim 6, wherein said salient is distributed in a dumbbell shape over two sides of said opening.
Type: Grant
Filed: Jan 28, 2004
Date of Patent: Feb 21, 2006
Patent Publication Number: 20050083148
Assignee: VIA Technologies, Inc. (Taipei Hsien)
Inventor: Jimmy Hsu (Taipei Hsien)
Primary Examiner: Robert Pascal
Assistant Examiner: Kimberly Glenn
Attorney: J.C. Patents
Application Number: 10/767,900
International Classification: H03H 7/38 (20060101);