Having Long Line Elements Patents (Class 333/33)
  • Patent number: 10930645
    Abstract: A semiconductor device assembly includes a substrate and a die coupled to the substrate. The die includes a first contact pad electrically coupled to a first circuit on the die including at least one active circuit element, and a second contact pad electrically coupled to a second circuit on the die including only passive circuit elements. The substrate includes a substrate contact electrically coupled to both the first and second contact pads. The semiconductor device assembly can further include a second die including a third contact pad electrically coupled to a third circuit on the second die including at least a second active circuit element, and a fourth contact pad electrically coupled to a fourth circuit on the second die including only passive circuit elements. The substrate contact can be electrically coupled to the third contact pad and electrically disconnected from the fourth contact pad.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 23, 2021
    Assignee: Micron Technology, Inc.
    Inventors: James E. Davis, John B. Pusey, Zhiping Yin, Kevin G. Duesman
  • Patent number: 10910688
    Abstract: The present invention relates to the field of communications technology, and in particular, to technology related to impedance matching in communication technology, and in particular, to a dielectric phase shifting unit, dielectric phase shifter and base station antenna. It includes a feeding network and a dielectric plate for impedance matching and for moving along a predetermined path, an impedance matching portion of the dielectric plate being disposed on one end of the dielectric plate adjacent to an input port on the feeding network. The present invention not only reduces the number of impedance matching and network loss; it also reduces the equivalent electrical length of the entire network, effectively saving costs, reducing the complexity of disassembly and assembly of related components, and improves disassembly and assembly efficiency.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: February 2, 2021
    Inventors: Litao Chen, Bin Gao, Peitao Liu, Guosheng Su
  • Patent number: 10854941
    Abstract: A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: December 1, 2020
    Assignee: ETEGENT TECHNOLOGIES, LTD.
    Inventors: Christopher G. Larsen, Oleg Lobkis, Richard A. Roth, Stuart J. Shelley, Conor Coyan, Jason Feldman, Ann El Demery, Mackenzie Shelley
  • Patent number: 10848003
    Abstract: A method of transmitting power wirelessly from at least two transmitter loops to at least one power receiver. The method comprises separately supplying a respective alternating current to each one of the transmitter loops thereby to transmit wireless power for receipt by the at least one power receiver. Also provided is a method of receiving power wirelessly. Associated apparatuses and an associated system are also provided.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: November 24, 2020
    Assignee: The University of Hong Kong
    Inventors: Wai Man Ng, Cheng Zhang, Deyan Lin, Ron Shu Yeun Hui
  • Patent number: 10720688
    Abstract: An RF transition assembly (300) for enabling a radiofrequency transition between an RF transmission layer (301) of an electronic device and a conductor (309) which is electrically connected (317) to the RF transmission layer (301). The conductor (309) extends generally orthogonal to the RF transmission layer (301). The assembly comprises an open coaxial structure (313) located adjacent to an edge of the RF transmission layer (301). The open coaxial structure (313) comprises a cavity (315) extending therethrough for receiving the conductor (309). The cavity (315) comprises an opening facing the edge of the RF transmission layer (301) so as to direct electromagnetic radiation towards the RF transmission layer (301).
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: July 21, 2020
    Assignee: Lumentum Technology UK Limited
    Inventors: Mario Bonazzoli, Roberto Galeotti, Luigi Gobbi
  • Patent number: 10720707
    Abstract: The present disclosure relates to a reconfigurable patch antenna, which includes a substrate, a ground plane formed on a bottom surface of the substrate or within the substrate, a primary patch, an extension patch, and switching components. The primary patch and the extension patch are formed on a top surface of the substrate and are placed parallel to each other. Herein, a gap is formed between the primary patch and the first extension patch. The switching components are formed across the gap, electrically coupled to both the primary patch and the extension patch, and configured to connect the primary patch to the extension patch or disconnect the primary patch from the extension patch.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: July 21, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Ali Tombak, Marcelo Jorge Franco, Edward T. Spears
  • Patent number: 10680567
    Abstract: A low-noise wide band amplifier is realized utilizing a superconductor-insulator-superconductor (SIS) junction, quasiparticle frequency mixers connected in tandem or in cascade, a first quasiparticle mixer performs first frequency mixing with use of a first local signal having a frequency not less than twice a frequency of an input signal to the first quasiparticle mixer, a second quasiparticle mixer performs second frequency mixing with use of a second local signal having a frequency not more than twice a frequency of an input signal to the second quasiparticle mixer, and signal amplification is performed through frequency conversion by extracting, from among a plurality of signals generated with the first and the second frequency mixing, a signal in a frequency band not more than a frequency band of the signal before the first frequency mixing and the second frequency mixing, using a transmission line or a filter.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: June 9, 2020
    Assignee: INTER-UNIVERSITY RESEARCH INSTITUTE CORPORATION NATIONAL INSTITUTES OE NATURAL SCIENCES
    Inventors: Yoshinori Uzawa, Takafumi Kojima
  • Patent number: 10666000
    Abstract: A coaxial bias T-connector includes: first and second coaxial cables; a rear body electrically connected to the first cable outer conductor; a first inner contact positioned within the rear body and electrically connected with the first inner conductor; a front body connected with the rear body and including a forward portion; a second inner contact positioned within the front body and electrically connected with the first inner contact; a spring basket including a plurality of spring fingers and electrically connected with the forward portion of the front body and electrically isolated from the second inner contact, the forward portion of the front body, the spring fingers and the second inner contact forming a 4.3/10 interface; a third inner contact electrically connected with the second cable inner conductor; and a coaxial fitting electrically connected with the front body and with the second cable outer conductor. The third inner contact is in electrical connection with the second inner contact.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 26, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Jien Zheng, Yujun Zhang, Xianxiang Li
  • Patent number: 10594014
    Abstract: A connection structure (3) of a high-frequency transmission line according to this invention includes a columnar central conductor (7) having one end connected to a coaxial line and the other end connected to a planar transmission line, a first outer conductor (41) arranged on a side of the one end of the central conductor coaxially with the central conductor, a first dielectric body (42) filled between the first outer conductor and the central conductor, a second outer conductor (61) arranged on a side of the other end of the central conductor coaxially with the central conductor, a second dielectric body (62) filled between the second outer conductor and the central conductor, a third outer conductor (51) arranged between the first outer conductor and the second outer conductor coaxially with the central conductor, and a third dielectric body (52) filled between the third outer conductor and the central conductor.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 17, 2020
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Hitoshi Wakita, Munehiko Nagatani, Hideyuki Nosaka
  • Patent number: 10536128
    Abstract: A transmission-line-based impedance transformer including first and second couplers, with each coupler including respective pairs of coupled signal conductors. The signal conductors are connected sequentially in series between an input port and an output port and may form a single spiral configuration. A signal conductor of one coupler may be connected in series between the two signal conductors of another coupler. The couplers have characteristic impedances between an input impedance and an output impedance. A signal conductor of a coupler may include first and second conductor portions disposed in respective spaced-apart parallel planes, with the other signal conductor of the coupler disposed physically directly between the first and second conductor portions. A transmission-line signal conductor in the spiral may be shielded from coupled signal conductors by ground conductors disposed in respective spaced-apart parallel planes on opposite sides of the shielded signal conductor.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: January 14, 2020
    Assignee: Werlatone, Inc.
    Inventors: Allen F. Podell, Ky-Hien Do, Mariama Dadhi Barrie
  • Patent number: 10529480
    Abstract: For a T-coil IC, a first inductor core is on an Mx layer, has at least 1? turns, and has a first-inductor-core-first end and a first-inductor-core-second end. A second inductor core is on an Mx-1 layer, has at least 2? turns, and has a second-inductor-core-first end and a second-inductor-core-second end. The first-inductor-core-second end is connected to the second-inductor-core-first end at a node. A third inductor core is on an Mx-2 layer and has at least 3 turns. The third inductor core has a third-inductor-core-first end and a third-inductor-core-second end. The second-inductor-core-second end is connected to the third-inductor-core-first end. A tap is on an Mx-3-y layer, where y?0. The tap is connected to the first and second inductor cores at the node. A first inductor is formed by the first inductor core, and a second inductor is formed by the second and third inductor cores.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: January 7, 2020
    Assignee: QUALCOMM Incorporated
    Inventor: Siqi Fan
  • Patent number: 10498002
    Abstract: The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes an attenuation port, wherein the attenuation port is configured to couple the beamforming network to the attenuation component. The attenuation component dissipates received electromagnetic energy.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: December 3, 2019
    Assignee: Waymo LLC
    Inventors: Jamal Izadian, Adam Brown
  • Patent number: 10498139
    Abstract: For a T-coil IC, a first inductor core is on an Mx layer and has n turns (n?15/8). The first inductor core has a first-inductor-core-first end and a first-inductor-core-second end. A second inductor core is on an Mx-2 layer and has n turns. The second inductor core has a second-inductor-core-first end and a second-inductor-core-second end. The first-inductor-core-second end is connected to the second-inductor-core-first end by a via stack between the Mx and Mx-2 layers. A center tap is on an Mx-1 layer. The center tap is connected to the second inductor core at a node of the second inductor core. A first inductor is formed by the first inductor core between the first-inductor-core-first end and the first-inductor-core-second end and by the second inductor core between the second-inductor-core-first end and the node. A second inductor is formed by the second inductor core between the node and the second-inductor-core-second end.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: December 3, 2019
    Assignee: QUALCOMM Incorporated
    Inventor: Siqi Fan
  • Patent number: 10469316
    Abstract: A reconfigurable multiplexer that can support more frequency bands than a traditional multiplexer is disclosed. For example, the reconfigurable multiplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable multiplexer includes a filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the multiplexer to support a variety of sets of frequencies. For instance, unlike traditional multiplexers, the reconfigurable multiplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: November 5, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Yang Hou, Reza Kasnavi, Jianxing Ni, Shanshan Zhao
  • Patent number: 10461384
    Abstract: A frequency selective limiter (FSL) is provided having a transmission line structure with a tapered width. The FSL includes a substrate having a magnetic material, a signal (or center) conductor disposed on the substrate and first and second ground plane conductors disposed on the substrate. The signal conductor having a first end with a first width and a second end with a second different width such that the signal conductor is provided having a taper between the first and second ends of the signal conductor. First and second ground plane conductors are spaced apart from first and second edges of signal conductor, respectively, by a distance that changes from the first end of signal conductor to the second end of signal conductor such that signal conductor, and first and second ground plane conductors form a co-planar waveguide transmission line.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: October 29, 2019
    Assignee: Raytheon Company
    Inventors: Matthew A. Morton, Gerhard Sollner
  • Patent number: 10454446
    Abstract: A high-frequency module includes a propagation path that has a simple structure and improves filter characteristics by causing an inductor and a matching network to electromagnetic field couple with each other such that attenuation characteristics outside of a frequency band of a transmission signal are improved without increasing the size of the high-frequency module. In addition, unintended electromagnetic field coupling between a first filter and the inductor is significantly reduced or prevented by a shield electrode. Therefore, unintended propagation of a high-frequency signal is significantly reduced or prevented. Therefore, the attenuation characteristics outside of the frequency band of transmission signal input to the transmission terminal are improved more effectively.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: October 22, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shinya Mizoguchi
  • Patent number: 10321564
    Abstract: A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: June 11, 2019
    Assignee: International Business Machines Corporation
    Inventors: Todd E. Takken, Xin Zhang, Yuan Yao, Andrew Ferencz
  • Patent number: 10274540
    Abstract: A method for identifying the existence of a failure of a relay device in an electrical power supply system of a device to be supplied with power, the power supply system comprising at least one power generator configured to generate a power supply signal and a load comprising at least one relay device; the power generator comprising a frequency variator; each relay device comprising a quadripole and at least one antenna linked to the quadripole. The identification method comprises the following steps: a) selecting a characteristic frequency, b) determining the impedance of the load, then when the supply signal has the selected characteristic frequency, c) repeating steps a) and b) for several distinct characteristic frequencies, d) identifying the existence of a failure from several impedances determined for different characteristic frequencies.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: April 30, 2019
    Assignee: SAGEM DEFENSE SECURITE
    Inventor: Frédéric Bocage
  • Patent number: 10116031
    Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: October 30, 2018
    Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Eric S. Li, Hong-Wei Huang
  • Patent number: 10109904
    Abstract: A coaxial transmission line, e.g. a coaxial cable, includes an inner electrical conductor, an outer electrical conductor, a dielectric region between the inner electrical conductor and the outer electrical conductor, and an electrically thin resistive layer within the dielectric region and concentric with the inner electrical conductor and the outer electrical conductor. The electrically thin resistive layer is a resistive layer configured to be transparent to a subtantially transverse-electromagnetic (TEM) mode of transmission, while absorbing higher order modes of transmission.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: October 23, 2018
    Assignee: Keysight Technologies, Inc.
    Inventors: Gregory S. Lee, Lewis R. Dove
  • Patent number: 10050350
    Abstract: A planar differential aperture antenna that has a high gain and wide bandwidth at a millimeter wave band is provided. The differential aperture antenna has a cavity within it that has a height of roughly a quarter of a wavelength of the desired transmission band. The cavity is H-shaped, and has a cross shaped patch within the cavity that is fed differentially by two grounded coplanar waveguides. Two ends of the patch extend towards the ports on either side of the differential aperture antenna, and the other two ends of the patch extend into the cavity lobes, perpendicular with respect to the ports.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: August 14, 2018
    Assignee: CITY UNIVERSITY OF HONG KONG
    Inventors: Quan Xue, Shaowei Liao, Peng Wu
  • Patent number: 10003116
    Abstract: An electronic apparatus having a coplanar waveguide transmission line configured to reduce impedance discontinuity in the coplanar waveguide transmission line is introduced. The electronic apparatus includes a coplanar waveguide transmission line including a substrate, at least one signal line and a plurality of reference planes, and the electronic apparatus includes at least one passive component. Each of the reference planes is coupled to a DC voltage. The at least one passive component is electrically connected between the reference planes and acts as a short circuit at relatively high frequencies.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: June 19, 2018
    Assignee: Novatek Microelectronics Corp.
    Inventors: Chun-Yi Lin, Yu-Jen Chen, Hung-Chi Chu
  • Patent number: 9985584
    Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: May 29, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazutaka Takagi, Yukio Takahashi
  • Patent number: 9974160
    Abstract: Systems and methods described herein are provided for electrically coupling conductors within a multilayered printed circuit board (PCB) using an interconnect formed along an outer surface of one or more stripline boards making up the multilayered PCB. The multilayered PCB may include first and second stripline boards each having multiple dielectric layers. A first conductor may be formed in the first stripline between the multiple dielectric layers and a second conductor may be formed in the second stripline between the multiple dielectric layers. The interconnect may be formed over an outer surface the dielectric layers such that the interconnect extends from the first conductor to the second conductor. An electrically conductive wall may be formed over the edge or side portion of the dielectric layers to form a cavity that encloses the interconnect and the outer surface of the multilayered PCB.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: May 15, 2018
    Assignee: Raytheon Company
    Inventors: Thomas V. Sikina, Mary K. Herndon, John P. Haven, Alkim Akyurtlu
  • Patent number: 9966180
    Abstract: A transmission line impedance transformer including at least two different dielectric media having different dielectric properties, each of the dielectric media being configured to taper in thickness along the length of the impedance transformer in an inverse relationship with respect to each other so as to form a combined dielectric medium having an effective dielectric property that is graded along the transmission path. The two or more dielectric media may be disposed between two conductors to provide an impedance transformer in which a characteristic impedance of the transmission line varies along its length in response to the gradation of the effective dielectric property of the combined dielectric medium.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: May 8, 2018
    Assignee: Raytheon Company
    Inventors: Daniel B. Schlieter, Patrick J. Kocurek, Christopher A. Loehrlein, Brandon W. Pillans
  • Patent number: 9935581
    Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: April 3, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazutaka Takagi
  • Patent number: 9929693
    Abstract: According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: March 27, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazutaka Takagi
  • Patent number: 9900653
    Abstract: An external device may recognize, in the case of including a communication unit that executes communication via a communication path made up of a pair of differential transmission paths included in a transmission path, information relating to the communication unit thereof. A disk recorder transmits function information indicating that a communication unit (high-speed data line I/F 213) configured to execute communication with an external device via a communication path made up of a reserve line and an HPD line of an HDMI cable to a television receiver via a CEC line that is a control data line of the HDMI cable. The television receiver receives function information, whereby whether or not the disk recorder is an eHDMI-compatible device can be determined, and in the case of an eHDMI-compatible device, a compatible transmission format (application) can be recognized.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: February 20, 2018
    Assignee: Sony Corporation
    Inventors: Masaki Kitano, Kazumoto Kondo, Toshihide Hayashi, Gen Ichimura
  • Patent number: 9692125
    Abstract: Antenna structures and methods of operating the same are described. One antenna structure having a stacked patch antenna including a first patch structure disposed in a first plane and a second patch structure disposed in a second plane, a first parasitic patch antenna that is coplanar with the second patch structure, and a second parasitic patch antenna that is coplanar with the second patch structure. The first patch structure includes a first substrate with a ground plane and a first patch element. The second patch structure includes a second substrate with a second patch element. The first parasitic patch antenna is disposed adjacent a first side of the second patch structure in the second plane. The second parasitic patch antenna is disposed adjacent a second side of the second patch structure in the second plane.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: June 27, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Eswarappa Channabasappa, Adrian Napoles
  • Patent number: 9658249
    Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: May 23, 2017
    Assignee: MPI CORPORATION
    Inventors: Wei-Cheng Ku, Jun-Liang Lai
  • Patent number: 9589908
    Abstract: A method and apparatus are provided for manufacturing a packaged electronic device (200) which includes a carrier substrate (120) in which conductive interconnect paths (122) extend between first and second opposed surfaces, an integrated circuit die (125) affixed to the first surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, and an array of conductors (110), such as BGA, LGA, PGA, C4 bump or flip chip conductors, affixed to the second surface of the carrier substrate for electrical connection to the plurality of conductive interconnect paths, where the array comprising a signal feed ball (112) and an array of shielding ground balls (111) surrounding the signal feed ball.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: March 7, 2017
    Assignee: NXP USA, INC.
    Inventor: Walter Parmon
  • Patent number: 9505478
    Abstract: An electric battery for the propulsion of vehicles in an underwater environment, comprising a cylindrical tubular casing defining a main chamber housing an anhydrous electrolyte; intake members to transfer a flow of water from the marine environment to the main chamber, to form, following execution of a water-intake command, a liquid electrolyte; a plurality of electrochemical cells housed in the tubular casing; a heat exchanger receiving as input electrolyte taken from the main chamber and an outlet communicating with an inlet of the electrochemical cells. The heat exchanger is provided in the cylindrical tubular portion and comprises at least one channel made in an inner wall of the cylindrical tubular portion, and extending along a helical path coaxial to the axis of the tubular portion.
    Type: Grant
    Filed: January 14, 2015
    Date of Patent: November 29, 2016
    Assignee: WHITEHEAD SISTEMI SUBACQUEI S.P.A.
    Inventor: Mauro Peselli
  • Patent number: 9496594
    Abstract: A printed circuit board includes a signal transmitting part and a ground part disposed having an insulating layer therebetween. The ground part includes an impedance adjusting part.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: November 15, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Hyun Park, Han Kim, Seong Hee Choi, Mi Ja Han
  • Patent number: 9490514
    Abstract: A high-frequency signal transmission line includes a body; a signal line including a first line portion provided to a first layer of the body, a second line portion provided to a second layer of the body alternately being connected; and a first ground conductor provided to the first layer or a third layer positioned on an opposite side of the second layer relative to the first layer, and also overlaid with a plurality of second line portions in planar view from a normal direction of a principal surface of the body, and also not overlaid with a plurality of the first line portions. A property impedance of the first line portion and a property impedance of the second line portion are different from each other.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: November 8, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki
  • Patent number: 9462676
    Abstract: A multi-layer circuit member includes first and second electrically connected reference regions. At least a portion of a signal conductor is in proximity to the first region and a circuit component is in proximity to the second region. An area of increased impedance exists between the first and second electrically connected regions.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: October 4, 2016
    Assignee: Molex, LLC
    Inventor: Kent E. Regnier
  • Patent number: 9438200
    Abstract: In various embodiments, a broadband matching circuit is disclosed. In one embodiment. the broadband matching circuit comprises a low-pass matching section, a quarter-wavelength transformer, and a high-pass matching section.
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: September 6, 2016
    Assignee: TELEDYNE WIRELESS, LLC
    Inventors: William Goumas, Yehuda G. Goren
  • Patent number: 9326819
    Abstract: An ablation system which transmits radio frequency (RF) energy for the ablation of biological tissues has a transmission line and an RF antenna disposed at the distal portion of the transmission line. An RF signal generator supplies RF energy to the proximal end of the cable for transmission to the antenna, and an electrically tunable transformer is connected between the signal generator and the antenna. The transformer is tuned based on detection of the reflected power level from the antenna so as to reduce or minimize reflected power, thereby increasing RF energy coupling between the antenna and tissue.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: May 3, 2016
    Assignee: Medwaves, Inc.
    Inventors: Theodore C. Ormsby, Russell Chung, George Leung, Gwo Jenn Shen
  • Patent number: 9287604
    Abstract: A frequency-scalable device for interfacing a planar medium with a coaxial medium to propagate a primary signal, the device comprises a transition medium connectable between the coaxial medium and the planar medium. The transition medium suppresses excitation of secondary electrical signals by the primary signal when the primary signal is propagated through the transition medium at a frequency below an upper limit.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: March 15, 2016
    Assignee: ANRITSU COMPANY
    Inventor: Karam M. Noujeim
  • Patent number: 9252078
    Abstract: A semiconductor device includes a first electrode formed on a substrate, the first electrode being a first electrical potential; and a second electrode formed on the first electrode, the second electrode including a signal wiring that transmits a signal and a planar electrode part with a prescribed area. A shape of the first electrode corresponding to the planar electrode part is made into a slit shape such that a longitudinal direction of a slit is parallel to a direction in which the signal proceeds in the planar electrode part.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: February 2, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Toshihide Suzuki, Masaru Sato
  • Patent number: 9231181
    Abstract: Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: January 5, 2016
    Assignee: D-Wave Systems Inc.
    Inventors: Murray C. Thom, Alexander M. Tcaciuc, Gordon Lamont, Jacob Craig Petroff, Richard David Neufeld, David S. Bruce, Sergey V. Uchaykin
  • Patent number: 9203132
    Abstract: A differential transmission transition interface is disclosed which can include first and a second buried conducting tracks providing respectively first and second differential couplings between a differential RF transmission output and a waveguide; the first buried conducting track extending over an opening of the waveguide to provide a first RF coupling element; and the second buried conducting track extending over the opening to provide a second RF coupling element. At least a portion of the first RF coupling element extends over the waveguide opening in a first angular direction; and at least a portion of the second RF coupling element extends over the waveguide opening in a second angular direction that is opposed to the first angular direction.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: December 1, 2015
    Assignee: BAE Systems plc
    Inventors: Murray Jerel Niman, Bruno Peter Pirollo
  • Patent number: 9204533
    Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: December 1, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Romero Christian, Seung Wook Park, Young Do Kweon, Mi Jin Park
  • Patent number: 9202783
    Abstract: A printed circuit board (PCB) may include antipads, used to provide clearance for backdrilling, which may be sized to allow backdrilling in a way that minimizes the presence of stubs. The PCB may include pads to connect a component to the PCB and vertically disposed vias connected to at least some of the pads. The PCB may further include horizontally disposed signal layers, electrically connected by the vias, to route signals from the component, received from the vias, to an edge of the component, in which signals associated with the component closer to an inner portion of the component are routed to the edge of the component on higher ones of the signal layers than signals associated with the component further from the inner portion of the component.
    Type: Grant
    Filed: March 24, 2011
    Date of Patent: December 1, 2015
    Assignee: Juniper Networks, Inc.
    Inventors: Mark R. Simpson, Joyce Kitabayashi
  • Patent number: 9190704
    Abstract: An electrosurgical system for treating tissue is disclosed. The system includes an electrosurgical generator, a printed circuit board, a generator ground and a patient ground. The printed circuit board is disposed in mechanical cooperation with the electrosurgical generator and includes a plurality of conductive layers. The generator ground includes a first portion and a second portion. The first portion is electro-mechanically connected to a conductive layer of the printed circuit board and the second portion is electro-mechanically connected to another conductive layer of the printed circuit board. The patient ground includes a portion that is at least partially interposed between the first portion of the generator ground and the second portion of the generator ground.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: November 17, 2015
    Assignee: Covidien LP
    Inventor: Robert J. Behnke, II
  • Patent number: 9157954
    Abstract: Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: October 13, 2015
    Assignee: Apple Inc.
    Inventor: Joshua G. Nickel
  • Patent number: 9154106
    Abstract: For broadband applications of a balun in a magnetic field, the balun includes at least three line transformers each having two transformer sides. At least two transformer sides of the balun that belong to different line transformers of the at least three line transformers are embodied for the same voltage drop at least in terms of magnitude. The at least two transformer sides of the balun are also embodied with an identical number of turns. Two transformer sides connected in parallel are replaced by a single coil, with the result that the balun may be produced from a five-wire structure.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: October 6, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventor: Ralph Oppelt
  • Patent number: 9147925
    Abstract: In an antenna coupler, a multilayer printed-circuit board has conductor levels which are electrically isolated from one another in the depth direction. A first radio-frequency line coupled to the antenna is arranged in a first conductor level, while a second radio-frequency line coupled on the appliance side is arranged in a second conductor level of the board. The board has an electrically insulating core layer, with the first and second conductor levels extending on the same of the two faces of the core layer and with the second radio-frequency line at a greater distance from the core layer than the first radio-frequency line. Furthermore, the second radio-frequency line is arranged on an outer surface of the board. The antenna coupler comprises an electrically conductive shielding structure designed to shield the first radio-frequency line and appliance-side metal parts, which are not part of the antenna coupler, against interaction with radio-frequency signals.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: September 29, 2015
    Assignee: Landis + Gyr AG
    Inventors: Igor Dremelj, Heinz Hohl
  • Patent number: 9140724
    Abstract: A compensating resistance adapter spans the distance from a mechanical point of contact of an electrical test probe and at least one signal testing point. The compensating resistance adapter has at least one transmission path extending longitudinally therewith. At least one compensating network is configured with the transmission path and positioned substantially near the probing end thereof. For preferred compensating resistance adapters, the at least one compensating network compensates for inductance caused by the conductive connector adapter. For preferred compensating resistance adapters, the at least one compensating network when used in combination with the electrical test probe is optimized to the signal testing point. Exemplary preferred compensating resistance adapters include a probing blade adapter, a twisted pair adapter, a Y-lead adapter, and a swivel pogo tip pair adapter.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: September 22, 2015
    Assignee: LeCroy Corporation
    Inventor: Julie A. Campbell
  • Patent number: 9112254
    Abstract: Embodiments disclosed include transmission line phase shifters and methods for fabricating transmission line phase shifters that switch signal and ground conductors to reverse electromagnetic fields in a transmission line structure.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: August 18, 2015
    Assignee: RAYTHEON COMPANY
    Inventors: Terry C. Cisco, Clinton O. Holter
  • Patent number: RE46932
    Abstract: Disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: July 3, 2018
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama