Controlled fluid delivery in a microelectronic package
A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.
Latest Intel Patents:
- ENHANCED TRAFFIC INDICATIONS FOR MULTI-LINK WIRELESS COMMUNICATION DEVICES
- METHODS AND APPARATUS FOR USING ROBOTICS TO ASSEMBLE/DE-ASSEMBLE COMPONENTS AND PERFORM SOCKET INSPECTION IN SERVER BOARD MANUFACTURING
- MICROELECTRONIC ASSEMBLIES
- INITIALIZER FOR CIRCLE DISTRIBUTION FOR IMAGE AND VIDEO COMPRESSION AND POSTURE DETECTION
- MECHANISM TO ENABLE ALIGNED CHANNEL ACCESS
The present application is a divisional of U.S. patent application Ser. No. 11/966,560, filed Dec. 28, 2007.
FIELD OF INVENTIONEmbodiments of the present invention relate to fluid delivery and, more particularly to micro-fluid delivery to a silicon die for example, for biological sensor applications.
BACKGROUNDRecently, there has been a growing interest for those in the health fields for developing biosensors, molecular libraries, Lab-on-a-Chip (LOC), and other biological electronic and bio-MEMS based devices. Lab-on-a-chip (LOC) refers to devices that integrate multiple laboratory functions on a single chip. Such chips are capable of managing extremely small volumes of fluid, for example, in the range of pico-liters or less. LOC generally involves the scaling of single or multiple lab processes down to chip-format to perform chemical analysis. Many uses are possible for LOC devices such as immunoassays to detect bacteria, viruses and cancers based on antigen-antibody reactions; dielectrophoresis for detecting cancer cells and bacteria, or blood sample analysis.
Controlled fluid delivery to a semiconductor die is of utmost importance for such biological sensor applications. Generally this delivery involves creating physical channels or trenches in a substrate in which the fluid may travel to reach the die where chemical analysis may be performed.
The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same becomes better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like parts throughout the various views unless otherwise specified:
Described is a microelectronic packaging scheme for controlling the delivery of fluids to one or more silicon devices which may comprise biological sensors, molecular libraries, MEMS devices and/or other applications involving interaction with a fluid. Embodiments eliminate the need for creating physical channels via methods such as milling, etching, etc. in the package with the ability to deliver controlled amounts of fluids to a chip for biological applications. Embodiments enable rapid, low cost assembly of packaging comprising complex microfluidics control. Embodiments also enable the use of clear quartz, polyester, or polycarbonate lids or covers which provide access to the silicon device for inspection by visual and/or spectrometric methods, such as UV light, IR light, laser, etc.
Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases “in one embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring now to
Rather than patterning depressions or physical channels in the substrate 100, the defined paths 106 comprise coatings that may channel the flow of liquids to the die 102 for biological sensor type applications or other application. The defined paths 106 may be coated with a wetting coating that has an affinity to fluids. Similarly, areas on the substrate 100 and package cover 104 not in the defined path may have a dewetting coating that tends to repel fluids.
Referring now to
The die 208 may comprise various microfluidic circuitry 210 that may comprise various CMOS and MEMS devices for analyzing the fluid. Spacers 212 may be provided between the cover 202 and the substrate 200 to allow clearance for the fluid to move. The fluid may move by capillary action through the microfluidic channels 206 to the die 208. As best shown in
A wide variety of fluids may be used such as water, alcohols, solvents such as toluene, acetone, etc. containing the biological molecules. The substrate 200 or cover 202 may comprise glass, quartz, ceramic, organics etc. such that it is optically, UV, or IR transparent, or electrically/thermally conductive to allow detection of biomolecules or allowing detection by any other methods known in the art.
Examples of useful wetting coatings 206 include monolayers, such as trimethoxysilane surfactants, thiol surfactants, alcohol surfactants, and the life. Similarly, dewetting materials such as silica, titania and the like, may be used outside the channels 206 which are neat, dispersed in solvents or in a polymer matric such as epoxy, polyimide, polyester etc. A wide variety of methods may be used to place the dewetting/wetting coating in the desired locations, including subtractive methods, such as UV lithography, additive methods, such as soft lithography, and other methods known in the art.
The substrate 200 may be designed such that there is a hollow etched in to create a space for the die 208 such that the die 208 is flush with the top of the substrate 200. The microfluidic channels 210 in the die 208 then line up with the channels on the substrate 200.
In one embodiment of the invention, the dewetting coating is a nanocomposite comprising silica nanoparticles in epoxy resin. The coating is placed on the substrate using a patterned stamp 300 in regions where fluid flow is not desired. An analogous coating is placed on another substrate which will act as the top surface. This surface is placed on the bottom substrate with a spacer 212 in between.
In another embodiment of the invention, the dewetting coatings are alkoxysilanes such as octadecyltrichlorosilane, heptadecafluoro 1, 1, 2, 2, tetrahydrodecyl trichlorosilane and alkanethiolates such as n-alkanethiol. The microfluidic channel is achieved by selective UV degradation of the coating or by using a patterned stamp inked with the coating and stamping onto the substrate, or by other methods known in the art.
In another embodiment of the invention, wetting coatings such as nanoparticles such as silica, titania, etc. neat or dispersed in solution, nanocomposites such as functionalized silica in epoxy resin etc. or carboxylic acid terminated silanes etc. are utilized. The coatings are stamped onto the substrate using a patterned stamp such that the coatings in this case comprise the microfluidic channel.
It is apparent to those skilled in the art that the micoelectronic packages of this invention may comprise multiple channels or channels comprising complex pattern for splitting the fluid sample. If desired, additional fluid flow control devices may be incorporated into the package of this invention, including gates, pumps, suction, and the like.
The above description of illustrated embodiments of the invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to be precise forms disclosed. While specific embodiments of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize.
These modifications can be made to the invention in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification and the claims. Rather, the scope of the invention is to be determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation.
Claims
1. A method for forming virtual fluidic channels on a substrate to channel a fluid to a die, comprising:
- providing a die on a substrate, the die including one or more fluidic circuits;
- patterning a coating on the substrate to define a fluid path from an edge of the substrate to the die:
- patterning a coating on a cover corresponding to the fluid flow path; positioning a spacer on the substrate; and
- placing the cover over the substrate and the spacer, wherein the coatings define a virtual fluidic path to channel a fluid to the die.
2. The method of claim 1, wherein the patterning comprises stamping the substrate and the cover with a stamp having the coating thereon.
3. The method of claim 1, wherein the coating comprises a wetting coating within the fluid flow path.
4. The method of claim 3, wherein the wetting coating comprises nanoparticles including silica or titania.
5. The method of claim 1, comprising providing a dewetting coating surrounding the fluid flow path.
6. The method of claim 5, wherein the dewetting coating comprises one of alkoxysilanes and alkanethiolates.
7. A system, comprising:
- a substrate having a die positioned thereon including CMOS and MEMS circuits for processing biological fluids;
- a cover over the substrate; and
- a virtual fluid path comprising one of a wetting or dewetting coating patterned on the substrate and the cover for channeling the biological fluids from an inlet on an edge of the substrate to the die.
8. The system of claim 7, wherein the wetting coating comprises nanoparticles including silica or titania within the fluid path.
9. The system of claim 7, wherein the dewetting comprises one of alkoxysilanes and alkanethiolates surrounding the fluid path.
10. A system, comprising:
- a substrate having a hollow defining space;
- a die positioned in the hollow defining space so that a top surface thereof is flush with a top surface of the substrate, and which includes CMOS and MEMS circuits and a fluidic channel for processing biological fluids;
- a cover over the substrate; and
- a fluid path including a first coating patterned on the substrate and a second coating patterned on the cover, wherein the first coating and the second coating respectively comprise a wetting coating within the fluid flow path, and the wetting coating comprises functionalized nanoparticles including any of silica in epoxy resin or titania; and
- a plurality of fluid inlet ports provided on an edge of the substrate and in line with the fluid flow path,
- wherein the fluid flow path is to channel the biological fluids from the fluid inlet ports to the die.
11. The system of claim 10, further comprising a spacer between the substrate and the cover.
7351323 | April 1, 2008 | Iketaki et al. |
20010055529 | December 27, 2001 | Wixforth |
20030087292 | May 8, 2003 | Chen et al. |
20030111714 | June 19, 2003 | Bates et al. |
20030198968 | October 23, 2003 | Matson |
20060088666 | April 27, 2006 | Kobrin et al. |
20060207789 | September 21, 2006 | Soeta |
20060214246 | September 28, 2006 | Garcia |
20070071789 | March 29, 2007 | Pantelidis et al. |
20070087187 | April 19, 2007 | Lu et al. |
20070166513 | July 19, 2007 | Sheng et al. |
20070287191 | December 13, 2007 | Stiene |
20080070349 | March 20, 2008 | Matayabas et al. |
20080122118 | May 29, 2008 | Basheer et al. |
20080199362 | August 21, 2008 | Chong et al. |
20090065932 | March 12, 2009 | Sane et al. |
20090114293 | May 7, 2009 | Kanai et al. |
20090130766 | May 21, 2009 | Weekamp |
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Nov. 9, 2010, 12 pages, U.S. Patent and Trademark Office.
- Final Office Action for U.S. Appl. No. 11/966,560, mailed Apr. 25, 2011, 13 pages, U.S. Patent and Trademark Office.
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Jul. 11, 2011, 13 pages, U.S. Patent and Trademark Office.
- Advisory Action for U.S. Appl. No. 11/966,560, mailed Jul. 1, 2013, 3 pages, U.S. Patent and Trademark Office.
- Final Office Action for U.S. Appl. No. 11/966,560, mailed Mar. 11, 2013, 14 pages, U.S. Patent and Trademark Office.
- Final Office Action for U.S. Appl. No. 11/966,560, mailed Oct. 20, 2014, 18 pages, U.S. Patent and Trademark Office.
- Notice of Allowance for U.S. Appl. No. 11/966,560, mailed Jan. 14, 2015, 8 pages, U.S. Patent and Trademark Office.
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Feb. 29, 2012, 13 pages, U.S. Patent and Trademark Office.
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Jul. 1, 2014, 19 pages, U.S. Patent and Trademark Office.
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Aug. 30, 2012, 13 pages, U.S. Patent and Trademark Office.
- Final Office Action for U.S. Appl. No. 11/966,560, mailed Feb. 6, 2014, 16 pages, U.S. Patent and Trademark Office.
- Non-Final Office Action for U.S. Appl. No. 11/966,560, mailed Sep. 11, 2013, 15 pages, U.S. Patent and Trademark Office.
- Advisory Action for U.S. Appl. No. 11/966,560, mailed Apr. 17, 2014, 5 pages, U.S. Patent and Trademark Office.
Type: Grant
Filed: Apr 10, 2015
Date of Patent: Mar 28, 2017
Patent Publication Number: 20150209780
Assignee: Intel Corporation (Santa Clara, CA)
Inventors: Lakshmi Supriya (Arlington, MN), James C. Matayabas, Jr. (Gilbert, AZ), Nirupama Chakrapani (Gilbert, AZ)
Primary Examiner: Jennifer Wecker
Application Number: 14/683,826
International Classification: B01L 3/00 (20060101); B05D 3/12 (20060101); B05D 5/00 (20060101); B29C 65/00 (20060101); B01J 19/00 (20060101);