Abstract: A waveguide microstrip line converter includes: a waveguide; a dielectric substrate; a ground conductor provided with a slot; a line conductor; and a conductor located at a distance from the line conductor and adjacent to the line conductor. The line conductor includes a microstrip line, a conversion unit, a first impedance transforming unit, a second impedance transforming unit, and a third impedance transforming unit, the microstrip line having a first line width, the conversion unit being located immediately above the slot and having a second line width larger than the first line width, the first impedance transforming unit, the second impedance transforming unit, and the third impedance transforming unit extending in a first direction from the conversion unit and having a role in impedance matching between the microstrip line and the conversion unit. The conductor is adjacent to at least part of the conversion unit of the line conductor.

Abstract: In one embodiment, an RF impedance matching circuit includes at least one electronically variable capacitor (EVC) comprising discrete fixed capacitors. Each fixed capacitor has a corresponding switching circuit for switching in and out the fixed capacitor to alter a total capacitance of the EVC. Each switching circuit includes a diode operably coupled to the fixed capacitor to cause the switching in and out of the fixed capacitor, the diode being a PIN diode or an NIP diode. Each switching circuit further includes a driver circuit operably coupled to the diode, and a resonant filter positioned between the driver circuit and the diode. The resonant filter includes an inductor and a capacitor coupled in parallel.

Abstract: A device for amplification of an input signal, the device comprising: amplification circuitry comprising a plurality of switchable transistors; a variable voltage input connected to the amplification circuitry; and controller circuitry; wherein the controller circuitry is configured to: set a target output power level of the device; and control at least one of: a state of connection between the plurality of switchable transistors to change an effective physical dimension of the amplification circuitry; or a level of the variable voltage input; in accordance with a load impedance of an output of the amplification circuitry, to amplify the input signal to the target output power level for that load impedance.

Abstract: A method includes receiving, from one or more sensors, sensor data associated with manufacturing equipment and updating one or more values of a digital replica associated with the manufacturing equipment based on the sensor data. The digital replica comprises a model reflecting a virtual representation of physical elements and dynamics of how the manufacturing equipment operates. One or more outputs indicative of predictive data is obtained from the digital replica and, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment is caused.

Abstract: Leakage of radio-frequency radiation noise radiated from a noise source to the outside is suppressed. An electronic control device 1 includes a printed board 101 having signal grounds 104a, 104b, and 104c, and a frame ground 103a, a housing 100 accommodating the printed board 101, and a connector 105 mounted on the printed board 101. The electronic control device 1 includes a first coupling portion 301 that AC-couples the signal ground 104a with the frame ground 103a and a second coupling portion 301 that electrically couples the frame ground 103a with the housing 100, and the first coupling portion 301 and the second coupling portion 301 are provided between the connector 105 and an electronic circuit 110 on the printed board 101.

Abstract: In one embodiment, an impedance matching network includes a variable reactance circuit having fixed reactance components and corresponding switching circuits. Each switching circuit includes a diode and a driver circuit. The driver circuit includes, coupled in series, a biasing current source positioned to provide a bias current to bias the diode, a first switch, a second switch, and a resistor. For each diode of each switching circuit, the control circuit is configured to receive a value related to a voltage drop on the resistor and, based on the value related to the voltage drop, adjust the bias current being provided by the biasing current source.

Abstract: High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

Abstract: Techniques are described herein for dynamically adjusting a resonant frequency of a resonance circuit to optimize power transfer to a mirror device such as a MEMS mirror. A variable capacitance circuit can be operated responsive to a bias control signal. A capacitance control circuit can vary the bias control signal to the resonance circuit responsive to a sense signal. The sense circuit is configured to generate the sense signal responsive to an output of the mirror device. By monitoring a signal level from the output of the mirror device 130, and adjusting the bias control signal of the resonance circuit, the exact resonance frequency of the resonance circuit can be adjusted until a peak signal level is observed, thus improving the efficiency of the energy transferred from the driver circuit 110 to the mirror device 130, and counteracting the impact of parasitic capacitances on the resonance.

Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.

Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.

Abstract: An optimizable beacon and method of using the same. The beacon has an onboard power source with a finite capacity. The system uses a capacitor bank to adjust the capacitance of the beacon, thereby maximizing the signal provided considering conditions, rather than simply using a theoretical value. With the specified capacitance being used, the beacon may be optimized in both a high and low power mode by driving the current to ensure the measured power is greater than or equal to a target. The system may also have a motion sensor to toggle the power off, or to a low-power mode, when the beacon is moving, and location measurements are not taking place. The optimization process may also consider the chemistry of the battery being utilized.

Abstract: This disclosure provides techniques for impedance matching. A radio frequency (RF) device includes a power detector to determine a transmitter leakage and a post-processing unit to determine a receiver leakage, and determines if isolation is acceptable based on the leakages. The RF device may include a device for measuring antenna impedance. Otherwise, the RF device may select multiple tuner settings (e.g., capacitor values) for test signals to be transmitted and received at a target frequency, determine multiple sets of leakage values, determine multiple reflection coefficients based on the multiple sets of leakage values, and determine an estimated antenna impedance at the target frequency based on the reflection coefficients. The RF device then determines impedance tuner settings based on the measured or estimated antenna impedance. Alternatively, the RF device determines impedance tuner settings using an inverse machine-learning model based on a determined matching impedance.

Abstract: A high-frequency power transistor comprises a transistor, at least one capacitor and a housing, which at least partially encloses the transistor and the capacitor. A first port for a high-frequency input and a gate DC voltage supply are connected to a gate contact of the transistor. A second port is connected to a drain contact of the transistor for a high-frequency output and drain DC voltage supply. A third port and fourth port are connected to a source contact of the transistor. All ports lead out of the same housing. The third port is connected via the capacitor to the source contact, and the fourth port is connected via at least one inductive element to the source contact, so that the third port provides a high-frequency ground, and the fourth port provides a floating low-frequency ground and source DC voltage supply.

Abstract: Method of operating a power combiner network (1), the power combiner network (1) comprising a power combiner device (10) having N secondary ports (11(1, 2, N)) combining into one primary port (12), wherein respective N secondary port (11(1, 2, . . . , N)) is provided with a phase shifter arrangement (13) and a load control arrangement (14). Respective phase shifter arrangement (13) is configured to set a phase of a signal fed through respective N secondary port (11(1, 2, . . . , N)). Respective load control arrangement (14) is configured to set the N secondary ports (11(1, 2, . . . , N)) in an active or in an inactive operation mode. For I inactive secondary ports (11(1)) the load control arrangement (14) is further configured to set a phase of the signal reflected from the I inactive secondary ports (11(1)). The method comprises the method steps of; step A (100), selecting which of the N secondary ports (11(1, 2, . . .

Abstract: Provided are, among other things, systems, apparatuses methods and techniques for converting digital data to radio-frequency (RF) signals. One such apparatus includes a reactive-impedance network within which the levels of multiple binary waveforms are individually boosted, before being combined to produce a single, composite output signal.

Abstract: A data network has at least three line branches connected via a common star node to distribute message signals from one of the line branches onto the other line branches, wherein connected to at least one of the line branches is at least one bus-user device is configured to generate in a corresponding transmit mode by a corresponding transmit unit at least one of the message signals, wherein in the corresponding bus-user device, the transmit unit has a current source circuit which, in generating the message signal (16), is configured to inject an electric current into electrical lines of the line branch to which the bus-user device is connected, and via the current source circuit the lines are connected to an internal impedance value of the current source circuit that in transmit mode is constantly greater than 10 times the value of the characteristic impedance, for example greater than 500 Ohms.

Abstract: A multiplexer includes an antenna terminal, an inductance element, and a transmission-side filter and a reception-side filter connected to the antenna terminal. The transmission-side filter has a first pass band, and the reception-side filter has a second pass band. The reception-side filter is connected to the antenna terminal through the inductance element. A center frequency of the second pass band is higher than a center frequency of the first pass band. The reception-side filter includes parallel arm resonance portions including a first parallel arm resonance portion connected closest to the inductance element. An electrostatic capacitance of the first parallel arm resonance portion is larger than an electrostatic capacitance of any other parallel arm resonance portions.

Abstract: A radio frequency laser includes: a power box, a radio frequency cavity, an electrode, and a first metal blocking ring. A bottom plate of the power box is provided with a first installation hole and a first installation groove, and the first installation groove is arranged around the first installation hole. A top plate of the radio frequency cavity is provided with a second installation hole and a second installation groove, and the second installation groove is arranged around the second installation hole. When the power box is assembled with the radio frequency cavity, the second installation hole corresponds to the first installation hole, and the second installation groove corresponds to the first installation groove.

Abstract: A data network has at least three line branches connected via a common star node to distribute message signals from one of the line branches onto the other line branches, wherein connected to at least one of the line branches is at least one bus-user device is configured to generate in a corresponding transmit mode by a corresponding transmit unit at least one of the message signals, wherein in the corresponding bus-user device, the transmit unit has a current source circuit which, in generating the message signal (16), is configured to inject an electric current into electrical lines of the line branch to which the bus-user device is connected, and via the current source circuit the lines are connected to an internal impedance value of the current source circuit that in transmit mode is constantly greater than 10 times the value of the characteristic impedance, for example greater than 500 Ohms.

Abstract: A tunable inductor arrangement includes a first winding part connected at one end to a first input of the inductor arrangement, a second winding part connected at one end to the other end of the first winding part, a third winding part connected at one end to a second input of the inductor arrangement, and a fourth winding part connected at one end to the other end of the third winding part. For tuning, the inductor arrangement includes a switch arrangement switchable between a first setting series-connecting the first and third winding parts between the inputs, and a second setting series-connecting the first, second, fourth and third winding parts between the inputs. The first and third winding parts are arranged on a chip or substrate with essentially common magnetic fields, and the second and fourth winding parts are arranged to cancel electro-magnetic coupling with the first and third winding parts.

Abstract: A video transmission system is disclosed. The video transmission system comprises a multi-drop bus, a first source driving chip, a second source driving chip and a timing controller. The first source driving chip comprises a first source driving circuit and a first terminal circuit. The first terminal circuit is coupled to the multi-drop bus and the first source driving circuit for providing a first terminal resistor. The second source driving chip comprises a second source driving circuit and a second terminal circuit. The second terminal circuit is coupled to the multi-drop bus and the second source driving circuit for providing a second terminal resistor. The timing controller is coupled to the first source driving chip and the second source driving chip via the multi-drop bus.

Abstract: A method includes causing manufacturing equipment to generate a RF signal to energize a processing chamber associated with the manufacturing equipment. The method further includes receiving, from one or more sensors associated with the manufacturing equipment, current trace data associated with the RF signal. The method further includes updating impedance values of a digital replica associated with the manufacturing equipment based on the current trace data. The method further includes obtaining, from the digital replica, one or more outputs indicative of predictive data. The method further includes causing, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment.

Abstract: An apparatus and method for co-axial wire bonding to improve impedance and electrical package connection performance of a substrate attached to the interior of an electrical device package. One or more wire bonds making ground connections between a package and an internal electrical circuit substrate make a non-contact geometrical crossing over an active electrical signal wire.

Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.

Abstract: An apparatus includes a module. The module includes a radio frequency (RF) circuit to transmit or receive RF signals, and a loop antenna to transmit or receive the RF signals. The module further comprises an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit comprises lumped reactive components.

Abstract: An apparatus includes a module, which includes an impedance matching circuit. The apparatus further includes a capacitor that is external to the module, and is coupled to the impedance matching circuit. The apparatus further includes a loop antenna to transmit or receive the RF signals. The loop antenna is coupled to the capacitor.

Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.

Abstract: A probe for receiving transmissions of electrical signals from a transmitter across an interface of a slip ring comprising a signal capture area comprising at least one segmented signal receiving strip arranged in spaced relation to the transmitter of the slip ring for receiving a signal transmitted across the interface of the slip ring. The segmented signal receiving strip configured to receive a range of frequency signal content of the signal and having a first signal receiving segment having a first frequency response, a second signal receiving segment electrically coupled to said first signal receiving segment and having a second frequency response less than the first frequency response, and a third signal coupled to the first signal receiving segment and having a third frequency response less than the first frequency response.

Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

Abstract: A front end radio frequency (RF) module including one or more first filter circuits configured to implement a front end function by filtering first signals communicated between one or more first antenna and a transceiver and one or more second filter circuits configured to implement at least a portion of an additional network function within the front end RF module by filtering second signals communicated between one or more second antennas and the transceiver.

Abstract: A multicomponent network may be added to a transmission line in a high-frequency circuit to transform a first impedance of a downstream circuit element to second impedance that better matches the impedance of an upstream circuit element. The multicomponent network may be added at a distance more than one-quarter wavelength from the downstream circuit element, and can tighten a frequency response of the impedance-transforming circuit to maintain low Q values and low VSWR values over a broad range of frequencies.

Abstract: A power line communication system (200) comprising a first node (202) and a second node (204). The first node (202) comprises a second-node-connection-terminal (206); a first-node-transmission-module (208) that provides a first-node-output-signal (210) to the second-node-connection-terminal (206); and modulates the voltage level of the first-node-output-signal based on first-node-transmission-data. The second node (204) comprises a second-node-input-voltage-terminal (214) that is connected to the second-node-connection-terminal (206) of the first node (202) in order to receive the first-node-output-voltage-signal (210). The second node (204) is configured to use the first-node-output-voltage-signal (218) as a supply voltage.

Abstract: A novel maize variety designated 1PCBY70 and seed, plants and plant parts thereof are provided. Methods for producing a maize plant comprise crossing maize variety 1PCBY70 with another maize plant are provided. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into 1PCBY70 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby are provided. Hybrid maize seed, plants or plant parts are produced by crossing the variety 1PCBY70 or a locus conversion of 1PCBY70 with another maize variety.

Abstract: A current mirror circuit includes a current output terminal, a first transistor, a second transistor, and a digital-to-analog converter (DAC). The first transistor includes a first terminal coupled to a power rail, a second terminal coupled to a current source, and a third terminal coupled to the current source. The second transistor includes a first terminal coupled to the power rail, a second terminal coupled to the second terminal of the first transistor, and a third terminal coupled to the current output terminal. The DAC includes an output terminal coupled to the second transistor.

Abstract: Systems and methods for operating a radio system include configuring a first antenna of a plurality of antennas in a wireless device to operate in a configured mode of a plurality of modes, wherein the plurality of modes include a first mode of operating as a quarter wave for operation in a 2.4 GHz band, a second mode of operating as a half wave for operation in a 5 GHz band, and a third mode of operating simultaneous as a half wave and a quarter wave for operation in both the 2.4 GHz band and the 5 GHz band; and operating a first radio of a plurality of radios connected to the first antenna in the configured mode of the first antenna.

Abstract: An amplifier circuit includes: a transistor provided between an input terminal and an output terminal and having a gate connected to the input terminal, a source connected to a ground, and a drain connected to the output terminal; an inductor connected between the source and the ground; an inductor connected between the gate and the input terminal, and switches connected to at least one of the inductors and configured to change a mutual inductance of the inductors.

Abstract: The present disclosure provides exemplary embodiments of voltage harvesting devices used in power distribution systems, and provides power distribution system architectures utilizing the voltage harvesting devices. Generally, the voltage harvesting devices transform distribution line AC voltages to produce a low wattage output for distribution system communication and control type devices. The voltage harvesting device can operate whether irrespective of the presence of load current.

Abstract: A power amplifier circuit includes a first impedance transformer circuit arranged to connect with a carrier device, and a second impedance transformer circuit arranged to connect with a peaking device. Both the first and the second impedance transformer circuit include a parallel impedance transformer arrangement.

Abstract: An electromagnetic device includes: a first electromagnetic, EM, signal feed; a second EM signal feed disposed adjacent to the first EM signal feed; and, an elevated electrically conductive region disposed between and elevated relative to the first and second EM signal feeds.

Abstract: An RF impedance measurement circuit includes a sensing capacitor connectable with an RF signal path; a first amplitude detector and a first frequency divider, each coupled, with the measurement circuit in operation, to the RF signal path at a first terminal of the sensing capacitor; a second amplitude detector and a second frequency divider, each coupled, with the measurement circuit in operation, to a second terminal of the sensing capacitor; and a phase detection circuit connected to an output of the first frequency divider and to an output of the second frequency divider.

Abstract: Embodiments presented herein are generally directed to techniques for separately transferring power and data from an external device to an implantable component of a partially or fully implantable medical device. The separated power and data transfer techniques use a single external coil and a single implantable coil. The external coil is part of an external resonant circuit, while the implantable coil is part of an implantable resonant circuit. The external coil is configured to transcutaneously transfer power and data to the implantable coil using separate (different) power and data time slots. At least one of the external or internal resonant circuit is substantially more damped during the data time slot than during the power time slot.

Abstract: Methods and apparatus for wireless power transfer and communications are provided. In one embodiment, a wireless power transfer system comprises an external transmit resonator configured to transmit wireless power, an implantable receive resonator configured to receive the transmitted wireless power from the transmit resonator, and a user interface device comprising a resonant coil circuit, the resonant coil circuit being configured to receive magnetic communication signals from the transmit resonator or the receive resonator and to display information relating to the magnetic communication signals to a user of the user interface device.

Abstract: A wireless transceiver circuit with an impedance matching network within an integrated circuit is disclosed. In some embodiments, the impedance matching network utilizes an inductor, having two portions, disposed on two different metal layers of the integrated circuit. The first end of the first portion of the inductor is in communication with an antenna. The second end of the second portion is in communication with a low noise amplifier for receiving signals and a power amplifier for transmitting RF signals. The second end of the first portion is connected to the first end of the second portion using a via. In another embodiment, the two portions are disposed on the same metal layer, wherein one portion is disposed within the other with a gap separating the two portions. These configurations require less space than using two separate inductors and also have a low coupling coefficient.

Abstract: Main wiring including a plurality of differential transmission lines for transmitting differential signals is formed on a motherboard. Termination resistors, provided at both ends of each of the plurality of differential transmission lines, connect the plurality of differential transmission lines to each other. A plurality of daughter boards are connected in parallel to each other via the main wiring. A line characteristic impedance of each differential transmission line is higher than a termination resistance value, which is a resistance value of the termination resistor.

Abstract: A method of manufacturing an RF switch includes adding a first mutual inductance portion to a first self-inductance portion of a first transmission line; and adding a second mutual inductance portion to a second self-inductance portion of a second transmission line, wherein values of the first and second mutual inductance portions and values of the first and second self-inductance portions equalize an impedance difference between the first transmission line and the second transmission line.

Abstract: A common-mode noise filter is provided, and comprises a first transmission structure and a second transmission structure. At least one first transmission unit is connected between a first signal input end and a first signal output end of the first transmission structure in series. At least one second transmission unit is connected between a second signal input end and a second signal output end of the second transmission structure in series. Two first capacitors are connected between the first signal input end and the second signal input end in series, and connected at a first node together. A first common-mode noise suppression unit is connected between the first node and a reference potential, and comprises a second capacitor and a first lossy element connected to the second capacitor in series or parallel. The first common-mode noise suppression unit can absorb a common-mode noise via the first lossy element.

Abstract: A multi-stage matching network filter circuit device. The device comprises bulk acoustic wave (BAW) resonator device having an input node, an output node, and a ground node. A first matching network circuit is coupled to the input node. A second matching network circuit is coupled to the output node. A ground connection network circuit coupled to the ground node. The first or second matching network circuit can include an inductive ladder network including a plurality of series inductors in a series configuration and a plurality of grounded inductors wherein each of the plurality of grounded inductors is coupled to the connection between each connected pair of series inductors. The inductive ladder network can include one or more LC tanks, wherein each of the one or more LC tanks is coupled between a connection between a series inductor and a subsequent series inductor, which is also coupled to a grounded inductor.

Abstract: A system and method for tuning a transistor-based circuit. The system includes a negative impedance converter circuit having a capacitor, a first transistor, and a second transistor. As a current travels through the capacitor, the first transistor and the second transistor each sample voltage at the capacitor and invert the voltage at an input of the negative impedance converter circuit. The negative impedance converter circuit also has a third transistor in series with the capacitor. The third transistor has a base voltage. Changing the base voltage of the third transistor changes the voltage sampled by the first transistor and the second transistor.

Abstract: Disclosed are devices and methods having a programmable resistor and an on-package decoupling capacitor (OPD). In one aspect a package includes an OPD and a programmable resistor formed from at least one thin-film transistor (TFT). The programmable resistor is disposed in series with the OPD between a supply voltage (VDD) conductor and a ground conductor.

Abstract: A current mirror circuit includes a current output terminal, a first transistor, a second transistor, and a digital-to-analog converter (DAC). The first transistor includes a first terminal coupled to a power rail, a second terminal coupled to a current source, and a third terminal coupled to the current source. The second transistor includes a first terminal coupled to the power rail, a second terminal coupled to the second terminal of the first transistor, and a third terminal coupled to the current output terminal. The DAC includes an output terminal coupled to the second transistor.